KR20010067253A - 다층 인덕터 어레이 - Google Patents
다층 인덕터 어레이 Download PDFInfo
- Publication number
- KR20010067253A KR20010067253A KR1020000057013A KR20000057013A KR20010067253A KR 20010067253 A KR20010067253 A KR 20010067253A KR 1020000057013 A KR1020000057013 A KR 1020000057013A KR 20000057013 A KR20000057013 A KR 20000057013A KR 20010067253 A KR20010067253 A KR 20010067253A
- Authority
- KR
- South Korea
- Prior art keywords
- spiral
- inductors
- inductor
- multilayer
- multilayer body
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims description 55
- 238000004804 winding Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 description 6
- 230000009467 reduction Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Abstract
Description
Claims (1)
- 복수개의 자성체층과 복수개의 코일 도체를 적층시켜 형성된 다층체;상기 코일 도체들을 전기적으로 접속시킴으로써 형성되어, 상기 다층체 내부에서 일렬로 정렬되어 있는 적어도 3개의 나선형 인덕터; 및상기 다층체의 표면에 배치되고, 복수개의 상기 나선형 인덕터의 각각의 인출 단부(leading end portion)에 전기적으로 접속되어 있는 외부전극을 포함하고 있는 다층 인덕터 어레이로서,상기 복수개의 나선형 인덕터들은 권선 회수가 동일하고,상기 나선형 인덕터의 정렬 방향으로 다층체의 양단부에 각각 위치된 나선형 인덕터의 나선부의 길이가 남은 나선형 인덕터의 나선부의 길이 보다 짧게 설정되는 것을 특징으로 하는 다층 인덕터 어레이.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-275023 | 1999-09-28 | ||
JP27502399A JP3446681B2 (ja) | 1999-09-28 | 1999-09-28 | 積層インダクタアレイ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010067253A true KR20010067253A (ko) | 2001-07-12 |
KR100343896B1 KR100343896B1 (ko) | 2002-07-20 |
Family
ID=17549809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000057013A KR100343896B1 (ko) | 1999-09-28 | 2000-09-28 | 다층 인덕터 어레이 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6437677B1 (ko) |
JP (1) | JP3446681B2 (ko) |
KR (1) | KR100343896B1 (ko) |
TW (1) | TW473748B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100548388B1 (ko) * | 2004-07-20 | 2006-02-02 | 삼성전자주식회사 | 저손실 인덕터소자 및 그의 제조방법 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003174749A (ja) * | 2001-12-06 | 2003-06-20 | Matsushita Electric Ind Co Ltd | 積層セラミックコイルおよびこれを用いたモータ |
US7033364B1 (en) * | 2002-01-31 | 2006-04-25 | Arthrotek, Inc. | Apparatus and method for manipulating a flexible strand and soft tissue replacement during surgery |
US6775807B2 (en) * | 2002-08-19 | 2004-08-10 | Intersil Americas Inc. | Numerically modeling inductive circuit elements |
JP2004095860A (ja) * | 2002-08-30 | 2004-03-25 | Murata Mfg Co Ltd | 積層型コイル部品及びその製造方法 |
JP4604580B2 (ja) * | 2004-07-12 | 2011-01-05 | 株式会社村田製作所 | 積層コイルアレイ |
JP5262775B2 (ja) * | 2008-03-18 | 2013-08-14 | 株式会社村田製作所 | 積層型電子部品及びその製造方法 |
TWI501269B (zh) * | 2010-04-21 | 2015-09-21 | Taiyo Yuden Kk | Laminated inductors |
US9324490B2 (en) | 2013-05-28 | 2016-04-26 | Tdk Corporation | Apparatus and methods for vector inductors |
US9570222B2 (en) | 2013-05-28 | 2017-02-14 | Tdk Corporation | Vector inductor having multiple mutually coupled metalization layers providing high quality factor |
JP6064854B2 (ja) * | 2013-09-30 | 2017-01-25 | 株式会社村田製作所 | 電子部品及びその製造方法 |
KR102004791B1 (ko) * | 2014-05-21 | 2019-07-29 | 삼성전기주식회사 | 칩 전자부품 및 그 실장기판 |
US9735752B2 (en) | 2014-12-03 | 2017-08-15 | Tdk Corporation | Apparatus and methods for tunable filters |
CN209449029U (zh) * | 2016-11-28 | 2019-09-27 | 株式会社村田制作所 | 多层基板以及多层基板向电路基板的安装构造 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3158757B2 (ja) * | 1993-01-13 | 2001-04-23 | 株式会社村田製作所 | チップ型コモンモードチョークコイル及びその製造方法 |
JPH1116738A (ja) * | 1997-06-20 | 1999-01-22 | Taiyo Yuden Co Ltd | チップ型インダクタアレイ |
JP3409998B2 (ja) * | 1997-08-05 | 2003-05-26 | 太陽誘電株式会社 | チップ型インダクタアレイ |
JP3371812B2 (ja) * | 1998-07-02 | 2003-01-27 | 株式会社村田製作所 | 積層型インダクタアレイ |
-
1999
- 1999-09-28 JP JP27502399A patent/JP3446681B2/ja not_active Expired - Lifetime
-
2000
- 2000-09-25 TW TW089119726A patent/TW473748B/zh not_active IP Right Cessation
- 2000-09-28 US US09/672,744 patent/US6437677B1/en not_active Expired - Lifetime
- 2000-09-28 KR KR1020000057013A patent/KR100343896B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100548388B1 (ko) * | 2004-07-20 | 2006-02-02 | 삼성전자주식회사 | 저손실 인덕터소자 및 그의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP3446681B2 (ja) | 2003-09-16 |
KR100343896B1 (ko) | 2002-07-20 |
JP2001102223A (ja) | 2001-04-13 |
US6437677B1 (en) | 2002-08-20 |
TW473748B (en) | 2002-01-21 |
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