JP2024053987A5 - - Google Patents

Download PDF

Info

Publication number
JP2024053987A5
JP2024053987A5 JP2022160543A JP2022160543A JP2024053987A5 JP 2024053987 A5 JP2024053987 A5 JP 2024053987A5 JP 2022160543 A JP2022160543 A JP 2022160543A JP 2022160543 A JP2022160543 A JP 2022160543A JP 2024053987 A5 JP2024053987 A5 JP 2024053987A5
Authority
JP
Japan
Prior art keywords
insulating layer
oxide
region
layer
oxide insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022160543A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024053987A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2022160543A priority Critical patent/JP2024053987A/ja
Priority claimed from JP2022160543A external-priority patent/JP2024053987A/ja
Priority to TW112133067A priority patent/TWI875169B/zh
Priority to KR1020230124709A priority patent/KR102874839B1/ko
Priority to CN202311224445.3A priority patent/CN117855287A/zh
Priority to DE102023209380.4A priority patent/DE102023209380A1/de
Priority to US18/479,934 priority patent/US20240113228A1/en
Publication of JP2024053987A publication Critical patent/JP2024053987A/ja
Publication of JP2024053987A5 publication Critical patent/JP2024053987A5/ja
Pending legal-status Critical Current

Links

JP2022160543A 2022-10-04 2022-10-04 半導体装置及びその製造方法 Pending JP2024053987A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022160543A JP2024053987A (ja) 2022-10-04 2022-10-04 半導体装置及びその製造方法
TW112133067A TWI875169B (zh) 2022-10-04 2023-08-31 半導體裝置及其製造方法
KR1020230124709A KR102874839B1 (ko) 2022-10-04 2023-09-19 반도체 장치 및 그 제조 방법
CN202311224445.3A CN117855287A (zh) 2022-10-04 2023-09-21 半导体装置及其制造方法
DE102023209380.4A DE102023209380A1 (de) 2022-10-04 2023-09-26 Halbleitervorrichtung und verfahren zum herstellen einer halbleitervorrichtung
US18/479,934 US20240113228A1 (en) 2022-10-04 2023-10-03 Semiconductor device and method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022160543A JP2024053987A (ja) 2022-10-04 2022-10-04 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2024053987A JP2024053987A (ja) 2024-04-16
JP2024053987A5 true JP2024053987A5 (https=) 2025-07-01

Family

ID=90246437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022160543A Pending JP2024053987A (ja) 2022-10-04 2022-10-04 半導体装置及びその製造方法

Country Status (6)

Country Link
US (1) US20240113228A1 (https=)
JP (1) JP2024053987A (https=)
KR (1) KR102874839B1 (https=)
CN (1) CN117855287A (https=)
DE (1) DE102023209380A1 (https=)
TW (1) TWI875169B (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011027656A1 (en) * 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
US8871565B2 (en) 2010-09-13 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9960278B2 (en) * 2011-04-06 2018-05-01 Yuhei Sato Manufacturing method of semiconductor device
EP2880690B1 (en) 2012-08-03 2019-02-27 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device with oxide semiconductor stacked film
TWI761605B (zh) 2012-09-14 2022-04-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
KR102220279B1 (ko) 2012-10-19 2021-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막을 포함하는 다층막 및 반도체 장치의 제작 방법
JP6345023B2 (ja) * 2013-08-07 2018-06-20 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
US9425217B2 (en) 2013-09-23 2016-08-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9640669B2 (en) * 2014-03-13 2017-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic appliance including the semiconductor device, the display device, and the display module
CN109121438B (zh) * 2016-02-12 2022-02-18 株式会社半导体能源研究所 半导体装置以及包括该半导体装置的显示装置
JP7194122B2 (ja) * 2018-01-05 2022-12-21 株式会社半導体エネルギー研究所 半導体装置
KR102797576B1 (ko) * 2018-03-23 2025-04-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102925791B1 (ko) * 2021-01-27 2026-02-09 삼성전자 주식회사 열전 소자를 구비한 수직형 비휘발성 메모리 소자, 그 메모리 소자를 구비한 반도체 패키지, 및 그 메모리 소자의 방열 방법

Similar Documents

Publication Publication Date Title
KR20100132308A (ko) 박막 트랜지스터 및 그 제조방법
KR102843075B1 (ko) 반도체 장치
JP2024051551A5 (https=)
JP2024053987A5 (https=)
KR102874839B1 (ko) 반도체 장치 및 그 제조 방법
US20250380465A1 (en) Semiconductor device and manufacturing method thereof
US20260006828A1 (en) Semiconductor device and manufacturing method thereof
KR102895613B1 (ko) 반도체 장치
JP2025128517A (ja) 半導体装置
JPWO2024190115A5 (https=)
JPWO2024190116A5 (https=)
JP2024039361A5 (https=)
US20240178325A1 (en) Semiconductor device
JP2025140590A (ja) 半導体装置
JP2025058486A (ja) 表示装置及び表示装置の製造方法
TW202412323A (zh) 半導體裝置
JP2025060044A (ja) 半導体装置
KR20250047864A (ko) 반도체 장치 및 표시 장치
KR20260054613A (ko) 반도체 장치 및 표시 장치
JP2025059911A (ja) 半導体装置
JP2024121394A (ja) 半導体装置
JP2025059540A (ja) 半導体装置及び表示装置
JP2024040960A5 (https=)