KR20020082463A - 복합재료 및 다층회로기판의 제조방법 - Google Patents

복합재료 및 다층회로기판의 제조방법 Download PDF

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Publication number
KR20020082463A
KR20020082463A KR1020027007270A KR20027007270A KR20020082463A KR 20020082463 A KR20020082463 A KR 20020082463A KR 1020027007270 A KR1020027007270 A KR 1020027007270A KR 20027007270 A KR20027007270 A KR 20027007270A KR 20020082463 A KR20020082463 A KR 20020082463A
Authority
KR
South Korea
Prior art keywords
copper foil
composite material
curable composition
multilayer circuit
circuit board
Prior art date
Application number
KR1020027007270A
Other languages
English (en)
Korean (ko)
Inventor
와끼자까야스히로
유야마간지
Original Assignee
제온 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제온 코포레이션 filed Critical 제온 코포레이션
Publication of KR20020082463A publication Critical patent/KR20020082463A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020027007270A 2000-02-28 2001-02-27 복합재료 및 다층회로기판의 제조방법 KR20020082463A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000055967A JP2001244639A (ja) 2000-02-28 2000-02-28 多層回路基板用材料および多層回路基板の製造方法
JPJP-P-2000-00055967 2000-02-28
PCT/JP2001/001448 WO2001063990A1 (fr) 2000-02-28 2001-02-27 Materiau composite et procede de fabrication de carte a circuit imprime multicouche

Publications (1)

Publication Number Publication Date
KR20020082463A true KR20020082463A (ko) 2002-10-31

Family

ID=18577004

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027007270A KR20020082463A (ko) 2000-02-28 2001-02-27 복합재료 및 다층회로기판의 제조방법

Country Status (3)

Country Link
JP (1) JP2001244639A (ja)
KR (1) KR20020082463A (ja)
WO (1) WO2001063990A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI262041B (en) 2003-11-14 2006-09-11 Hitachi Chemical Co Ltd Formation method of metal layer on resin layer, printed wiring board, and production method thereof
JP4704025B2 (ja) * 2004-12-21 2011-06-15 Ｊｘ日鉱日石金属株式会社 高周波回路用粗化処理圧延銅箔及びその製造方法
TWI498408B (zh) * 2009-07-14 2015-09-01 Ajinomoto Kk Attached film with copper foil
JP5482524B2 (ja) * 2009-07-14 2014-05-07 味の素株式会社 銅張積層板
US20170208680A1 (en) * 2016-01-15 2017-07-20 Jx Nippon Mining & Metals Corporation Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing Antenna
CN108012406A (zh) * 2017-12-06 2018-05-08 广州兴森快捷电路科技有限公司 可拉伸的fpc板及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1027960A (ja) * 1996-07-09 1998-01-27 Mitsui Mining & Smelting Co Ltd 多層プリント配線板の製造方法
JPH10303569A (ja) * 1997-04-23 1998-11-13 Multi:Kk 多層銅張り積層板及びこれを用いた高密度多層プリント配線板及びこれらの製造方法
JP3568091B2 (ja) * 1997-08-20 2004-09-22 ソニー株式会社 積層シート並びにプリント配線板及びその製造方法
JPH11135952A (ja) * 1997-10-27 1999-05-21 Furukawa Electric Co Ltd:The 印刷回路基板用樹脂付き銅箔、およびそれを用いた印刷回路基板

Also Published As

Publication number Publication date
JP2001244639A (ja) 2001-09-07
WO2001063990A1 (fr) 2001-08-30

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