KR20010067303A - 연마포용 드레서 및 그 제조방법 - Google Patents
연마포용 드레서 및 그 제조방법 Download PDFInfo
- Publication number
- KR20010067303A KR20010067303A KR1020000059065A KR20000059065A KR20010067303A KR 20010067303 A KR20010067303 A KR 20010067303A KR 1020000059065 A KR1020000059065 A KR 1020000059065A KR 20000059065 A KR20000059065 A KR 20000059065A KR 20010067303 A KR20010067303 A KR 20010067303A
- Authority
- KR
- South Korea
- Prior art keywords
- binder
- diamond
- silicon
- dressing
- dresser
- Prior art date
Links
- 239000004744 fabric Substances 0.000 title claims abstract description 35
- 238000005498 polishing Methods 0.000 title claims description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000010432 diamond Substances 0.000 claims abstract description 73
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 73
- 239000011230 binding agent Substances 0.000 claims abstract description 37
- 238000005245 sintering Methods 0.000 claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 24
- 239000010703 silicon Substances 0.000 claims abstract description 24
- 229910000676 Si alloy Inorganic materials 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000006061 abrasive grain Substances 0.000 claims abstract description 14
- 150000002739 metals Chemical class 0.000 claims abstract 2
- 239000002245 particle Substances 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 12
- 238000000227 grinding Methods 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- 230000000737 periodic effect Effects 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 239000007888 film coating Substances 0.000 claims description 5
- 238000009501 film coating Methods 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 17
- 239000002002 slurry Substances 0.000 abstract description 16
- 238000011109 contamination Methods 0.000 abstract description 4
- 239000002253 acid Substances 0.000 description 11
- 230000002378 acidificating effect Effects 0.000 description 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- PVFSDGKDKFSOTB-UHFFFAOYSA-K iron(3+);triacetate Chemical compound [Fe+3].CC([O-])=O.CC([O-])=O.CC([O-])=O PVFSDGKDKFSOTB-UHFFFAOYSA-K 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims (5)
- 규소 및/또는 규소합금으로 이루어지는 결합재와 다이아몬드 숫돌입자를 혼합하고, 성형, 소결함으로써 얻어진 소결체에 의해 드레싱면이 구성되고, 상기 다이아몬드 숫돌입자의 표면에는 결합재중의 규소와 다이아몬드의 반응소성에 의해 생성된 탄화물막을 구비하고, 그것에 의해 상기 소결체에 있어서의 다이아몬드 숫돌입자와 결합재가 강고히 결합되어 이루어지는 것을 특징으로 하는 연마포용 드레서.
- 규소 및/또는 규소합금으로 이루어지는 결합재와, 주기율표 Ⅳ, Ⅴ또는 Ⅵ족 금속의 탄화물막 코팅처리가 실시되어 있는 다이아몬드 숫돌입자를 혼합하고, 성형, 소결함으로써 얻어진 소결체에 의해 드레싱면이 구성되고, 상기 탄화물막에 의해 상기 소결체에 있어서의 다이아몬드 숫돌입자와 결합재가 강고히 결합되어 이루어지는 것을 특징으로 하는 연마포용 드레서.
- 제1항 또는 제2항에 기재된 소결체를 대반의 표면에 접착하고, 그 드레싱면에 대한 평면화 및 날세우기 가공에 의해서 소정의 치수로 마무리함과 아울러 다이아몬드 숫돌입자를 돌출시킨 것을 특징으로 하는 연마포용 드레서.
- 규소 및/또는 규소합금으로 이루어지는 결합재와 다이아몬드 숫돌입자를 혼합하고, 성형, 소결함으로써, 상기 다이아몬드 숫돌입자의 표면에 그 다이아몬드와 결합재중의 규소의 반응소결에 의한 탄화물막을 생성시키고, 그 탄화물막에 의해 상기 다이아몬드 숫돌입자와 결합재를 강고히 결합한 드레싱용 소결체를 얻는 것을 특징으로 하는 연마포용 드레서의 제조방법.
- 규소 및/또는 규소합금으로 이루어지는 결합재와, 주기율표 Ⅳ, Ⅴ또는 Ⅵ족 금속의 탄화물막 코팅처리가 실시되어 있는 다이아몬드 숫돌입자를 혼합하고, 성형, 소결함으로써, 상기 탄화물막에 의해 상기 다이아몬드 숫돌입자와 결합재를 강고히 결합한 드레싱용의 소결체를 얻는 것을 특징으로 하는 연마포용 드레서의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36175399A JP3527448B2 (ja) | 1999-12-20 | 1999-12-20 | Cmp研磨布用ドレッサー及びその製造方法 |
JP99-361753 | 1999-12-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010067303A true KR20010067303A (ko) | 2001-07-12 |
KR100426527B1 KR100426527B1 (ko) | 2004-04-08 |
Family
ID=18474755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-0059065A KR100426527B1 (ko) | 1999-12-20 | 2000-10-07 | 연마포용 드레서 및 그 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6293854B1 (ko) |
JP (1) | JP3527448B2 (ko) |
KR (1) | KR100426527B1 (ko) |
TW (1) | TW474850B (ko) |
Cited By (1)
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US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
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JP3387858B2 (ja) * | 1999-08-25 | 2003-03-17 | 理化学研究所 | ポリッシングパッドコンディショナー |
JP2001162532A (ja) * | 1999-09-29 | 2001-06-19 | Toshiba Corp | ドレッサ、研磨装置ならびに物品の製造方法 |
EP1319470B1 (en) * | 2000-09-13 | 2006-12-13 | A.L.M.T. Corp. | Ultra abrasive grain wheel for mirror finish |
JP4599696B2 (ja) * | 2000-09-21 | 2010-12-15 | アイシン精機株式会社 | 自動車のドライビングポジション調整装置 |
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JP2005288685A (ja) * | 2004-03-10 | 2005-10-20 | Read Co Ltd | 研磨布用ドレッサー及びその製造方法 |
TWI286963B (en) * | 2004-03-10 | 2007-09-21 | Read Co Ltd | Dresser for polishing cloth and method for manufacturing thereof |
US20070060026A1 (en) * | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
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TW200708375A (en) * | 2005-08-24 | 2007-03-01 | Kinik Co | Ceramic polishing pad conditioner/dresser having plastic base and manufacturing method thereof |
US20080153398A1 (en) * | 2006-11-16 | 2008-06-26 | Chien-Min Sung | Cmp pad conditioners and associated methods |
JP2008132573A (ja) * | 2006-11-29 | 2008-06-12 | Mitsubishi Materials Corp | Cmpコンディショナ |
TW200940258A (en) | 2007-11-13 | 2009-10-01 | Chien-Min Sung | CMP pad dressers |
US9011563B2 (en) | 2007-12-06 | 2015-04-21 | Chien-Min Sung | Methods for orienting superabrasive particles on a surface and associated tools |
KR100881162B1 (ko) * | 2008-03-28 | 2009-02-03 | 주식회사 세라코리 | 연마패드용 컨디셔닝 디스크의 제조방법 |
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CN103659627A (zh) * | 2012-09-20 | 2014-03-26 | 周道林 | 一种竹麻抛光轮及其制造方法 |
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JPH09103965A (ja) * | 1995-10-09 | 1997-04-22 | Alps Electric Co Ltd | 多孔質超砥粒砥石とその製造方法 |
JP3368312B2 (ja) | 1996-06-26 | 2003-01-20 | 新日本製鐵株式会社 | 半導体基板用研磨布のドレッサーおよびその製造方法 |
JP2896657B2 (ja) * | 1996-06-28 | 1999-05-31 | 旭ダイヤモンド工業株式会社 | ドレッサ及びその製造方法 |
US5921856A (en) * | 1997-07-10 | 1999-07-13 | Sp3, Inc. | CVD diamond coated substrate for polishing pad conditioning head and method for making same |
-
1999
- 1999-12-20 JP JP36175399A patent/JP3527448B2/ja not_active Expired - Lifetime
-
2000
- 2000-07-10 US US09/612,959 patent/US6293854B1/en not_active Expired - Fee Related
- 2000-07-14 TW TW089114136A patent/TW474850B/zh not_active IP Right Cessation
- 2000-10-07 KR KR10-2000-0059065A patent/KR100426527B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004086477A1 (en) * | 2003-03-26 | 2004-10-07 | Dddia Corporation | Pad conditioners and fabrication methods thereof |
Also Published As
Publication number | Publication date |
---|---|
US6293854B1 (en) | 2001-09-25 |
JP3527448B2 (ja) | 2004-05-17 |
KR100426527B1 (ko) | 2004-04-08 |
TW474850B (en) | 2002-02-01 |
JP2001179638A (ja) | 2001-07-03 |
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