KR102802116B1 - 마이크로 전자기계 공진기 - Google Patents

마이크로 전자기계 공진기 Download PDF

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Publication number
KR102802116B1
KR102802116B1 KR1020217036930A KR20217036930A KR102802116B1 KR 102802116 B1 KR102802116 B1 KR 102802116B1 KR 1020217036930 A KR1020217036930 A KR 1020217036930A KR 20217036930 A KR20217036930 A KR 20217036930A KR 102802116 B1 KR102802116 B1 KR 102802116B1
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South Korea
Prior art keywords
resonator
paragraph
central spring
microelectromechanical resonator
microelectromechanical
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Korean (ko)
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KR20210151924A (ko
Inventor
빌레 사렐라
안티 야콜라
아르네 오야
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교세라 테크놀로지스 오와이
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H03H3/0076—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks for obtaining desired frequency or temperature coefficients
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/013—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2473—Double-Ended Tuning Fork [DETF] resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2478—Single-Ended Tuning Fork resonators
    • H03H9/2484—Single-Ended Tuning Fork resonators with two fork tines, e.g. Y-beam cantilever
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/02291—Beams
    • H03H2009/02307—Dog-bone-like structure, i.e. the elongated part of the "bone" is doubly clamped
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/02291—Beams
    • H03H2009/02322—Material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/0233—Vibrating means comprising perforations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)
KR1020217036930A 2019-04-15 2020-04-15 마이크로 전자기계 공진기 Active KR102802116B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20195305 2019-04-15
FI20195305A FI130145B (en) 2019-04-15 2019-04-15 Microelectromechanical resonator
PCT/FI2020/050249 WO2020212648A1 (en) 2019-04-15 2020-04-15 Microelectromechanical resonator

Publications (2)

Publication Number Publication Date
KR20210151924A KR20210151924A (ko) 2021-12-14
KR102802116B1 true KR102802116B1 (ko) 2025-05-02

Family

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Family Applications (1)

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KR1020217036930A Active KR102802116B1 (ko) 2019-04-15 2020-04-15 마이크로 전자기계 공진기

Country Status (7)

Country Link
US (1) US12323131B2 (https=)
EP (1) EP3956983A4 (https=)
JP (1) JP7590340B2 (https=)
KR (1) KR102802116B1 (https=)
CN (2) CN113692707B (https=)
FI (1) FI130145B (https=)
WO (1) WO2020212648A1 (https=)

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FI129591B (en) * 2020-11-06 2022-05-13 Kyocera Tikitin Oy Mems resonator with high quality factor and its use
FR3120700B1 (fr) * 2021-03-10 2023-02-10 Office National Detudes Rech Aerospatiales Resonateur en vibration de flexion a haut facteur de qualite pour la realisation de references de temps, de capteurs de force ou de gyrometres
FI20216348A1 (en) * 2021-12-23 2023-06-24 Kyocera Tikitin Oy MEMS resonator
CN115236357B (zh) * 2022-07-04 2024-10-18 南京理工大学 具有单锚点固支音叉谐振器的硅微谐振梁加速度计结构
IT202200022845A1 (it) 2022-11-07 2024-05-07 Milano Politecnico Dispositivo meccanico unidirezionale
FI20235493A1 (en) * 2023-05-04 2024-11-05 Kyocera Tech Oy Mems resonator comprising in-phase and out-of-phase elements
FI132024B1 (fi) * 2023-09-14 2026-04-17 Kyocera Tech Oy Liittimen sisältävä mems-resonaattori

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WO2012081457A1 (ja) * 2010-12-15 2012-06-21 株式会社村田製作所 振動ジャイロ
WO2013005625A1 (ja) * 2011-07-04 2013-01-10 株式会社村田製作所 振動子および振動ジャイロ
JP2016099269A (ja) * 2014-11-25 2016-05-30 セイコーエプソン株式会社 ジャイロセンサー、電子機器、および移動体
JP2017537500A (ja) * 2014-10-22 2017-12-14 マイクロチップ・テクノロジー・インコーポレーテッド 発振器およびリアルタイムクロック用途のための複合バネｍｅｍｓ共振器
JP2018522461A (ja) * 2015-06-19 2018-08-09 サイタイム・コーポレイションＳｉｔｉｍｅ Ｃｏｒｐｏｒａｔｉｏｎ 微小電気機械共振器

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JP2008545333A (ja) * 2005-06-30 2008-12-11 ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Ｍｅｍｓ共振器アレイ構造ならびにその動作および使用方法
WO2012081457A1 (ja) * 2010-12-15 2012-06-21 株式会社村田製作所 振動ジャイロ
WO2013005625A1 (ja) * 2011-07-04 2013-01-10 株式会社村田製作所 振動子および振動ジャイロ
JP2017537500A (ja) * 2014-10-22 2017-12-14 マイクロチップ・テクノロジー・インコーポレーテッド 発振器およびリアルタイムクロック用途のための複合バネｍｅｍｓ共振器
JP2016099269A (ja) * 2014-11-25 2016-05-30 セイコーエプソン株式会社 ジャイロセンサー、電子機器、および移動体
JP2018522461A (ja) * 2015-06-19 2018-08-09 サイタイム・コーポレイションＳｉｔｉｍｅ Ｃｏｒｐｏｒａｔｉｏｎ 微小電気機械共振器

Also Published As

Publication number Publication date
JP2022529131A (ja) 2022-06-17
JP7590340B2 (ja) 2024-11-26
CN113692707B (zh) 2026-01-16
WO2020212648A1 (en) 2020-10-22
CN121690115A (zh) 2026-03-17
FI130145B (en) 2023-03-13
US20220166406A1 (en) 2022-05-26
KR20210151924A (ko) 2021-12-14
US12323131B2 (en) 2025-06-03
CN113692707A (zh) 2021-11-23
EP3956983A4 (en) 2023-04-26
EP3956983A1 (en) 2022-02-23
FI20195305A1 (en) 2020-10-16

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