KR20020093897A - 마이크로 열 교환기를 장착한 파워 전자 장치의 부품냉각을 위한 냉각장치 - Google Patents

마이크로 열 교환기를 장착한 파워 전자 장치의 부품냉각을 위한 냉각장치 Download PDF

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Publication number
KR20020093897A
KR20020093897A KR1020027013507A KR20027013507A KR20020093897A KR 20020093897 A KR20020093897 A KR 20020093897A KR 1020027013507 A KR1020027013507 A KR 1020027013507A KR 20027013507 A KR20027013507 A KR 20027013507A KR 20020093897 A KR20020093897 A KR 20020093897A
Authority
KR
South Korea
Prior art keywords
heat exchanger
micro heat
component
cooling
refrigerant
Prior art date
Application number
KR1020027013507A
Other languages
English (en)
Korean (ko)
Inventor
브로이어노어버트
로이트너슈테판
홀라이너
자츠거페터
Original Assignee
로베르트 보쉬 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로베르트 보쉬 게엠베하 filed Critical 로베르트 보쉬 게엠베하
Publication of KR20020093897A publication Critical patent/KR20020093897A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020027013507A 2000-04-11 2001-02-09 마이크로 열 교환기를 장착한 파워 전자 장치의 부품냉각을 위한 냉각장치 KR20020093897A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10017971.1 2000-04-11
DE10017971A DE10017971A1 (de) 2000-04-11 2000-04-11 Kühlvorrichtung zur Kühlung von Bauelementen der Leistungselektronik mit einem Mikrowärmeübertrager
PCT/DE2001/000498 WO2001078478A1 (de) 2000-04-11 2001-02-09 Kühlvorrichtung zur kühlung von bauelementen der leistungselektronik mit einem mikrowärmeübertrager

Publications (1)

Publication Number Publication Date
KR20020093897A true KR20020093897A (ko) 2002-12-16

Family

ID=7638356

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027013507A KR20020093897A (ko) 2000-04-11 2001-02-09 마이크로 열 교환기를 장착한 파워 전자 장치의 부품냉각을 위한 냉각장치

Country Status (6)

Country Link
US (1) US20030178178A1 (ja)
EP (1) EP1275278A1 (ja)
JP (1) JP2004509450A (ja)
KR (1) KR20020093897A (ja)
DE (1) DE10017971A1 (ja)
WO (1) WO2001078478A1 (ja)

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DE10333877A1 (de) * 2003-07-25 2005-02-24 Sdk-Technik Gmbh Kühlvorrichtung, insbesondere zur Kühlung von Bauelementen der Leistungselektronik mittels eines Wärmeübertragungskreislaufes
US20050141195A1 (en) * 2003-12-31 2005-06-30 Himanshu Pokharna Folded fin microchannel heat exchanger
US20060102353A1 (en) * 2004-11-12 2006-05-18 Halliburton Energy Services, Inc. Thermal component temperature management system and method
US8024936B2 (en) * 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
US7699102B2 (en) * 2004-12-03 2010-04-20 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
US7717167B2 (en) * 2004-12-03 2010-05-18 Halliburton Energy Services, Inc. Switchable power allocation in a downhole operation
CA2587897C (en) 2004-12-03 2012-05-29 Halliburton Energy Services, Inc. Heating and cooling electrical components in a downhole operation
DE102005008271A1 (de) 2005-02-22 2006-08-24 Behr Gmbh & Co. Kg Mikrowärmeübertrager
US20070119572A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
EP2063696B1 (de) 2007-11-23 2012-08-22 MiCryon Technik GmbH Verfahren zum Kühlen thermisch hochbelasteter Bauelemente und Vorrichtung zur Durchführung des Verfahrens
DE202007016535U1 (de) 2007-11-23 2008-10-16 Hellwig, Udo, Prof. Dr.-Ing. Einrichtung zum Kühlen thermisch hochbelasteter Bauelemente
DE102007056783A1 (de) 2007-11-23 2009-05-28 Micryon Technik Gmbh Verfahren zum Kühlen thermisch hochbelasteter Bauelemente und Vorrichtung zur Durchführung des Verfahrens
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JPWO2016075838A1 (ja) * 2014-11-14 2017-10-19 株式会社ＥｘａＳｃａｌｅｒ 電子機器の冷却システム、及び冷却方法

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Also Published As

Publication number Publication date
EP1275278A1 (de) 2003-01-15
WO2001078478A1 (de) 2001-10-18
JP2004509450A (ja) 2004-03-25
US20030178178A1 (en) 2003-09-25
DE10017971A1 (de) 2001-10-25

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E601 Decision to refuse application