CN114365586B - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN114365586B
CN114365586B CN202080063904.2A CN202080063904A CN114365586B CN 114365586 B CN114365586 B CN 114365586B CN 202080063904 A CN202080063904 A CN 202080063904A CN 114365586 B CN114365586 B CN 114365586B
Authority
CN
China
Prior art keywords
insulating layer
circuit pattern
circuit board
layer
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080063904.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN114365586A (zh
Inventor
梁义烈
罗世雄
柳到爀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN114365586A publication Critical patent/CN114365586A/zh
Application granted granted Critical
Publication of CN114365586B publication Critical patent/CN114365586B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202080063904.2A 2019-09-10 2020-09-09 印刷电路板 Active CN114365586B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2019-0112233 2019-09-10
KR1020190112233A KR102820035B1 (ko) 2019-09-10 2019-09-10 인쇄회로기판 및 이의 제조 방법
PCT/KR2020/012137 WO2021049859A1 (ko) 2019-09-10 2020-09-09 인쇄회로기판

Publications (2)

Publication Number Publication Date
CN114365586A CN114365586A (zh) 2022-04-15
CN114365586B true CN114365586B (zh) 2024-08-16

Family

ID=74866661

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080063904.2A Active CN114365586B (zh) 2019-09-10 2020-09-09 印刷电路板

Country Status (5)

Country Link
US (1) US12167540B2 (https=)
JP (1) JP2022547676A (https=)
KR (1) KR102820035B1 (https=)
CN (1) CN114365586B (https=)
WO (1) WO2021049859A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102933098B1 (ko) * 2020-10-23 2026-03-03 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
EP4380325A4 (en) * 2021-07-29 2025-09-03 Lg Innotek Co Ltd PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140090961A (ko) * 2013-01-10 2014-07-18 주식회사 두산 절연수지 필름, 상기 필름을 포함하는 금속박 적층판 및 인쇄회로기판, 및 상기 필름을 포함하는 회로기판의 제조방법
KR20170122500A (ko) * 2016-04-27 2017-11-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07176866A (ja) * 1993-12-17 1995-07-14 Hokuriku Electric Ind Co Ltd 多層回路基板の製造方法
JP2003101227A (ja) * 2001-09-27 2003-04-04 Ngk Spark Plug Co Ltd 電子回路用部品およびその製造方法
KR20060045206A (ko) * 2004-11-12 2006-05-17 삼성테크윈 주식회사 반도체기판 제조방법
JP4668030B2 (ja) * 2005-10-27 2011-04-13 株式会社メイコー プリント配線板及びその製造方法
JP5355957B2 (ja) 2008-07-31 2013-11-27 住友化学株式会社 積層体及びその製造方法並びに回路基板用部材
KR101086828B1 (ko) 2009-11-30 2011-11-25 엘지이노텍 주식회사 매립형 인쇄회로기판, 다층 인쇄회로기판 및 이들의 제조방법
KR101140982B1 (ko) * 2010-09-07 2012-05-03 삼성전기주식회사 단층 인쇄회로기판 및 그 제조 방법
KR20130068659A (ko) 2011-12-15 2013-06-26 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR20140019689A (ko) * 2012-08-07 2014-02-17 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP6223909B2 (ja) 2013-07-11 2017-11-01 新光電気工業株式会社 配線基板及びその製造方法
KR102268388B1 (ko) * 2014-08-11 2021-06-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5795415B1 (ja) 2014-08-29 2015-10-14 新光電気工業株式会社 配線基板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140090961A (ko) * 2013-01-10 2014-07-18 주식회사 두산 절연수지 필름, 상기 필름을 포함하는 금속박 적층판 및 인쇄회로기판, 및 상기 필름을 포함하는 회로기판의 제조방법
KR20170122500A (ko) * 2016-04-27 2017-11-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Also Published As

Publication number Publication date
CN114365586A (zh) 2022-04-15
WO2021049859A1 (ko) 2021-03-18
KR102820035B1 (ko) 2025-06-13
US12167540B2 (en) 2024-12-10
KR20210030725A (ko) 2021-03-18
US20220346236A1 (en) 2022-10-27
JP2022547676A (ja) 2022-11-15

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