CN113692707B - 微机电谐振器 - Google Patents

微机电谐振器

Info

Publication number
CN113692707B
CN113692707B CN202080028930.1A CN202080028930A CN113692707B CN 113692707 B CN113692707 B CN 113692707B CN 202080028930 A CN202080028930 A CN 202080028930A CN 113692707 B CN113692707 B CN 113692707B
Authority
CN
China
Prior art keywords
resonator
weight portion
layer
silicon
central spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080028930.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN113692707A (zh
Inventor
V·萨雷拉
A·贾克拉
A·奥加
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jingci Diketing Co
Kyocera Technology Co
Original Assignee
Jingci Diketing Co
Kyocera Technology Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jingci Diketing Co, Kyocera Technology Co filed Critical Jingci Diketing Co
Priority to CN202512042562.3A priority Critical patent/CN121690115A/zh
Publication of CN113692707A publication Critical patent/CN113692707A/zh
Application granted granted Critical
Publication of CN113692707B publication Critical patent/CN113692707B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H03H3/0076—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks for obtaining desired frequency or temperature coefficients
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/013—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H03H9/02448—Means for compensation or elimination of undesired effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2473—Double-Ended Tuning Fork [DETF] resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2478—Single-Ended Tuning Fork resonators
    • H03H9/2484—Single-Ended Tuning Fork resonators with two fork tines, e.g. Y-beam cantilever
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/02291—Beams
    • H03H2009/02307—Dog-bone-like structure, i.e. the elongated part of the "bone" is doubly clamped
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/02291—Beams
    • H03H2009/02322—Material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/0233—Vibrating means comprising perforations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)
CN202080028930.1A 2019-04-15 2020-04-15 微机电谐振器 Active CN113692707B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202512042562.3A CN121690115A (zh) 2019-04-15 2020-04-15 微机电谐振器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20195305 2019-04-15
FI20195305A FI130145B (en) 2019-04-15 2019-04-15 Microelectromechanical resonator
PCT/FI2020/050249 WO2020212648A1 (en) 2019-04-15 2020-04-15 Microelectromechanical resonator

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202512042562.3A Division CN121690115A (zh) 2019-04-15 2020-04-15 微机电谐振器

Publications (2)

Publication Number Publication Date
CN113692707A CN113692707A (zh) 2021-11-23
CN113692707B true CN113692707B (zh) 2026-01-16

Family

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Family Applications (2)

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CN202080028930.1A Active CN113692707B (zh) 2019-04-15 2020-04-15 微机电谐振器
CN202512042562.3A Pending CN121690115A (zh) 2019-04-15 2020-04-15 微机电谐振器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202512042562.3A Pending CN121690115A (zh) 2019-04-15 2020-04-15 微机电谐振器

Country Status (7)

Country Link
US (1) US12323131B2 (https=)
EP (1) EP3956983A4 (https=)
JP (1) JP7590340B2 (https=)
KR (1) KR102802116B1 (https=)
CN (2) CN113692707B (https=)
FI (1) FI130145B (https=)
WO (1) WO2020212648A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI129591B (en) * 2020-11-06 2022-05-13 Kyocera Tikitin Oy Mems resonator with high quality factor and its use
FR3120700B1 (fr) * 2021-03-10 2023-02-10 Office National Detudes Rech Aerospatiales Resonateur en vibration de flexion a haut facteur de qualite pour la realisation de references de temps, de capteurs de force ou de gyrometres
FI20216348A1 (en) * 2021-12-23 2023-06-24 Kyocera Tikitin Oy MEMS resonator
CN115236357B (zh) * 2022-07-04 2024-10-18 南京理工大学 具有单锚点固支音叉谐振器的硅微谐振梁加速度计结构
IT202200022845A1 (it) 2022-11-07 2024-05-07 Milano Politecnico Dispositivo meccanico unidirezionale
FI20235493A1 (en) * 2023-05-04 2024-11-05 Kyocera Tech Oy Mems resonator comprising in-phase and out-of-phase elements
FI132024B1 (fi) * 2023-09-14 2026-04-17 Kyocera Tech Oy Liittimen sisältävä mems-resonaattori

Citations (1)

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CN107251425A (zh) * 2014-10-22 2017-10-13 微芯片科技公司 用于振荡器和实时时钟应用的多线圈弹簧mems谐振器

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US7068126B2 (en) * 2004-03-04 2006-06-27 Discera Method and apparatus for frequency tuning of a micro-mechanical resonator
US7227432B2 (en) 2005-06-30 2007-06-05 Robert Bosch Gmbh MEMS resonator array structure and method of operating and using same
US7420318B1 (en) 2006-03-20 2008-09-02 The United States Of America As Represented By The Secretary Of The Army Lateral piezoelectric microelectromechanical system (MEMS) actuation and sensing device
FR2910742B1 (fr) * 2006-12-22 2009-05-01 Commissariat Energie Atomique Oscillateur mecanique forme d'un reseau d'oscillateurs elementaires
DE102008021175A1 (de) * 2007-05-23 2009-01-15 Sony Corp. Resonator, Oszillator und Kommunikationsvorrichtung
SG190064A1 (en) * 2010-11-08 2013-06-28 Agency Science Tech & Res A piezoelectric resonator
WO2012081457A1 (ja) 2010-12-15 2012-06-21 株式会社村田製作所 振動ジャイロ
FI126586B (fi) 2011-02-17 2017-02-28 Teknologian Tutkimuskeskus Vtt Oy Uudet mikromekaaniset laitteet
CN103460592B (zh) * 2011-04-07 2016-04-06 株式会社村田制作所 压电发电装置
WO2013005625A1 (ja) 2011-07-04 2013-01-10 株式会社村田製作所 振動子および振動ジャイロ
EP2544370B1 (en) * 2011-07-06 2020-01-01 Nxp B.V. MEMS resonator
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Also Published As

Publication number Publication date
JP2022529131A (ja) 2022-06-17
JP7590340B2 (ja) 2024-11-26
KR102802116B1 (ko) 2025-05-02
WO2020212648A1 (en) 2020-10-22
CN121690115A (zh) 2026-03-17
FI130145B (en) 2023-03-13
US20220166406A1 (en) 2022-05-26
KR20210151924A (ko) 2021-12-14
US12323131B2 (en) 2025-06-03
CN113692707A (zh) 2021-11-23
EP3956983A4 (en) 2023-04-26
EP3956983A1 (en) 2022-02-23
FI20195305A1 (en) 2020-10-16

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Country or region after: Finland

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Applicant after: Kyocera Technology Co.

Address before: Espoo, Finland

Applicant before: Jingci diketing Co.

Country or region before: Finland

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