KR20010086441A - 에폭시 수지 조성물 및 반도체 장치 - Google Patents
에폭시 수지 조성물 및 반도체 장치 Download PDFInfo
- Publication number
- KR20010086441A KR20010086441A KR1020017005298A KR20017005298A KR20010086441A KR 20010086441 A KR20010086441 A KR 20010086441A KR 1020017005298 A KR1020017005298 A KR 1020017005298A KR 20017005298 A KR20017005298 A KR 20017005298A KR 20010086441 A KR20010086441 A KR 20010086441A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- curing
- semiconductor device
- cured product
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
실 시 예 | ||||||
1 | 2 | 3 | 4 | 5 | 6 | |
식(1)의에폭시 수지 | 10.2 | 10.2 | 7.6 | |||
식(3)의에폭시 수지 | 4.2 | 5.9 | ||||
식(4)의에폭시 수지 | 6.4 | |||||
식(2)의페놀 수지 | 5.8 | 5.8 | 4.4 | |||
식(5)의페놀 수지 | 3.8 | |||||
식(6)의페놀 수지 | 6.1 | 5.6 | ||||
구형 용융 실리카 | 83.25 | 83.30 | 91.25 | 87.20 | 87.30 | 87.30 |
트리페닐포스핀 | 0.15 | 0.10 | 0.15 | 0.20 | 0.10 | 0.10 |
카본 블랙 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
카르나우바 왁스 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
나선형 유동(cm) | 100 | 100 | 80 | 70 | 80 | 70 |
경화성 | 95 | 95 | 90 | 95 | 95 | 95 |
굴곡모듈러스 a(N/mm2) | 14000 | 8000 | 1500 | 600 | 1500 | 10000 |
b + c (%) | 0.28 | 0.42 | 0.40 | 0.28 | 0.20 | 0.20 |
수분흡수율(중량%) | 0.26 | 0.27 | 0.10 | 0.10 | 0.09 | 0.22 |
이형성 | 우수 | 우수 | 우수 | 우수 | 우수 | 우수 |
패키지의뒤틀림 양 (㎛) | 50 | 80 | 80 | 30 | 20 | 30 |
솔더링 크랙레지스턴스(60℃) | 0/10 | 0/10 | 0/10 | 0/10 | 0/10 | 0/10 |
솔더링 크랙레지스턴스(85℃) | 10/10 | 10/10 | 0/10 | 0/10 | 0/10 | 8/10 |
비 교 예 | ||||||
1 | 2 | 3 | 4 | 5 | 6 | |
식(1)의에폭시 수지 | 4.9 | 7.6 | 12.7 | |||
식(3)의에폭시 수지 | 10.7 | 6.3 | 5.2 | |||
식(2)의페놀 수지 | 5.3 | 4.4 | 7.3 | |||
식(5)의페놀 수지 | 5.7 | |||||
페놀노볼락 수지 | 2.8 | 3.1 | ||||
구형 용융 실리카 | 83.25 | 87.20 | 91.35 | 91.35 | 87.15 | 79.10 |
트리페닐포스핀 | 0.15 | 0.20 | 0.05 | 0.05 | 0.25 | 0.30 |
카본 블랙 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
카르나우바 왁스 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 |
나선형 유동(cm) | 100 | 80 | 70 | 70 | 20 | 140 |
경화성 | 95 | 85 | 50 | 85 | 95 | 100 |
굴곡모듈러스 a(N/mm2) | 400 | 1000 | 200 | 1600 | 24000 | 17000 |
b + c (%) | 0.38 | 0.45 | 0.16 | 0.13 | 0.20 | 0.52 |
수분흡수율(중량%) | 0.16 | 0.11 | 0.08 | 0.15 | 0.26 | 0.33 |
이형성 | 우수 | 우수 | 불량 | 불량 | 공란 | 우수 |
패키지의뒤틀림 양 (㎛) | 110 | 120 | 40 | 30 | 공란 | 130 |
솔더링 크랙레지스턴스(60℃) | 0/10 | 0/10 | 0/10 | 0/10 | 공란 | 10/10 |
솔더링 크랙레지스턴스(85℃) | 2/10 | 0/10 | 0/10 | 5/10 | 공란 | 10/10 |
Claims (4)
- (A) 에폭시 수지, (B) 페놀 수지, (C) 경화 가속제 그리고 (D) 무기 충전제를 주요성분으로 포함하는 반도체 캡슐화용 에폭시 수지 조성물에 있어서, 상기 에폭시 수지 조성물을 가열 및 경화하여 형성한 경화물의 특성이 식, a ≥10R(R=10×(b+c)-1), 300 ≤a ≤20000 그리고 0.15 ≤b + c ≤0.50 (여기에서 a는 성형 온도에서의 굴곡 모듈러스(N/mm2)를 나타내고, b는 경화 수축(%)를 나타내며, c는 성형 온도부터 상온까지의 열 수축(%)을 나타낸다)을 만족하는 것을 특징으로 하는 에폭시 수지 조성물.
- 제 1 항에 있어서, 상기 경화물이 85 ℃ 및 60 %의 상대 습도 환경에서 168 시간 동안 처리된 후에 0.2 중량 % 이하의 수분 흡수율을 갖는 반도체 캡슐화용 에폭시 수지 조성물.
- 제 1 항 또는 제 2 항에 있어서, 상기 에폭시 수지 및/또는 상기 페놀 수지가 나프탈렌 골격을 갖는 반도체 캡슐화용 에폭시 수지 조성물.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서, 상기 에폭시 수지 조성물로 캡슐화하여 수득한 반도체 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25160099 | 1999-09-06 | ||
JP1999-251600 | 1999-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010086441A true KR20010086441A (ko) | 2001-09-12 |
KR100663680B1 KR100663680B1 (ko) | 2007-01-02 |
Family
ID=17225240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020017005298A KR100663680B1 (ko) | 1999-09-06 | 2000-09-04 | 에폭시 수지 조성물 및 반도체 장치 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1137708A1 (ko) |
KR (1) | KR100663680B1 (ko) |
CN (1) | CN1321179A (ko) |
TW (1) | TWI281482B (ko) |
WO (1) | WO2001018115A1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1301296C (zh) * | 2004-06-14 | 2007-02-21 | 江苏中电华威电子股份有限公司 | 一种环氧树脂组合物 |
CN100590168C (zh) * | 2007-04-24 | 2010-02-17 | 中国科学院广州化学研究所 | 一种复合环氧型电子封装材料及其制备方法 |
CN102365310B (zh) | 2009-03-27 | 2013-11-20 | 日立化成工业株式会社 | 热固化性树脂组合物、以及使用了该组合物的预浸料、带支撑体的绝缘膜、层叠板及印刷布线板 |
JP5838659B2 (ja) * | 2010-09-02 | 2016-01-06 | 住友ベークライト株式会社 | 樹脂成形体の製造方法、樹脂組成物の製造方法 |
CN102633990A (zh) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
WO2013149386A1 (zh) * | 2012-04-05 | 2013-10-10 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
CN103450632A (zh) * | 2012-05-28 | 2013-12-18 | 汉高华威电子有限公司 | 一种电子封装用环氧树脂组合物及其制备方法 |
JP5769674B2 (ja) * | 2012-08-08 | 2015-08-26 | 日東電工株式会社 | 電子部品封止用樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法 |
DE102015207310A1 (de) * | 2015-04-22 | 2016-10-27 | Zf Friedrichshafen Ag | Elektronikmodul und Verfahren zum Umkapseln desselben |
KR102278300B1 (ko) * | 2016-07-06 | 2021-07-19 | 디아이씨 가부시끼가이샤 | 활성 에스테르 수지와 그 경화물 |
CN109415483B (zh) * | 2016-07-06 | 2021-09-14 | Dic株式会社 | 活性酯树脂和其固化物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02258831A (ja) * | 1988-12-28 | 1990-10-19 | Nippon Steel Chem Co Ltd | 封止用樹脂組成物及びその製造方法 |
JP2994127B2 (ja) * | 1992-01-27 | 1999-12-27 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
TW452584B (en) * | 1997-10-03 | 2001-09-01 | Hitachi Chemical Co Ltd | Epoxy resin composition and semiconductor devices using it as encapsulant |
JPH11140277A (ja) * | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
-
2000
- 2000-09-04 CN CN00801800A patent/CN1321179A/zh active Pending
- 2000-09-04 KR KR1020017005298A patent/KR100663680B1/ko active IP Right Grant
- 2000-09-04 WO PCT/JP2000/005992 patent/WO2001018115A1/en active IP Right Grant
- 2000-09-04 EP EP00956907A patent/EP1137708A1/en not_active Withdrawn
- 2000-09-05 TW TW089118170A patent/TWI281482B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1137708A1 (en) | 2001-10-04 |
CN1321179A (zh) | 2001-11-07 |
WO2001018115A1 (en) | 2001-03-15 |
KR100663680B1 (ko) | 2007-01-02 |
TWI281482B (en) | 2007-05-21 |
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