KR102831840B1 - 폴리아마이드 수지 조성물 및 폴리아마이드 성형체 - Google Patents

폴리아마이드 수지 조성물 및 폴리아마이드 성형체 Download PDF

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Publication number
KR102831840B1
KR102831840B1 KR1020237029649A KR20237029649A KR102831840B1 KR 102831840 B1 KR102831840 B1 KR 102831840B1 KR 1020237029649 A KR1020237029649 A KR 1020237029649A KR 20237029649 A KR20237029649 A KR 20237029649A KR 102831840 B1 KR102831840 B1 KR 102831840B1
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polyamide resin
resin composition
mass
derived
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KR20230135675A (ko
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와타루 마키구치
하루카 도이
고헤이 니시노
이사오 와시오
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미쓰이 가가쿠 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/387—Borates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/30—Applications used for thermoforming

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
KR1020237029649A 2021-03-30 2022-03-18 폴리아마이드 수지 조성물 및 폴리아마이드 성형체 Active KR102831840B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021057558 2021-03-30
JPJP-P-2021-057551 2021-03-30
JPJP-P-2021-057558 2021-03-30
JP2021057551 2021-03-30
PCT/JP2022/012582 WO2022210019A1 (ja) 2021-03-30 2022-03-18 ポリアミド樹脂組成物およびポリアミド成形体

Publications (2)

Publication Number Publication Date
KR20230135675A KR20230135675A (ko) 2023-09-25
KR102831840B1 true KR102831840B1 (ko) 2025-07-08

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KR1020237029649A Active KR102831840B1 (ko) 2021-03-30 2022-03-18 폴리아마이드 수지 조성물 및 폴리아마이드 성형체

Country Status (5)

Country Link
US (1) US20240158633A1 (https=)
EP (1) EP4317253A4 (https=)
JP (1) JP7576159B2 (https=)
KR (1) KR102831840B1 (https=)
WO (1) WO2022210019A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023136207A1 (ja) * 2022-01-12 2023-07-20 三井化学株式会社 ポリアミド樹脂組成物及びポリアミド成形体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014122329A (ja) 2012-11-20 2014-07-03 Kuraray Co Ltd ポリアミド樹脂組成物
JP2016526597A (ja) 2013-07-03 2016-09-05 ウニヴェルシタ デッリ ストゥディ ディ ミラノ 難燃性を有する複雑な高分子構造を有するポリマー
WO2020040282A1 (ja) 2018-08-24 2020-02-27 株式会社クラレ ポリアミド及びポリアミド組成物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2225938A1 (de) 1972-05-27 1973-12-13 Hoechst Ag Transparente polyamide
DE2447727A1 (de) * 1974-10-07 1976-04-08 Hoechst Ag Schwerentflammbare polyamidformmassen
DE2715413A1 (de) * 1977-04-06 1978-10-12 Bayer Ag Transparente copolyamide
JPH0717747B2 (ja) * 1986-12-19 1995-03-01 東レ株式会社 ポリアミドの製造法
WO1995004781A1 (en) * 1993-08-05 1995-02-16 Mitsui Petrochemical Industries, Ltd. Polyamide resin composition
JP2003176408A (ja) 2001-09-21 2003-06-24 Kuraray Co Ltd 電気・電子部品封止用ポリアミド組成物
JPWO2003085029A1 (ja) 2002-04-05 2005-08-11 三井化学株式会社 発光ダイオード反射板用樹脂組成物
EP1916278A4 (en) * 2005-08-18 2011-07-20 Mitsubishi Eng Plastics Corp POYAMIDE RESIN COMPOSITION FOR LASER MARKING AND LASER MARKED POLYAMIDE RESIN COMPONENTS
EP3034553A1 (de) * 2014-12-19 2016-06-22 LANXESS Deutschland GmbH Polyamidzusammensetzungen
EP3156435B1 (de) 2015-10-14 2019-07-24 Ems-Patent Ag Copolyamide, diese enthaltende formmassen und daraus hergestellte formkörper
EP3312224B1 (en) * 2016-10-21 2018-12-26 Ems-Patent Ag Polyamide moulding composition and multi-layered structure made herefrom
US20220064443A1 (en) * 2019-05-16 2022-03-03 Unitika Ltd. Polyamide resin composition
JP2021057558A (ja) 2019-10-02 2021-04-08 パナソニックＩｐマネジメント株式会社 立体回路基板
JP7328108B2 (ja) 2019-10-02 2023-08-16 ニチコン株式会社 電解コンデンサおよび電解コンデンサの製造方法
EP4183813A4 (en) * 2020-07-16 2024-08-07 Mitsui Chemicals, Inc. CRYSTALLINE POLYAMIDE RESIN, RESIN COMPOSITION AND MOLDED BODIES

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014122329A (ja) 2012-11-20 2014-07-03 Kuraray Co Ltd ポリアミド樹脂組成物
JP2016526597A (ja) 2013-07-03 2016-09-05 ウニヴェルシタ デッリ ストゥディ ディ ミラノ 難燃性を有する複雑な高分子構造を有するポリマー
WO2020040282A1 (ja) 2018-08-24 2020-02-27 株式会社クラレ ポリアミド及びポリアミド組成物

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Publication number Publication date
US20240158633A1 (en) 2024-05-16
JP7576159B2 (ja) 2024-10-30
KR20230135675A (ko) 2023-09-25
WO2022210019A1 (ja) 2022-10-06
JPWO2022210019A1 (https=) 2022-10-06
EP4317253A1 (en) 2024-02-07
EP4317253A4 (en) 2025-04-02

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