CN106910698A - Semiconductor package part processing unit - Google Patents

Semiconductor package part processing unit Download PDF

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Publication number
CN106910698A
CN106910698A CN201610875875.5A CN201610875875A CN106910698A CN 106910698 A CN106910698 A CN 106910698A CN 201610875875 A CN201610875875 A CN 201610875875A CN 106910698 A CN106910698 A CN 106910698A
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CN
China
Prior art keywords
semiconductor package
package part
unit
deburring
mentioned
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Granted
Application number
CN201610875875.5A
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Chinese (zh)
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CN106910698B (en
Inventor
林栽瑛
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Hanmi Semiconductor Co Ltd
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Hanmi Semiconductor Co Ltd
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Publication of CN106910698A publication Critical patent/CN106910698A/en
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Publication of CN106910698B publication Critical patent/CN106910698B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The present invention relates to a kind of semiconductor package part processing unit, the semiconductor package part that it will complete sputtering process is from after the framework apart with fixed film, the burr for remaining in semiconductor package part is effectively removed by sputtering process, semiconductor package part is carried afterwards, or the semiconductor package part provided from semiconductor package part supply unit is provided and it is stably attached to the framework with the fixed film for semiconductor package part sputtering process and is fixed.

Description

Semiconductor package part processing unit
Technical field
The present invention relates to semiconductor package part processing unit, in more detail, the present invention relates to sputtering process will be completed half Conductor packaging part is effectively removed by sputtering process and remains in semiconductor package part from after the framework apart with fixed film Semiconductor package part, or the semiconductor package part that pickup is provided from semiconductor package part supply unit are carried after burr, and will It is stably attached to the framework with the fixed film for semiconductor package part sputtering process and the semiconductor package being fixed Piece installing processing unit.
Background technology
The present invention relates to semiconductor package part processing unit.For electronic product semiconductor package part in order to stop to people Body produces the electromagnetic wave of influence or minimizes the electronic interferences occurred between adjacent electronics product, to individual semiconductor package part Perform sputtering process.
Sputtering process needs the upper side or side (for example, 4 sides) except by the bottom surfaces with terminals such as soldered balls Perform.Therefore, semiconductor package part not performs sputtering work to be placed on the state of the pallet of intensive storage semiconductor package part Sequence, but hidden in the multiple that semiconductor package part formation can make the terminal of the soldered ball of semiconductor package part bottom surfaces etc. hiding Groove, it is ensured that spacing distance between semiconductor package part and semiconductor package part is attached to framework in a spaced manner respectively, Easily to carry out the sputtering process of the side of semiconductor package part.
, it is necessary to prevent the sputtering of semiconductor package part bottom surface in the sputtering process of semiconductor package part, therefore, can incite somebody to action Semiconductor package part performs sputtering process after being equably attached on framework.Also, complete the semiconductor package part point of sputtering Not Bei Xuanze device picked up, so as to being handled upside down with being loaded into the state of pallet etc..
Conventional semiconductor package part processing unit, in order to carry out sputtering process, adheres in the fixed film for being formed at framework During semiconductor package part, it is difficult to equably adhere to semiconductor package part, so as to cause the delay of operation.
Also, remained because of sputtering in the perimeter that the bottom faces and side that complete the semiconductor package part of sputtering connect Burr (Burr) that deposition material is formed etc. removes above-mentioned burr, it is necessary to pass through handwork, therefore reduces operating efficiency, And automation equipment difficult to use.
The content of the invention
Problem to be solved by this invention is, there is provided a kind of semiconductor package part processing unit, will complete sputtering process Semiconductor package part is effectively removed by sputtering process and remains in semiconductor package part from after the framework apart with fixed film Burr after carry semiconductor package part, or the semiconductor package part that is provided from semiconductor package part supply unit of pickup and general It is stably attached to the framework with the fixed film for semiconductor package part sputtering process and is fixed.
In order to solve the above problems, the present invention provides a kind of semiconductor package part processing unit, including：Framework supply is reclaimed Portion, it is used to supply the framework that sputtering process is performed in the state of multiple semiconductor package parts are attached with, and reclaims separation institute State the empty framework of semiconductor package part；Semiconductor package part separation unit, it picks up to be attached to and is supplied using detection selector The framework semiconductor package part so that the semiconductor package part is from the framework apart；Semiconductor package part goes Burr portion, it includes multiple deburring units, transfer from above-mentioned semiconductor package part separate section from semiconductor package part During, the deburring unit removal remains in the burr on the semiconductor package part；Multiple saddles, it is used to load The semiconductor package part picked up by the detection selector, or the semiconductor package part that flash removed is removed for loading；And, Semiconductor package part loading part, the semiconductor package for removing flash removed for being loaded into the saddle is picked up by unloading selector Piece installing, and it is loaded into semiconductor package part conveyor tray.
Now, the semiconductor package part deburring portion also includes cleaning selector, and the cleaning selector pickup is loaded Semiconductor package part on the saddle, transfers to above-mentioned deburring unit top,
The deburring unit includes：First deburring unit, it includes the more than one rotation with vertical rotating shaft Turn brush；And, the second deburring unit, it includes the round brush with feathering axis, the first deburring unit and described Second deburring unit is arranged side by side and removes flash removed successively.
Also, the saddle includes：First saddle, it is used to load by the detection selector from the semiconductor package Piece installing separate section from semiconductor package part；And, the second saddle, it is used for loading and removes defeathering by the cleaning selector The semiconductor package part of thorn, first saddle and second saddle are transferred to Y direction independently of each other.
Also, multiple rotating brushes of composition the first deburring unit are respectively arranged in and are formed with screw thread in outer peripheral face On rotary part, mutually concluded with screw thread between each rotary part and adjacent rotary part, when in multiple rotary parts When one rotary part is by rotation motor rotation driving, all rotary parts are rotated simultaneously.
Herein, the vertical bristle being implanted with largely in groups on the rotating brush of the first deburring unit is constituted, it is described Second deburring unit is implanted with substantial amounts of bristle in its elongated rotary shaft with radiation, and the rotary shaft is by motor Drive shaft and drive belt drive.
Now, the deburring unit also includes the 3rd deburring unit, and the 3rd deburring unit is described second The rear of deburring unit is parallel with the first deburring unit and the second deburring unit and sets, and the described 3rd goes Burr unit includes blower fan and suction passage, and the blower fan in the second deburring unit by going partly leading for flash removed Body packaging part sprays compressed air to remove to the side surface direction of the semiconductor package part or bottom surface direction or diagonal Remain in the burr of semiconductor package part.
In order to solve the above problems, the present invention also provides a kind of semiconductor package part processing unit, including：Semiconductor packages Part supply unit, for supplying sputtering object semiconductor package part；Semiconductor package part facies posterior hepatis, it uses additional selector to pick up The semiconductor package part supplied by the semiconductor package part supply unit, and semiconductor package part is attached to fixed film, it is described Fixed film is arranged at the ring-shaped frame for sputtering process；Semiconductor package part press section, it is from top in the semiconductor It is attached in packaging part facies posterior hepatis and applies pressure in the semiconductor package part for being arranged at the fixed film of framework, strengthens semiconductor package Piece installing and the attachment state of fixed film；And, framework supply recoverer, it is to semiconductor package part facies posterior hepatis supply sky Framework, semiconductor package part is attached to after the fixed film of the framework, is reclaimed complete in the semiconductor package part press section Into the framework of pressurization.
Also, the semiconductor package part supply unit includes：First supply unit, it is with the semiconductor package part facies posterior hepatis Centered on be arranged at the front of semiconductor package part facies posterior hepatis, cutting semiconductor batten is simultaneously supplied to semiconductor package part；And, Second supply unit, its rear that semiconductor package part facies posterior hepatis is arranged at centered on the semiconductor package part facies posterior hepatis is used The individualized semiconductor package part of pallet is loaded into supply.
First supply unit described herein includes：Semiconductor batten supply unit, for semiconductor supply batten；Semiconductor bar Plate cutting part, the semiconductor batten for that will be supplied cuts into multiple semiconductor package parts；Unit selection device, is cut in pickup In the state of the multiple semiconductor package parts for cutting, the semiconductor package part is set to be sent to drying device via wash mill；It is dry Dry device, for adsorbing the semiconductor package part received from the Unit selection device, it is on X/Y plane along X-direction It is mobile, it is defined by Y-axis and is rotated；And, permutation platform, the loading chute and unloaded half for loading above-mentioned semiconductor package part The portion off board of conductor packaging part is alternatively formed along X-axis and Y direction, and moves in the Y-axis direction.
Also, load the semiconductor package part that the drying device adsorbed or directly will be described in the permutation platform The semiconductor package part that drying device is adsorbed is attached to the fixed film of the semiconductor package part facies posterior hepatis.
Also, the semiconductor package part for being loaded into the permutation platform is picked up using the additional selector, and is adhered to In the fixed film of the semiconductor package part facies posterior hepatis.
Herein, the semiconductor package part press section is transferred along the direction vertical with the transfer direction of the framework, The semiconductor package part press section includes at least one pressing component, the setting direction of the pressing component and the framework Transfer direction is vertical, and parallel with the transfer direction of the semiconductor package part press section.
Also, the semiconductor package part press section lifts along Z-direction, the semiconductor package part press section is pressed Splenium part is installed by medium of elastomeric element, so as to flexibly support and the semiconductor package part that pressurizes.
Semiconductor package part processing unit of the invention, in the semiconductor package part will sputtering process completed from having After the framework apart of fixed film, by sputtering process, by the semiconductor package part deburring with various brushes or blower fan Portion's effectively removal is remained in after the burr of semiconductor package part, carries semiconductor package part.
Also, semiconductor package part processing unit of the invention, pickup is provided from semiconductor package part supply unit Semiconductor package part is simultaneously affixed to being used for after the framework of the fixed film of semiconductor package part sputtering process, by half Conductor packaging part press section applies pressure again in addition, so as to the attachment state of semiconductor package part can be strengthened.
Brief description of the drawings
Fig. 1 is the top view of one embodiment of semiconductor package part processing unit of the invention.
Fig. 2 is first unhairing in the semiconductor package part deburring portion for constituting semiconductor package part processing unit of the invention Pierce the exploded perspective view of unit.
Fig. 3 is first unhairing in the semiconductor package part deburring portion for constituting semiconductor package part processing unit of the invention Pierce the sectional view of unit.
Fig. 4 is second unhairing in the semiconductor package part deburring portion for constituting semiconductor package part processing unit of the invention Pierce the sectional view of unit.
Fig. 5 is the 3rd unhairing in the semiconductor package part deburring portion for constituting semiconductor package part processing unit of the invention Pierce the sectional view of one embodiment of unit.
Fig. 6 is the detailed running status schematic diagram of the 3rd deburring unit shown in Fig. 5.
Fig. 7 is another implementation in the semiconductor package part deburring portion for constituting semiconductor package part processing unit of the invention The sectional view of the 3rd deburring unit of example.
Fig. 8 is another implementation in the semiconductor package part deburring portion for constituting semiconductor package part processing unit of the invention The sectional view of the 3rd deburring unit of example.
The one embodiment in the semiconductor package part deburring portion of Fig. 9 semiconductor package part processing units of the invention is cutd open View.
Figure 10 is the another embodiment in the semiconductor package part deburring portion of semiconductor package part processing unit of the invention Sectional view.
Figure 11 is the another embodiment in the semiconductor package part deburring portion of semiconductor package part processing unit of the invention Sectional view.
Figure 12 is the top view of the another embodiment of semiconductor package part processing unit of the invention.Figure 13 is of the invention The top view of the another embodiment of semiconductor package part processing unit.
Figure 14 is the top view of the another embodiment of semiconductor package part processing unit of the invention.
Figure 15 is the top view of the another embodiment of semiconductor package part processing unit of the invention.
Figure 16 is an implementation of the semiconductor package part press section for constituting semiconductor package part processing unit of the invention The stereogram and enlarged drawing of example.
Figure 17 is the running status of the semiconductor package part press section shown in Figure 16.
Figure 18 is the another implementation of the semiconductor package part press section for constituting semiconductor package part processing unit of the invention The stereogram and enlarged drawing of example.
Figure 19 is the running status schematic diagram of the semiconductor package part press section shown in Figure 18.
Specific embodiment
Hereinafter, referring to the drawings, the preferred embodiments of the present invention are described in detail.But, the invention is not limited in saying herein Bright embodiment, but other forms can be embodied in.On the contrary, the embodiment introduced herein has become for disclosure Entirely, but also for fully transmitting thought of the invention to general technical staff of the technical field of the invention.In overall theory In bright book, same reference numerals represent identical structural element.
Fig. 1 is the top view of one embodiment of semiconductor package part processing unit 1 of the invention.
Semiconductor package part processing unit 1 of the invention includes：Framework supplies recoverer 100, and it partly leads in attachment multiple The framework (not shown) for performing sputtering process is supplied in the state of body packaging part, the framework of separate semiconductor packages part is reclaimed；Half Conductor packaging part separation unit 200, it passes through to detect that selector 230 is picked up from the framework of the said frame supply supply of recoverer 100 Take separate semiconductor packages part；And, semiconductor package part deburring portion 300, it includes the first deburring unit 310 and second Deburring unit 320, above-mentioned first deburring unit 310 includes will be by detecting selector 230 from above-mentioned semiconductor package part The semiconductor package part that separation unit 200 is separate is loaded into can be along the first saddle 510 of Y direction transfer and to semiconductor packages It is residual in order to wipe during in the state of being picked up with cleaning selector 370 by transfer after part deburring portion 300 transfers Stay in the burr of semiconductor package part and there is at least one rotating brush 311 of vertical rotating shaft, above-mentioned second deburring unit 330 include the round brush 331 with feathering axis, and above-mentioned first deburring unit 310 and above-mentioned second deburring unit 330 are wrapped The suction passage for sucking the burr for by brush separate is included, hair is removed in above-mentioned semiconductor package part deburring portion 300 The semiconductor package part of thorn is loaded into after the second saddle 530 that can be transferred along Y direction by cleaning selector 370, to The transfer of unloading selector 250 side.The semiconductor package part for being loaded into the second saddle is picked up by unloading selector 250, so that Semiconductor package part conveyor tray tr is loaded into semiconductor package part loading part 400.
Semiconductor package part processing unit 1 shown in Fig. 1 is related to be attached with the fixation of sputtering object semiconductor package part Film is attached in the state of the outer peripheral face of annular frame after performing sputtering process, from after fixed UF membrane semiconductor package part Removal remains in the semiconductor package part processing unit 1 of the burr of semiconductor package part.
Semiconductor package part can be attached to the central part for being arranged on annular frame in the state of only exposure upper side and side Fixed film state perform sputtering process.
Semiconductor package part processing unit 1 shown in Fig. 1 supplies recoverer 100 and takes out semiconductor packages with clip from framework Part picks up object-oriented framework, and transfers above-mentioned semiconductor package part to semiconductor package part separation unit 200 by framework selector 120 Pickup object-oriented framework.There can be the First look unit for being checked by the shooting of transfer framework in said frame selector 120 vu1。
Above-mentioned semiconductor package part separation unit 200 can be with the framework that can place the semiconductor package part for being attached with evaporation Platform tf.
The semiconductor package part for being attached to the fixed film of the framework being placed on above-mentioned tf can be by injector e and detection Selector 230 is from fixed UF membrane and is picked.
In the state of the framework of the fixed film of the semiconductor package part with attachment sputter process is positioned on platform, can borrow Help the injector e being arranged at below platform tf from fixed UF membrane semiconductor package part, the semiconductor package part of separation can be by upper Detection selector 230 is stated to pick up and the first saddle can be loaded into.
And, in the embodiment shown in fig. 1, above-mentioned tf and detection selector 230 can be transferred to Y-axis, above-mentioned injection Device e can be transferred to X-axis.
Also, for pick up the detection selector 230 of semiconductor package part have with forming a line along Y direction it is many Individual pickup unit 231, and the pickup unit separately adsorbs semiconductor package part or releasing to semiconductor package part Absorption.
Therefore, circle can be located at by above-mentioned injector e and above-mentioned detection selector 230 by detecting that selector 230 is picked up The semiconductor package part of the optional position of ring framework.
In above-mentioned semiconductor package part separation unit 200, by injector e and detection fixed film of the selector 230 from platform May be remained on separate semiconductor package part jagged.
Therefore, semiconductor package part processing unit 1 of the invention can possess for remove remain in semiconductor package part Semiconductor package part deburring portion 300.In the semiconductor of the semiconductor package part processing unit 1 of the invention shown in pie graph 1 Packaging part deburring portion 300, because semiconductor package part has various deburring units, so as to deburring work can be performed stage by stage Industry.Implementation shown in Fig. 1 is exemplified with three kinds of examples of deburring unit, and the accompanying drawing after reference picture 2 is described in detail for upper State semiconductor package part deburring portion 300.
The injector e of above-mentioned semiconductor package part separation unit 200 is successively to being attached to the semiconductor package part of fixed film Bottom surface is hit, so as to the multiple pickup units for being arranged at detection selector 230 can pick up the semiconductor from fixed UF membrane Packaging part.The burr of above-mentioned semiconductor package part can be remained in the removal of deburring portion 300.May include to be arranged at semiconductor unhairing The another cleaning selector 370 for setting and multiple deburring units that can be transferred to X-direction in thorn portion 300.
Above-mentioned cleaning selector 370 shown in Fig. 1 picks up semiconductor package with above-mentioned semiconductor package part deburring portion 300 The state of piece installing transfers the top of each deburring unit and removes flash removed to X-direction.Above-mentioned semiconductor package part deburring Portion 300 is arranged in parallel with multiple deburring units along Y direction, therefore, the cleaning selector transferred to X-direction can be disposable Clean the semiconductor package part picked up to Y direction.
It is as described below, in the multiple deburring units for constituting above-mentioned semiconductor package part deburring portion 300, multiple unhairings Thorn unit is configured side by side, and above-mentioned multiple deburring units can be made up of brush unit respectively, therefore, by above-mentioned cleaning selector 370 pickup semiconductor selectors come by deburring unit, and can remain in semiconductor package by brush friction or blast removal The burr of piece installing.
Therefore, the burr of semiconductor package part can completely be removed successively by multiple deburring units.
In above-mentioned semiconductor package part separation unit 200, by detecting the semiconductor package part needs that selector 230 is picked up Transferred to above-mentioned semiconductor package part deburring portion 300, with by the cleaning selector in above-mentioned semiconductor package part deburring portion 300 370 pickups.
Therefore, the semiconductor package part processing unit 1 of the invention shown in Fig. 1 includes：First saddle 510, it will be half Conductor packaging part separation unit 200 is detected the semiconductor package part of the pickup of selector 230 to above-mentioned semiconductor package part deburring Portion 300 transfers；And, the second saddle 530, it loads the first saddle and removes the semiconductor package part of flash removed and transferred.
Set from above-mentioned first saddle 510 to the semiconductor package part that above-mentioned semiconductor package part deburring portion 300 transfers The cleaning selector 370 that can be transferred to X-axis for being placed in semiconductor package part deburring portion 300 is picked up and transferred to X-direction, and Executable washing and cleaning operation.
As described above, constituting each burr retrieval unit in above-mentioned semiconductor package part deburring portion 300 to Y direction simultaneously Row is set, and the semiconductor package formed a line to Y direction on the cleaning selector 370 transferred to X-axis is thus performed by the stage The deburring operation of piece installing, so as to be completely removed burr.
Picked up by above-mentioned cleaning selector 370 and complete the packaging part of deburring operation to be positioned over the second saddle 530 State along unloading selector 250 transfer path transfer, so that encapsulation loading part can be loaded into by unloading selector 250 400。
Above-mentioned detection selector 230 and above-mentioned cleaning selector 370 can be transferred to Y direction respectively, in above-mentioned detection choosing Select on device 230 and above-mentioned cleaning selector 370 towards Y direction possess with corresponding spacing respectively have multiple pickup units 231, 251st, 371, accordingly formed with the interval with above-mentioned each pickup unit on above-mentioned first saddle 510, the second saddle 530 There is loading chute 511,531.
Therefore, the semiconductor package part for being selected by above-mentioned detection selector 230 is disposably loaded into the first saddle 510 Transferred afterwards, so as to disposably can pick up and perform washing and cleaning operation by cleaning selector 370.
The 5th visual unit vu5 is may also include, it is used to check what is transferred as above-mentioned first saddle 510 is placed on The die face of the upper side of semiconductor package part.
In the embodiment shown in fig. 1, above-mentioned semiconductor package part deburring unit include the first deburring unit 310 to 3rd deburring unit 350, in the state of being selected by above-mentioned cleaning selector 370, in above-mentioned first deburring unit 310 Deburring operation is performed successively to the 3rd deburring unit 350, after washing and cleaning operation is completed, by above-mentioned cleaning selector 370th, above-mentioned second saddle 530 and above-mentioned unloading selector 250 are transferred in reverse order, so as in above-mentioned semiconductor package part The semiconductor package part that deburring portion 300 is removed burr is picked up by above-mentioned unloading selector 250, so that can be by being loaded into The semiconductor package part loading part 400 of semiconductor package part conveyor tray is carried.
Can be with the second visual unit vu2 and the 3rd visual unit vu3, it is used for according to by above-mentioned unloading selector The inspection of the bottom surface or side of the 250 above-mentioned semiconductor package parts for picking up and being handled upside down.
Above-mentioned semiconductor package part loading part 400 has pallet selector 410, thus can carry and fill semiconductor package part Conveyor tray tr, and can by empty conveyor tray tr supplied to above-mentioned unloading selector 250 " loaded " position.
Also, the inspection result of visual unit, semiconductor package part is judged as bad or semiconductor package part size It is small and in the case of being difficult to be loaded into pallet, also can be by the other grade collection semiconductor packaging part of carrier box 430, rather than logical Cross conveyor tray collection.
Hereinafter, the semiconductor package part deburring portion for constituting semiconductor package part processing unit 1 of the invention is described in detail 300。
The semiconductor package part burr removal portion 300 for constituting semiconductor package part processing unit 1 of the invention includes：First Deburring unit 310, it includes at least one rotating brush 311 with rotary shaft, and the rotating brush is from above-mentioned semiconductor package The semiconductor package part that piece installing separation unit 200 is separate with the state that is picked by transfer during, remain in half for wiping The burr of conductor packaging part；And, the second deburring unit 330, it includes the round brush 331 for possessing feathering axis, above-mentioned One deburring unit 310 and above-mentioned second deburring unit 330 can possess the suction for sucking the burr for by brush separate Stream.
Hereinafter, the deburring unit in composition semiconductor package part deburring portion 300 is illustrated.
Fig. 2 is the first of the semiconductor package part deburring portion 300 for constituting semiconductor package part processing unit 1 of the invention The exploded perspective view of deburring unit 310, Fig. 3 is the semiconductor packages for constituting semiconductor package part processing unit 1 of the invention The sectional view of the first deburring unit 310 in part deburring portion 300.
Above-mentioned first deburring unit 310 may include the multiple rotating brushes 311 with vertical rotating shaft.Constitute above-mentioned first The rotating brush 311 of deburring unit 310 has substantial amounts of bristle 311a in vertical direction in groups, so that implantable in main body Part 311b.
Specifically, constitute the rotating brush 311 of above-mentioned first deburring unit 310 and be arranged with multiple with a row, constitute above-mentioned Multiple rotating brushes 311 of the first deburring unit 310 can be along perpendicular to separating from above-mentioned semiconductor package part separation unit 200 The Y direction of the transfer track of the cleaning selector 370 of semiconductor package part is arranged into a row and is formed.
And, as shown in Fig. 2 the multiple rotating brushes 311 for constituting above-mentioned first deburring unit 310 can be respectively arranged in outward Side face is formed with the rotary part 313 of screw thread 313b.
Above-mentioned rotary part 313 includes installing the mounting hole 313a of above-mentioned main element 311 and fixing axle 313c, above-mentioned solid Dead axle 313c, as medium, can rotatably be concluded in the peace for being formed in installing component 315 with bearing 314 by fastening bolt 316 Dress mouth 315b.
As shown in figure 3, each rotary part 313 of above-mentioned first deburring unit 310 and adjacent rotary part 313 it Between configured in the way of screw thread 313b mutually concludes, thus, when a rotary part 313 in multiple rotary parts 313 by During rotation motor rotation driving, rotate together with integral-rotation part 313, so as to one can only be possessed for rotating rotating brush 311 rotation motor 317.
And, can in the outer cover 319 for being rotatably mounted with the rotating brush 311 for constituting above-mentioned first deburring unit 310 It is formed with the suction passage 318 for sucking the burr for by brush separate.
Therefore, semiconductor package part can be to the transfer of the rotating brush of above-mentioned first deburring unit 310 top, if remaining in half The burr of conductor packaging part is separated, then drop to above-mentioned outer cover 319, and via the inlet hole 319h drops of above-mentioned outer cover 319 Burr for falling etc. can be discharged.
As shown in figure 3, by a rotation for rotation motor 317, the rotary shaft that multiple above-mentioned rotating brushes 311 can be vertical Centered on rotated respectively, therefore can pass through what above-mentioned rotating brush 311 was arranged to being picked up by above-mentioned cleaning selector 370 Side by side for the burr of multiple semiconductor package parts row of a row removes operation.Also, the implementation shown in Fig. 1 and Fig. 3 is exemplified First deburring unit 310 is arranged side by side the example of a row rotating brush 311, but, species, size according to semiconductor package part Or the demand such as the diameter of rotating brush, it is possible to have multiple row rotating brush.
Fig. 4 shows to constitute the of the semiconductor package part deburring portion 300 of semiconductor package part processing unit 1 of the invention The sectional view of two deburring units 330.
Such as explanation of reference picture 1, with above-mentioned second deburring unit 330 together from above-mentioned semiconductor package part separation unit After 200 separate, can be perpendicular to the direction of the transfer track of the semiconductor package part picked up by above-mentioned cleaning selector 370 It is arranged side-by-side.
Above-mentioned second deburring unit can have the round brush 331 rotated centered on feathering axis 331x.Above-mentioned second Deburring unit 330 is implanted with substantial amounts of bristle on rotary shaft 331x more long with radial, though above-mentioned rotary shaft not with Motor is orthogonal, can also be driven by the drive shaft 337x of motor 337 and drive belt 337b.
And, identically with above-mentioned first deburring unit 310, in above-mentioned second deburring unit 330 rotatably Being provided with the outer cover 336 of round brush 331 can have the suction passage 338 of the burr by brush separate for suction.
Therefore, semiconductor package part is transferred and separating residual to the top of the round brush 331 of above-mentioned second deburring unit 330 In the burr of semiconductor package part, then can land to above-mentioned outer cover 336, burr landed to above-mentioned outer cover 336 etc. is by above-mentioned Suction passage 338 is inhaled into, so that same discharge to outside.
Show the round brush 331 for constituting above-mentioned second deburring unit 330 in Y-axis side in the embodiment shown in Fig. 1 and Fig. 4 One is set up, it is mutual that the round brush 331 configured to Y direction can also be divided into multiple, or multiple round brush 331 Parallel mode is set.
Except the first deburring unit 310 with rotating brush 311 and the second deburring unit 330 with round brush 331, Semiconductor package part processing unit 1 of the invention may also include goes for removing the 3rd of the burr for remaining in semiconductor package part the Burr unit 350.
Above-mentioned first deburring unit 310 and above-mentioned second deburring unit 330 carry out Separate With Friction and are splashing using brush etc. Penetrate in operation and remain in the burr of semiconductor package part.But, the burr for from semiconductor package part separate is remained because of electrostatic etc. In semiconductor package part, can also possess the 3rd deburring unit 350 to remove above-mentioned burr.
Above-mentioned 3rd deburring unit 350 may include blower fan or fixed brush etc., and be not rotary-type brush.Reference Fig. 5 to Fig. 7 is illustrated.
Fig. 5 is the 3 of the semiconductor package part deburring portion 300 for constituting semiconductor package part processing unit 1 of the invention The sectional view of one embodiment of deburring unit 350a.
Fig. 6 shows the detailed running status of the 3rd deburring unit 350a shown in Fig. 5.
The rear side of above-mentioned second deburring unit 330 has the 3rd deburring unit 350a, above-mentioned 3rd deburring unit 350a is parallel with above-mentioned first deburring unit 310 and above-mentioned second burr removal unit 330, above-mentioned 3rd deburring unit 350a can have blower fan and suction passage.
Above-mentioned 3rd deburring unit 350a shown in Fig. 5 and Fig. 6 can have blower fan.Gone in the second deburring unit 330 After the semiconductor package part of flash removed is transferred to the top of the 3rd deburring unit 350, in the state of decline, the above-mentioned 3rd goes The blower fan of burr unit 350a sprays compressed air to the side surface direction of semiconductor package part and bottom surface face direction, so as to remove residual Stay in the burr of semiconductor package part.
The outer cover 354a for constituting the blower fan of above-mentioned 3rd deburring unit 350a is formed with unhairing in central part towards Y direction Thorn space 354a3, has injection stream 354a1,354a2 and the spray of compressed air in the side and bottom surface in above-mentioned deburring space Loophole 354a5, such that it is able to spray compressed air.And, the suction being connected by the outer cover with blower fan is flowed into 354a4 and sucked The burr that is separated by compressed air and dispersed simultaneously is discharged to outside.
Shown in enlarged drawing as shown in Figure 6, in order to the semiconductor package part picked up by above-mentioned cleaning selector 370 Side and bottom surface injection compressed air in the inside for being formed at the deburring space 354a3 of the outer cover of above-mentioned blower fan, it is necessary to configure There is semiconductor package part, therefore, the pickup unit 371 of above-mentioned cleaning selector 370 needs to decline predetermined altitude.
That is, in the embodiment shown in Fig. 5 and Fig. 6, by the first deburring unit 310 and the second deburring unit 330 Top and need temporarily to decline in the 3rd deburring unit 350 with the cleaning selector 370 that predetermined altitude is transferred, just can be to half The side of conductor packaging part and bottom surface injection compressed air.Therefore, in the embodiment shown in Fig. 5 and Fig. 6, in order to be gone the 3rd Burr unit 350 carries out deburring operation by blower fan, and cleaning selector 370 needs temporarily decline, and this point is likely to become work The factor that sequence postpones.
Fig. 7 be constitute semiconductor package part processing unit 1 of the invention semiconductor package part deburring portion 300 it is another The sectional view of the 3rd deburring unit 350b of embodiment.
The blower fan of the above-mentioned 3rd deburring unit 350 shown in Fig. 7 is characterized in, in the second deburring unit 330 After the semiconductor package part of flash removed is transferred to the top of the 3rd deburring unit 350b, constituted in the lower section of semiconductor package part The inclined face 354b5 of outer cover medial surface of the blower fan of above-mentioned 3rd deburring unit 350b, and by above-mentioned inclined plane 354b5 to Diagonal sprays compressed air.
Therefore, with the embodiment shown in Fig. 5 and Fig. 6 differently, in the embodiment shown in fig. 7, in cleaning selector 370 It is transferred in the state of the top of the 3rd deburring unit 350, does not have extra down maneuver, from injection stream 354b1 and spray The compressed air of loophole injection is sprayed along the inclined plane 354b5 of outer cover to the bottom surface of semiconductor package part and side, so that can Removal remains in the burr of semiconductor package part.
Fig. 8 is the fixation in the semiconductor package part deburring portion 300 for constituting semiconductor package part processing unit 1 of the invention The sectional view of type brush unit.
Embodiment shown in Fig. 5 to Fig. 7 is gone using above-mentioned 3rd west unit 350 by the compressed air based on blower fan Except the method for the burr for remaining in semiconductor package part.
As above told, above-mentioned 3rd deburring unit 350 is blown away or removed and fails in semiconductor package part for assistance Burr for removing completely etc..
Therefore, above-mentioned 3rd deburring unit 350 also can be used fixed brush, and simultaneously non-usage rotating brush, equally, quilt The burr of separation can be discharged by suction passage to outside.
In the embodiment shown in fig. 8, there is the 3rd deburring unit at the rear of above-mentioned second deburring unit 330 350c, above-mentioned 3rd deburring unit 350c are flat with above-mentioned first deburring unit 310 and above-mentioned second deburring unit 330 OK, above-mentioned 3rd deburring unit 350c has fixed brush 351c, can have suction passage at the center of above-mentioned fixed brush 351c 358c。
It is identical with the embodiment shown in Fig. 7 in the case of including fixed brush 351c as described above, by the 3rd In the cleaning process of deburring unit 350, even if cleaning selector 370 does not decline, it is also possible to by the faint of fixed brush Frictional force removes the burr of residual, and the burr of removal can suck and be discharged by suction passage.
Semiconductor package part processing unit 1 of the invention shown in Fig. 1 completes the semiconductor package part of sputtering from being attached with The pickup semiconductor package part such as framework, and removal remains in semiconductor package part in semiconductor package part deburring portion 300 After burr, the loading chute 531 of the second saddle 530 is loaded into.
As described above, the semiconductor package part deburring portion 300 for constituting semiconductor package part processing unit 1 of the invention wraps Include：First deburring unit 310, it has rotating brush 311；And, the second deburring unit 330, it has round brush 331, and The 3rd deburring unit 350 can also be included, above-mentioned 3rd deburring unit 350 includes blower fan or fixed brush.
And, such as explanation that carries out of reference picture 1, the deburring unit 350 of the first deburring unit 310 to the 3rd can towards with As the vertical Y direction of the X-direction of the transfer direction of above-mentioned cleaning selector 370 with long to being arranged side-by-side.
Reference picture 9 and the above-mentioned pickup semiconductor package part of cleaning selector 370 of brief description of the drawings afterwards and insertion above-mentioned half Conductor packaging part burr removal portion 300 simultaneously goes the process of flash removed.
Fig. 9 is an implementation in the semiconductor package part deburring portion 300 of semiconductor package part processing unit 1 of the invention The sectional view of example, Figure 10 is the another of the semiconductor package part deburring portion 300 of semiconductor package part processing unit 1 of the invention The sectional view of embodiment, Figure 11 is the semiconductor package part deburring portion 300 of semiconductor package part processing unit 1 of the invention The sectional view of another embodiment.
Specifically, the 3rd deburring unit 350a of Fig. 9 includes the fan unit with reference to above-mentioned Fig. 5 and Fig. 6, the of Figure 10 Three deburring unit 350c include the fixed brush of reference picture 8, and the 3rd deburring unit 350d of Figure 11 includes the wind of neomorph Machine.
In the embodiment shown in fig. 9, the semiconductor package part for being picked up by above-mentioned cleaning selector 370 can level transfer To the height that the bottom surface and side of semiconductor package part can rub with rotating brush 311 or round brush 331.
Thus, the burr quilt remained on the semiconductor package part that the state picked up with being cleaned selector 370 is transferred After rotating brush 311 and round brush 331 are removed successively, the top of the 3rd deburring unit 350 can be shifted into.
Above-mentioned 3rd deburring unit 350a may include blower fan, and the explanation that reference picture 5 and Fig. 6 are carried out is removed empty in burr Between inside there is semiconductor package part in the state of, to the side of semiconductor package part and bottom surface direction injection compressed air, Therefore, above-mentioned cleaning selector 370 needs to decline.
Selector 370 is cleaned after the 3rd deburring unit 350a completes the cleaning of semiconductor package part to rise and cause half Conductor packaging part is handled upside down in the case of will not being contacted with rotating brush or the grade of round brush 331.
Conversely, in the embodiment shown in fig. 10, the 3rd deburring unit 350c includes fixed brush, therefore, with Fig. 9 institutes The embodiment shown is different, without declining semiconductor package part in order to spray compressed air.
Therefore, in the embodiment shown in fig. 10, semiconductor package part can be turned round and look to horizontal direction and remove list with the first burr The brush of first 310, second deburring unit 330 and the 3rd deburring unit 350c completes cleaning after contiguously being transferred successively.
Different from the blower fan in Fig. 5 to Fig. 7, the 3rd deburring unit 350d of the embodiment shown in Figure 11 has suck stream The structure that road and blower fan are separated.
That is, the blower fan 351d of the embodiment shown in Figure 11 is air knife shape, with can be to the semiconductor package part transferred Diagonal spray compressed air structure, there is suction passage 358d at the rear of above-mentioned blower fan, so as to pressure can be distinguished The suction position of the eject position of contracting air and the burr for being dispersed.
By the above method, after completing the semiconductor package part of sputtering process from the framework apart with fixed film, lead to Sputtering process is crossed, semiconductor package is remained in by the effectively removal of the semiconductor package part deburring portion with various brushes or blower fan Piece installing, and carry semiconductor package part.
Semiconductor package part processing unit 1 of the invention referring to figs. 1 to Figure 11 explanations is divided from the fixed film of framework After remaining in the burr of semiconductor package part from the semiconductor package part and removal that complete sputtering, tray, conveying is loaded into The device that disk tr is carried.
Also, semiconductor package part processing unit 1 of the invention may include in order to carry out sputtering process and from semiconductor package Piece installing supply unit A picks up semiconductor package part and is affixed to have the device of the framework for fixing film for sputtering process.
Specifically, the present invention can provide semiconductor package part processing unit 1 ', and it includes：Semiconductor package part supply unit A, It is used to supply sputtering object semiconductor package part；Semiconductor package part facies posterior hepatis 200, it is picked up by above-mentioned half by selector The semiconductor package part of conductor packaging part supply unit A supplies, and semiconductor package part is attached to is formed at for sputtering process Annular frame central part fixed film on；Semiconductor package part press section 700, in above-mentioned semiconductor package part facies posterior hepatis 200, pressure is applied to the semiconductor package part for being attached to the fixed film of framework from top, so as to strengthen semiconductor package part and consolidate Determine the attachment state of film；And, framework supply recoverer 100 supplies the frame of sky to above-mentioned semiconductor package part facies posterior hepatis 200 Frame, and carry the framework of the semiconductor package part pressurizeed in the completion of above-mentioned semiconductor package part press section 700.
Figure 12 is the top view of the another embodiment of semiconductor package part processing unit 1' of the invention.
With the semiconductor package part processing unit 1 shown in Fig. 1 differently, the semiconductor package part processing unit shown in Figure 12 1' is will to pick up to be loaded into after the sputtering object semiconductor package part of supply tray by selector, attached in semiconductor package part The device that above-mentioned semiconductor package part is attached to the empty framework supplied by framework supply recoverer 100 in portion 200.
Also, the semiconductor package part processing unit 1 shown in Fig. 1 is to separate to complete sputtering from semiconductor separation unit 200 After semiconductor package part, remove flash removed in semiconductor package part deburring portion 300 and be loaded into transportation tray and removed Fortune, but, the semiconductor package part processing unit 1' shown in Figure 12 can possess semiconductor package part press section 700, and it is used for Pressure is applied to the semiconductor package part for being attached to the fixed film of framework from top in above-mentioned semiconductor package part facies posterior hepatis 200, So as to strengthen the attachment state of semiconductor package part and fixed film.
That is, difference is, the semiconductor package part processing unit 1 shown in Fig. 1 has and remains in completion for removal The semiconductor package part deburring portion 300 of the burr of the semiconductor package part of sputtering, the semiconductor package part treatment shown in Figure 12 Device 1' have will sputtering object semiconductor package part be attached to after the fixed film for being arranged on framework, for strengthening semiconductor The semiconductor package part press section 700 of the attachment state of packaging part and fixed film.
Also, the transportation tray and detection selector 230 of the semiconductor package part processing unit 1 shown in Fig. 1 and Figure 12 institutes The supply tray and additional selector 810a, 810b of the semiconductor package part processing unit 1' for showing are corresponding.Also, shown in Figure 12 Above-mentioned additional selector 810a, 810b possess towards transfer direction arrange and independently drive multiple pickup unit 811a, 811b is also identical with the above-mentioned detection selector 230 shown in Fig. 1 from this point on.
Also, supplied with the state for adhering to multiple semiconductor package parts of the semiconductor package part processing unit 1 shown in Fig. 1 The framework of sputtering process is performed, the framework supply recoverer 100 of the framework of separate semiconductor packages part is reclaimed and to shown in Figure 12 Semiconductor package part processing unit 1' above-mentioned semiconductor package part facies posterior hepatis 200 supply sky framework, and carrying be attached with The framework that the framework of the semiconductor package part of pressurization is completed in above-mentioned semiconductor package part press section 700 supplies the phase of recoverer 100 Correspondence.
Also, above-mentioned semiconductor package part deburring portion 300 in the embodiment shown in fig. 1 eliminates partly leading for burr Body packaging part is chosen device and picks up and be loaded on the semiconductor package part loading part of semiconductor package part conveyor tray tr 400 can be relative with the semiconductor package part supply unit A of the sputtering object semiconductor package part of the embodiment shown in supply Figure 12 Should, from the framework of the said frame of the embodiment shown in Fig. 1 supply supply of recoverer 100, picked up by selector and partly led The semiconductor package part attachment of body packaging part and separate semiconductor package part separation unit 200 and the embodiment shown in Figure 12 Portion 200 is corresponding, and the semiconductor package part facies posterior hepatis is used for the semiconductor package for providing above-mentioned semiconductor package part supply unit A Piece installing is picked up by selector, and is affixed to be arranged on the fixation adhesive tape in the annular frame center portion for sputtering process On.
In sum, the semiconductor package part treatment dress shown in the semiconductor package part processing unit and Figure 12 shown in Fig. 1 Put has similar layout respectively, but, whether its distinctive points is the transfer path of semiconductor package part conversely, and performing removal The treatment of burr or whether perform attachment state for strengthening semiconductor package part and fixed film push action treatment.
The mode that the semiconductor package part press section 700 of the embodiment shown in Figure 12 can be transferred to X-direction is installed, and is constituted At least one pressing component of semiconductor package part press section 700 also can be in the elongated shape set to X-direction.
And, as shown in figure 12, in above-mentioned semiconductor package part facies posterior hepatis 200, the transfer direction of above-mentioned and above-mentioned attached Plus the transfer direction of selector 810a, 810b can be mutually perpendicular to.
Embodiment shown in Figure 12 may include：6th visual unit vu6, in said frame supply recoverer 100 The shooting inspection of the platform transferred by framework selector 210；8th visual unit vu8 and the 9th visual unit vu10, is installed on A pair of additional selectors 810a, 810b, check for performing lower section shooting；Tenth visual unit vu10, is installed on and above-mentioned partly leads Body packaging part press section 700, and also can possess the 7th visual unit vu7, it can be in order to added by above-mentioned a pair The shooting inspection of the pick-up situation of the semiconductor package part that selector 810a, 810b are picked up, performs top shooting and checks.
Figure 13 is the top view of the another embodiment of semiconductor package part processing unit 1 ' of the invention.
Embodiment shown in Figure 13 is different with the embodiment shown in Figure 12, and the position of visual unit can be different.This be in order to Reduce the mobile route of above-mentioned additional selector 810a, 810b.
Different from the embodiment shown in Figure 12, in the embodiment shown in fig. 13, the 11st visual unit vu11 is located at half Between conductor packaging part supply unit A and platform, the transfer distance of above-mentioned a pair of additional selectors 810a, 810b, therefore tool can be reduced The effect of the efficiency of operation is improved, the 11st visual unit is used to perform top shooting inspection, to perform by above-mentioned one Shooting inspection to the pick-up situation of the semiconductor package part of additional selector 810a, 810b pickup.
On the other hand, the semiconductor package part supply unit A of the embodiment shown in Figure 12 or Figure 13 is by being mounted with individually The semiconductor package part supply tray of semiconductor package part supply, but, the semiconductor package in embodiment shown in Figure 14 Piece installing supply unit A, cuts cutter unit 630 to make semiconductor batten (strip) individualized and supply by semiconductor batten.
The semiconductor package part supply unit of another embodiment of the present invention includes：First supply unit, it is with above-mentioned semiconductor The front of above-mentioned semiconductor package part facies posterior hepatis is arranged at centered on packaging part facies posterior hepatis, for cutting cutting semiconductor batten and Supplied as semiconductor package part；And, the second supply unit, it is arranged at centered on above-mentioned semiconductor package part facies posterior hepatis The rear of semiconductor package part facies posterior hepatis is stated, the individualized semiconductor package part of pallet is loaded into for supplying.
Above-mentioned first supply unit includes：Semiconductor batten supply unit, for semiconductor supply batten；Semiconductor batten cuts Portion, the semiconductor batten for that will be supplied cuts into multiple semiconductor package parts；Unit selection device, pickup be cut it is many In the state of individual semiconductor package part, semiconductor package part is transferred to drying device via wash mill；Drying device, is used for The above-mentioned semiconductor package part received from said units selector is adsorbed, on X/Y plane, is moved along X-direction, be with Y-axis Standard is rotated；And, permutation platform is alternatively formed the loading for loading above-mentioned semiconductor package part along X-axis and Y direction The portion off board of groove and unloaded semiconductor package part, and can be moved along Y direction.Therefore, the first supply unit is by supply And cutting semiconductor batten realizes the individualized of semiconductor package part, thus can be supplied to sputter object semiconductor package part.
Figure 14 is the top view of the another embodiment of semiconductor package part processing unit 1' of the invention.Figure 14 be Figure 12 and A form for material supply unit is added in Figure 13 embodiment forms.As shown in FIG. 12 and 13, semiconductor packages of the invention Part processing unit can respectively provide individualized semiconductor package part, but, in the present embodiment, supply the material of batten form Material, so as to can provide by stage washing, dry semiconductor package part.
The figure of the above-mentioned semiconductor package part supply unit A of reference picture 14 and Figure 15, gives the account in greater detail.Omit with The explanation that the explanation of reference picture 12 and Figure 13 is repeated, below, illustrate newly-increased the first supply unit and utilization its semiconductor packages Part processing method.
In above-mentioned semiconductor package part supply unit A, semiconductor bar flaggy is laminated in box 700, and semiconductor batten is pressed from both sides Sub- 600g draws and is supplied to successively.
Cutting object semiconductor batten s can be arranged along X-axis and Y direction for multiple semiconductor package parts with matrix shape The elongated tetragonal material of row, in its length direction mode parallel with X-direction to above-mentioned semiconductor bar plate cutter sweep The 600 above-mentioned semiconductor battens of supply.
Multiple cutting object semiconductor battens can be loaded into box M supply, if clip 600g successively by semiconductor batten to Above-mentioned semiconductor batten cutter sweep 600 side-lining, then to the semiconductor batten s of X-direction propulsion to for guiding semiconductor The inner side of entrance track 610 of batten and the semiconductor cutter sweep 600 that sets enters.
Above-mentioned batten selector 615 carries semiconductor batten to chuck table 650.
That is, the above-mentioned vacuum suction semiconductor batten of batten selector 615, with the die face of semiconductor package part with direction The state of side is transferred to chuck table.
Above-mentioned chuck table 650 can be moved on X/Y plane to optional position, and can be pivoted about with Z axis, be inhaled The semiconductor batten for investing above-mentioned chuck table 650 is cut into individualized semiconductor packages by least one cutter unit 630 Part.Cutter unit 630 has two cutting knifes in embodiment shown in Figure 14.
Also, during above-mentioned cutting cutter unit 630 with the relative displacement of above-mentioned chuck table 650, it is adsorbed in above-mentioned It is single semiconductor package part that the semiconductor batten of chuck table 650 is cleavable, and the multiple semiconductor package parts for completing cutting are borrowed Unit selectors are helped to be transferred by disposable pickup.
The disposal vacuum of said units selector 670 adsorbs multiple semiconductor package parts and picks up, thus single via washing Unit 640 transfers or transmits to drying device described later 520, and executable washing procedure and drying process.In cutting process, on Stating washing unit 640 may include to remove brush unit, blower fan and the spraying cleaning solution of the dust for remaining in semiconductor package part etc. Unit etc..
The multiple semiconductor package parts for being picked up by said units selector 670 and being washed in above-mentioned washing unit 640 Can be loaded with being adsorbed in the state being arranged on the loading chute of drying device 520, above-mentioned drying device constitutes conductor encapsulation Adsorption section 400.
The embedment of above-mentioned drying device 520 has hot line and can perform drying process, constitutes above-mentioned semiconductor package part supply The drying device 520 of portion A may also include the quick turn over function for spinning upside down and the transfer to X-direction or Y direction Function.
That is, the semiconductor package part that the above-mentioned absorption of drying device 520 is cut and washs, along X-axis side on X/Y plane To or Y direction move, be defined by Y-axis on X/Y plane and rotated.
Drying device 520 is loaded into by the part in the semiconductor package part that said units selector 670 is picked up Upper side (simultaneously), remaining semiconductor package part is loaded into the bottom surface (another side) of drying device 520.
And, can form whole with the first loading area and the second loading area in the side of above-mentioned drying device 520 Row platform 530, has been alternatively formed along X-axis and Y direction in the first loading area and the second loading area and (has been arranged with chess row Row) adsorb and load the suction inlet of semiconductor package part and the portion off board of unloaded semiconductor package part.
In the case where each loading area of permutation platform 530 loads semiconductor package part, the dress of permutation platform 530 is formed at It is in not intensive and seamless lattice type to carry groove, but only in the adjacent lattice type of diagonal or grid print (with complications Type air pressure stream is connected).
The half of the upper side and bottom surface of only one side or the above-mentioned drying device 520 of above-mentioned drying device 520 is loaded into respectively After conductor packaging part is transferred to above-mentioned permutation platform 530, respectively will be by dry semiconductor package by splitting the method for loading etc. Piece installing is loaded into each loading chute 531a, the 531b for being arranged at the first loading area and the second loading area, and above-mentioned first loads Region and the second loading area are arranged at above-mentioned permutation platform 530.Then, if permutation platform 530 is moved to Y direction, additional choosing Select device 810a, 810b pickup to be loaded into after the semiconductor package part of permutation platform, each is adhered in the fixed film for being attached to framework Semiconductor package part.
Semiconductor package part is being attached to setting by semiconductor package part processing unit of the invention for sputtering process During fixed film on framework, as shown in Figure 12 or Figure 13, attachment object semiconductor package part can be loaded into pallet State provide, but embodiment as shown in figure 14, it is also possible to cut simultaneously using in semiconductor batten cutter sweep 600 After supply, additional selector 810a, 810b pick up above-mentioned semiconductor batten and are affixed to platform, and in semiconductor package part The method that press section 700 strengthens its attachment state.
Moreover, it is also possible to which the semiconductor package part that will not be adsorbed in drying device is positioned over permutation platform, but dries Device is moved to X-axis, and the state that the top and bottom of semiconductor package part invert is attached directly to the fixed film of framework.
Therefore, in these cases, drying device also can perform the function of additional selector.I.e., in fig. 14, in supply Cut after semiconductor batten and the supply of the state of individualized semi-conducting material, as shown in Figure 12 and Figure 13, in pallet point Do not load after the state supply of individualized semiconductor package part, semiconductor package is picked up by additional selector 810a, 810b Piece installing simultaneously is affixed to fix film.
That is, it is as follows in the method for fixed film attachment semiconductor package part of the invention according to Figure 14 and Figure 15, will be adsorbed in The semiconductor package part of drying device is directly passed with the state that the top and bottom of semiconductor package part overturn to the loading chute of permutation platform After sending, picked up by additional selector and be loaded into the semiconductor package part of permutation platform and be affixed to semiconductor package part Fixed film, the semiconductor package part that can will be also adsorbed in drying device is attached directly to semiconductor package with the state that top and bottom overturn On the fixed film of piece installing facies posterior hepatis.
And, in the embodiment shown in fig. 14, the side also to be transferred to X-direction of semiconductor package part press section 700 Formula is installed, and at least one pressing component for constituting semiconductor package part press section 700 is in elongated, such as Figure 14 also along X-direction It is shown, in above-mentioned semiconductor package part facies posterior hepatis 200, the transfer direction of above-mentioned and above-mentioned additional selector 810a, 810b Transfer direction be also vertical.
Same as the previously described embodiments, the embodiment shown in Figure 14 may include：8th visual unit vu8 and the 9th visual unit Vu9, is installed on a pair of additional selectors 810a, 810b, is checked for performing lower section shooting；And, the tenth visual unit vu10, It is installed on above-mentioned semiconductor press section 700, for the semiconductor package picked up by above-mentioned a pair of additional selectors 810a, 810b The shooting inspection of the pick-up situation of piece installing, with for performing the 7th visual unit vu7 that top shooting is checked.
Figure 15 is the top view of the another embodiment of semiconductor package part processing unit 1' of the invention.Omit and reference picture The 14 explanation identical explanations for carrying out.The position of the visual unit in the embodiment shown in embodiment and Figure 14 shown in Figure 15 is not Together.
Different from the embodiment shown in Figure 14, the embodiment shown in Figure 15 is same as the previously described embodiments, in order to by above-mentioned one The shooting inspection of the pick-up situation of the semiconductor package part picked up to additional selector 810a, 810b, takes the photograph for performing top As the 11st visual unit vu11 for checking is located between semiconductor package part supply unit A and platform, so as to can reduce above-mentioned a pair The transfer distance of additional selector 810a, 810b.
Hereinafter, reference picture 16 describes the semiconductor package part for constituting semiconductor package part processing unit 1 of the invention in detail The structure and operation method of press section 700.
Figure 16 is of the semiconductor package part press section 700 for constituting semiconductor package part processing unit 1' of the invention The stereogram and enlarged drawing of embodiment.
The semiconductor package part press section 700 of semiconductor package part processing unit 1' of the invention performs pressing semiconductor package The upper side of piece installing and stressed operation is applied to it so that be loaded into sky framework t semiconductor package part and be coated on frame The adhesive of frame is uniformly and stably bonded.
In the case, above-mentioned semiconductor package part press section 700 presses multiple semiconductor package parts simultaneously, so as to can carry Height pressing and the efficiency of attachment operation.Describe in detail as follows.
The transfer direction of the transfer direction with above-mentioned of above-mentioned semiconductor package part press section 700 is perpendicular, above-mentioned partly to lead Body packaging part press section 700 may include at least one pressing component 710, and the pressing component is along the transfer direction with above-mentioned Direction configuration vertically parallel with the transfer direction of above-mentioned semiconductor package part press section 700.
Above-mentioned semiconductor package part press section 700 shown in Figure 16 have be arranged in a row for semiconductor package part Upper side apply stressed multiple pressing components 710.
Each pressing component 710 can be made up of rubber of flexible material etc., and each pressing component 710 can be by elastomeric element 720 resilient support.Therefore, semiconductor package part press section 700 declines and applies pressure to the upper side of each semiconductor package part During power, plus-pressure is restricted in the presence of elastomeric element 720, so as to semiconductor package part can be prevented to be damaged.
As shown in the enlarged drawing of Figure 16, each pressable of pressing component 710 multiple semiconductor package part, multiple pressing components 710 depression bars 730 for being constituted press section 700 for medium is installed on each elastomeric element 720.
Above-mentioned press section 700 is mountable to the lift 740 lifted along Z axis.
The multiple pressing components 710 for being installed on above-mentioned press section 730 are a row along Y direction spread configuration, above-mentioned to press Splenium 730 can also be transferred along Y direction, be shelved with the platform of framework of attachment sputtering object semiconductor package part along X-axis side To transfer, platform is transferred along X-direction in the semiconductor package part for be attached to said frame, and edge is independently configured with position The pressing component 710 for the semiconductor package part press section 700 of Y direction transfer is pressed, so as to framework can be stably attached to.
Figure 17 is the running status schematic diagram of the semiconductor package part press section 700 shown in Figure 16.
Specifically, (a) of Figure 17 is pressurization or pressing position of the semiconductor package part press section 700 to semiconductor package part The schematic diagram of the process declined after transfer, (b) of Figure 17 is the pressing component 710 pairs for constituting semiconductor package part press section 700 The upper side of semiconductor package part applies to preset the pressure of time, and thus semiconductor package part is attached to the process of framework Schematic diagram.
Each pressing component 710 applies pressure to a upper side for semiconductor package part respectively so that be attached to framework Semiconductor package part be equably attached to framework by being coated on the adhesive of framework.
Figure 18 be constitute semiconductor package part processing unit 1' of the invention semiconductor package part press section 700 it is another The stereogram and enlarged drawing of embodiment, Figure 19 are the running status of the semiconductor package part press section 700 shown in Figure 18.Omit with The explanation identical explanation of reference picture 16 and Figure 17.
With the pressing component shown in Fig. 2 and Fig. 3 differently, in the embodiment shown in Figure 18 and Figure 19, a press section Part 710' can apply pressure to multiple semiconductor package parts.That is, pressing component 710' can be elongated, so that a pressing component It is corresponding with multiple semiconductor package parts.
Also, identically with the embodiment shown in Figure 16 and Figure 17, above-mentioned pressing component 710' can be along the transfer with platform The vertical direction in direction is installed on above-mentioned press section 730 side by side.
Also, the embodiment shown in Figure 18 and Figure 19 is also provided with elastomeric element 720, thus, in pressing component 710 pairs half Conductor packaging part limits stressed size in a period of performing push action, is prevented because to the indivedual of difference in height with this The damage that semiconductor package part provides identical plus-pressure and occurs.
In the embodiment shown in Figure 18 and Figure 19, a two ends of pressing component 710' are respectively with elastomeric element 720 Medium is connected with press section 730, but, length according to pressing component 710' etc., the position being connected with above-mentioned press section 730 The variable amounts put.That is, in the embodiment shown in Figure 18 and Figure 19,2 pressing component 710' are only installed on a press section 730, but pressing component quantity changeable, the length according to pressing component etc., the quantity of link position can increase and decrease.
It is, size of pressing component of semiconductor package part press section 700 shown in Figure 16 to Figure 19 etc. can be with Change, but the quantity that common ground is the semiconductor package part part for being pressurized by decline sliding action successively and being adhered to is It is multiple.Thus, the efficiency of the attachment operation based on semiconductor package part push action can be improved.
By the above method, the semiconductor package part that present invention pickup is provided from semiconductor package part supply unit, and by its It is another by semiconductor package part press section after being attached to the framework for the fixed film of semiconductor package part sputtering process Row applies pressure, so as to the attachment state of semiconductor package part can be strengthened.Can be fixed after attachment.
Also, after additional selector 810a, 810b attachment semiconductor package part, do not use additional selector to press again Semiconductor package part, but strengthen attachment state by setting other semiconductor package part press section, it is possible thereby to Prevent operation from concentrating on additional selector, output hourly (UPH) is favorably improved by separating each operation portion.
In this manual, it is illustrated with reference to the preferred embodiments of the present invention, but, the technical field of the invention The thought of the invention described in without departing from the claimed scope of invention described below of those of ordinary skill and field In the range of can carry out various revisions and change to the present invention.Therefore, if the implementation of deformation consists essentially of application claims guarantor The structural element of scope is protected, then belongs to technology category of the invention.

Claims (13)

1. a kind of semiconductor package part processing unit, it is characterised in that including：
Framework supplies recoverer, and it is used to supply the frame that sputtering process is performed in the state of multiple semiconductor package parts are attached with Frame, and reclaim the empty framework for separating the semiconductor package part；
Semiconductor package part separation unit, it picks up the semiconductor packages for being attached to the framework for being supplied using detection selector Part, so that the semiconductor package part is from the framework apart；
Semiconductor package part deburring portion, it includes multiple deburring units, in transfer from above-mentioned semiconductor package part separation unit During the semiconductor package part of separation, the deburring unit removal remains in the burr on the semiconductor package part；
Multiple saddles, it is used to load the semiconductor package part picked up by the detection selector, or is removed for loading The semiconductor package part of burr；And,
Semiconductor package part loading part, the described of flash removed that go that the saddle is loaded into by unloading selector pickup is partly led Body packaging part, and it is loaded into semiconductor package part conveyor tray.
2. semiconductor package part processing unit according to claim 1, it is characterised in that
The semiconductor package part deburring portion also includes cleaning selector, and the cleaning selector pickup is loaded into the saddle On semiconductor package part, to above-mentioned deburring unit top transfer,
The deburring unit includes：
First deburring unit, it includes the more than one rotating brush with vertical rotating shaft；And,
Second deburring unit, it includes the round brush with feathering axis,
The first deburring unit and the second deburring unit are arranged side by side and remove flash removed successively.
3. semiconductor package part processing unit according to claim 2, it is characterised in that
The saddle includes：
First saddle, its be used for load by it is described detect selector from the semiconductor package part separate section from semiconductor Packaging part；And,
Second saddle, it is used to load the semiconductor package part for removing flash removed by the cleaning selector,
First saddle and second saddle are transferred to Y direction independently of each other.
4. semiconductor package part processing unit according to claim 1, it is characterised in that constitute the first deburring list Multiple rotating brushes of unit are respectively arranged in and are formed with the rotary part of screw thread in outer peripheral face, each rotary part and adjacent rotation Mutually concluded with screw thread between rotation member, when a rotary part in multiple rotary parts is by rotation motor rotation driving, All rotary parts are rotated simultaneously.
5. semiconductor package part processing unit according to claim 2, it is characterised in that
The vertical bristle being implanted with largely in groups on the rotating brush of the first deburring unit is constituted,
The second deburring unit is implanted with substantial amounts of bristle in its elongated rotary shaft with radiation, and the rotary shaft is borrowed The drive shaft and drive belt of motor is helped to drive.
6. semiconductor package part processing unit according to claim 2, it is characterised in that
The deburring unit also includes the 3rd deburring unit, and the 3rd deburring unit is in the second deburring unit Rear it is parallel with the first deburring unit and the second deburring unit and set,
The 3rd deburring unit includes blower fan and suction passage, and the blower fan is by the second deburring unit The semiconductor package part of flash removed is gone to be sprayed to the side surface direction of the semiconductor package part or bottom surface direction or diagonal Compressed air remains in the burr of semiconductor package part to remove.
7. a kind of semiconductor package part processing unit, it is characterised in that including：
Semiconductor package part supply unit, for supplying sputtering object semiconductor package part；
Semiconductor package part facies posterior hepatis, it is picked up using additional selector and is partly led by what the semiconductor package part supply unit was supplied Body packaging part, and semiconductor package part is attached to fixed film, the fixed film is arranged at the ring-shaped frame for sputtering process；
Semiconductor package part press section, it is being arranged at framework from top to being attached in the semiconductor package part facies posterior hepatis The semiconductor package part of fixed film apply pressure, to strengthen the attachment state of semiconductor package part and fixed film；And,
Framework supplies recoverer, and it adheres to semiconductor package part to the empty framework of semiconductor package part facies posterior hepatis supply After the fixed film of the framework, reclaim and complete the framework of pressurization in the semiconductor package part press section.
8. semiconductor package part processing unit according to claim 7, it is characterised in that the semiconductor package part supply Portion includes：
First supply unit, before it is arranged at semiconductor package part facies posterior hepatis centered on the semiconductor package part facies posterior hepatis Side, cutting semiconductor batten is simultaneously supplied to semiconductor package part；And,
Second supply unit, after it is arranged at semiconductor package part facies posterior hepatis centered on the semiconductor package part facies posterior hepatis Side, the individualized semiconductor package part of pallet is loaded into for supplying.
9. semiconductor package part processing unit according to claim 8, it is characterised in that first supply unit includes：
Semiconductor batten supply unit, for semiconductor supply batten；
Semiconductor batten cutting part, the semiconductor batten for that will be supplied cuts into multiple semiconductor package parts；
Unit selection device, in the state of the cut multiple semiconductor package parts of pickup, make the semiconductor package part via Wash mill is sent to drying device；
Drying device, for adsorbing the semiconductor package part received from the Unit selection device, it is on X/Y plane along X Direction of principal axis is moved, and is defined by Y-axis and is rotated；And,
Permutation platform, for load the loading chute of above-mentioned semiconductor package part and the portion off board of unloaded semiconductor package part along X-axis and Y direction are alternatively formed, and move in the Y-axis direction.
10. semiconductor package part processing unit according to claim 9, it is characterised in that load institute in the permutation platform State the semiconductor package part that drying device is adsorbed or the semiconductor packages that will directly be adsorbed by the drying device Part is attached to the fixed film of the semiconductor package part facies posterior hepatis.
11. semiconductor package part processing units according to claim 9, it is characterised in that use the additional selector Pickup is loaded into the semiconductor package part of the permutation platform, and is affixed to the fixation of the semiconductor package part facies posterior hepatis Film.
12. semiconductor package part processing units according to claim 7, it is characterised in that the semiconductor package part is pressed Splenium is transferred along the direction vertical with the transfer direction of the framework, and the semiconductor package part press section includes at least one Pressing component, the setting direction of the pressing component is vertical with the transfer direction of the framework, and with the semiconductor package part The transfer direction of press section is parallel.
13. semiconductor package part processing units according to claim 7, it is characterised in that the semiconductor package part is pressed Splenium is lifted along Z-direction, and the pressing component of the semiconductor package part press section is installed by medium of elastomeric element, so that Flexibly support and pressurize semiconductor package part.
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KR20170043997A (en) 2017-04-24

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