CN106910698B - Semiconductor package processing apparatus - Google Patents

Semiconductor package processing apparatus Download PDF

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Publication number
CN106910698B
CN106910698B CN201610875875.5A CN201610875875A CN106910698B CN 106910698 B CN106910698 B CN 106910698B CN 201610875875 A CN201610875875 A CN 201610875875A CN 106910698 B CN106910698 B CN 106910698B
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China
Prior art keywords
semiconductor package
deburring
semiconductor
unit
deburring unit
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CN201610875875.5A
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Chinese (zh)
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CN106910698A (en
Inventor
林栽瑛
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Hanmi Semiconductor Co Ltd
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Hanmi Semiconductor Co Ltd
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Publication of CN106910698A publication Critical patent/CN106910698A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure

Abstract

The present invention relates to a semiconductor package handling apparatus which separates a semiconductor package having completed a sputtering process from a frame having a fixing film, removes burrs remaining on the semiconductor package by the sputtering process, and then carries the semiconductor package, or picks up the semiconductor package supplied from a semiconductor package supply unit and stably attaches the semiconductor package to the frame having the fixing film used in the semiconductor package sputtering process and fixes the semiconductor package.

Description

Semiconductor package processing apparatus
Technical Field
The present invention relates to a semiconductor package processing apparatus, and more particularly, to a semiconductor package processing apparatus which separates a semiconductor package having completed a sputtering process from a frame having a fixing film, efficiently removes burrs remaining on the semiconductor package through the sputtering process, and then conveys the semiconductor package, or picks up the semiconductor package supplied from a semiconductor package supply unit, and stably attaches and fixes the semiconductor package to the frame having the fixing film used in the semiconductor package sputtering process.
Background
The present invention relates to a semiconductor package handling apparatus. Semiconductor packages for electronic products perform a sputtering process on individual semiconductor packages in order to block electromagnetic waves affecting the human body or minimize electrical interference occurring between adjacent electronic products.
The sputtering process needs to be performed on an upper surface or a side surface (for example, 4 side surfaces) excluding a lower surface to be provided with a terminal such as a solder ball. Therefore, the semiconductor package is not subjected to the sputtering process in a state of being placed on a tray for densely housing the semiconductor package, but a plurality of hiding grooves capable of hiding terminals such as solder balls on the lower surface of the semiconductor package are formed in the semiconductor package, and the semiconductor packages are attached to the frame in a spaced manner while ensuring the spacing distance between the semiconductor packages, so that the sputtering process of the side surfaces of the semiconductor package is easily performed.
In the sputtering process of the semiconductor package, it is necessary to prevent sputtering of the bottom surface of the semiconductor package, and therefore, the sputtering process may be performed after the semiconductor package is uniformly attached to the frame. The semiconductor packages that have been subjected to sputtering are picked up by the selectors, and are carried in a state of being mounted on a tray or the like.
In a conventional semiconductor package processing apparatus, in order to perform a sputtering process, it is difficult to uniformly attach a semiconductor package in a process of attaching the semiconductor package to a fixing film formed on a frame, and a process delay is caused.
Further, burrs (Burr) formed by sputtering the vapor deposition material remain around the edge where the bottom surface and the side surface of the sputtered semiconductor package meet, and the burrs need to be removed manually, which reduces the work efficiency and makes it difficult to use an automated apparatus.
Disclosure of Invention
The present invention has been made in view of the above problems, and it is an object of the present invention to provide a semiconductor package processing apparatus which separates a semiconductor package having completed a sputtering process from a frame having a fixing film, removes burrs remaining on the semiconductor package by the sputtering process, and then conveys the semiconductor package, or picks up the semiconductor package supplied from a semiconductor package supply unit, and stably attaches the semiconductor package to the frame having the fixing film used in the semiconductor package sputtering process, and fixes the semiconductor package.
In order to solve the above problems, the present invention provides a semiconductor package processing apparatus including: a frame supply/collection unit for supplying a frame on which a sputtering process is performed in a state in which a plurality of semiconductor packages are attached, and collecting an empty frame from which the semiconductor packages are separated; a semiconductor package separating part picking up the semiconductor package attached to the supplied frame using a test selector, thereby separating the semiconductor package from the frame; a semiconductor package deburring part including a plurality of deburring units that remove burrs remaining on the semiconductor packages in a process of transferring the semiconductor packages separated from the semiconductor package separating part; a plurality of seating blocks for loading the semiconductor packages picked up by the inspection selector or for loading the semiconductor packages deburred; and a semiconductor package loading unit for picking up the semiconductor package from which the burrs are removed, loaded on the seating block, by an unloading selector, and loading the semiconductor package on a semiconductor package carrying tray.
In this case, the semiconductor package deburring unit further includes a cleaning selector for picking up the semiconductor package loaded on the seating block and transferring the semiconductor package to the upper portion of the deburring unit,
the deburring unit includes: a first deburring unit including one or more rotating brushes having a vertical rotating shaft; and the second deburring unit comprises a rolling brush with a horizontal rotating shaft, and the first deburring unit and the second deburring unit are arranged side by side to sequentially remove burrs.
And, the seat block includes: a first seating block for loading the semiconductor package separated from the semiconductor package separating part by the inspection selector; and a second block for loading the semiconductor package whose burr is removed by the cleaning selector, wherein the first block and the second block are independently transferred in a Y-axis direction.
The plurality of rotating brushes constituting the first deburring unit are respectively attached to rotating members having threads formed on the outer peripheral surfaces thereof, the rotating members are engaged with the adjacent rotating members by the threads, and when one of the plurality of rotating members is rotated by the rotating motor, all the rotating members are rotated at the same time.
Here, a large number of groups of bristles are vertically implanted in a rotating brush constituting the first deburring unit, and a large number of bristles are radially implanted in the second deburring unit at an elongated rotating shaft driven by a driving shaft of a motor and a driving belt.
In this case, the deburring unit further includes a third deburring unit disposed in parallel with the first deburring unit and the second deburring unit at the rear of the second deburring unit, the third deburring unit includes a fan and a suction flow path, and the fan removes the burrs remaining in the semiconductor package by spraying compressed air in a side surface direction or a bottom surface direction or a diagonal direction of the semiconductor package to the semiconductor package from which the burrs are removed in the second deburring unit.
In order to solve the above problems, the present invention also provides a semiconductor package processing apparatus including: a semiconductor package supply unit for supplying a semiconductor package to be sputtered; a semiconductor package attaching part picking up the semiconductor package supplied from the semiconductor package supplying part using an additional selector and attaching the semiconductor package to a fixing film provided to an annular frame used for a sputtering process; a semiconductor package pressing portion that applies pressure from above to a semiconductor package attached to a fixing film provided to a frame in the semiconductor package attaching portion to enhance an attached state of the semiconductor package and the fixing film; and a frame supply/recovery unit configured to supply an empty frame to the semiconductor package attachment unit, attach the semiconductor package to the fixing film of the frame, and then recover the frame pressurized by the semiconductor package pressing unit.
And, the semiconductor package supply part includes: a first supply part which is arranged in front of the semiconductor package attachment part with the semiconductor package attachment part as the center, cuts the semiconductor strip plate and supplies the semiconductor strip plate to the semiconductor package; and a second supply unit disposed behind the semiconductor package attachment unit with the semiconductor package attachment unit as a center, for supplying the singulated semiconductor packages mounted on the tray.
Here, the first supply part includes: a semiconductor strip supply part for supplying semiconductor strips; a semiconductor strip cutting part for cutting the supplied semiconductor strip into a plurality of semiconductor packages; a unit selector which causes the semiconductor packages to be transferred to a drying device via a washing device in a state of picking up the plurality of cut semiconductor packages; a drying device for sucking the semiconductor package received from the unit selector, moving in an X-axis direction on an XY plane, and rotating about a Y-axis; and an alignment stage in which a loading slot for loading the semiconductor package and a non-loading portion for not loading the semiconductor package are alternately formed along the X-axis and Y-axis directions and are moved in the Y-axis direction.
And, the semiconductor package sucked by the drying device is loaded on the alignment stage or the semiconductor package sucked by the drying device is directly adhered to the fixing film of the semiconductor package adhering part.
And picking up the semiconductor packages loaded on the alignment stage using the additional selector and attaching the semiconductor packages to the fixing film of the semiconductor package attaching part.
Here, the semiconductor package pressing part is transferred in a direction perpendicular to a transfer direction of the frame, and the semiconductor package pressing part includes at least one pressing member, and an installation direction of the pressing member is perpendicular to the transfer direction of the frame and parallel to the transfer direction of the semiconductor package pressing part.
The semiconductor package pressing portion is raised and lowered along the Z-axis direction, and the pressing member of the semiconductor package pressing portion is attached with an elastic member as a medium to elastically support and press the semiconductor package.
According to the semiconductor package processing apparatus of the present invention, after separating the semiconductor package having completed the sputtering process from the frame having the fixing film, the semiconductor package is conveyed after effectively removing the burrs remaining on the semiconductor package by the semiconductor package deburring part having the plurality of kinds of brushes or fans by the sputtering process.
Further, according to the semiconductor package handling apparatus of the present invention, after picking up the semiconductor package supplied from the semiconductor package supply part and attaching it to the frame having the fixing film for the semiconductor package sputtering process, pressure is additionally applied by the semiconductor package pressing part, so that the attachment state of the semiconductor package can be enhanced.
Drawings
Fig. 1 is a top view of one embodiment of a semiconductor package handling device of the present invention.
Fig. 2 is an exploded perspective view of a first deburring unit constituting a semiconductor package deburring portion of the semiconductor package processing apparatus of the present invention.
Fig. 3 is a sectional view of a first deburring unit constituting a semiconductor package deburring portion of the semiconductor package processing apparatus of the present invention.
Fig. 4 is a sectional view of a second deburring unit constituting a semiconductor package deburring portion of the semiconductor package processing apparatus of the present invention.
Fig. 5 is a sectional view of one embodiment of a third deburring unit constituting a semiconductor package deburring part of the semiconductor package processing apparatus of the present invention.
Fig. 6 is a detailed operation state diagram of the third deburring unit shown in fig. 5.
Fig. 7 is a sectional view of a third deburring unit that constitutes still another embodiment of the semiconductor package deburring part of the semiconductor package processing apparatus of the present invention.
Fig. 8 is a sectional view of a third deburring unit constituting another embodiment of the semiconductor package deburring part of the semiconductor package processing apparatus of the present invention.
Fig. 9 is a sectional view of one embodiment of a semiconductor package burring part of the semiconductor package processing apparatus of the present invention.
Fig. 10 is a sectional view of still another embodiment of a semiconductor package deburring part of the semiconductor package processing apparatus of the present invention.
Fig. 11 is a sectional view of still another embodiment of a semiconductor package deburring part of the semiconductor package processing apparatus of the present invention.
Fig. 12 is a top view of another embodiment of a semiconductor package handling device of the present invention. Fig. 13 is a top view of another embodiment of a semiconductor package handling device of the present invention.
Fig. 14 is a top view of another embodiment of a semiconductor package handling device of the present invention.
Fig. 15 is a top view of another embodiment of a semiconductor package handling device of the present invention.
Fig. 16 is a perspective view and an enlarged view of one embodiment of a semiconductor package pressing portion constituting the semiconductor package handling apparatus of the present invention.
Fig. 17 is an operation state of the pressing portion of the semiconductor package shown in fig. 16.
Fig. 18 is a perspective view and an enlarged view of a semiconductor package pressing portion constituting another embodiment of the semiconductor package handling apparatus of the present invention.
Fig. 19 is a schematic view showing an operation state of the pressing portion of the semiconductor package shown in fig. 18.
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein, and may be embodied in other forms. Rather, the embodiments described herein are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Like reference numerals denote like structural elements throughout the specification.
Fig. 1 is a plan view of one embodiment of a semiconductor package handling apparatus 1 of the present invention.
The semiconductor package handling apparatus 1 of the present invention includes: a frame supply/recovery unit 100 that supplies a frame (not shown) for performing a sputtering process with a plurality of semiconductor packages attached thereto, and recovers and separates the frames of the semiconductor packages; a semiconductor package separating part 200 for picking up and separating the semiconductor package from the frame supplied from the frame supply and recovery part 100 by the inspection selector 230; and a semiconductor package deburring unit 300 including a first deburring unit 310 and a second deburring unit 330, the first deburring unit 310 including at least one rotary brush 311 having a vertical rotation axis for wiping off burrs remaining in the semiconductor package in a process of loading the semiconductor package separated from the semiconductor package separating unit 200 by the inspection selector 230 on a first block 510 movable in the Y-axis direction and transferring the semiconductor package to the semiconductor package deburring unit 300 and transferring the semiconductor package in a picked-up state by a cleaning selector 370, the second deburring unit 330 including a roller brush 331 having a horizontal rotation axis, the first deburring unit 310 and the second deburring unit 330 including an intake flow path for taking in the burrs separated by the brush, the semiconductor package from which the burrs are removed in the semiconductor package separating unit 300 being loaded on a second block 530 movable in the Y-axis direction by the cleaning selector 370 Then, the substrate is transferred to the unload selector 250. The semiconductor packages loaded on the second block are picked up by the unload selector 250, and the semiconductor package transfer tray tr is loaded on the semiconductor package loading portion 400.
A semiconductor package processing apparatus 1 shown in fig. 1 relates to a semiconductor package processing apparatus 1 that performs a sputtering process in a state where a fixing film to which a semiconductor package to be sputtered is attached to an outer peripheral surface of a ring frame, separates the semiconductor package from the fixing film, and removes burrs remaining in the semiconductor package.
The semiconductor package may perform the sputtering process in a state where only the upper surface and the side surface are exposed and the semiconductor package is attached to the fixing film provided at the center portion of the ring frame.
The semiconductor package handling apparatus 1 shown in fig. 1 takes out a semiconductor package pickup target frame from the frame supply and collection unit 100 by a clip, and transfers the semiconductor package pickup target frame to the semiconductor package separation unit 200 by the frame selector 120. The frame selector 120 may include a first vision unit vu1 for imaging inspection of the transferred frame.
The semiconductor package separating unit 200 may have a table tf on which a frame to which the evaporated semiconductor package is attached may be placed.
The semiconductor package attached to the fixing film of the frame placed on the above-described stage tf may be separated from the fixing film by the ejector e and the inspection selector 230 and picked up.
In a state where the frame having the fixing film to which the semiconductor package subjected to the sputtering process is attached is placed on the stage, the semiconductor package may be separated from the fixing film by means of the ejector e disposed below the stage tf, and the separated semiconductor package may be picked up by the above-described inspection selector 230 and may be loaded on the first block.
In the embodiment shown in fig. 1, the table tf and the detection selector 230 may be transferred to the Y axis, and the injector e may be transferred to the X axis.
Also, a plurality of pickup units 231 are provided in a row along the Y-axis direction in the inspection selector 230 for picking up the semiconductor packages, and the pickup units individually suck or release the suction of the semiconductor packages, respectively.
Therefore, the semiconductor package located at an arbitrary position of the ring frame by the ejector e and the inspection selector 230 can be picked up by the inspection selector 230.
In the semiconductor package separating unit 200, burrs may remain on the semiconductor package separated from the fixed film of the stage by the ejector e and the detection selector 230.
Therefore, the semiconductor package processing apparatus 1 of the present invention may include the semiconductor package deburring part 300 for removing the residual semiconductor package. In the semiconductor package deburring part 300 constituting the semiconductor package processing apparatus 1 of the present invention shown in fig. 1, since the semiconductor package has a plurality of types of deburring units, the deburring work can be performed in stages. The embodiment shown in fig. 1 shows an example having three types of deburring units, and the deburring portion 300 for the semiconductor package described above is described in detail with reference to the drawings after fig. 2.
The ejector e of the above-described semiconductor package separating part 200 sequentially strikes the bottom surfaces of the semiconductor packages attached to the fixing film, so that the plurality of pickup units provided to the inspection selector 230 can pick up the semiconductor packages separated from the fixing film. The burr remaining on the semiconductor package may be removed at the deburring part 300. May include a cleaning selector 370 and a plurality of deburring units separately provided to the semiconductor deburring unit 300 and capable of being transferred in the X-axis direction.
The cleaning selector 370 shown in fig. 1 removes burrs by transferring the upper portions of the respective deburring units in the X-axis direction in a state where the semiconductor package is picked up by the semiconductor package deburring unit 300. Since the semiconductor package deburring unit 300 has a plurality of deburring units arranged in parallel along the Y-axis direction, the cleaning selector for transferring the semiconductor packages in the X-direction can clean the semiconductor packages picked up in the Y-axis direction at a time.
As described below, in the plurality of deburring units constituting the semiconductor package deburring part 300, the plurality of deburring units are arranged in parallel, and the plurality of deburring units may be respectively formed of brush units, so that the semiconductor selector is picked up by the cleaning selector 370 to pass through the deburring units, and burrs remaining in the semiconductor package can be removed by brush friction or wind pressure.
Accordingly, the burrs of the semiconductor package may be completely removed in sequence by the plurality of deburring units.
In the semiconductor package separating unit 200, the semiconductor package picked up by the inspection selector 230 needs to be transferred to the semiconductor package deburring unit 300 to be picked up by the cleaning selector 370 of the semiconductor package deburring unit 300.
For this purpose, the semiconductor package handling apparatus 1 of the present invention shown in fig. 1 includes: a first block 510 for transferring the semiconductor package picked up by the inspection selector 230 at the semiconductor package separating unit 200 to the semiconductor package deburring unit 300; and a second block 530 for loading and transferring the semiconductor package from which the burrs are removed and the first block.
The semiconductor package transferred from the first block 510 to the semiconductor package deburring unit 300 is picked up by a cleaning selector 370 provided in the semiconductor package deburring unit 300 and capable of transferring the semiconductor package in the X-axis direction, and can be cleaned.
As described above, the respective burr removal units constituting the semiconductor package deburring unit 300 are arranged in parallel in the Y-axis direction, and thus the deburring process for the semiconductor packages arranged in a line in the Y-axis direction on the cleaning selector 370 transferred to the X-axis is performed in stages, and thus burrs can be completely removed.
The package picked up by the cleaning selector 370 and having completed the deburring process is transferred along the transfer path of the unload selector 250 in a state of being placed on the second block 530, and thus may be loaded on the package loading unit 400 by the unload selector 250.
The detection selector 230 and the cleaning selector 370 may be respectively transferred in the Y-axis direction, the detection selector 230 and the cleaning selector 370 may be respectively provided with a plurality of pickup units 231 and 371 at corresponding pitches in the Y-axis direction, and the first block 510 and the second block 530 may be provided with loading grooves 511 and 531 corresponding to the intervals between the pickup units.
Therefore, the semiconductor packages selected by the inspection selector 230 are loaded and transferred to the first block 510 at a time, and are picked up by the cleaning selector 370 at a time to perform a cleaning operation.
A fifth vision unit vu5 for inspecting a mold surface, which is an upper surface of the semiconductor package placed on the first block 510 and transferred, may be further included.
In the embodiment shown in fig. 1, the semiconductor package deburring unit includes first through third deburring units 310 through 350, deburring is sequentially performed by the first through third deburring units 310 through 350 in a state selected by the cleaning selector 370, and after the cleaning operation is completed, the semiconductor packages from which burrs are removed in the semiconductor package deburring unit 300 are picked up by the unloading selector 250 by transferring the semiconductor packages from the cleaning selector 370, the second block 530, and the unloading selector 250 in reverse order, and the semiconductor packages can be transported by the semiconductor package loading unit 400 loaded on the semiconductor package transporting tray.
A second vision unit vu2 and a third vision unit vu3 may be further provided for inspection of the bottom surface or the side surface of the semiconductor package picked up and carried by the unload selector 250.
The semiconductor package loading unit 400 includes a tray selector 410, so that a tray tr filled with semiconductor packages can be transported and an empty tray tr can be supplied to the loading position of the unloading selector 250.
In addition, as a result of the inspection by the vision unit, when the semiconductor package is determined to be defective or the semiconductor package is small in size and difficult to be loaded on the tray, the semiconductor package may be collected by another carrier box 430 or the like instead of the tray for carrying.
The semiconductor package deburring unit 300 constituting the semiconductor package processing apparatus 1 of the present invention will be described in detail below.
The semiconductor package burr removing portion 300 constituting the semiconductor package processing apparatus 1 of the present invention includes: a first deburring unit 310 including at least one rotary brush 311 having a rotation axis for erasing burrs remaining on the semiconductor package while the semiconductor package separated from the semiconductor package separating part 200 is transferred in a picked-up state; and a second deburring unit 330 including a roller brush 331 having a horizontal rotation axis, and the first deburring unit 310 and the second deburring unit 330 may include a suction flow path for sucking the burrs separated by the brush.
The deburring unit constituting the semiconductor package deburring portion 300 will be described below.
Fig. 2 is an exploded perspective view of the first deburring unit 310 constituting the semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention, and fig. 3 is a sectional view of the first deburring unit 310 constituting the semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention.
The first deburring unit 310 may include a plurality of rotating brushes 311 having vertical rotating shafts. The rotary brush 311 constituting the first deburring unit 310 has a large number of bristles 311a grouped in a vertical direction so as to be implanted in the body member 311 b.
Specifically, the plurality of rotary brushes 311 constituting the first deburring unit 310 may be arranged in a row, and the plurality of rotary brushes 311 constituting the first deburring unit 310 may be formed in a row in parallel along a Y-axis direction perpendicular to a transfer trajectory of the cleaning selector 370 of the semiconductor package separated from the semiconductor package separating unit 200.
As shown in fig. 2, the plurality of rotating brushes 311 constituting the first deburring unit 310 may be respectively attached to a rotating member 313 having a screw 313b formed on an outer circumferential surface thereof.
The rotating member 313 includes a mounting hole 313a to which the body member 311 is mounted and a fixed shaft 313c rotatably coupled to a mounting hole 315b formed in the mounting member 315 via a bearing 314 and a fastening bolt 316.
As shown in fig. 3, the respective rotating members 313 of the first deburring unit 310 and the adjacent rotating members 313 are disposed so as to be coupled to each other by the screws 313b, so that when one of the plurality of rotating members 313 is rotationally driven by the rotating motor, the entire rotating member 313 is rotated together, and only one rotating motor 317 for rotating the rotating brush 311 can be provided.
Also, a suction flow path 318 for sucking the burrs separated by the brush may be formed in the housing 319 to which the rotating brush 311 constituting the first deburring unit 310 described above is rotatably mounted.
Therefore, the semiconductor package may be transferred above the rotary brush of the first deburring unit 310, and if the burrs remaining in the semiconductor package are separated, the burrs may be dropped to the cover 319, and the burrs dropped through the suction hole 319h of the cover 319 may be discharged to the outside.
As shown in fig. 3, since the plurality of rotary brushes 311 are rotated about a vertical rotation axis by the rotation of one rotary motor 317, the burr removing operation can be performed on the plurality of semiconductor package rows aligned in a row picked up by the cleaning selector 370 and passed through the rotary brush 311 row. Further, although the embodiment shown in fig. 1 and 3 shows an example in which a row of rotating brushes 311 is provided in parallel to the first deburring unit 310, a plurality of rows of rotating brushes may be provided according to the kind and size of the semiconductor package, the diameter of the rotating brushes, and the like.
Fig. 4 illustrates a sectional view of the second deburring unit 330 constituting the semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention.
As described with reference to fig. 1, after being separated from the semiconductor package separating part 200 together with the second deburring unit 330, the semiconductor packages may be arranged in parallel in a direction perpendicular to a transfer trajectory of the semiconductor packages picked up by the cleaning selector 370.
The second deburring unit may have a roller brush 331 rotating around a horizontal rotation shaft 331 x. The second deburring unit 330 has a large number of bristles radially implanted on a long rotary shaft 331x, and can be driven by a drive shaft 337x of a motor 337 and a drive belt 337b even if the rotary shaft is not orthogonal to the motor.
Also, the second deburring unit 330 may include a suction flow path 338 for sucking the burrs separated by the brush in a housing 336 to which the rolling brush 331 is rotatably mounted, as in the first deburring unit 310.
Therefore, when the semiconductor package is transferred to the upper portion of the roll brush 331 of the second deburring unit 330 and burrs remaining in the semiconductor package are separated, the semiconductor package drops down to the cover 336, and the burrs and the like dropping down to the cover 336 are sucked in through the suction flow path 338 and are discharged to the outside in the same manner.
In the embodiment shown in fig. 1 and 4, one roll brush 331 constituting the second deburring unit 330 is provided in the Y axis direction, and the roll brush 331 arranged in the Y axis direction may be divided into a plurality of rolls, or a plurality of roll brushes 331 may be provided in parallel with each other.
The semiconductor package processing apparatus 1 of the present invention may further include a third deburring unit 350 for removing burrs remaining on the semiconductor package, in addition to the first deburring unit 310 having the rotary brush 311 and the second deburring unit 330 having the roll brush 331.
The first deburring unit 310 and the second deburring unit 330 rub and separate burrs remaining in the semiconductor package during the sputtering process using a brush or the like. However, when the burr separated from the semiconductor package remains in the semiconductor package due to static electricity or the like, a third deburring unit 350 may be further provided to remove the burr.
The third deburring unit 350 may include a blower fan, a fixed type brush, or the like, instead of the rotary type brush. The description is made with reference to fig. 5 to 7.
Fig. 5 is a sectional view of one embodiment of a third deburring unit 350a constituting the semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention.
Fig. 6 illustrates a detailed operation state of the third deburring unit 350a shown in fig. 5.
The second deburring unit 330 may have a third deburring unit 350a at a rear side thereof, the third deburring unit 350a may be parallel to the first deburring unit 310 and the second deburring unit 330, and the third deburring unit 350a may have a blower and a suction flow path.
The third deburring unit 350a shown in fig. 5 and 6 may have a blower fan. After the semiconductor package from which the burrs are removed by the second deburring unit 330 is transferred to the upper side of the third deburring unit 350, the blower of the third deburring unit 350a sprays compressed air in the side surface direction and the bottom surface direction of the semiconductor package in a lowered state, thereby removing the burrs remaining in the semiconductor package.
The housing 354a of the blower constituting the third deburring unit 350a has a deburring space 354a3 formed in the Y axis direction at the center, and injection channels 354a1, 354a2 and an injection port 354a5 for compressed air are provided on the side and bottom surfaces of the deburring space, so that compressed air can be injected. The burrs separated and scattered by the compressed air are sucked in by the suction inlet 354a4 connected to the housing of the fan and discharged to the outside.
As shown in the enlarged view of fig. 6, in order to spray compressed air to the side and bottom surfaces of the semiconductor package picked up by the cleaning selector 370, the semiconductor package needs to be disposed inside the deburring space 354a3 formed in the housing of the blower, and therefore, the pickup unit 371 of the cleaning selector 370 needs to be lowered by a predetermined height.
That is, in the embodiment shown in fig. 5 and 6, the cleaning selector 370, which passes through the upper portions of the first deburring unit 310 and the second deburring unit 330 and is transferred at a predetermined height, is temporarily lowered in the third deburring unit 350 to spray compressed air to the side surface and the bottom surface of the semiconductor package. Therefore, in the embodiment shown in fig. 5 and 6, in order to perform the deburring work by the blower in the third deburring unit 350, the cleaning selector 370 needs to be temporarily lowered, which may become a factor of process delay.
Fig. 7 is a sectional view of a third deburring unit 350b constituting still another embodiment of the semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention.
The fan of the third deburring unit 350 shown in fig. 7 is characterized in that the inside surface of the housing of the fan constituting the third deburring unit 350b below the semiconductor package is formed with an inclined surface 354b5 after the semiconductor package from which the burrs are removed in the second deburring unit 330 is transferred to the upper side of the third deburring unit 350b, and compressed air is injected in a diagonal direction by the inclined surface 354b 5.
Therefore, unlike the embodiments shown in fig. 5 and 6, in the embodiment shown in fig. 7, in a state where the cleaning selector 370 is moved to the upper side of the third deburring unit 350, the compressed air injected from the injection flow path 354b1 and the injection port is injected toward the bottom surface and the side surface of the semiconductor package along the inclined surface 354b5 of the housing without an additional lowering operation, and thus the burrs remaining in the semiconductor package can be removed.
Fig. 8 is a sectional view of a fixed brush unit constituting a semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention.
The embodiment shown in fig. 5 to 7 uses the above-described third west edge unit 350 to remove the burr remaining on the semiconductor package by the compressed air based on the blower.
As mentioned above, the third deburring unit 350 described above is used to assist in blowing or removing burrs or the like that are not completely removed in the semiconductor package.
Therefore, the third deburring unit 350 may use a fixed brush instead of the rotating brush, and the separated burrs may be discharged to the outside through the suction flow path.
In the embodiment shown in fig. 8, a third deburring unit 350c is provided behind the second deburring unit 330, the third deburring unit 350c is parallel to the first deburring unit 310 and the second deburring unit 330, the third deburring unit 350c has a fixed brush 351c, and a suction flow path 358c may be provided at the center of the fixed brush 351 c.
In the case of including the fixed type brush 351c as described above, as in the embodiment shown in fig. 7, during the cleaning process by the third deburring unit 350, even if the cleaning selector 370 does not descend, the remaining burrs can be removed by the weak frictional force of the fixed type brush, and the removed burrs can be sucked through the suction flow path and discharged.
The semiconductor package handling apparatus 1 of the present invention shown in fig. 1 picks up a semiconductor package from a frame or the like to which a sputtered semiconductor package is attached, and after the semiconductor package deburring portion 300 removes burrs remaining in the semiconductor package, loads the semiconductor package in the loading groove 531 of the second block 530.
As described above, the semiconductor package deburring part 300 constituting the semiconductor package processing apparatus 1 of the present invention includes: a first deburring unit 310 having a rotating brush 311; and a second deburring unit 330 having a rolling brush 331 and further including a third deburring unit 350, the third deburring unit 350 including a fan or a fixed type brush.
As described with reference to fig. 1, the first through third deburring units 310 through 350 may be arranged in parallel in a longitudinal direction along a Y-axis direction perpendicular to an X-axis direction, which is a transfer direction of the cleaning selector 370.
The process of picking up a semiconductor package and penetrating the semiconductor package burr removing portion 300 and removing burrs by the wash selector 370 will be described with reference to fig. 9 and subsequent figures.
Fig. 9 is a sectional view of one embodiment of the semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention, fig. 10 is a sectional view of another embodiment of the semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention, and fig. 11 is a sectional view of yet another embodiment of the semiconductor package deburring part 300 of the semiconductor package processing apparatus 1 of the present invention.
Specifically, the third deburring unit 350a of fig. 9 includes the fan unit with reference to fig. 5 and 6 described above, the third deburring unit 350c of fig. 10 includes the fixed-type brush with reference to fig. 8, and the third deburring unit 350d of fig. 11 includes a new configuration of a fan.
In the embodiment shown in fig. 9, the semiconductor package picked up by the above-described wash selector 370 may be horizontally transferred to a height at which the bottom and side surfaces of the semiconductor package can be rubbed against the rotary brush 311 or the roll brush 331.
Accordingly, the burrs remaining on the semiconductor package transferred in the state of being picked up by the cleaning selector 370 are sequentially removed by the rotary brush 311 and the roller brush 331, and then transferred to the upper side of the third deburring unit 350.
The third deburring unit 350a may include a blower fan, and as described with reference to fig. 5 and 6, the cleaning selector 370 may be lowered in order to spray compressed air toward the side and bottom surfaces of the semiconductor package in a state where the semiconductor package is disposed in the deburring space.
After the third deburring unit 350a completes the cleaning of the semiconductor package, the cleaning selector 370 is raised so that the semiconductor package is carried without contacting the rotary brush, the roll brush 331, or the like.
In contrast, in the embodiment shown in fig. 10, the third deburring unit 350c includes a fixed-type brush, and thus, unlike the embodiment shown in fig. 9, there is no need to lower the semiconductor package in order to inject compressed air.
Therefore, in the embodiment shown in fig. 10, the semiconductor package is transferred in a horizontal direction while being sequentially brought into contact with the brushes of the first deburring unit 310, the second deburring unit 330, and the third deburring unit 350c, and then cleaned.
Unlike the fan in fig. 5 to 7, the third deburring unit 350d of the embodiment shown in fig. 11 has a structure in which a suction flow path is separated from the fan.
That is, the fan 351d of the embodiment shown in fig. 11 has a fan blade shape and has a structure capable of injecting compressed air in a diagonal direction of the semiconductor package to be transferred, and the fan has an intake passage 358d at the rear thereof so that the injection position of the compressed air and the intake position of the scattered burrs can be distinguished.
In the above method, after the semiconductor package having been subjected to the sputtering process is separated from the frame having the fixing film, the remaining semiconductor package is effectively removed by the semiconductor package deburring unit having various brushes or blowers through the sputtering process, and the semiconductor package is conveyed.
The semiconductor package handling apparatus 1 according to the present invention described with reference to fig. 1 to 11 is an apparatus for separating a sputtered semiconductor package from a fixing film of a frame, removing burrs remaining in the semiconductor package, and then loading the semiconductor package on a transfer tray tr for transfer.
The semiconductor package handling apparatus 1 of the present invention may include a device for picking up a semiconductor package from the semiconductor package supply unit a for performing a sputtering process and attaching the semiconductor package to a frame having a fixing film for the sputtering process.
Specifically, the present invention may provide a semiconductor package handling apparatus 1' including: a semiconductor package supply unit a for supplying a semiconductor package to be sputtered; a semiconductor package attaching part 200 picking up the semiconductor package supplied from the semiconductor package supplying part a by a selector and attaching the semiconductor package to a fixing film formed at a central portion of the ring frame for a sputtering process; a semiconductor package pressing part 700 for applying pressure to the semiconductor package attached to the fixing film of the frame from above in the semiconductor package attaching part 200 to reinforce the attachment state of the semiconductor package and the fixing film; and a frame supply/recovery unit 100 for supplying an empty frame to the semiconductor package attaching unit 200 and conveying the frame of the semiconductor package pressurized by the semiconductor package pressing unit 700.
Fig. 12 is a plan view of still another embodiment of the semiconductor package handling apparatus 1' of the present invention.
Unlike the semiconductor package handling apparatus 1 shown in fig. 1, the semiconductor package handling apparatus 1' shown in fig. 12 is an apparatus that picks up a semiconductor package to be sputtered, which is loaded on a supply tray, by a selector and then attaches the semiconductor package to an empty frame supplied from a frame supply and recovery unit 100 in a semiconductor package attachment unit 200.
Further, although the semiconductor package processing apparatus 1 shown in fig. 1 separates the sputtered semiconductor package from the semiconductor separating portion 200, removes the burrs in the semiconductor package deburring portion 300, and loads the semiconductor package onto a carrying tray for carrying, the semiconductor package processing apparatus 1' shown in fig. 12 may include a semiconductor package pressing portion 700 for applying pressure to the semiconductor package attached to the fixing film of the frame from above in the semiconductor package attaching portion 200, thereby reinforcing the attachment state of the semiconductor package and the fixing film.
That is, the semiconductor package processing apparatus 1 shown in fig. 1 is different in that it has a semiconductor package deburring portion 300 for removing burrs remaining on a semiconductor package subjected to sputtering, and the semiconductor package processing apparatus 1' shown in fig. 12 has a semiconductor package pressing portion 700 for enhancing the adhesion state of the semiconductor package and a fixing film after the semiconductor package to be sputtered is adhered to the fixing film provided on a frame.
The transfer tray and inspection selector 230 of the semiconductor package handling apparatus 1 shown in fig. 1 corresponds to the supply tray and additional selectors 810a and 810b of the semiconductor package handling apparatus 1' shown in fig. 12. The additional selectors 810a and 810b shown in fig. 12 are the same as the detection selector 230 shown in fig. 1 in that they include a plurality of pickup units 811a and 811b arranged in the transfer direction and driven independently.
The frame for performing the sputtering step is supplied in a state where the plurality of semiconductor packages of the semiconductor package processing apparatus 1 shown in fig. 1 are attached, and the frame supply/recovery unit 100 for recovering and separating the frames of the semiconductor packages corresponds to the frame supply/recovery unit 100 for supplying an empty frame to the semiconductor package attaching unit 200 of the semiconductor package processing apparatus 1' shown in fig. 12 and conveying the frame to which the frame of the semiconductor package having been pressurized by the semiconductor package pressing unit 700 is attached.
Further, the semiconductor package loading portion 400 where the semiconductor package from which the burrs have been removed by the semiconductor package deburring portion 300 in the embodiment shown in fig. 1 is picked up by the selector and loaded on the semiconductor package carrying tray tr may correspond to the semiconductor package supply portion a for supplying the semiconductor package to be sputtered of the embodiment shown in fig. 12, in the frame supplied from the above-described frame supply and recovery part 100 of the embodiment shown in fig. 1, a semiconductor package separating part 200 that picks up and separates a semiconductor package by a selector corresponds to the semiconductor package attaching part 200 of the embodiment shown in fig. 12, the semiconductor package attaching part is used for picking up the semiconductor package provided by the semiconductor package supply part A through a selector, and is attached to a fixing tape provided at the center portion of an annular frame for a sputtering process.
As described above, the semiconductor package handling apparatus shown in fig. 1 and the semiconductor package handling apparatus shown in fig. 12 have similar layouts, but are different in that the transfer paths of the semiconductor packages are reversed, and whether to perform a process of removing burrs or a process of performing a pressing operation for enhancing the adhesion state of the semiconductor packages and the fixing films.
The semiconductor package pressing part 700 according to the embodiment shown in fig. 12 may be mounted so as to be transferred in the X-axis direction, and at least one pressing member constituting the semiconductor package pressing part 700 may have an elongated shape provided in the X-axis direction.
As shown in fig. 12, in the semiconductor package attaching portion 200, the transfer direction of the stage and the transfer direction of the additional selectors 810a and 810b may be perpendicular to each other.
The embodiment shown in fig. 12 may include: a sixth vision unit vu6 for performing imaging inspection of the stage transferred by the frame selector 210 in the frame supply/collection unit 100; an eighth visual unit vu8 and a ninth visual unit vu9 attached to the pair of additional selectors 810a and 810b for performing an under-image inspection; the tenth visual unit vu10 is attached to the package pressing part 700, and may further include a seventh visual unit vu7 that is capable of performing an upward imaging inspection for performing an imaging inspection of the picked-up state of the semiconductor package picked up by the pair of additional selectors 810a and 810 b.
Fig. 13 is a plan view of still another embodiment of a semiconductor package handling apparatus 1' of the present invention.
The embodiment shown in fig. 13 differs from the embodiment shown in fig. 12 in that the location of the visual elements may differ. This is to reduce the movement route of the above-described additional selectors 810a, 810 b.
Unlike the embodiment shown in fig. 12, in the embodiment shown in fig. 13, the eleventh vision unit vu11 for performing the upper image pickup inspection to perform the image pickup inspection of the pickup state of the semiconductor package picked up by the pair of additional selectors 810a and 810b is located between the semiconductor package supply part a and the stage, and thus has an effect of improving the efficiency of the process because the transfer distance of the pair of additional selectors 810a and 810b can be reduced.
On the other hand, the semiconductor package supply part a of the embodiment shown in fig. 12 or 13 is supplied by a semiconductor package supply tray on which individual semiconductor packages are loaded, but the semiconductor package supply part a of the embodiment shown in fig. 14 is supplied by singulating and supplying a semiconductor strip (strip) by a semiconductor strip cutting unit 630.
A semiconductor package supply part according to still another embodiment of the present invention includes: a first supply part which is arranged in front of the semiconductor package attachment part with the semiconductor package attachment part as the center and is used for cutting and cutting the semiconductor strip plate to supply as a semiconductor package; and a second supply unit disposed behind the semiconductor package attachment unit with the semiconductor package attachment unit as a center, for supplying the singulated semiconductor packages mounted on the tray.
The first supply unit includes: a semiconductor strip supply part for supplying semiconductor strips; a semiconductor strip cutting part for cutting the supplied semiconductor strip into a plurality of semiconductor packages; a unit selector which transfers the semiconductor packages to the drying device via the washing device in a state of picking up the plurality of cut semiconductor packages; a drying device for adsorbing the semiconductor package received from the unit selector, moving along the X-axis direction on the XY plane, and rotating about the Y-axis; and an alignment stage which is provided with loading grooves for loading the semiconductor packages and non-loading parts for not loading the semiconductor packages alternately along the X-axis direction and the Y-axis direction and can move along the Y-axis direction. Therefore, the first supply unit supplies and cuts the semiconductor strip to singulate the semiconductor packages, thereby supplying the semiconductor packages to be sputtered.
Fig. 14 is a plan view of still another embodiment of a semiconductor package handling apparatus 1' of the present invention. Fig. 14 shows an additional form of a material supply unit in the embodiment of fig. 12 and 13. As shown in fig. 12 and 13, the semiconductor package handling apparatus of the present invention can provide singulated semiconductor packages, respectively, but in the present embodiment, a material in a strip form is supplied, so that semiconductor packages subjected to stepwise washing and drying can be provided.
The semiconductor package supply unit a will be described in more detail with reference to fig. 14 and 15. A description overlapping with the description with reference to fig. 12 and 13 is omitted, and a description is given below of the first supply unit newly added and a semiconductor package processing method using the same.
In the semiconductor package supply part a, semiconductor chips are stacked in a cassette M, and the semiconductor chips are sequentially pulled by clips 600g and supplied.
The semiconductor strip s to be cut may be a rectangular material in which a plurality of semiconductor packages are arranged in a matrix form along the X-axis and Y-axis directions, and the semiconductor strip may be supplied to the semiconductor strip cutting apparatus 600 such that the longitudinal direction thereof is parallel to the X-axis direction.
When a plurality of semiconductor strips to be cut are loaded in the cassette M and supplied, and the semiconductor strips are sequentially pulled toward the semiconductor strip cutting apparatus 600 by the clips 600g, the semiconductor strips s pushed in the X-axis direction enter the entrance rail 610 of the semiconductor strip cutting apparatus 600 provided for guiding the semiconductor strips.
The strip selector 615 conveys the semiconductor strips toward the chuck table 650.
That is, the paddle selector 615 sucks the semiconductor paddle in vacuum and transfers the semiconductor paddle to the chuck table in a state where the mold surface of the semiconductor package faces downward.
The chuck table 650 is movable to an arbitrary position on the XY plane and rotatable about the Z axis, and the semiconductor strip sucked to the chuck table 650 is cut into singulated semiconductor packages by at least one cutting unit 630. The cutting unit 630 in the embodiment shown in fig. 14 has two cutters.
In the process of relative displacement between the dicing unit 630 and the chuck table 650, the semiconductor strip adhered to the chuck table 650 may be diced into individual semiconductor packages, and the diced semiconductor packages may be picked up and transferred at one time by the unit selector.
The unit selector 670 vacuum-sucks and picks up a plurality of semiconductor packages at a time, and transfers or conveys the semiconductor packages to the drying device 520, which will be described later, through the washing unit 640, thereby performing a washing process and a drying process. The washing unit 640 may include a brush unit for removing dust and the like remaining on the semiconductor packages, a blower, a washing liquid spraying unit, and the like during the dicing process.
The plurality of semiconductor packages picked up by the unit selector 670 and washed in the washing unit 640 may be loaded in a state of being adsorbed to a loading slot provided in a drying device 520 constituting the conductor package adsorbing portion 400.
The drying device 520 may be embedded with a hot wire to perform a drying process, and the drying device 520 constituting the semiconductor package supply part a may further include a quick-flipping function for flipping up and down and a transfer function in an X-axis direction or a Y-axis direction.
That is, the drying device 520 sucks the cut and washed semiconductor package, moves in the X-axis direction or the Y-axis direction on the XY plane, and rotates on the XY plane about the Y axis.
Some of the semiconductor packages picked up by the unit selector 670 are mounted on the upper surface (one surface) of the drying device 520, and the rest of the semiconductor packages are mounted on the bottom surface (the other surface) of the drying device 520.
An alignment stage 530 having a first mounting area and a second mounting area may be formed on one side of the drying device 520, and suction ports for sucking and mounting semiconductor packages and non-mounting portions for not mounting semiconductor packages are alternately formed (arranged in a row) in the first and second mounting areas along the X-axis and Y-axis directions.
When the semiconductor packages are mounted on the respective mounting areas of the alignment stage 530, the mounting grooves formed in the alignment stage 530 are not formed in dense and seamless lattices, but are formed in lattices or lattices adjacent to each other only in the diagonal direction (connected to the zigzag air pressure flow path).
After the semiconductor packages mounted on only one side of the drying device 520 or the upper and lower surfaces of the drying device 520 are transferred to the aligning table 530, the semiconductor packages to be dried are mounted in the respective mounting grooves 531a and 531b provided in the first and second mounting areas provided on the aligning table 530 by a method such as split mounting. Next, when the aligning table 530 moves in the Y-axis direction, the additional selectors 810a and 810b pick up the semiconductor packages loaded on the aligning table, and then attach the semiconductor packages to the fixing films attached to the frames.
In the semiconductor package handling apparatus of the present invention, in the process of attaching the semiconductor package to the fixing film provided on the frame for the sputtering process, as shown in fig. 12 or 13, the semiconductor package to be attached may be provided in a state of being mounted on the tray, but as shown in the embodiment shown in fig. 14, a method may be used in which after the semiconductor strip is cut and supplied by the semiconductor strip cutting apparatus 600, the semiconductor strip is picked up by the additional selectors 810a and 810b and attached to the stage, and the attachment state is strengthened at the semiconductor package pressing part 700.
In addition, the semiconductor package sucked by the drying device may not be placed on the aligning table, but the drying device may be moved in the X-axis direction to directly adhere the semiconductor package to the fixing film of the frame in a state where the upper and lower surfaces of the semiconductor package are reversed.
Therefore, in the above case, the drying device may also perform the function of the additional selector. That is, in fig. 14, the semiconductor strip is supplied after being cut to singulate the semiconductor material, and as shown in fig. 12 and 13, after the semiconductor packages singulated by being loaded on the tray are supplied, the semiconductor packages are picked up by the additional selectors 810a, 810b and attached to the fixing film.
That is, according to fig. 14 and 15, the method of attaching the semiconductor package to the fixing film according to the present invention may be such that the semiconductor package attached to the drying device is directly transferred to the mounting groove of the aligning table in a state where the upper and lower surfaces of the semiconductor package are turned, and then the semiconductor package attached to the aligning table is picked up by the additional selector and attached to the fixing film of the semiconductor package, or the semiconductor package attached to the drying device is directly attached to the fixing film of the semiconductor package attaching portion in a state where the upper and lower surfaces of the semiconductor package are turned.
In the embodiment shown in fig. 14, the semiconductor package pressing portion 700 is also mounted to be transferred in the X-axis direction, and at least one pressing member constituting the semiconductor package pressing portion 700 is also elongated in the X-axis direction, and as shown in fig. 14, in the semiconductor package attaching portion 200, the transfer direction of the stage and the transfer direction of the additional selectors 810a and 810b are also perpendicular.
As with the previous embodiment, the embodiment shown in fig. 14 may include: an eighth visual unit vu8 and a ninth visual unit vu9 attached to the pair of additional selectors 810a and 810b for performing an under-image inspection; and a tenth vision unit vu10 attached to the semiconductor pressing part 700 and including a seventh vision unit vu7 for performing an upper imaging inspection for imaging inspection of the picked-up state of the semiconductor package picked up by the pair of additional selectors 810a and 810 b.
Fig. 15 is a plan view of still another embodiment of the semiconductor package handling apparatus 1' of the present invention. The same explanation as that made with reference to fig. 14 is omitted. The embodiment shown in fig. 15 differs from the embodiment shown in fig. 14 in the location of the visual elements.
Unlike the embodiment shown in fig. 14, the embodiment shown in fig. 15 is the same as the above embodiment, and an eleventh vision unit vu11 for performing an upper image pickup inspection is located between the semiconductor package supply part a and the stage for the image pickup inspection of the pickup state of the semiconductor package picked up by the pair of additional selectors 810a, 810b, so that the transfer distance of the pair of additional selectors 810a, 810b can be reduced.
Hereinafter, the structure and operation method of the semiconductor package pressing part 700 constituting the semiconductor package processing apparatus 1 according to the present invention will be described in detail with reference to fig. 16.
Fig. 16 is a perspective view and an enlarged view of one embodiment of a semiconductor package pressing part 700 constituting the semiconductor package handling apparatus 1' of the present invention.
The semiconductor package pressing part 700 of the semiconductor package handling apparatus 1' of the present invention performs a process of pressing the upper surface of the semiconductor package to apply pressure thereto, so that the semiconductor package loaded on the empty frame t and the adhesive applied to the frame are uniformly and stably adhered.
In this case, the semiconductor package pressing part 700 simultaneously presses the plurality of semiconductor packages, thereby improving the efficiency of the pressing and attaching process. The detailed description is as follows.
The semiconductor package pressing part 700 may be transferred in a direction perpendicular to the transfer direction of the stage, and the semiconductor package pressing part 700 may include at least one pressing member 710 disposed in a direction perpendicular to the transfer direction of the stage and parallel to the transfer direction of the semiconductor package pressing part 700.
The semiconductor package pressing part 700 shown in fig. 16 includes a plurality of pressing members 710 arranged in a line for applying pressure to the upper surface of the semiconductor package.
Each pressing member 710 may be made of rubber or the like of a flexible material, and each pressing member 710 may be elastically supported by the elastic member 720. Therefore, when the semiconductor package pressing part 700 descends to apply pressure to the upper surface of each semiconductor package, the pressure is restricted by the elastic member 720, and the semiconductor package can be prevented from being damaged.
As shown in the enlarged view of fig. 16, each of the pressing members 710 can press a plurality of semiconductor packages, and the plurality of pressing members 710 are attached to the pressing bar 730 constituting the pressing part 700 via the elastic members 720.
The pressing part 700 may be mounted on a lifter 740 that ascends and descends along the Z-axis.
The plurality of pressing members 710 mounted on the pressing portion 730 are arranged in a row along the Y-axis direction, the pressing portion 730 may be transferred along the Y-axis direction, the stage on which the frame to which the semiconductor package to be sputtered is placed is transferred along the X-axis direction, and the stage may be transferred along the X-axis direction in the semiconductor package attached to the frame, and may be stably attached to the frame by being pressed by the pressing members 710 of the semiconductor package pressing portion 700 configured to be transferred along the Y-axis direction regardless of the position.
Fig. 17 is a schematic view illustrating an operation state of the semiconductor package pressing part 700 shown in fig. 16.
Specifically, (a) of fig. 17 is a schematic view showing a process in which the semiconductor package pressing part 700 moves down after transferring to a pressing or pressing position of the semiconductor package, and (b) of fig. 17 is a schematic view showing a process in which the pressing member 710 constituting the semiconductor package pressing part 700 applies a predetermined pressure to the upper surface of the semiconductor package to attach the semiconductor package to the frame.
The pressing members 710 apply pressure to the upper surface of one semiconductor package, respectively, so that the semiconductor packages attached to the frame are uniformly attached to the frame by the adhesive applied to the frame.
Fig. 18 is a perspective view and an enlarged view of a semiconductor package pressing part 700 constituting another embodiment of the semiconductor package handling apparatus 1' of the present invention, and fig. 19 is an operation state of the semiconductor package pressing part 700 shown in fig. 18. The same description as that with reference to fig. 16 and 17 is omitted.
Unlike the pressing members shown in fig. 2 and 3, in the embodiment shown in fig. 18 and 19, one pressing member 710' may apply pressure to a plurality of semiconductor packages. That is, the pressing member 710' may have a long shape such that one pressing member corresponds to a plurality of semiconductor packages.
As in the embodiment shown in fig. 16 and 17, the pressing members 710' may be mounted in parallel to the pressing portion 730 along a direction perpendicular to the table transfer direction.
In the embodiment shown in fig. 18 and 19, the elastic member 720 is also mounted, so that the magnitude of the pressurizing force is limited while the semiconductor package is being pressed by the pressing member 710, thereby preventing damage due to the same pressurizing force being applied to the individual semiconductor packages having a level difference.
In the embodiment shown in fig. 18 and 19, both ends of one pressing member 710 'are connected to the pressing portion 730 via the elastic member 720, but the number of positions connected to the pressing portion 730 may be varied according to the length of the pressing member 710'. That is, in the embodiment shown in fig. 18 and 19, 2 pressing members 710' are attached to only one pressing portion 730, but the number of the pressing members may be increased or decreased, and the number of the connecting positions may be increased or decreased depending on the length of the pressing members.
That is, the dimensions and the like of the pressing members of the semiconductor package pressing part 700 shown in fig. 16 to 19 may vary, but the common point is that the number of semiconductor packages attached by being pressed by the sequential descending sliding action is plural. This improves the efficiency of the adhering step by the pressing operation of the semiconductor package.
In the method, the semiconductor package provided from the semiconductor package supply part is picked up and attached to the frame with the fixing film used for the semiconductor package sputtering process, and then the pressing part of the semiconductor package is used for applying pressure additionally, so that the attaching state of the semiconductor package can be enhanced. The attachment may be followed by fixation.
Further, after the additional selectors 810a and 810b attach the semiconductor packages, the semiconductor packages are pressed once again without using the additional selectors, and the attachment state is enhanced by providing another semiconductor package pressing portion, so that it is possible to prevent processes from being concentrated on the additional selectors, and to contribute to improvement of hourly throughput (UPH) by separating the respective process portions.
Although the present invention has been described with reference to the preferred embodiments, those skilled in the art to which the present invention pertains can make various modifications and alterations to the present invention without departing from the spirit and scope of the present invention described in the claims below. Therefore, if the modified embodiment substantially includes the structural elements within the scope of the claims, the technical scope of the present invention is encompassed.

Claims (6)

1. A semiconductor package handling apparatus, comprising:
a frame supply/collection unit for supplying a frame on which a sputtering process is performed in a state in which a plurality of semiconductor packages are attached, and collecting an empty frame from which the semiconductor packages are separated;
a semiconductor package separating part picking up the semiconductor package attached to the supplied frame using a test selector, thereby separating the semiconductor package from the frame;
a semiconductor package deburring part including a plurality of deburring units that remove burrs remaining on the semiconductor packages in a process of transferring the semiconductor packages separated from the semiconductor package separating part;
a plurality of seating blocks for loading the semiconductor packages picked up by the inspection selector or for loading the semiconductor packages deburred; and the number of the first and second groups,
and a semiconductor package loading part for picking up the semiconductor package with the burrs removed and loaded on the seat block by an unloading selector and loading the semiconductor package on a semiconductor package carrying tray.
2. The semiconductor package handling device of claim 1,
the semiconductor package deburring part also comprises a cleaning selector which picks up the semiconductor package loaded on the seat block and transfers the semiconductor package to the upper part of the deburring unit,
the deburring unit includes:
a first deburring unit including one or more rotating brushes having a vertical rotating shaft; and the number of the first and second groups,
a second deburring unit including a roll brush having a horizontal rotation shaft,
the first deburring unit and the second deburring unit are arranged side by side to sequentially remove burrs.
3. The semiconductor package handling device of claim 2,
the seat block includes:
a first seating block for loading the semiconductor package separated from the semiconductor package separating part by the inspection selector; and the number of the first and second groups,
a second block for loading the semiconductor package deburred by the cleaning selector,
the first seat block and the second seat block are independently transferred in the Y-axis direction.
4. The semiconductor package processing apparatus according to claim 2, wherein the plurality of rotary brushes constituting the first deburring unit are respectively mounted on rotary members having threads formed on outer peripheral surfaces thereof, the rotary members are engaged with adjacent rotary members by the threads, and when one of the rotary members is rotationally driven by the rotary motor, all of the rotary members are simultaneously rotated.
5. The semiconductor package handling device of claim 2,
the rotary brush constituting the first deburring unit is vertically implanted with a group of brush hairs,
the second deburring unit has bristles radially embedded in its elongated rotary shaft, which is driven by a drive shaft of a motor and a drive belt.
6. The semiconductor package handling device of claim 2,
the deburring unit further comprises a third deburring unit which is arranged in parallel with the first deburring unit and the second deburring unit at the rear of the second deburring unit,
the third deburring unit comprises a fan and a suction flow path, and the fan sprays compressed air to the semiconductor package which is deburred in the second deburring unit to the side surface direction or the bottom surface direction or the diagonal direction of the semiconductor package to remove the residual burrs of the semiconductor package.
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KR101820667B1 (en) 2018-01-22

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