KR20010006944A - 반도체 집적 회로 장치 및 그 제조 방법 - Google Patents

반도체 집적 회로 장치 및 그 제조 방법 Download PDF

Info

Publication number
KR20010006944A
KR20010006944A KR1020000017110A KR20000017110A KR20010006944A KR 20010006944 A KR20010006944 A KR 20010006944A KR 1020000017110 A KR1020000017110 A KR 1020000017110A KR 20000017110 A KR20000017110 A KR 20000017110A KR 20010006944 A KR20010006944 A KR 20010006944A
Authority
KR
South Korea
Prior art keywords
insulating layer
conductive
layer
contact
integrated circuit
Prior art date
Application number
KR1020000017110A
Other languages
English (en)
Korean (ko)
Inventor
호리바신이찌
Original Assignee
가네꼬 히사시
닛본 덴기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가네꼬 히사시, 닛본 덴기 가부시끼가이샤 filed Critical 가네꼬 히사시
Publication of KR20010006944A publication Critical patent/KR20010006944A/ko

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J1/00—Containers specially adapted for medical or pharmaceutical purposes
    • A61J1/03—Containers specially adapted for medical or pharmaceutical purposes for pills or tablets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B—MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
    • B31B50/00—Making rigid or semi-rigid containers, e.g. boxes or cartons
    • B31B50/14—Cutting, e.g. perforating, punching, slitting or trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D5/00—Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
    • B65D5/42—Details of containers or of foldable or erectable container blanks
    • B65D5/54—Lines of weakness to facilitate opening of container or dividing it into separate parts by cutting or tearing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B26D2001/006—Cutting members therefor the cutting blade having a special shape, e.g. a special outline, serrations

Landscapes

  • Health & Medical Sciences (AREA)
  • Veterinary Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Memories (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
KR1020000017110A 1999-04-01 2000-04-01 반도체 집적 회로 장치 및 그 제조 방법 KR20010006944A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1999-095107 1999-04-01
JP11095107A JP2000294629A (ja) 1999-04-01 1999-04-01 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
KR20010006944A true KR20010006944A (ko) 2001-01-26

Family

ID=14128650

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020000017110A KR20010006944A (ko) 1999-04-01 2000-04-01 반도체 집적 회로 장치 및 그 제조 방법

Country Status (2)

Country Link
JP (1) JP2000294629A (ja)
KR (1) KR20010006944A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005026641A (ja) * 2003-07-04 2005-01-27 Nec Electronics Corp 半導体装置およびその製造方法
JP4638140B2 (ja) * 2003-07-09 2011-02-23 マグナチップセミコンダクター有限会社 半導体素子の銅配線形成方法
KR101403409B1 (ko) * 2010-04-28 2014-06-03 한국전자통신연구원 반도체 장치 및 그 제조 방법

Also Published As

Publication number Publication date
JP2000294629A (ja) 2000-10-20

Similar Documents

Publication Publication Date Title
US6214663B1 (en) Methods of fabricating integrated circuit devices having contact pads which are separated by sidewall spacers
KR100299594B1 (ko) 디램 장치의 제조 방법
US6607955B2 (en) Method of forming self-aligned contacts in a semiconductor device
US6232224B1 (en) Method of manufacturing semiconductor device having reliable contact structure
US6770555B2 (en) Process for fabricating semiconductor integrated circuit device having polycide line and impurity region respectively exposed to contact holes different in depth
KR100265773B1 (ko) 반도체장치의 접촉창의 제조방법
KR100351933B1 (ko) 반도체소자의 콘택 구조체 형성방법
US6680511B2 (en) Integrated circuit devices providing improved short prevention
US6159808A (en) Method of forming self-aligned DRAM cell
US6404020B1 (en) Method of forming contact pads in a semiconductor device and a semiconductor device formed using the method
KR20010056888A (ko) 반도체 메모리 제조방법
US6248636B1 (en) Method for forming contact holes of semiconductor memory device
US7034354B2 (en) Semiconductor structure with lining layer partially etched on sidewall of the gate
KR20010006944A (ko) 반도체 집적 회로 장치 및 그 제조 방법
US6287982B1 (en) Method of removing a portion of a silicon oxide form over stacked polysilicon and silicide layers by using hydrofluorine (HF) solution
US6765263B2 (en) Semiconductor device and method for fabricating the same
JPH10321822A (ja) 半導体素子の構造並びに製造方法
JPH1197529A (ja) 半導体装置の製造方法
KR100713927B1 (ko) 반도체 소자의 제조방법
KR100200697B1 (ko) 가드링을 구비하는 반도체장치 및 이를 이용한 콘택트 형성방법
KR100321693B1 (ko) 티타늄실리사이드를이용한반도체소자의게이트전극및비트라인형성방법
KR100506050B1 (ko) 반도체소자의 콘택 형성방법
KR100325288B1 (ko) 커패시터 및 그 제조방법
KR100528765B1 (ko) 반도체 소자의 제조 방법
JP4033728B2 (ja) コンタクトホール形成方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application