KR19980024008A - Clean room - Google Patents
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- KR19980024008A KR19980024008A KR1019970014470A KR19970014470A KR19980024008A KR 19980024008 A KR19980024008 A KR 19980024008A KR 1019970014470 A KR1019970014470 A KR 1019970014470A KR 19970014470 A KR19970014470 A KR 19970014470A KR 19980024008 A KR19980024008 A KR 19980024008A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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Abstract
반도체 장치 제조공정에서, 화학물질을 사용하는 제조장치로부터의 화학물질의 확산을 완전히 방지할 수 있음과 동시에, 반도체 웨이퍼의 반송시나 보관시등의 케미컬오염을 방지하기 위한 필요에 따른 공기조절관리를 저비용으로 행할 수 있는 클린룸을 제공한다. 클린룸1을 공기조절 계통이 독립한 복수의 영역으로 분리하여, 화학물질을 누출하는 제조장치6a를 배치한 제 2클린룸1b에서는, 순환덕트13에 케미컬필터를 설치하고 작업존5에서 생긴 케미컬 미스트를 제거한 공기를 천정 체임버4에 순환하는 공기조절방식을 채용하여, 다른 공기조절 계통을 가지는 영역에의 케미컬미스트의 확산을 방지하고 있다. 또한, 반송장치7a, 7b나 보관장치8a, 8b등이 설치된 제 1클린룸1a에서는, 케미컬프리에어를 필요한 영역에만 국소적으로 공급하는 공기조절방식을 채용한다.In the semiconductor device manufacturing process, it is possible to completely prevent the diffusion of chemicals from the manufacturing apparatus using chemical substances, and to control the air conditioning as necessary to prevent chemical contamination during transportation or storage of semiconductor wafers. It provides a clean room that can be carried out at low cost. In the second clean room 1b in which the clean room 1 is separated into a plurality of areas independent of the air conditioning system, and a manufacturing apparatus 6a for leaking chemicals is disposed, a chemical filter formed in the work zone 5 by installing a chemical filter in the circulation duct 13 An air conditioning system is used to circulate the air from which the mist has been removed to the ceiling chamber 4, thereby preventing the diffusion of the chemical mist into an area having a different air conditioning system. Moreover, in the 1st clean room 1a provided with conveying apparatuses 7a, 7b, storage apparatuses 8a, 8b, etc., the air conditioning system which locally supplies a chemical free air only to a required area is employ | adopted.
Description
본 발명은, 반도체 장치등의 제조가 행하여지는 클린룸에 관한 것이다.The present invention relates to a clean room in which manufacturing of a semiconductor device or the like is performed.
종래, 반도체 장치는 클린룸의 환경에서의 오염에 의해 제품효율이 저하하기 때문에, 온도 습도가 제어됨과 동시에 통상수 미크론레벨의 이물질이 제거된 클린룸내에서 제조되고 있다.BACKGROUND ART Conventionally, semiconductor devices have been manufactured in a clean room where product efficiency is lowered due to contamination in the environment of a clean room, where temperature and humidity are controlled and foreign matters having a few microns level are usually removed.
도2는 종래의 클린룸을 나타내는 도면이다. 도면에서, 1은 클린룸, 2는 외기를 받아들여 온도 습도를 제어한 후 클린룸1에 공기를 공급하는 외조기로서, 외기도입용팬과 가열·냉각팬 및 가습기를 가지고 있다. 클린룸1은, 외조기2로부터 공기가 공급되는 천정체임버4와, 제조장치6, 6a나 천정주행방식등의 반송장치7, 순환장치를 내장한 보관장치8등이 배치되어 작업이 행해지는 작업존5과, 동력공급설비나 환경보전설비등이 배치된 유틸리티존9으로 구성되어 있고, 천정체임버4와 작업존5의 사이에는 천정체임버4의 공기로부터 수 미크론레벨의 먼지등의 이물질을 제거하는 HEPA(High Efficiency Particulate Air)필터 또는 ULPA(Ultra Low Penetration Air)필터등의 천정필터10가 배치되며, 작업존5은 마루 면의 그레이팅(grating)12을 개재하여 유틸리티존9과 접하고, 유틸리티 존9에는 작업존5의 공기를 순환팬14에 의해 그레이팅(grating)12을 통해서 흡인하여, 유틸리티존9으로부터 천정체임버4에 공기를 순환시키는 순환덕트13가 배치되어 있다. 15는 순환덕트13에 설치된 순환공기의 온도조절장치이다. 또, 유산, 불산등을 사용하는 웨트처리장치 및 유기용제를 사용하는 도포장치나 현상장치등의 케미컬미스트를 발생하는 제조장치6a에 대해서는, 배기처리장치6b에 강제배기를 행함과 동시에, 이들 케미컬미스트를 발생하는 제조장치6a의 배치영역에는 커튼등의 간막이17를 설치하여, 사용약품으로부터 생기는 케미컬미스트의 작업존5에의 확산을 방지하고 있다.2 is a view showing a conventional clean room. In the drawing, 1 denotes a clean room, 2 denotes an external air tank that supplies air to the clean room 1 after receiving external air to control temperature and humidity, and has an external air inlet fan, a heating / cooling fan, and a humidifier. The clean room 1 includes a ceiling chamber 4 through which air is supplied from the outer tank 2, a manufacturing device 6, 6a, a conveying device 7 such as a ceiling driving system, a storage device 8 with a circulating device, and the like. Zone 5 and utility zone 9 with power supply facilities and environmental protection facilities, and between the ceiling chamber 4 and the work zone 5 to remove foreign matter such as a few microns of dust from the air in the ceiling chamber 4 A ceiling filter 10, such as a HEPA (High Efficiency Particulate Air) filter or ULPA (Ultra Low Penetration Air) filter, is arranged, and the work zone 5 is in contact with the utility zone 9 via the grating 12 of the floor surface, and the utility zone 9 The circulation duct 13 which draws air of the work zone 5 through the grating 12 by the circulation fan 14, and circulates air from the utility zone 9 to the ceiling chamber 4 is arrange | positioned. 15 is a temperature control device of the circulation air installed in the circulation duct 13. Moreover, the manufacturing apparatus 6a which produces chemical mists, such as a wet processing apparatus using lactic acid and hydrofluoric acid, a coating apparatus using an organic solvent, and a developing apparatus, performs forced exhaust to the exhaust processing apparatus 6b, and these chemicals In the arrangement | positioning area of the manufacturing apparatus 6a which generate | occur | produces mist, the partition 17, such as a curtain, is provided, and the spread | diffusion of the chemical mist which arises from a chemical | medical agent to work zone 5 is prevented.
또한, 클린룸1은, 외기로부터의 이물질침입을 방지하기 위해서 외기보다도 양압상태(陽壓狀態)로 하고 있지만, 도어의 개폐나 장치로부터의 배기등에 의해 클린룸11내의 기압이 저하하기 때문에, 상시 클린룸1내의 기압을 검출하여, 외조기2의 송풍팬의 회전수를 변화시켜서 외기보다도 일정치 양압상태가 되도록 압력을 콘트롤하고 있다.In addition, in order to prevent infiltration of foreign matters from the outside air, the clean room 1 is in a positive pressure state than the outside air, but since the air pressure in the clean room 11 decreases due to opening and closing of the door or exhausting from the apparatus, The air pressure in the clean room 1 is detected, and the pressure is controlled so that the rotation speed of the blower fan of the external tank 2 is changed to be a constant positive pressure state than the outside air.
반도체 장치의 고집적화에 의한 패턴의 미세화, 막 두께의 박막화에 따라서, 반도체 장치가 제조되는 클린룸내의 공기에 포함되는 유기물이나 무기물로 이루어지는 서브미크론 레벨의 케미컬미스트에 의한 케미컬오염도 문제시되게 되었다. 케미컬오염의 원인이 되는 케미컬미스트로서는, 클린룸내의 웨트처리장치등으로 사용되는 약품으로부터의 증발가스 뿐만 아니라, 받아들인 외기에 혼입하고 있던 유화계가스나 산계가스, 클린룸의 벽의 콘크리트나 제조장치의 도장(塗裝)으로부터의 증발가스등이 있고, 이하에 나타내는 것과 같은 악영향을 반도체 장치에 주고 있다.As the pattern becomes smaller due to the higher integration of the semiconductor device and the thickness of the film becomes thinner, the chemical contamination caused by the chemical mist of the submicron level composed of organic or inorganic substances contained in the air in the clean room where the semiconductor device is manufactured also becomes a problem. As chemical mist causing chemical contamination, not only evaporation gas from chemicals used in wet treatment devices in clean rooms, but also emulsified gas and acid gas mixed in the received outside air, concrete and manufacturing apparatus of walls of clean rooms. There is an evaporation gas from the coating of, and the semiconductor device is adversely affected as shown below.
1. 염소계가스나 산계가스는 반도체 장치에 사용하고 있는 금속등에 부식을 생기게 하여, 반도체 장치의 신뢰성을 저하시킨다. 특히, A1 배선에서는 부식에 의해 배선저항이 증가한다든지 단선등이 생겨서 트랜지스터특성의 변화나 기능상실을 발생시킨다.1. Chlorine-based gas or acid-based gas cause corrosion of metals used in semiconductor devices and the like, thereby degrading the reliability of semiconductor devices. In particular, in A1 wiring, wiring resistance increases or disconnection occurs due to corrosion, resulting in a change in transistor characteristics or a malfunction.
2. CVD 법에 의한 성막에서는, 성막면의 오염에 의해 성막층의 이상성장이 생겨서 패턴형성의 이상이 발생하기 쉽게 된다.2. In the film formation by the CVD method, abnormal growth of the film formation layer occurs due to contamination of the film formation surface, and abnormality in pattern formation easily occurs.
3. 불소계가스는 표면상태를 변질시키고, 나트륨이온은 산화막을 증식산화시켜서 산화막 두께에 이상이 생기게 해서, 트랜지스터특성을 변화시킨다.3. The fluorine-based gas deteriorates the surface state, and sodium ions proliferate and oxidize the oxide film, causing abnormality in the oxide film thickness, thereby changing transistor characteristics.
도 3은, 클린룸1의 공기의 순환계에 케미컬미스트를 제거할 수 있는 케미컬필터 16a, 16b, 16c를 배치한 예를 나타내고 있다. 16a는 그레이팅(grating)12의 밑으로 배치된 케미컬필터, 16b는 유틸리티존9으로부터 천정체임버4에 공기를 순환시키는 순환덕트13에 배치된 케미컬필터, 16c는 천정필터10에 추가한 케미컬필터이다. 케미컬필터16a, 16b, 16c의 적어도 어느 하나를 클린룸1내에 배치함에 의해, 작업존5으로부터 케미컬미스트를 제거하고 있다.FIG. 3 shows an example in which chemical filters 16a, 16b, and 16c capable of removing chemical mists are arranged in an air circulation system of clean room 1. 16a is a chemical filter disposed below the grating 12, 16b is a chemical filter disposed in the circulation duct 13 for circulating air from the utility zone 9 to the ceiling chamber 4, and 16c is a chemical filter added to the ceiling filter 10. By disposing at least one of the chemical filters 16a, 16b, and 16c in the clean room 1, the chemical mist is removed from the work zone 5.
종래의 클린룸은 이상과 같이 구성되어 있고, 반도체 장치의 제조공정에서의 반도체 웨이퍼의 케미컬오염이 문제로 되어 있어, 케미컬오염의 원인이 되는 케미컬미스트의 발생원의 하나인 황산, 불산등을 사용하는 웨트처리장치 및, 유기용제를 사용하는 도포장치나 현상장치등의 케미컬미스트를 발생하는 장치6a에서의 케미컬미스트의 확산을 방지하기 위해서, 장치로부터 강제배기를 행하는 동시에, 이들 케미컬미스트가 발생하는 제조장치6a의 배치영역에는 커튼등의 경계17를 설치하고 있지만, 케미컬미스트의 확산을 완전히 방지할 수는 없고, 반송시및 보관시의 반도체 웨이퍼가 케미컬오염되는등의 문제가 있었다. 또한, 클린룸1의 공기 순환계에 케미컬미스트를 제거할 수 있는 케미컬필터16a∼16c를 배치하여, 클린룸1내를 순환하고 있는 모든 공기를 케미컬필터16a∼16c를 통과시킴으로써, 클린룸1의 작업존5으로부터 케미컬미스트를 제거하는 방법이 제안되어 있지만, 공기조절 설비의 initial cost 및 운전자금이 높아지는 등의 문제가 있었다.The conventional clean room is constructed as described above, and chemical contamination of the semiconductor wafer in the manufacturing process of the semiconductor device is a problem, and sulfuric acid, hydrofluoric acid, and the like, which are one of the sources of chemical mist, which cause chemical contamination, are used. In order to prevent the diffusion of the chemical mist in the apparatus 6a that generates chemical mist, such as a wet treatment apparatus and an application apparatus or a developing apparatus using an organic solvent, a forced exhaust from the apparatus and the production of these chemical mists are generated. In the arrangement area of the device 6a, a boundary 17 such as a curtain is provided, but the diffusion of the chemical mist cannot be completely prevented, and there is a problem of chemical contamination of the semiconductor wafer during transportation and storage. In addition, the operation of the clean room 1 is performed by arranging the chemical filters 16a to 16c capable of removing chemical mist in the air circulation system of the clean room 1 and passing all the air circulating in the clean room 1 through the chemical filters 16a to 16c. Although a method of removing the chemical mist from zone 5 has been proposed, there have been problems such as an increase in the initial cost and operating cost of the air conditioning system.
본 발명은, 상기한 것과 같은 문제를 해결하기 위해서 이루어진 것으로, 반도체 장치의 제조공정에서, 산이나 유기용제등의 약품을 사용하는 장치에서의 케미컬미스트의 확산을 완전히 방지하는 동시에, 반도체 웨이퍼의 반송시나 보관시등의 케미컬오염을 방지하기 위한 필요에 따른 공기조절관리를 저비용으로 행할 수 있는 클린룸을 제공하는 것을 목적으로 한다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. In the manufacturing process of a semiconductor device, the diffusion of chemical mist in a device using a chemical such as an acid or an organic solvent is completely prevented, and the semiconductor wafer is conveyed. It is an object of the present invention to provide a clean room that can perform air conditioning management at a low cost as needed to prevent chemical contamination such as during storage or storage.
본 발명에 관계되는 클린룸은, 외조기에 의해 온도 습도가 제어된 공기가 공급되는 천정체임버와, 고성능필터가 배치된 천정필터부와, 천정체임버의 공기가 천정필터부에 의해 청정화되어 공급되는 작업존과, 작업존의 그레이팅(grating) 마루밑에 위치하고 동력공급설비나 환경보전설비등이 배치된 유틸리티존을 가지는 복수의 영역과, 각 영역마다 작업존의 공기를 유틸리티존으로부터 천정체임버에 순환시키는 순환덕트를 구비하여, 그 영역은 각별하게 공기조절 관리되는 것이다.The clean room according to the present invention includes a ceiling chamber to which air controlled by temperature and humidity is supplied, a ceiling filter unit to which a high performance filter is disposed, and air of the ceiling chamber is cleaned and supplied by the ceiling filter unit. A plurality of zones having a work zone, a utility zone located under a grating floor of the work zone, and a power supply facility or an environmental protection facility are arranged, and air in the work zone is circulated from the utility zone to the ceiling chamber for each zone. The circulation duct is provided, and the area is particularly controlled by air.
또한, 복수의 영역은 간막이를 사이에 두고 인접해 있는 것이다. 또한, 인접하는 영역 사이에는 보다 고청정도로 관리되는 영역측의 공기압력이, 인접하는 다른 영역의 공기압력보다 양압상태가 되도록 조정되는 것이다.In addition, the plurality of regions are adjacent to each other with a partition between them. In addition, the air pressure on the side of the region managed with higher cleanness is adjusted to be in a positive pressure state than the air pressure of the other adjacent regions between the adjacent regions.
도 1은 본 발명의 실시의 형태 1에 의한 클린룸을 나타내는 모식도.BRIEF DESCRIPTION OF THE DRAWINGS The schematic diagram which shows the clean room by Embodiment 1 of this invention.
도 2는 종래의 이 종류의 클린룸을 나타내는 모식도.2 is a schematic diagram showing a conventional clean room of this kind.
도 3은 종래의 다른 클린룸을 나타내는 모식도.3 is a schematic diagram showing another conventional clean room.
* 도면의 주요부분에 대한 부호설명* Explanation of symbols on the main parts of the drawings
1 : 클린룸1a : 제 1클린룸1: Clean Room 1a: 1st Clean Room
1b : 제 2클린룸2 : 외조기1b: 2nd clean room 2: outer bowl
3 : 케미컬 프리에어 공급장치4 : 천정체임버3: chemical pre-air supply device 4: ceiling chamber
5 : 작업존6 : 제조장치5: working zone 6: manufacturing apparatus
6a : 케미컬 미스트를 발생하는 제조장치7a,7b : 반송장치6a: manufacturing apparatus for generating chemical mist 7a, 7b: conveying apparatus
8a,8b : 보관장치9 : 유틸리티 존8a, 8b Storage device 9: Utility zone
10 : 천정필터11 : 팬 필터 유닛10 ceiling filter 11: fan filter unit
12 : 그레이팅(grating)13 : 순환덕트12 grating 13 circulating duct
14 : 순환팬15 : 유타카조장치14: circulation fan 15: yutakazo device
16 : 케미컬필터17 : 간막이16 chemical filter 17 membrane
(실시의 형태 1)(Embodiment 1)
이하, 본 발명의 일실시의 형태인 클린룸을 도면에 의거해서 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, the clean room which is one Embodiment of this invention is demonstrated based on drawing.
도 1은 본 발명의 클린룸을 나타내는 모식도이다.1 is a schematic diagram showing a clean room of the present invention.
도면에서, 1은 클린룸, 1a, 1b는 클린룸1내에 형성되고, 독립된 공기조절 계통을 가지는 제 1, 제 2클린룸, 2은 외기를 받아들여서 온도 습도를 제어한 후 클린룸1에 공기를 공급하는 외조기, 3는 케미컬필터 및, HEPA 필터 또는 ULPA 필터가 설치된 케미컬프리에어의 공급장치, 4는 외조기2로부터 공기가 공급되는 천정체임버, 5는 제조장치6, 6a 및, 반송장치7a, 7b나 보관장치8a, 8b등이 배치되어 작업이 행해지는 작업존, 9은 동력공급설비나 환경보전설비등이 배치된 유틸리티존, 10은 천정체임버4와 작업존5의 사이에 설치된 HEPA 필터, 또는 ULPA 필터등의 천정필터로서, 천정체임버4의 공기로부터 0. 1미크론이상의 이물질을 99. 99%이상 제거한 클린에어를 작업존5에 공급한다. 11은 케미컬필터및 송풍팬으로 구성된 팬 필터 유닛으로서, 필요에 따라서 천정필터10에 추가배치되어, 케미컬미스트를 제거한 깨끗한 케미컬프리공기를 작업존5의 소정영역에 공급하고 있다. 12는 작업존5 마루 면의 그레이팅(grating), 13은 작업존5의 공기를 유틸리티존9에 설치된 순환팬14에 의해 그레이팅(grating)12을 통해서 흡인하여, 유틸리티 존9에서 천정체임버4에 공기를 순환시키는 순환덕트, 15는 순환덕트13에 설치된 순환공기의 온도조절 장치이다. 16은 순환덕트13에 설치된 케미컬필터로서, 케미컬미스트를 제거한 케미컬프리에어를 순환덕트13를 통해 천정체임버4에 공급한다. 또, 케미컬프리에어는 케미컬오염의 원인이 되는 케미컬미스트가 1ppt∼ 1f 범위의 농도로 제어된 공기이다.In the figure, 1 is a clean room, 1a, 1b is formed in the clean room 1, the first, second clean room having a separate air conditioning system, 2 is the air in the clean room 1 after controlling the temperature and humidity by receiving the outside air The outer tank for supplying a, 3 is a chemical filter, and a supply device of the chemical free air, HEPA filter or ULPA filter is installed, 4 is a ceiling chamber to which air is supplied from the outer tank 2, 5 is a manufacturing apparatus 6, 6a, and the conveying device 7a, 7b, storage zones 8a, 8b, etc., where the work is carried out, 9 is a utility zone where power supply or environmental preservation facilities are arranged, 10 is a HEPA installed between the ceiling chamber 4 and the work zone 5. As a ceiling filter such as a filter or a ULPA filter, clean air is removed from the air of the ceiling chamber 4 from which 99. 99% or more of foreign matter of 0.01 micron or more is supplied to the working zone 5. 11 is a fan filter unit composed of a chemical filter and a blower fan, which is additionally disposed in the ceiling filter 10 as necessary to supply clean chemical free air from which chemical mist has been removed to a predetermined region of the work zone 5. 12 is a grating of the work zone 5 floor, 13 is aspirated through the grating 12 by the circulation fan 14 installed in the utility zone 9, the air in the utility chamber 9 to the ceiling chamber 4 Circulation duct for circulating, 15 is a temperature control device of the circulating air installed in the circulation duct 13. 16 is a chemical filter installed in the circulation duct 13, and supplies the chemical free air from which the chemical mist is removed to the ceiling chamber 4 through the circulation duct 13. In addition, chemical free air is air in which the chemical mist which causes chemical contamination is controlled by the density | concentration of 1 ppt-1f.
클린룸1은, 반송장치7a, 7b나 보관장치8a, 8b및 화학물질을 거의 사용하지 않고, 또는 화학물질을 누출할 가능성이 낮은 장치6가 배치된 제 1클린룸1a이나, 화학물질을 다량 사용하여, 화학물질을 누출할 가능성이 높은 장치6a가 배치된 제 2클린룸1b등, 공기조절계통이 독립된 영역으로 분리되어, 요구되는 청정도 및, 그 청정도가 필요한 영역에 따라서 공기조절방식이 선택되고 있다.The clean room 1 is a first clean room 1a in which conveying devices 7a, 7b, storage devices 8a, 8b, and chemicals are used with little or no device 6 is less likely to leak, or a large amount of chemicals are disposed. The air conditioning system is separated into independent areas, such as the second clean room 1b in which the device 6a, which has a high possibility of leaking chemicals, is disposed. It is chosen.
또 클린룸1은, 외기로부터의 이물질침입을 방지하기 위해서, 도어의 개폐나 배기 등에 의한 기압의 저하를 고려하여 항상 클린룸1내의 기압을 검출해서, 외조기2의 송풍팬의 회전수를 변화시켜 외기보다도 일정치의 양압상태가 되도록 압력이 콘트롤되어 있지만, 클린룸1내에 형성되어 공기조절계통이 독립된 영역사이서도, 보다 고청정도로 관리되는 영역측의 공기압력이, 인접하는 다른 영역의 공기압력보다 양압상태가 되도록 콘트롤된다.In order to prevent foreign matter from infiltrating from the outside air, the clean room 1 always detects the air pressure in the clean room 1 in consideration of the decrease in the air pressure due to the opening and closing of the door, exhaust, etc. The pressure is controlled so as to be a positive pressure state than the outside air, but even in an area in which the air control system is formed in the clean room 1 and the air control system is independent, the air pressure in the other area where the air pressure on the side of the area which is more cleanly controlled It is controlled to be positive pressure than pressure.
반송장치7a, 7b나 보관장치8a, 8b및 화학물질을 거의 사용하지 않고, 또는 화학물질을 누출할 가능성이 낮은 장치6가 배치된 제 1클린룸1a에서는, 케미컬프리에어가 필요한 작업존5 영역의 천정필터10에 팬 필터 유닛11을 추가배치하여, 천정주행방식의 반송장치7a나 개방형의 보관고8a에 클린인 케미컬프리에어를 공급하기도 하고, 밀폐구조의 반송로를 가지는 반송장치7b나 밀폐구조의 보관고8b에는, 케미컬프리에어의 공급장치3로부터 공급된 케미컬프리에어를, 배관을 통해 직접 공급하는 등, 국소적으로 깨끗한 케미컬프리에어를 공급하는 공기조절방식이 채용되어 있다.In the first clean room 1a, where conveying devices 7a, 7b, storage devices 8a, 8b, and chemicals are used with little or no device 6 is less likely to leak chemicals, a work zone 5 area requiring chemical free air is required. The fan filter unit 11 is additionally arranged in the ceiling filter 10 of the system to supply a clean chemical free air to the conveying device 7a or the open storage 8a of the ceiling driving method, or the conveying device 7b or the sealing structure having the conveying path of the closed structure. The storage 8b has an air conditioning system for supplying locally clean chemical free air, such as directly supplying the chemical free air supplied from the chemical free air supply device 3 through a pipe.
또한, 화학물질을 다량으로 사용하여 화학물질을 누출할 가능성이 높은 장치6a가 배치된 제 2클린룸1b에서는, 순환덕트13에 케미컬필터16를 설치하여, 작업존5에서 발생된 케미컬미스트를 제거한 케미컬프리에어를 천정체임버4에 순환시키는 공기조절방식이 채용되어 있다. 또, 케미컬필터16는, 순환덕트13의 어떤 위치에 배치하더라도 케미컬미스트를 제거하여 천정체임버4에 케미컬프리에어를 공급할 수는 있으나, 순환계의 상류부분인 순환덕트13의 입구부분에 배치함으로서, 덕트벽에의 오염을 방지할 수 있다.In addition, in the second clean room 1b in which a large amount of chemical is used to leak the chemical, the second clean room 1b is provided with a chemical filter 16 installed in the circulation duct 13 to remove chemical mist generated in the work zone 5. The air conditioning system circulates the chemical free air through the ceiling chamber 4. In addition, the chemical filter 16 can remove the chemical mist and supply the chemical free air to the ceiling chamber 4 at any position of the circulation duct 13. Contamination on the wall can be prevented.
또한, 제 2의 클린룸1b내의 기압은, 제 1클린룸1a에의 오염을 방지하기 위해서 제 1클린룸1a보다 부압상태(負壓狀態)로 하고, 외기로부터의 오염을 방지하기 위해서 외기보다 양압상태(陽壓狀態)가 되도록 콘트롤되어 있다.In addition, the air pressure in the second clean room 1b is in a negative pressure state than the first clean room 1a in order to prevent contamination of the first clean room 1a, and is positive pressure than in the outside air in order to prevent contamination from the outside air. It is controlled to become a state.
이 실시의 형태1에 의하면, 클린룸1을 독립된 공기조절 계통을 가지는 복수의 영역으로 분리하여, 화학물질을 다량으로 사용해서 케미컬미스트를 발생시키는 제조장치6a를 모아서 하나의 제 2클린룸1b에 배치함으로써, 다른 공기조절 계통을 가지는 영역에의 케미컬미스트의 확산을 방지할 수 있다. 또한, 반송장치7a, 7b나 보관장치8a, 8b등이 배치된 제 1클린룸1a에서는, 필요에 따라서 국소적으로 깨끗한 케미컬프리에어를 공급함에 의해, 공기조절설비의 비용을 절감시킬 수 있다.According to the first embodiment, the clean room 1 is divided into a plurality of areas having independent air conditioning systems, and a manufacturing apparatus 6a for generating chemical mist using a large amount of chemicals is collected in one second clean room 1b. By disposing, it is possible to prevent the diffusion of the chemical mist into the region having another air conditioning system. In addition, in the first clean room 1a in which the conveying apparatuses 7a, 7b, the storage apparatuses 8a, 8b, and the like are arranged, by supplying locally clean chemical free air, the cost of the air conditioner can be reduced.
이상과 같이 본 발명에 의하면, 클린룸을 독립한 공기조절 계통을 가지는 복수의 영역으로 분리함으로써, 각 영역간의 크로스콘터미네이션을 방지할 수 있음과 동시에, 보다 고청정도로 관리된 공기가 요구되는 경우라도, 필요한 영역에만 알맞은 공기조절방식에 의해서 최소한의 량을 공급할 수 있으므로, 공기조절설비의 비용을 절감할 수 있다.According to the present invention as described above, by separating the clean room into a plurality of areas having an independent air conditioning system, it is possible to prevent cross-conversion between each area, and at the same time requires a more clean air management Even if it is possible to supply a minimum amount by the air conditioning method suitable only in the required area, it is possible to reduce the cost of the air conditioning equipment.
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8249529A JPH1096332A (en) | 1996-09-20 | 1996-09-20 | Clean room |
| JP249529 | 1996-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19980024008A true KR19980024008A (en) | 1998-07-06 |
Family
ID=17194345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970014470A KR19980024008A (en) | 1996-09-20 | 1997-04-18 | Clean room |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH1096332A (en) |
| KR (1) | KR19980024008A (en) |
| CN (1) | CN1135331C (en) |
| DE (1) | DE19723954A1 (en) |
| TW (1) | TW365641B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100376349B1 (en) * | 1999-07-14 | 2003-03-15 | 엔이씨 일렉트로닉스 코포레이션 | Fan filter unit for clenaroom |
| KR100643252B1 (en) * | 2004-05-26 | 2006-11-10 | 알프스 덴키 가부시키가이샤 | Clean unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2951949B1 (en) * | 1998-07-03 | 1999-09-20 | 富士電機総設株式会社 | Local air conditioning system for clean room |
| JP3375294B2 (en) * | 1998-12-17 | 2003-02-10 | 東京エレクトロン株式会社 | Processing apparatus, processing system, and method for supplying clean air in the apparatus |
| JP3476395B2 (en) * | 1999-09-24 | 2003-12-10 | Ｎｅｃエレクトロニクス株式会社 | Clean room and clean room air conditioning method |
| DE10029200A1 (en) * | 2000-02-21 | 2001-08-23 | Data Disc Robots Gmbh | Production line for manufacturing optical data media has process climate control with conditioned air fed to limited region of production line and only air free of particles to other regions |
| JP2002147811A (en) | 2000-11-08 | 2002-05-22 | Sharp Corp | Cleanroom |
| JP3631993B2 (en) * | 2001-11-21 | 2005-03-23 | 株式会社織部精機製作所 | Disaster prevention shelter system |
| DE102004049520A1 (en) * | 2004-10-11 | 2006-04-13 | Alfred Reinicke | Process and plant for the ventilation of clean rooms |
| CN100434642C (en) * | 2005-12-05 | 2008-11-19 | 亚翔系统集成科技（苏州）有限公司 | Modularized mfg. process factory building for liquid crystal display |
| JP4378652B2 (en) * | 2007-01-10 | 2009-12-09 | 株式会社ダイフク | Purified air ventilation-type goods storage facility |
| US9435552B2 (en) | 2007-12-14 | 2016-09-06 | Ge-Hitachi Nuclear Energy Americas Llc | Air filtration and handling for nuclear reactor habitability area |
| DE102007062813B4 (en) | 2007-12-21 | 2009-11-12 | Khs Ag | Partition, in particular for housing packaging machines for food |
| DE102008005606B3 (en) * | 2008-01-22 | 2010-04-15 | Khs Ag | Device for sealing vertical joints between plate-shaped wall elements |
| JP5408909B2 (en) * | 2008-06-05 | 2014-02-05 | 株式会社竹中工務店 | Clean room |
| CN104748265B (en) * | 2015-03-10 | 2017-09-26 | 芜湖锐进医疗设备有限公司 | Medical electric Ju Zuan clean rooms air cleaning system |
| CN105666528B (en) * | 2016-03-29 | 2018-12-07 | 威格气体纯化科技（苏州）股份有限公司 | Dust free room circulation filter, dust free room and glove box |
| CN106760700A (en) * | 2016-11-28 | 2017-05-31 | 中国铁塔股份有限公司长春市分公司 | A kind of base station machine room |
| CN106760675B (en) * | 2017-01-22 | 2019-01-18 | 中联西北工程设计研究院有限公司 | The high precision temperature control room in ultra-clean space and temperature control method |
| JP6911799B2 (en) * | 2018-03-15 | 2021-07-28 | 信越半導体株式会社 | Clean booth for silicon polycrystalline filling work |
| CN110469160B (en) * | 2019-08-12 | 2024-08-27 | 中国电子工程设计院有限公司 | Clean room arrangement structure with secondary humidification system and clean production factory building |
| EP4006434B1 (en) * | 2019-07-23 | 2024-10-23 | China Electronics Engineering Design Institute Co., Ltd. | Clean workshop capable of being controlled in partition mode |
| CA3209498A1 (en) * | 2019-12-04 | 2021-06-10 | Hitachi Global Life Solutions, Inc. | Air conditioning system |
| BE1031344B1 (en) * | 2023-02-15 | 2024-09-16 | Abn Cleanroom Tech N V | DESIGN AND METHOD FOR VENTILATING A CLIMATE CHAMBER |
-
1996
- 1996-09-20 JP JP8249529A patent/JPH1096332A/en active Pending
-
1997
- 1997-04-09 TW TW086104483A patent/TW365641B/en not_active IP Right Cessation
- 1997-04-18 KR KR1019970014470A patent/KR19980024008A/en not_active Application Discontinuation
- 1997-06-06 DE DE19723954A patent/DE19723954A1/en not_active Withdrawn
- 1997-07-21 CN CNB971154422A patent/CN1135331C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100376349B1 (en) * | 1999-07-14 | 2003-03-15 | 엔이씨 일렉트로닉스 코포레이션 | Fan filter unit for clenaroom |
| KR100643252B1 (en) * | 2004-05-26 | 2006-11-10 | 알프스 덴키 가부시키가이샤 | Clean unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1135331C (en) | 2004-01-21 |
| TW365641B (en) | 1999-08-01 |
| JPH1096332A (en) | 1998-04-14 |
| CN1177709A (en) | 1998-04-01 |
| DE19723954A1 (en) | 1998-03-26 |
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