KR20020082463A - 복합재료 및 다층회로기판의 제조방법 - Google Patents
복합재료 및 다층회로기판의 제조방법 Download PDFInfo
- Publication number
- KR20020082463A KR20020082463A KR1020027007270A KR20027007270A KR20020082463A KR 20020082463 A KR20020082463 A KR 20020082463A KR 1020027007270 A KR1020027007270 A KR 1020027007270A KR 20027007270 A KR20027007270 A KR 20027007270A KR 20020082463 A KR20020082463 A KR 20020082463A
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- composite material
- curable composition
- multilayer circuit
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00055967 | 2000-02-28 | ||
JP2000055967A JP2001244639A (ja) | 2000-02-28 | 2000-02-28 | 多層回路基板用材料および多層回路基板の製造方法 |
PCT/JP2001/001448 WO2001063990A1 (fr) | 2000-02-28 | 2001-02-27 | Materiau composite et procede de fabrication de carte a circuit imprime multicouche |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20020082463A true KR20020082463A (ko) | 2002-10-31 |
Family
ID=18577004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020027007270A KR20020082463A (ko) | 2000-02-28 | 2001-02-27 | 복합재료 및 다층회로기판의 제조방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2001244639A (ja) |
KR (1) | KR20020082463A (ja) |
WO (1) | WO2001063990A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI262041B (en) | 2003-11-14 | 2006-09-11 | Hitachi Chemical Co Ltd | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
JP4704025B2 (ja) * | 2004-12-21 | 2011-06-15 | Jx日鉱日石金属株式会社 | 高周波回路用粗化処理圧延銅箔及びその製造方法 |
KR20110006627A (ko) * | 2009-07-14 | 2011-01-20 | 아지노모토 가부시키가이샤 | 동박 적층판 |
TWI498408B (zh) * | 2009-07-14 | 2015-09-01 | Ajinomoto Kk | Attached film with copper foil |
US20170208680A1 (en) * | 2016-01-15 | 2017-07-20 | Jx Nippon Mining & Metals Corporation | Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna |
CN108012406A (zh) * | 2017-12-06 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | 可拉伸的fpc板及其制作方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1027960A (ja) * | 1996-07-09 | 1998-01-27 | Mitsui Mining & Smelting Co Ltd | 多層プリント配線板の製造方法 |
JPH10303569A (ja) * | 1997-04-23 | 1998-11-13 | Multi:Kk | 多層銅張り積層板及びこれを用いた高密度多層プリント配線板及びこれらの製造方法 |
JP3568091B2 (ja) * | 1997-08-20 | 2004-09-22 | ソニー株式会社 | 積層シート並びにプリント配線板及びその製造方法 |
JPH11135952A (ja) * | 1997-10-27 | 1999-05-21 | Furukawa Electric Co Ltd:The | 印刷回路基板用樹脂付き銅箔、およびそれを用いた印刷回路基板 |
-
2000
- 2000-02-28 JP JP2000055967A patent/JP2001244639A/ja active Pending
-
2001
- 2001-02-27 KR KR1020027007270A patent/KR20020082463A/ko not_active Application Discontinuation
- 2001-02-27 WO PCT/JP2001/001448 patent/WO2001063990A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2001063990A1 (fr) | 2001-08-30 |
JP2001244639A (ja) | 2001-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |