KR102820035B1 - 인쇄회로기판 및 이의 제조 방법 - Google Patents

인쇄회로기판 및 이의 제조 방법 Download PDF

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Publication number
KR102820035B1
KR102820035B1 KR1020190112233A KR20190112233A KR102820035B1 KR 102820035 B1 KR102820035 B1 KR 102820035B1 KR 1020190112233 A KR1020190112233 A KR 1020190112233A KR 20190112233 A KR20190112233 A KR 20190112233A KR 102820035 B1 KR102820035 B1 KR 102820035B1
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KR
South Korea
Prior art keywords
insulating layer
circuit pattern
circuit board
circuit
layer
Prior art date
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Active
Application number
KR1020190112233A
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English (en)
Korean (ko)
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KR20210030725A (ko
Inventor
양의열
라세웅
유도혁
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020190112233A priority Critical patent/KR102820035B1/ko
Priority to PCT/KR2020/012137 priority patent/WO2021049859A1/ko
Priority to US17/641,865 priority patent/US12167540B2/en
Priority to CN202080063904.2A priority patent/CN114365586B/zh
Priority to JP2022515778A priority patent/JP2022547676A/ja
Publication of KR20210030725A publication Critical patent/KR20210030725A/ko
Application granted granted Critical
Publication of KR102820035B1 publication Critical patent/KR102820035B1/ko
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020190112233A 2019-09-10 2019-09-10 인쇄회로기판 및 이의 제조 방법 Active KR102820035B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020190112233A KR102820035B1 (ko) 2019-09-10 2019-09-10 인쇄회로기판 및 이의 제조 방법
PCT/KR2020/012137 WO2021049859A1 (ko) 2019-09-10 2020-09-09 인쇄회로기판
US17/641,865 US12167540B2 (en) 2019-09-10 2020-09-09 Printed circuit board
CN202080063904.2A CN114365586B (zh) 2019-09-10 2020-09-09 印刷电路板
JP2022515778A JP2022547676A (ja) 2019-09-10 2020-09-09 印刷回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190112233A KR102820035B1 (ko) 2019-09-10 2019-09-10 인쇄회로기판 및 이의 제조 방법

Publications (2)

Publication Number Publication Date
KR20210030725A KR20210030725A (ko) 2021-03-18
KR102820035B1 true KR102820035B1 (ko) 2025-06-13

Family

ID=74866661

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190112233A Active KR102820035B1 (ko) 2019-09-10 2019-09-10 인쇄회로기판 및 이의 제조 방법

Country Status (5)

Country Link
US (1) US12167540B2 (https=)
JP (1) JP2022547676A (https=)
KR (1) KR102820035B1 (https=)
CN (1) CN114365586B (https=)
WO (1) WO2021049859A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102933098B1 (ko) * 2020-10-23 2026-03-03 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
EP4380325A4 (en) * 2021-07-29 2025-09-03 Lg Innotek Co Ltd PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051803A (ja) * 2014-08-29 2016-04-11 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07176866A (ja) * 1993-12-17 1995-07-14 Hokuriku Electric Ind Co Ltd 多層回路基板の製造方法
JP2003101227A (ja) * 2001-09-27 2003-04-04 Ngk Spark Plug Co Ltd 電子回路用部品およびその製造方法
KR20060045206A (ko) * 2004-11-12 2006-05-17 삼성테크윈 주식회사 반도체기판 제조방법
JP4668030B2 (ja) * 2005-10-27 2011-04-13 株式会社メイコー プリント配線板及びその製造方法
JP5355957B2 (ja) 2008-07-31 2013-11-27 住友化学株式会社 積層体及びその製造方法並びに回路基板用部材
KR101086828B1 (ko) 2009-11-30 2011-11-25 엘지이노텍 주식회사 매립형 인쇄회로기판, 다층 인쇄회로기판 및 이들의 제조방법
KR101140982B1 (ko) * 2010-09-07 2012-05-03 삼성전기주식회사 단층 인쇄회로기판 및 그 제조 방법
KR20130068659A (ko) 2011-12-15 2013-06-26 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR20140019689A (ko) * 2012-08-07 2014-02-17 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20140090961A (ko) * 2013-01-10 2014-07-18 주식회사 두산 절연수지 필름, 상기 필름을 포함하는 금속박 적층판 및 인쇄회로기판, 및 상기 필름을 포함하는 회로기판의 제조방법
JP6223909B2 (ja) 2013-07-11 2017-11-01 新光電気工業株式会社 配線基板及びその製造方法
KR102268388B1 (ko) * 2014-08-11 2021-06-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR102473417B1 (ko) * 2016-04-27 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051803A (ja) * 2014-08-29 2016-04-11 新光電気工業株式会社 配線基板及びその製造方法

Also Published As

Publication number Publication date
CN114365586A (zh) 2022-04-15
WO2021049859A1 (ko) 2021-03-18
US12167540B2 (en) 2024-12-10
KR20210030725A (ko) 2021-03-18
CN114365586B (zh) 2024-08-16
US20220346236A1 (en) 2022-10-27
JP2022547676A (ja) 2022-11-15

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