FI130145B - Microelectromechanical resonator - Google Patents

Microelectromechanical resonator Download PDF

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Publication number
FI130145B
FI130145B FI20195305A FI20195305A FI130145B FI 130145 B FI130145 B FI 130145B FI 20195305 A FI20195305 A FI 20195305A FI 20195305 A FI20195305 A FI 20195305A FI 130145 B FI130145 B FI 130145B
Authority
FI
Finland
Prior art keywords
resonator
spring portion
weight
silicon
certain embodiments
Prior art date
Application number
FI20195305A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20195305A1 (en
Inventor
Antti Jaakkola
Ville Saarela
Original Assignee
Tikitin Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tikitin Oy filed Critical Tikitin Oy
Priority to FI20195305A priority Critical patent/FI130145B/en
Priority to EP20790942.5A priority patent/EP3956983A4/en
Priority to JP2021559712A priority patent/JP7590340B2/ja
Priority to CN202512042562.3A priority patent/CN121690115A/zh
Priority to CN202080028930.1A priority patent/CN113692707B/zh
Priority to KR1020217036930A priority patent/KR102802116B1/ko
Priority to PCT/FI2020/050249 priority patent/WO2020212648A1/en
Priority to US17/602,351 priority patent/US12323131B2/en
Publication of FI20195305A1 publication Critical patent/FI20195305A1/en
Application granted granted Critical
Publication of FI130145B publication Critical patent/FI130145B/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2473—Double-Ended Tuning Fork [DETF] resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H03H3/0076—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks for obtaining desired frequency or temperature coefficients
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/013—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2478—Single-Ended Tuning Fork resonators
    • H03H9/2484—Single-Ended Tuning Fork resonators with two fork tines, e.g. Y-beam cantilever
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/02291—Beams
    • H03H2009/02307—Dog-bone-like structure, i.e. the elongated part of the "bone" is doubly clamped
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/02291—Beams
    • H03H2009/02322—Material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/0233—Vibrating means comprising perforations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)
FI20195305A 2019-04-15 2019-04-15 Microelectromechanical resonator FI130145B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20195305A FI130145B (en) 2019-04-15 2019-04-15 Microelectromechanical resonator
EP20790942.5A EP3956983A4 (en) 2019-04-15 2020-04-15 MICROELECTRO-MECHANICAL RESONATOR
JP2021559712A JP7590340B2 (ja) 2019-04-15 2020-04-15 微小電気機械共振器
CN202512042562.3A CN121690115A (zh) 2019-04-15 2020-04-15 微机电谐振器
CN202080028930.1A CN113692707B (zh) 2019-04-15 2020-04-15 微机电谐振器
KR1020217036930A KR102802116B1 (ko) 2019-04-15 2020-04-15 마이크로 전자기계 공진기
PCT/FI2020/050249 WO2020212648A1 (en) 2019-04-15 2020-04-15 Microelectromechanical resonator
US17/602,351 US12323131B2 (en) 2019-04-15 2020-04-15 Spring-mass microelectromechanical resonator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20195305A FI130145B (en) 2019-04-15 2019-04-15 Microelectromechanical resonator

Publications (2)

Publication Number Publication Date
FI20195305A1 FI20195305A1 (en) 2020-10-16
FI130145B true FI130145B (en) 2023-03-13

Family

ID=72837063

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20195305A FI130145B (en) 2019-04-15 2019-04-15 Microelectromechanical resonator

Country Status (7)

Country Link
US (1) US12323131B2 (https=)
EP (1) EP3956983A4 (https=)
JP (1) JP7590340B2 (https=)
KR (1) KR102802116B1 (https=)
CN (2) CN113692707B (https=)
FI (1) FI130145B (https=)
WO (1) WO2020212648A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI129591B (en) * 2020-11-06 2022-05-13 Kyocera Tikitin Oy Mems resonator with high quality factor and its use
FR3120700B1 (fr) * 2021-03-10 2023-02-10 Office National Detudes Rech Aerospatiales Resonateur en vibration de flexion a haut facteur de qualite pour la realisation de references de temps, de capteurs de force ou de gyrometres
FI20216348A1 (en) * 2021-12-23 2023-06-24 Kyocera Tikitin Oy MEMS resonator
CN115236357B (zh) * 2022-07-04 2024-10-18 南京理工大学 具有单锚点固支音叉谐振器的硅微谐振梁加速度计结构
IT202200022845A1 (it) 2022-11-07 2024-05-07 Milano Politecnico Dispositivo meccanico unidirezionale
FI20235493A1 (en) * 2023-05-04 2024-11-05 Kyocera Tech Oy Mems resonator comprising in-phase and out-of-phase elements
FI132024B1 (fi) * 2023-09-14 2026-04-17 Kyocera Tech Oy Liittimen sisältävä mems-resonaattori

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US7068126B2 (en) * 2004-03-04 2006-06-27 Discera Method and apparatus for frequency tuning of a micro-mechanical resonator
US7227432B2 (en) 2005-06-30 2007-06-05 Robert Bosch Gmbh MEMS resonator array structure and method of operating and using same
US7420318B1 (en) 2006-03-20 2008-09-02 The United States Of America As Represented By The Secretary Of The Army Lateral piezoelectric microelectromechanical system (MEMS) actuation and sensing device
FR2910742B1 (fr) * 2006-12-22 2009-05-01 Commissariat Energie Atomique Oscillateur mecanique forme d'un reseau d'oscillateurs elementaires
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WO2013005625A1 (ja) 2011-07-04 2013-01-10 株式会社村田製作所 振動子および振動ジャイロ
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Also Published As

Publication number Publication date
JP2022529131A (ja) 2022-06-17
JP7590340B2 (ja) 2024-11-26
KR102802116B1 (ko) 2025-05-02
CN113692707B (zh) 2026-01-16
WO2020212648A1 (en) 2020-10-22
CN121690115A (zh) 2026-03-17
US20220166406A1 (en) 2022-05-26
KR20210151924A (ko) 2021-12-14
US12323131B2 (en) 2025-06-03
CN113692707A (zh) 2021-11-23
EP3956983A4 (en) 2023-04-26
EP3956983A1 (en) 2022-02-23
FI20195305A1 (en) 2020-10-16

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Legal Events

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PC Transfer of assignment of patent

Owner name: KYOCERA TIKITIN OY

TC Name/ company changed in patent

Owner name: KYOCERA TIKITIN OY, FI

TC Name/ company changed in patent

Owner name: KYOCERA TECHNOLOGIES OY

TC Name/ company changed in patent

Owner name: KYOCERA TECHNOLOGIES OY