CN1177709A - Punification room - Google Patents

Punification room Download PDF

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Publication number
CN1177709A
CN1177709A CN97115442A CN97115442A CN1177709A CN 1177709 A CN1177709 A CN 1177709A CN 97115442 A CN97115442 A CN 97115442A CN 97115442 A CN97115442 A CN 97115442A CN 1177709 A CN1177709 A CN 1177709A
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CN
China
Prior art keywords
air
clean room
section
chemical
operation area
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Granted
Application number
CN97115442A
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Chinese (zh)
Other versions
CN1135331C (en
Inventor
长舟平
福本隼明
谷博司
江崎浩治
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN1177709A publication Critical patent/CN1177709A/en
Application granted granted Critical
Publication of CN1135331C publication Critical patent/CN1135331C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ventilation (AREA)

Abstract

The invention provides a clean room which, in a semiconductor device manufacturing process, can completely prevent diffusion of chemical materials and which can control air conditioning to meet the need for preventing chemical pollution. A clean room 1 is divided into a plurality of areas whose air conditioning systems are independent of one another, and in a second clean room 1b where a manufacturing device 6a leaking chemical materials is placed, and an air conditioning method by which air from which chemical mist has been removed is circulated to a ceiling chamber 4 is adopted. In a first clean room 1 a where conveyors 7a, 7b and storage devices 8a, 8b or the like are installed, an air conditioning method by which chemical- free air is supplied locally to only the required areas is adopted.

Description

The clean room
The present invention relates to make the clean room of semiconductor device etc.
In the past, owing to, cause the decrease in yield of semiconductor device, made semiconductor device so will when carrying out temperature, humidity control, will count usually in the clean room that micron-sized foreign matter removed from the pollution of clean room's environment.
Fig. 2 is the schematic diagram of the existing clean room of expression.Among the figure: the 1st, the clean room, the 2nd, be taken into outside air and go forward side by side and air is supplied with after the control of trip temperature, humidity the air conditioner of clean room 1, have outside air and import with fan and heating cooling fan and humidifier.Clean room 1 is by from air conditioner air fed ceiling partition chambers 42, disposed manufacturing installation 6, the conveying device 7 of the 6a and the ceiling method of operation etc. and the inner storage appts 8 that EGR is housed etc. carry out the operation area 5 of operation and have disposed practicality district 9 formations of power supply equipment and environmental protection equipment etc., between ceiling partition chamber 4 and operation area 5, be provided with and foreign matter such as number micron-sized dust etc. removed ceiling filters 10 such as HEPA (the High Efficiency Particulate Air) filter of usefulness or ULPA (Ultra Low Penetration Air) filter from the air of ceiling partition chamber 4, operation area 5 links with practical district 9 by the grid on the table top 12, utilize circulating fan 14 air of operation area 5 to be attracted in the practical district 9 by grid 12, be provided with make air from practicality district 9 to ceiling partition chamber the circulation canals 13 of 4 circulations.15 are arranged on the temperature-adjusting device of the circulating air in the circulation canal 13.In addition, with exhaust gas treatment device 6b the liquid handling device of use sulfuric acid, fluoric acid etc. and the manufacturing installation 6a of generation chemical fumes such as applying device with an organic solvent or developing device are carried out exhaust forcibly, configuring area at the manufacturing installation 6a that produces these chemical fumes is provided with next doors 17 such as barrier simultaneously, and the chemical fumes that prevents to produce from employed medicine is to operation area 5 diffusions.
In addition, in order to prevent to enter from the foreign matter of extraneous air, air pressure in the clean room 1 is than external pressure height, but owing to opening the door or the air pressure in the clean room 1 being reduced from device emission gases etc., so will often detect the air pressure in the clean room 1, change the rotating speed of the blowing fan of air conditioner 2, controlled pressure is so that make air pressure in the clean room 1 keep state than outside high certain value.
Follow the becoming more meticulous of the desired figure of Highgrade integration of semiconductor device, the filming of thickness, have the problem of the chemical contamination that the chemical fumes, gas etc. of the ultra micro meter level that is made of organic matter that contains in the air in the clean room that makes semiconductor device or inorganic matter cause.Chemical fumes as the reason that causes chemical contamination, the medicine vaporized gas of using the liquid handling device in the clean room etc. is not only arranged, and be blended in sulfide-based gas in the outside air that is taken into or acids gas in addition, from the concrete that purifies locular wall and the coating vaporized gas on the manufacturing installation etc., they have following harmful effect to semiconductor device.
1. chlorine class gas or acids gas produce corrosion to the metal that uses in the semiconductor device etc., make the reliability decrease of semiconductor device.Particularly the Al wiring causes the cloth line resistance to increase because of being corroded, and broken string etc. takes place, and causes transistor characteristic variation, defunctionalization.
2. when adopting CVD method film forming, because the pollution of film forming face causes the growth failure of film forming layer, the formation of figure takes place unusual easily.
3. fluorine type gas makes surface state rotten, and sodium ion makes the oxide-film accelerated oxidation, causes oxide thickness unusual, causes transistor characteristic to change.
Fig. 3 shows in the air circulation system of clean room 1 and has disposed chemical filter 16a, 16b, the 16c that chemical fumes can be removed.16a is the chemical filter that is configured in below the grid 12, and 16b is configured in the chemical filter that makes the circulation canal 13 that air circulates from practicality district 9 to ceiling partition chamber 4, and 16c is the chemical filter that is added in the ceiling filter 10.By with among chemical filter 16a, 16b, the 16c any one is configured in the clean room 1 at least, and chemical fumes 5 is removed from the operation area.
Existing clean room as above constitutes, in the manufacture process of semiconductor device, the chemical contamination of semiconductor wafer becomes problem, in order to prevent the use sulfuric acid in one of generation source from the chemical fumes that becomes the chemical contamination reason, the diffusion of the chemical fumes of the device 6a of generation such as the liquid handling device of fluoric acid etc. and applying device with an organic solvent or developing device chemical fumes, though carry out exhaust forcibly from device, configuring area at the manufacturing installation 6a that produces these chemical fumes is provided with next doors 17 such as barrier simultaneously, but can not prevent the diffusion of chemical fumes fully, the chemical contamination problem of semiconductor wafer when exist carrying or during keeping.
In addition, though proposed in the air circulation system of clean room 1, to dispose and to have removed the chemical filter 16a~16c of chemical fumes, make the whole air in the clean room 1 pass through chemical filter 16a~16c, with the chemical fumes method that remove 1 operation area 5 from the clean room, but there are the original cost of air-conditioning equipment and the problem that operating cost all increases.
The present invention develops in order to address the above problem, its purpose is to provide a kind of diffusion that can prevent fully from the chemical fumes of the device that uses medicines such as acid or organic solvent in the manufacture process of semiconductor device, simultaneously in order to prevent the chemical contamination of semiconductor wafer when carrying or during keeping, to carry out the clean room of air conditioning managing cheaply as required.
Clean room of the present invention has: the ceiling partition chamber of being supplied with the air that has carried out temperature and humidity control by air conditioner; Disposed the ceiling filter house of high-performance filter; The operation area, the air of ceiling partition chamber is purified the back by the ceiling filter house and supplies with this operation area; Be positioned at a plurality of sections that the practicality district that has disposed power supply equipment and environmental protection equipment etc. is arranged under the grid table top; And the circulation canal that circulates to ceiling partition chamber from the practicality district of the air that makes the operation area of each section, section carries out air conditioning managing separately.
In addition, a plurality of sections next door space between adjacent.
In addition, between the adjacent section, managed air pressure to be adjusted to the state higher than the air pressure of other adjacent section than section one side of high cleanliness.
In addition, use chemical substance hardly in the operation area of the 1st section of one of section, perhaps configuration spills the low device of possibility of chemical substance.
In addition, configuration is used chemical substance in large quantities, is spilt the high device of possibility of chemical substance in the operation area of the 2nd section of one of section.
Fig. 1 is the ideograph of the clean room of example 1 of the present invention.
Fig. 2 is the ideograph of existing this clean room.
Fig. 3 is the ideograph of existing another clean room.
Example 1
Below, with reference to the clean room of a description of drawings example of the present invention.Fig. 1 is the ideograph of clean room of the present invention.
Among the figure, the 1st, the clean room, 1a, 1b be in clean room 1, form the 1st of air-conditioning system independently arranged, the 2nd clean room, the 2nd, be taken into the outside air trip temperature of going forward side by side, after the humidity control air is supplied with the air conditioner of clean room 1, the 3rd, be provided with the feedway of the chemical-free air of chemical filter and HEPA filter or ulpa filter, the 4th, supply with ceiling partition chamber from the air of air conditioner 2, the 5th, disposed manufacturing installation 6,6a and conveying device 7a, 7b and storage appts 8a, 8b etc. carry out the operation area of operation, the 9th, the practicality district that has disposed power supply equipment and environmental protection equipment etc., the 10th, between ceiling partition chamber 4 and operation area 5, be provided with the ceiling filter of HEPA filter or ulpa filter etc., it is removed the cleaned air that reaches after 99.99% with the airborne foreign matter more than 0.1 micron of ceiling partition chamber 4 and supplies with operation area 5.The 11st, by the fan filter that chemical filter and blowing fan constitute, increase is configured in the ceiling filter 10 as required, and the clean chemical-free air that will remove chemical fumes is supplied with the regulation zone of operation area 5.The 12nd, the grid of the table top of operation area 5, the 13rd, make the circulation canal of air circulation, its utilizes the circulating fan 14 be located in the practical district 9 to make air in the operation area 5 be attracted the back by grid 12 and circulates from practicality district 9 to ceiling partition chamber 4, and 15 are arranged on the temperature-adjusting device of the circulating air in the circulation canal 13.16 are arranged on the chemical filter in the circulation canal 13, will remove the clean chemical-free air of chemical fumes by circulation canal 13 and supply with ceiling partition chamber 4.In addition, chemical-free air is that the concentration that will become the chemical fumes of chemical contamination reason is controlled at the air in the scope of 1ppt~1f.
Clean room 1 is divided into and has disposed conveying device 7a, 7b and storage appts 8a, 8b and use chemical substance hardly or spill the 1st 1a of clean room of the low device 6 of the possibility of chemical substance, and disposed and used chemical substance in large quantities, the air-conditioning systems such as the 2nd 1b of clean room that spill the high device 6a of the possibility of chemical substance are section independently, can select air conditioning mode according to the zone of desired cleannes and these cleannes of needs.
In addition, in order to prevent to enter clean room 1 from the foreign matter of extraneous air, consider owing to opening the door or air pressure being reduced from device emission gases etc., so will often detect the air pressure in the clean room 1, change the rotating speed of the blowing fan of air conditioner 2, controlled pressure, so that make air pressure in the clean room 1 keep state than outside high certain value, even the air-conditioning system that forms in clean room 1 is independently between the section, managed air pressure to be controlled as the state higher than the air pressure of other adjacent section than section one side of high cleanliness.
Disposing conveying device 7a, 7b and storage appts 8a, 8b and use chemical substance hardly or spill among the 1st 1a of clean room of the low device 6 of the possibility of chemical substance, fan filter 11 is increased in the ceiling filter 10 in the zone that is configured in the operation area 5 that needs chemical-free air, supply with clean chemical-free air to the conveying device 7a of the ceiling method of operation and the safe-deposit vault 8a of open type, and will be from the direct conveying device 7b of the transport path with closed structure and the safe-deposit vault 8b of closed structure etc. of supplying with of the chemical-free air that chemical-free air feedway 3 is supplied with by pipeline, the air conditioning mode of supplying with clean chemical-free air partly may be utilized.
In addition, use chemical substance in large quantities having disposed, spill among the 2nd 1b of clean room of the high device 6a of the possibility of chemical substance, chemical filter 16 is arranged in the circulation canal 13, adopts the air conditioning modes make chemical-free air 4 circulations that in the operation area 5 chemical fumes that produce have been removed in ceiling partition chamber.In addition, even regardless of which position that chemical filter 16 is configured in the circulation canal 13, chemical fumes can both be removed, chemical-free air is supplied with ceiling partition chamber 4, but by the upstream portion that is configured in the circulatory system is the intake section of circulation canal 13, can prevent the pollution to conduit wall.
In addition,, make the air pressure in the 2nd 1b of clean room be low state,, also will control the air pressure in the 2nd 1b of clean room, make it be the state higher than external pressure in order to prevent pollution from the outside than the 1st 1a of clean room in order to prevent pollution to the 1st 1a of clean room.
According to this example 1, owing to being divided into, clean room 1 has independently a plurality of sections of air-conditioning system, with the manufacturing installation 6a centralized configuration using chemical substance in large quantities, produce chemical fumes in one the 2nd 1b of clean room, so can prevent the diffusion of chemical fumes to section with different air-conditioning systems.In addition, owing in the 1st 1a of clean room that has disposed conveying device 7a, 7b and storage appts 8a, 8b etc., supply with clean chemical-free air as required and partly, so can reduce the cost of air-conditioning equipment.
As mentioned above, according to the present invention, owing to being divided into, clean room 1 has independently a plurality of sections of air-conditioning system, so can prevent the cross pollution between each section, even simultaneously owing to requiring to manage under the situation of the air of high cleanliness more, also can only take suitable air conditioning mode, supply with minimal air capacity, so can suppress the cost of air-conditioning equipment to the zone of necessity.

Claims (5)

1. clean room is characterized in that having:
Supply with the ceiling partition chamber that air has to external world carried out the air after predetermined temperature and humidity and the predetermined dedusting level control by air conditioner;
Disposed the ceiling filter house of high-performance filter;
The air of above-mentioned ceiling partition chamber is purified the operation area that the back is supplied with by described ceiling filter house;
Be positioned at a plurality of sections that the practicality district that has disposed power supply equipment and environmental protection equipment etc. is arranged respectively below the grid table top of above-mentioned operation area;
And making the air of above-mentioned operation area distinguish the circulation canal that each section circulates in above-mentioned ceiling partition chamber through above-mentioned practicality, above-mentioned section carries out air conditioning managing separately.
2. clean room according to claim 1 is characterized in that: a plurality of sections next door space between adjacent.
3. clean room according to claim 2 is characterized in that: between the adjacent section, managed the air pressure than section one side of high cleanliness to be adjusted to the state higher than the air pressure of other adjacent section.
4. according to any described clean room in the claim 1~3, it is characterized in that: use chemical substance hardly in the operation area of the 1st section of one of section, perhaps configuration spills the low device of possibility of chemical substance.
5. according to any described clean room in the claim 1~3, it is characterized in that: configuration is used chemical substance in large quantities, is spilt the high device of possibility of chemical substance in the operation area of the 2nd section of one of section.
CNB971154422A 1996-09-20 1997-07-21 Punification room Expired - Fee Related CN1135331C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP249529/1996 1996-09-20
JP249529/96 1996-09-20
JP8249529A JPH1096332A (en) 1996-09-20 1996-09-20 Clean room

Publications (2)

Publication Number Publication Date
CN1177709A true CN1177709A (en) 1998-04-01
CN1135331C CN1135331C (en) 2004-01-21

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ID=17194345

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB971154422A Expired - Fee Related CN1135331C (en) 1996-09-20 1997-07-21 Punification room

Country Status (5)

Country Link
JP (1) JPH1096332A (en)
KR (1) KR19980024008A (en)
CN (1) CN1135331C (en)
DE (1) DE19723954A1 (en)
TW (1) TW365641B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6869457B2 (en) 2000-11-08 2005-03-22 Sharp Kabushiki Kaisha Clean room for semiconductor device
CN101457960A (en) * 2007-12-14 2009-06-17 通用电气-日立核能美国有限责任公司 Air filtration and handling for nuclear reactor habitability area
CN101220978B (en) * 2007-01-10 2013-11-06 大福股份有限公司 Air purifying ventilation type article storing equipment
CN104748265A (en) * 2015-03-10 2015-07-01 芜湖锐进医疗设备有限公司 Purifying room air purification system for medical electric saw drill
CN106760675A (en) * 2017-01-22 2017-05-31 中联西北工程设计研究院有限公司 The high precision temperature control room in ultra-clean space and temperature control method
CN114341559A (en) * 2019-12-04 2022-04-12 日立环球生活方案株式会社 Air conditioning system

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JP2951949B1 (en) * 1998-07-03 1999-09-20 富士電機総設株式会社 Local air conditioning system for clean room
JP3375294B2 (en) * 1998-12-17 2003-02-10 東京エレクトロン株式会社 Processing apparatus, processing system, and method for supplying clean air in the apparatus
JP3287337B2 (en) * 1999-07-14 2002-06-04 日本電気株式会社 Fan filter unit
JP3476395B2 (en) * 1999-09-24 2003-12-10 Necエレクトロニクス株式会社 Clean room and clean room air conditioning method
DE10029200A1 (en) * 2000-02-21 2001-08-23 Data Disc Robots Gmbh Production line for manufacturing optical data media has process climate control with conditioned air fed to limited region of production line and only air free of particles to other regions
JP3631993B2 (en) * 2001-11-21 2005-03-23 株式会社織部精機製作所 Disaster prevention shelter system
JP2005340435A (en) * 2004-05-26 2005-12-08 Alps Electric Co Ltd Clean sheet
DE102004049520A1 (en) * 2004-10-11 2006-04-13 Alfred Reinicke Process and plant for the ventilation of clean rooms
CN100434642C (en) * 2005-12-05 2008-11-19 亚翔系统集成科技(苏州)有限公司 Modularized mfg. process factory building for liquid crystal display
DE102007062813B4 (en) 2007-12-21 2009-11-12 Khs Ag Partition, in particular for housing packaging machines for food
DE102008005606B3 (en) * 2008-01-22 2010-04-15 Khs Ag Device for sealing vertical joints between plate-shaped wall elements
JP5408909B2 (en) * 2008-06-05 2014-02-05 株式会社竹中工務店 Clean room
CN105666528B (en) * 2016-03-29 2018-12-07 威格气体纯化科技(苏州)股份有限公司 Dust free room circulation filter, dust free room and glove box
CN106760700A (en) * 2016-11-28 2017-05-31 中国铁塔股份有限公司长春市分公司 A kind of base station machine room
JP6911799B2 (en) * 2018-03-15 2021-07-28 信越半導体株式会社 Clean booth for silicon polycrystalline filling work
EP4006434B1 (en) * 2019-07-23 2024-10-23 China Electronics Engineering Design Institute Co., Ltd. Clean workshop capable of being controlled in partition mode
CN110469160B (en) * 2019-08-12 2024-08-27 中国电子工程设计院有限公司 Clean room arrangement structure with secondary humidification system and clean production factory building
BE1031344B1 (en) * 2023-02-15 2024-09-16 Abn Cleanroom Tech N V DESIGN AND METHOD FOR VENTILATING A CLIMATE CHAMBER

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6869457B2 (en) 2000-11-08 2005-03-22 Sharp Kabushiki Kaisha Clean room for semiconductor device
CN101220978B (en) * 2007-01-10 2013-11-06 大福股份有限公司 Air purifying ventilation type article storing equipment
CN101457960A (en) * 2007-12-14 2009-06-17 通用电气-日立核能美国有限责任公司 Air filtration and handling for nuclear reactor habitability area
CN101457960B (en) * 2007-12-14 2014-05-07 通用电气-日立核能美国有限责任公司 Air filtration and handling for nuclear reactor habitability area
US9435552B2 (en) 2007-12-14 2016-09-06 Ge-Hitachi Nuclear Energy Americas Llc Air filtration and handling for nuclear reactor habitability area
CN104748265A (en) * 2015-03-10 2015-07-01 芜湖锐进医疗设备有限公司 Purifying room air purification system for medical electric saw drill
CN104748265B (en) * 2015-03-10 2017-09-26 芜湖锐进医疗设备有限公司 Medical electric Ju Zuan clean rooms air cleaning system
CN106760675A (en) * 2017-01-22 2017-05-31 中联西北工程设计研究院有限公司 The high precision temperature control room in ultra-clean space and temperature control method
CN114341559A (en) * 2019-12-04 2022-04-12 日立环球生活方案株式会社 Air conditioning system

Also Published As

Publication number Publication date
TW365641B (en) 1999-08-01
JPH1096332A (en) 1998-04-14
KR19980024008A (en) 1998-07-06
CN1135331C (en) 2004-01-21
DE19723954A1 (en) 1998-03-26

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