KR102843075B1 - 반도체 장치 - Google Patents

반도체 장치

Info

Publication number
KR102843075B1
KR102843075B1 KR1020230123124A KR20230123124A KR102843075B1 KR 102843075 B1 KR102843075 B1 KR 102843075B1 KR 1020230123124 A KR1020230123124 A KR 1020230123124A KR 20230123124 A KR20230123124 A KR 20230123124A KR 102843075 B1 KR102843075 B1 KR 102843075B1
Authority
KR
South Korea
Prior art keywords
insulating layer
region
oxide
layer
gate insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230123124A
Other languages
English (en)
Korean (ko)
Other versions
KR20240046023A (ko
Inventor
하지메 와따까베
마사시 즈부꾸
도시나리 사사끼
아끼히로 하나다
다까야 다마루
Original Assignee
가부시키가이샤 재팬 디스프레이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 재팬 디스프레이 filed Critical 가부시키가이샤 재팬 디스프레이
Publication of KR20240046023A publication Critical patent/KR20240046023A/ko
Application granted granted Critical
Publication of KR102843075B1 publication Critical patent/KR102843075B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739Conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
KR1020230123124A 2022-09-30 2023-09-15 반도체 장치 Active KR102843075B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022157776A JP2024051551A (ja) 2022-09-30 2022-09-30 半導体装置
JPJP-P-2022-157776 2022-09-30

Publications (2)

Publication Number Publication Date
KR20240046023A KR20240046023A (ko) 2024-04-08
KR102843075B1 true KR102843075B1 (ko) 2025-08-07

Family

ID=90246246

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230123124A Active KR102843075B1 (ko) 2022-09-30 2023-09-15 반도체 장치

Country Status (6)

Country Link
US (1) US20240113227A1 (https=)
JP (1) JP2024051551A (https=)
KR (1) KR102843075B1 (https=)
CN (1) CN117810268A (https=)
DE (1) DE102023209319A1 (https=)
TW (1) TWI851391B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118695682B (zh) * 2024-08-27 2024-11-01 武汉华星光电技术有限公司 阵列基板及其制备方法以及显示面板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002175028A (ja) 2000-07-31 2002-06-21 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
KR100675263B1 (ko) * 1999-07-22 2007-01-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그의 제작방법
US20200411694A1 (en) * 2018-03-23 2020-12-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8871565B2 (en) 2010-09-13 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP6035195B2 (ja) * 2012-05-01 2016-11-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP2880690B1 (en) 2012-08-03 2019-02-27 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device with oxide semiconductor stacked film
TWI761605B (zh) 2012-09-14 2022-04-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
KR102220279B1 (ko) 2012-10-19 2021-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막을 포함하는 다층막 및 반도체 장치의 제작 방법
JP6345023B2 (ja) * 2013-08-07 2018-06-20 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
US9425217B2 (en) 2013-09-23 2016-08-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9929279B2 (en) * 2014-02-05 2018-03-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102298775B1 (ko) * 2015-01-21 2021-09-07 에스케이하이닉스 주식회사 싱글 폴리 비휘발성 메모리 소자 및 그 제조방법
US9647116B1 (en) * 2015-10-28 2017-05-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating self-aligned contact in a semiconductor device
CN109121438B (zh) 2016-02-12 2022-02-18 株式会社半导体能源研究所 半导体装置以及包括该半导体装置的显示装置
JP7194122B2 (ja) * 2018-01-05 2022-12-21 株式会社半導体エネルギー研究所 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100675263B1 (ko) * 1999-07-22 2007-01-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그의 제작방법
JP2002175028A (ja) 2000-07-31 2002-06-21 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US20200411694A1 (en) * 2018-03-23 2020-12-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
DE102023209319A1 (de) 2024-04-04
US20240113227A1 (en) 2024-04-04
TW202416389A (zh) 2024-04-16
JP2024051551A (ja) 2024-04-11
CN117810268A (zh) 2024-04-02
KR20240046023A (ko) 2024-04-08
TWI851391B (zh) 2024-08-01

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