EP1275278A1 - Kühlvorrichtung zur kühlung von bauelementen der leistungselektronik mit einem mikrowärmeübertrager - Google Patents
Kühlvorrichtung zur kühlung von bauelementen der leistungselektronik mit einem mikrowärmeübertragerInfo
- Publication number
- EP1275278A1 EP1275278A1 EP01913609A EP01913609A EP1275278A1 EP 1275278 A1 EP1275278 A1 EP 1275278A1 EP 01913609 A EP01913609 A EP 01913609A EP 01913609 A EP01913609 A EP 01913609A EP 1275278 A1 EP1275278 A1 EP 1275278A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat exchanger
- component
- cooling device
- refrigerant
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a cooling device, in particular for cooling components of the power electronics by means of a refrigerant flowing through a microwave heat exchanger that is in good thermal contact with the component.
- Such a cooling device is in INT. J. Heat Mass Transfer, Volume 37, No. 2, pages 321-332, 1994, by MP Bowers and I. Mudawar with the title "High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks ".
- components or assemblies of power electronics such as. B. pulse inverters, mainly cooled with the help of massive heat sinks made of aluminum or copper. The heat is dissipated with coolant, which is passed through holes in the heat sinks.
- heat dissipation by boiling bath cooling is known in power electronics components.
- the heat from evaporation does not become electrical conductive liquid, which is in direct contact with the components.
- the essence of the invention is the combination of the phase transition, e.g. B. in evaporative cooling, for cooling the power electronics components with the use of a micro heat exchanger.
- Microwave heat exchangers are structures in which there are channel arrangements with very small dimensions in the submillimeter range.
- Heat is usually dissipated in microwaves by heat transfer to a liquid flowing through.
- Decisive advantages result from the flow through the micro heat exchanger with a suitable refrigerant, which evaporates at the desired component temperature.
- micro heat exchangers Because of the large number of channels through which they flow, micro heat exchangers have a large heat transfer area and are therefore able, when they are flowed through by a suitable refrigerant, to dissipate very large amounts of heat at the desired temperature.
- the temperature difference along the cooling channels is smaller than with single-phase convective heat transfer, since a large part of the heat is transferred at the phase transition temperature. This results in uniform temperature distributions in the area of the components to be cooled. Due to their small channel diameter, micro heat exchangers are suitable for use at high pressures. In addition, sealing problems are easier to solve than with boiling bath cooling.
- Figure 1 shows schematically in section a first exemplary embodiment of a cooling device according to the invention
- Figure 2 shows schematically in section a second exemplary embodiment of a cooling device according to the invention
- Figure 3 shows schematically in section a third exemplary embodiment of a cooling device according to the invention.
- FIGS. 1 to 3 show three variants of a cooling device according to the invention for cooling components of the power electronics.
- a micro heat exchanger 10 is arranged on the back of an insulating circuit board substrate 2 opposite a component 1 to be cooled, which on the front side of the substrate 2 via an electrical and thermal contact 6 and a solder layer 5 with the circuit board substrate 2 connected is.
- a heat current is released in the power electronics component 1, which is emitted to the micro heat exchanger 10 via the solder 5, the electrical and thermal contacts 6 and the circuit board substrate 2 (in short, circuit board).
- Liquid refrigerant which is slightly supercooled, is supplied to the micro heat exchanger 10.
- the refrigerant first warms up to the boiling state and then begins to boil in the channels of the micro heat exchanger 10. This is also referred to as flow boiling of a saturated liquid.
- An alternative is flow boiling of a supercooled liquid serving as a refrigerant.
- the supercooled liquid enters the micro heat exchanger 10 and bubbles form which, however, in contrast to the flow boiling of saturated liquids, either collapse on the wall or in the immediate vicinity of the wall.
- the improved heat transfer that occurs here is due to simultaneous evaporation and condensation and to increased turbulence in the liquid near the wall downstream of the point of bubble formation.
- FIG. 2 shows a second embodiment of the cooling device according to the invention, in which a micro heat exchanger 11 is arranged directly on and above the component to be cooled (e.g. chip) 1.
- This component 1 is also connected to an insulating board 2 via a solder layer 5 and an electrical and thermal contact 6.
- FIG. 3 A further exemplary embodiment is shown in FIG. 3.
- a micro heat exchanger 12 is integrated directly in the circuit board substrate 3, specifically in such a way that the microchannels of the microwave heat exchanger 3 run in the substrate plane and run adjacent to the component 1 to be cooled or its electrical and thermal contact 6.
- micro heat exchanger can then be divided into individual sections, which can then each have the structure and position shown in FIGS. 1 to 3.
- the refrigerant and the system pressure at which the corresponding evaporation process occurs are selected so that the heat flow is removed from the electrical components and the maximum permissible temperature in the region of the component or chip is not exceeded.
- a condenser (not shown), which serves to condense the evaporated refrigerant emerging from the micro heat exchanger, can be microstructured or conventionally constructed, and is arranged centrally or decentrally.
- the refrigerant condensed in the condenser can be returned to the microwave heat exchanger actively via a pump (not shown) or passively via gravity or via capillary lines.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10017971 | 2000-04-11 | ||
DE10017971A DE10017971A1 (de) | 2000-04-11 | 2000-04-11 | Kühlvorrichtung zur Kühlung von Bauelementen der Leistungselektronik mit einem Mikrowärmeübertrager |
PCT/DE2001/000498 WO2001078478A1 (de) | 2000-04-11 | 2001-02-09 | Kühlvorrichtung zur kühlung von bauelementen der leistungselektronik mit einem mikrowärmeübertrager |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1275278A1 true EP1275278A1 (de) | 2003-01-15 |
Family
ID=7638356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01913609A Ceased EP1275278A1 (de) | 2000-04-11 | 2001-02-09 | Kühlvorrichtung zur kühlung von bauelementen der leistungselektronik mit einem mikrowärmeübertrager |
Country Status (6)
Country | Link |
---|---|
US (1) | US20030178178A1 (ja) |
EP (1) | EP1275278A1 (ja) |
JP (1) | JP2004509450A (ja) |
KR (1) | KR20020093897A (ja) |
DE (1) | DE10017971A1 (ja) |
WO (1) | WO2001078478A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7246940B2 (en) * | 2003-06-24 | 2007-07-24 | Halliburton Energy Services, Inc. | Method and apparatus for managing the temperature of thermal components |
WO2005006436A1 (de) | 2003-07-08 | 2005-01-20 | Infineon Technologies Ag | Integrierte kühl-schaltungsanordnung, betriebsverfahren und herstellungsverfahren |
DE10333877A1 (de) * | 2003-07-25 | 2005-02-24 | Sdk-Technik Gmbh | Kühlvorrichtung, insbesondere zur Kühlung von Bauelementen der Leistungselektronik mittels eines Wärmeübertragungskreislaufes |
US20050141195A1 (en) * | 2003-12-31 | 2005-06-30 | Himanshu Pokharna | Folded fin microchannel heat exchanger |
US20060102353A1 (en) * | 2004-11-12 | 2006-05-18 | Halliburton Energy Services, Inc. | Thermal component temperature management system and method |
US8024936B2 (en) * | 2004-11-16 | 2011-09-27 | Halliburton Energy Services, Inc. | Cooling apparatus, systems, and methods |
WO2006060673A1 (en) * | 2004-12-03 | 2006-06-08 | Halliburton Energy Services, Inc. | Rechargeable energy storage device in a downhole operation |
WO2006060708A1 (en) * | 2004-12-03 | 2006-06-08 | Halliburton Energy Services, Inc. | Switchable power allocation in a downhole operation |
AU2005316870A1 (en) | 2004-12-03 | 2006-06-22 | Halliburton Energy Services, Inc. | Heating and cooling electrical components in a downhole operation |
DE102005008271A1 (de) | 2005-02-22 | 2006-08-24 | Behr Gmbh & Co. Kg | Mikrowärmeübertrager |
US20070119572A1 (en) * | 2005-11-30 | 2007-05-31 | Raytheon Company | System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements |
EP2063696B1 (de) | 2007-11-23 | 2012-08-22 | MiCryon Technik GmbH | Verfahren zum Kühlen thermisch hochbelasteter Bauelemente und Vorrichtung zur Durchführung des Verfahrens |
DE102007056783A1 (de) | 2007-11-23 | 2009-05-28 | Micryon Technik Gmbh | Verfahren zum Kühlen thermisch hochbelasteter Bauelemente und Vorrichtung zur Durchführung des Verfahrens |
DE202007016535U1 (de) | 2007-11-23 | 2008-10-16 | Hellwig, Udo, Prof. Dr.-Ing. | Einrichtung zum Kühlen thermisch hochbelasteter Bauelemente |
TWI513069B (zh) * | 2013-05-21 | 2015-12-11 | Subtron Technology Co Ltd | 散熱板 |
US20170332514A1 (en) * | 2014-11-14 | 2017-11-16 | Exascaler Inc. | Cooling system and cooling method for electronic equipment |
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DE2204589A1 (de) * | 1972-02-01 | 1973-08-16 | Siemens Ag | Kuehlanordnung fuer flache halbleiterbauelemente |
US4047198A (en) * | 1976-04-19 | 1977-09-06 | Hughes Aircraft Company | Transistor cooling by heat pipes having a wick of dielectric powder |
JPS5936827B2 (ja) * | 1979-01-12 | 1984-09-06 | 日本電信電話株式会社 | 集積回路素子の冷却装置 |
US4392362A (en) * | 1979-03-23 | 1983-07-12 | The Board Of Trustees Of The Leland Stanford Junior University | Micro miniature refrigerators |
US4322737A (en) * | 1979-11-20 | 1982-03-30 | Intel Corporation | Integrated circuit micropackaging |
US4573067A (en) * | 1981-03-02 | 1986-02-25 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits |
US4386505A (en) * | 1981-05-01 | 1983-06-07 | The Board Of Trustees Of The Leland Stanford Junior University | Refrigerators |
DE3206059C2 (de) * | 1982-02-19 | 1984-11-29 | Siemens AG, 1000 Berlin und 8000 München | Kühleinrichtung für elektrische Bauelemente |
US4503483A (en) * | 1982-05-03 | 1985-03-05 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
US4491010A (en) * | 1983-06-20 | 1985-01-01 | General Motors Corporation | Dynamic combustion characteristic sensor for internal combustion engine |
DE3402003A1 (de) * | 1984-01-21 | 1985-07-25 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul |
DE3504992A1 (de) * | 1985-02-14 | 1986-08-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit integriertem waermerohr |
DE3650719T2 (de) * | 1985-11-19 | 2000-04-13 | Fujitsu Ltd | Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis |
US4758926A (en) * | 1986-03-31 | 1988-07-19 | Microelectronics And Computer Technology Corporation | Fluid-cooled integrated circuit package |
US4894709A (en) * | 1988-03-09 | 1990-01-16 | Massachusetts Institute Of Technology | Forced-convection, liquid-cooled, microchannel heat sinks |
US5179043A (en) * | 1989-07-14 | 1993-01-12 | The Texas A&M University System | Vapor deposited micro heat pipes |
JP2859927B2 (ja) * | 1990-05-16 | 1999-02-24 | 株式会社東芝 | 冷却装置および温度制御装置 |
US5199487A (en) * | 1991-05-31 | 1993-04-06 | Hughes Aircraft Company | Electroformed high efficiency heat exchanger and method for making |
US5355942A (en) * | 1991-08-26 | 1994-10-18 | Sun Microsystems, Inc. | Cooling multi-chip modules using embedded heat pipes |
US5218515A (en) * | 1992-03-13 | 1993-06-08 | The United States Of America As Represented By The United States Department Of Energy | Microchannel cooling of face down bonded chips |
JP2660879B2 (ja) * | 1992-05-25 | 1997-10-08 | マンネスマン・アクチエンゲゼルシャフト | 半導体スイッチを有する電気機械 |
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
DE4311839A1 (de) * | 1993-04-15 | 1994-10-20 | Siemens Ag | Mikrokühleinrichtung für eine Elektronik-Komponente |
US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
US5611214A (en) * | 1994-07-29 | 1997-03-18 | Battelle Memorial Institute | Microcomponent sheet architecture |
US5598632A (en) * | 1994-10-06 | 1997-02-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method for producing micro heat panels |
DE19514548C1 (de) * | 1995-04-20 | 1996-10-02 | Daimler Benz Ag | Verfahren zur Herstellung einer Mikrokühleinrichtung |
US5548605A (en) * | 1995-05-15 | 1996-08-20 | The Regents Of The University Of California | Monolithic microchannel heatsink |
DE19608824A1 (de) * | 1996-03-07 | 1997-09-18 | Inst Mikrotechnik Mainz Gmbh | Verfahren zur Herstellung von Mikrowärmetauschern |
DE19626227C2 (de) * | 1996-06-29 | 1998-07-02 | Bosch Gmbh Robert | Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere für Multichipmodule, und Verfahren zu ihrer Herstellung |
US5801442A (en) * | 1996-07-22 | 1998-09-01 | Northrop Grumman Corporation | Microchannel cooling of high power semiconductor devices |
US5901037A (en) * | 1997-06-18 | 1999-05-04 | Northrop Grumman Corporation | Closed loop liquid cooling for semiconductor RF amplifier modules |
US5841244A (en) * | 1997-06-18 | 1998-11-24 | Northrop Grumman Corporation | RF coil/heat pipe for solid state light driver |
US6290685B1 (en) * | 1998-06-18 | 2001-09-18 | 3M Innovative Properties Company | Microchanneled active fluid transport devices |
US6907921B2 (en) * | 1998-06-18 | 2005-06-21 | 3M Innovative Properties Company | Microchanneled active fluid heat exchanger |
KR100294317B1 (ko) * | 1999-06-04 | 2001-06-15 | 이정현 | 초소형 냉각 장치 |
US6457515B1 (en) * | 1999-08-06 | 2002-10-01 | The Ohio State University | Two-layered micro channel heat sink, devices and systems incorporating same |
US6415860B1 (en) * | 2000-02-09 | 2002-07-09 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Crossflow micro heat exchanger |
EP1321015B1 (en) * | 2000-09-29 | 2004-05-19 | Nanostream, Inc. | Microfluidic devices for heat transfer |
US6437981B1 (en) * | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
-
2000
- 2000-04-11 DE DE10017971A patent/DE10017971A1/de not_active Ceased
-
2001
- 2001-02-09 US US10/257,509 patent/US20030178178A1/en not_active Abandoned
- 2001-02-09 WO PCT/DE2001/000498 patent/WO2001078478A1/de not_active Application Discontinuation
- 2001-02-09 KR KR1020027013507A patent/KR20020093897A/ko not_active Application Discontinuation
- 2001-02-09 EP EP01913609A patent/EP1275278A1/de not_active Ceased
- 2001-02-09 JP JP2001575793A patent/JP2004509450A/ja active Pending
Non-Patent Citations (1)
Title |
---|
See references of WO0178478A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2004509450A (ja) | 2004-03-25 |
WO2001078478A1 (de) | 2001-10-18 |
US20030178178A1 (en) | 2003-09-25 |
KR20020093897A (ko) | 2002-12-16 |
DE10017971A1 (de) | 2001-10-25 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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Effective date: 20021111 |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: HOHL, REINER Inventor name: LEUTHNER, STEPHAN Inventor name: SATZGER, PETER Inventor name: BREUER, NORBERT |
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RBV | Designated contracting states (corrected) |
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