KR20020060716A - 금속 도금욕 중의 첨가제 측정 방법 및 장치 - Google Patents

금속 도금욕 중의 첨가제 측정 방법 및 장치 Download PDF

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Publication number
KR20020060716A
KR20020060716A KR1020027004993A KR20027004993A KR20020060716A KR 20020060716 A KR20020060716 A KR 20020060716A KR 1020027004993 A KR1020027004993 A KR 1020027004993A KR 20027004993 A KR20027004993 A KR 20027004993A KR 20020060716 A KR20020060716 A KR 20020060716A
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KR
South Korea
Prior art keywords
solution
plating
potential
additive
concentration
Prior art date
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KR1020027004993A
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English (en)
Korean (ko)
Inventor
로버트슨피터엠
Original Assignee
바누치 유진 지.
어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드
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Application filed by 바누치 유진 지., 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 filed Critical 바누치 유진 지.
Publication of KR20020060716A publication Critical patent/KR20020060716A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/4161—Systems measuring the voltage and using a constant current supply, e.g. chronopotentiometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020027004993A 1999-10-20 2000-10-17 금속 도금욕 중의 첨가제 측정 방법 및 장치 Withdrawn KR20020060716A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/421,658 US6280602B1 (en) 1999-10-20 1999-10-20 Method and apparatus for determination of additives in metal plating baths
US09/421,658 1999-10-20
PCT/US2000/041202 WO2001029548A1 (en) 1999-10-20 2000-10-17 Method and apparatus for determination of additives in metal plating baths

Publications (1)

Publication Number Publication Date
KR20020060716A true KR20020060716A (ko) 2002-07-18

Family

ID=23671482

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027004993A Withdrawn KR20020060716A (ko) 1999-10-20 2000-10-17 금속 도금욕 중의 첨가제 측정 방법 및 장치

Country Status (6)

Country Link
US (3) US6280602B1 (cg-RX-API-DMAC7.html)
EP (1) EP1226426A4 (cg-RX-API-DMAC7.html)
JP (1) JP2003512618A (cg-RX-API-DMAC7.html)
KR (1) KR20020060716A (cg-RX-API-DMAC7.html)
AU (1) AU1966701A (cg-RX-API-DMAC7.html)
WO (1) WO2001029548A1 (cg-RX-API-DMAC7.html)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100788279B1 (ko) 2006-09-20 2008-01-02 재단법인서울대학교산학협력재단 구리 무전해 도금에서의 단차평탄화 방법
WO2011017197A3 (en) * 2009-08-03 2011-06-16 Novellus Systems, Inc. Monitoring of electroplating additives
KR101274363B1 (ko) * 2009-05-27 2013-06-13 노벨러스 시스템즈, 인코포레이티드 얇은 시드층 상의 도금을 위한 펄스 시퀀스
KR20140090116A (ko) * 2013-01-07 2014-07-16 노벨러스 시스템즈, 인코포레이티드 전기도금을 위한 기판들의 전류 램핑 및 전류 펄싱 진입
US9309605B2 (en) 2011-12-12 2016-04-12 Novellus Systems, Inc. Monitoring leveler concentrations in electroplating solutions
KR101691949B1 (ko) * 2016-10-28 2017-01-02 서울대학교 산학협력단 도금액 내 요오드화물 농도 측정방법
US9689083B2 (en) 2013-06-14 2017-06-27 Lam Research Corporation TSV bath evaluation using field versus feature contrast
US10968531B2 (en) 2011-05-17 2021-04-06 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
KR20210083020A (ko) * 2019-12-26 2021-07-06 서울대학교산학협력단 도금액 내 브롬화물 농도 측정방법
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
US12305307B2 (en) 2020-01-10 2025-05-20 Lam Research Corporation TSV process window and fill performance enhancement by long pulsing and ramping

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US6814855B2 (en) * 1998-05-01 2004-11-09 Semitool, Inc. Automated chemical management system having improved analysis unit
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US6280602B1 (en) * 1999-10-20 2001-08-28 Advanced Technology Materials, Inc. Method and apparatus for determination of additives in metal plating baths
KR100474418B1 (ko) * 2000-09-19 2005-03-08 주식회사 포스코 염화물계 도금액 중의 유기첨가제 정량방법
US6974951B1 (en) * 2001-01-29 2005-12-13 Metara, Inc. Automated in-process ratio mass spectrometry
US6592747B2 (en) * 2001-06-18 2003-07-15 International Business Machines Corporation Method of controlling additives in copper plating baths
US7220383B2 (en) 2001-07-13 2007-05-22 Metara, Inc. Method and instrument for automated analysis of fluid-based processing systems
US6936157B2 (en) * 2001-08-09 2005-08-30 Advanced Technology Materials, Inc. Interference correction of additives concentration measurements in metal electroplating solutions
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US6878245B2 (en) * 2002-02-27 2005-04-12 Applied Materials, Inc. Method and apparatus for reducing organic depletion during non-processing time periods
US20030159937A1 (en) * 2002-02-27 2003-08-28 Applied Materials, Inc. Method to reduce the depletion of organics in electroplating baths
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US6808611B2 (en) * 2002-06-27 2004-10-26 Applied Materials, Inc. Methods in electroanalytical techniques to analyze organic components in plating baths
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US6986835B2 (en) * 2002-11-04 2006-01-17 Applied Materials Inc. Apparatus for plating solution analysis
US6758955B2 (en) * 2002-12-06 2004-07-06 Advanced Technology Materials, Inc. Methods for determination of additive concentration in metal plating baths
US20060266648A1 (en) * 2002-12-17 2006-11-30 King Mackenzie E Process analyzer for monitoring electrochemical deposition solutions
JP4534983B2 (ja) * 2003-03-25 2010-09-01 凸版印刷株式会社 電気銅めっき液の分析方法、その分析装置
JP2004323971A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 改良された浴分析
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法
US7157051B2 (en) * 2003-09-10 2007-01-02 Advanced Technology Materials, Inc. Sampling management for a process analysis tool to minimize sample usage and decrease sampling time
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7141156B2 (en) * 2004-04-27 2006-11-28 Advanced Technology Materials, Inc. One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
US20050236280A1 (en) * 2004-04-27 2005-10-27 Jianwen Han Methods for analyzing inorganic components of an electrolytic solution, and /or cleaning an electrochemical analytical cell
US7435320B2 (en) * 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US7186326B2 (en) * 2004-05-27 2007-03-06 Eci Technology, Inc. Efficient analysis of organic additives in an acid copper plating bath
US8529738B2 (en) * 2005-02-08 2013-09-10 The Trustees Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
US8496799B2 (en) * 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
WO2006110437A1 (en) * 2005-04-08 2006-10-19 The Trustees Of Columbia University In The City Of New York Systems and methods for monitoring plating and etching baths
US7851222B2 (en) * 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
WO2007027907A2 (en) * 2005-09-02 2007-03-08 The Trustees Of Columbia University In The City Of New York A system and method for obtaining anisotropic etching of patterned substrates
US8398582B2 (en) * 2005-10-27 2013-03-19 Novartis Ag Fluid pressure sensing chamber
US8202243B2 (en) * 2005-10-27 2012-06-19 Novartis Ag Fluid pressure sensing chamber
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US7942853B2 (en) * 2006-01-11 2011-05-17 Alcon, Inc. Fluid chamber
US20070261963A1 (en) * 2006-02-02 2007-11-15 Advanced Technology Materials, Inc. Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions
WO2007103946A2 (en) * 2006-03-07 2007-09-13 Metara, Inc. Module for automated matrix removal in acidic plating solutions
WO2008070786A1 (en) * 2006-12-06 2008-06-12 The Trustees Of Columbia University In The City Of New York Microfluidic systems and methods for screening plating and etching bath compositions
US7879222B2 (en) * 2007-08-27 2011-02-01 Eci Technology, Inc. Detection of additive breakdown products in acid copper plating baths
DE102008056470B3 (de) 2008-11-05 2010-04-22 Atotech Deutschland Gmbh Verfahren zum Untersuchen einer Metallschicht und Verfahren zur analytischen Kontrolle eines zum Abscheiden der Metallschicht dienenden Abscheideelektrolyten
US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating
JP5442400B2 (ja) * 2009-11-13 2014-03-12 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
US8760637B2 (en) 2010-08-30 2014-06-24 Alcon Research, Ltd. Optical sensing system including electronically switched optical magnification
JP5826952B2 (ja) * 2014-01-17 2015-12-02 株式会社荏原製作所 めっき方法およびめっき装置
US9575032B2 (en) * 2014-08-07 2017-02-21 Hong Kong Applied Science and Technology Research Institute Company Limited Method of analyzing at least two inhibitors simultaneously in a plating bath
US10508357B2 (en) * 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
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CN112164805B (zh) * 2020-09-25 2024-07-16 西南交通大学 一种液流电池用催化剂原位制备装置及催化剂制备方法
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100788279B1 (ko) 2006-09-20 2008-01-02 재단법인서울대학교산학협력재단 구리 무전해 도금에서의 단차평탄화 방법
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
KR101274363B1 (ko) * 2009-05-27 2013-06-13 노벨러스 시스템즈, 인코포레이티드 얇은 시드층 상의 도금을 위한 펄스 시퀀스
WO2011017197A3 (en) * 2009-08-03 2011-06-16 Novellus Systems, Inc. Monitoring of electroplating additives
CN102471919A (zh) * 2009-08-03 2012-05-23 诺发系统有限公司 对电镀添加剂的监视
US8372258B2 (en) 2009-08-03 2013-02-12 Novellus Systems, Inc. Monitoring of electroplating additives
US10968531B2 (en) 2011-05-17 2021-04-06 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
US9309605B2 (en) 2011-12-12 2016-04-12 Novellus Systems, Inc. Monitoring leveler concentrations in electroplating solutions
US9856574B2 (en) 2011-12-12 2018-01-02 Novellus Systems, Inc. Monitoring leveler concentrations in electroplating solutions
KR20140090116A (ko) * 2013-01-07 2014-07-16 노벨러스 시스템즈, 인코포레이티드 전기도금을 위한 기판들의 전류 램핑 및 전류 펄싱 진입
US9689083B2 (en) 2013-06-14 2017-06-27 Lam Research Corporation TSV bath evaluation using field versus feature contrast
US10508359B2 (en) 2013-06-14 2019-12-17 Lam Research Corporation TSV bath evaluation using field versus feature contrast
KR101691949B1 (ko) * 2016-10-28 2017-01-02 서울대학교 산학협력단 도금액 내 요오드화물 농도 측정방법
KR20210083020A (ko) * 2019-12-26 2021-07-06 서울대학교산학협력단 도금액 내 브롬화물 농도 측정방법
US12305307B2 (en) 2020-01-10 2025-05-20 Lam Research Corporation TSV process window and fill performance enhancement by long pulsing and ramping

Also Published As

Publication number Publication date
US6280602B1 (en) 2001-08-28
US6495011B2 (en) 2002-12-17
JP2003512618A (ja) 2003-04-02
WO2001029548A1 (en) 2001-04-26
EP1226426A4 (en) 2004-04-07
EP1226426A1 (en) 2002-07-31
US6592737B1 (en) 2003-07-15
US20010042694A1 (en) 2001-11-22
AU1966701A (en) 2001-04-30

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