KR102778985B1 - 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법 - Google Patents

레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법 Download PDF

Info

Publication number
KR102778985B1
KR102778985B1 KR1020247011118A KR20247011118A KR102778985B1 KR 102778985 B1 KR102778985 B1 KR 102778985B1 KR 1020247011118 A KR1020247011118 A KR 1020247011118A KR 20247011118 A KR20247011118 A KR 20247011118A KR 102778985 B1 KR102778985 B1 KR 102778985B1
Authority
KR
South Korea
Prior art keywords
laser
workpiece
laser energy
energy
paragraph
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247011118A
Other languages
English (en)
Korean (ko)
Other versions
KR20240050452A (ko
Inventor
패트릭 리켈
마크 언라쓰
제이크 로버트
조셉 해스티
제임스 브룩카이저
재커리 던
크리스토퍼 햄너
제프리 로트
제이콥 매이거스
잭 런델
제프리 하워톤
장 클레이너트
더그 할
개리 라르센
줄리에 윌슨
리 페터슨
마크 위그너
커트 이튼
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority to KR1020257007311A priority Critical patent/KR20250039487A/ko
Publication of KR20240050452A publication Critical patent/KR20240050452A/ko
Application granted granted Critical
Publication of KR102778985B1 publication Critical patent/KR102778985B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/108—Beam splitting or combining systems for sampling a portion of a beam or combining a small beam in a larger one, e.g. wherein the area ratio or power ratio of the divided beams significantly differs from unity, without spectral selectivity
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
    • G02F1/33—Acousto-optical deflection devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
KR1020247011118A 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법 Active KR102778985B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257007311A KR20250039487A (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201862680856P 2018-06-05 2018-06-05
US62/680,856 2018-06-05
US201862688484P 2018-06-22 2018-06-22
US62/688,484 2018-06-22
KR1020207038132A KR102655354B1 (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
PCT/US2019/035443 WO2019236616A1 (en) 2018-06-05 2019-06-04 Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207038132A Division KR102655354B1 (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020257007311A Division KR20250039487A (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법

Publications (2)

Publication Number Publication Date
KR20240050452A KR20240050452A (ko) 2024-04-18
KR102778985B1 true KR102778985B1 (ko) 2025-03-12

Family

ID=68770974

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020247011118A Active KR102778985B1 (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
KR1020207038132A Active KR102655354B1 (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
KR1020257007311A Pending KR20250039487A (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020207038132A Active KR102655354B1 (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
KR1020257007311A Pending KR20250039487A (ko) 2018-06-05 2019-06-04 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법

Country Status (7)

Country Link
US (2) US12011785B2 (enExample)
EP (1) EP3774166A4 (enExample)
JP (3) JP7437323B2 (enExample)
KR (3) KR102778985B1 (enExample)
CN (2) CN116275467A (enExample)
TW (2) TWI829703B (enExample)
WO (1) WO2019236616A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021161367A1 (ja) * 2020-02-10 2021-08-19 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
JP7485014B2 (ja) * 2020-04-15 2024-05-16 株式会社ニコン 加工システム及び計測部材
US20230061635A1 (en) * 2020-05-14 2023-03-02 Electro Scientific Industries, Inc. Laser processing apparatus facilitating directed inspection of laser-processed workpieces and methods of operating the same
US12070898B2 (en) * 2020-11-12 2024-08-27 Eagle Technology, Llc Additive manufacturing device with acousto-optic deflector and related methods
TWI747641B (zh) * 2020-12-03 2021-11-21 新代科技股份有限公司 雷射打標系統及雷射打標方法
JP7594925B2 (ja) * 2021-02-05 2024-12-05 株式会社ディスコ レーザー加工装置
EP4301541A4 (en) * 2021-03-05 2025-10-15 Electro Scient Ind Inc LASER PROCESSING APPARATUS, METHODS OF OPERATING SAID APPARATUS AND METHODS OF PROCESSING WORKPIECES USING SAID APPARATUS
DE102021203609A1 (de) * 2021-04-13 2022-10-13 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Behandlung wenigstens einer Schicht oder eines Bereichs eines Bauteils und Vorrichtung zum Durchführen des Verfahrens
US12590372B2 (en) * 2021-05-27 2026-03-31 Ioanna ZERGIOTI Laser induced forward transfer of 2D materials
JP2024524120A (ja) * 2021-06-18 2024-07-05 アイピージー フォトニクス コーポレーション 手持ち式レーザシステムにおける洗浄機能性
WO2022271483A1 (en) 2021-06-21 2022-12-29 Electro Scientific Industries, Inc. Laser processing apparatus including beam analysis system and methods of measurement and control of beam characteristics
KR20240056517A (ko) * 2021-09-17 2024-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 광검출기 상의 레이저 빔의 위치 감도 감소를 위한 컨디셔닝 장치 및 이를 사용하는 방법
DE102021211232A1 (de) 2021-10-05 2023-04-06 Carl Zeiss Meditec Ag Vorrichtung und Verfahren zur Charakterisierung eines Laserstrahls eines ophthalmischen Lasersystems
AT526120B1 (de) * 2022-04-08 2024-07-15 Trotec Laser Gmbh Verfahren zum Betreiben eines Laserplotters zum Schneiden, Gravieren, Markieren und/oder Beschriften eines Werkstückes, sowie einen Laserplotter zum Gravieren, Markieren und/oder Beschriften eines Werkstückes
JP2024033159A (ja) * 2022-08-30 2024-03-13 セイコーエプソン株式会社 レーザー加工装置
TWI866486B (zh) * 2022-11-28 2024-12-11 精捷科技光學股份有限公司 以人工智慧驅動的雷射移除基板防焊層的智能除焊裝置
CN117600084B (zh) * 2024-01-22 2024-03-29 上海强华实业股份有限公司 一种石英棒外观检测装置及其检测系统
CN118030530B (zh) * 2024-02-28 2024-07-12 无锡科里斯特科技有限公司 一种用于大通径真空泵的密封端盖及其制作工艺
KR102893365B1 (ko) * 2025-05-02 2025-12-02 주식회사 아이쓰리엔지니어링 Abf 레이어가 있는 pcb 패널에 대한 스마트 디텍션 시스템 및 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000042763A (ja) 1998-07-24 2000-02-15 Komatsu Ltd レーザビームによるドットマーク形態と、そのマーキング装置及びマーキング方法
US20130330844A1 (en) 2012-06-11 2013-12-12 Ultratech, Inc. Laser annealing systems and methods with ultra-short dwell times

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3319071A (en) * 1964-11-27 1967-05-09 Gen Motors Corp Infrared gas analysis absorption chamber having a highly reflective specular internal surface
CH561942A5 (enExample) * 1974-03-08 1975-05-15 Cerberus Ag
FR2585480B1 (fr) * 1985-07-24 1994-01-07 Ateq Corp Generateur de modeles a laser
US4797696A (en) 1985-07-24 1989-01-10 Ateq Corporation Beam splitting apparatus
US4912487A (en) 1988-03-25 1990-03-27 Texas Instruments Incorporated Laser scanner using focusing acousto-optic device
US4942305A (en) * 1989-05-12 1990-07-17 Pacific Scientific Company Integrating sphere aerosol particle detector
US5168454A (en) * 1989-10-30 1992-12-01 International Business Machines Corporation Formation of high quality patterns for substrates and apparatus therefor
US5220179A (en) * 1990-02-06 1993-06-15 Helmut Katschnig Method of and apparatus for detecting the presence of vapor and/or smoke in the outgoing air of a device for heating materials
US5128693A (en) * 1990-09-14 1992-07-07 Nippon Telegraph & Telephone Corporation Information recording apparatus
JP2720744B2 (ja) * 1992-12-28 1998-03-04 三菱電機株式会社 レーザ加工機
US5340975A (en) * 1993-01-29 1994-08-23 Minnesota Mining And Manufacturing Company Method and apparatus for reducing the effects of laser noise and for improving modulation transfer function in scanning a photoconductive surface
US5638267A (en) 1994-06-15 1997-06-10 Convolve, Inc. Method and apparatus for minimizing unwanted dynamics in a physical system
US5545896A (en) * 1994-06-28 1996-08-13 Santa Barbara Research Center Optically immersed semiconductor photodetectors
US5633747A (en) 1994-12-21 1997-05-27 Tencor Instruments Variable spot-size scanning apparatus
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
JP2858236B2 (ja) * 1996-03-19 1999-02-17 住友重機械工業株式会社 レーザ加工装置
JP3689510B2 (ja) * 1996-11-15 2005-08-31 キヤノン株式会社 露光装置およびデバイス製造方法
US5917300A (en) 1997-03-10 1999-06-29 Convolve, Inc. Method and apparatus for the control of gantry machines
US6314463B1 (en) 1998-05-29 2001-11-06 Webspective Software, Inc. Method and system for measuring queue length and delay
JP2000206035A (ja) * 1999-01-19 2000-07-28 Anritsu Corp ガス検出装置
JP4061765B2 (ja) * 1999-02-09 2008-03-19 コニカミノルタセンシング株式会社 蛍光試料の分光特性測定装置及びその測定方法
US6225910B1 (en) * 1999-12-08 2001-05-01 Gentex Corporation Smoke detector
WO2001052004A1 (en) 2000-01-11 2001-07-19 Electro Scientific Industries, Inc. Abbe error correction system and method
US6600600B2 (en) 2000-08-14 2003-07-29 Cid, Inc. Projection screen and projection method
US6469623B2 (en) * 2001-01-26 2002-10-22 Gentex Corporation Smoke detector maintenance and verification tool
US7245412B2 (en) 2001-02-16 2007-07-17 Electro Scientific Industries, Inc. On-the-fly laser beam path error correction for specimen target location processing
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
US6816294B2 (en) 2001-02-16 2004-11-09 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
US6606999B2 (en) 2001-03-27 2003-08-19 R. J. Reynolds Tobacco Company Reduced ignition propensity smoking article
EP1386192A2 (en) * 2001-04-03 2004-02-04 CiDra Corporation Dynamic optical filter having a spatial light modulator
US6606998B1 (en) 2001-10-05 2003-08-19 Ely Gold Simple simulated cigarette
JP4270891B2 (ja) 2003-01-21 2009-06-03 三洋電機株式会社 Ｅｌ表示装置のレーザーリペア方法
GB2389176C (en) * 2002-05-27 2011-07-27 Kidde Ip Holdings Ltd Smoke detector
US20040151008A1 (en) * 2003-02-03 2004-08-05 Artsyukhovich Alexander N. Variable spot size illuminators with enhanced homogeneity and parfocality
US6947454B2 (en) 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
US7483196B2 (en) 2003-09-23 2009-01-27 Applied Materials, Inc. Apparatus for multiple beam deflection and intensity stabilization
US7633033B2 (en) * 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
US7800014B2 (en) * 2004-01-09 2010-09-21 General Lasertronics Corporation Color sensing for laser decoating
US7133186B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing transducers to modulate different axes
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
JP2006098720A (ja) 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 描画装置
US7292616B2 (en) * 2005-02-09 2007-11-06 Ultratech, Inc. CO2 laser stabilization systems and methods
US7284396B2 (en) * 2005-03-01 2007-10-23 International Gemstone Registry Inc. Method and system for laser marking in the volume of gemstones such as diamonds
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
WO2007041460A2 (en) * 2005-10-03 2007-04-12 Aradigm Corporation Method and system for laser machining
US7834293B2 (en) 2006-05-02 2010-11-16 Electro Scientific Industries, Inc. Method and apparatus for laser processing
US7605343B2 (en) 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
DE102006038795A1 (de) * 2006-08-18 2008-03-20 Fft Edag Produktionssysteme Gmbh & Co. Kg Überwachungsvorrichtung für eine Laserbearbeitungsvorrichtung
US7907341B2 (en) * 2006-09-28 2011-03-15 Sumitomo Electric Industries, Ltd. Laser processing method and laser processing apparatus
US8536483B2 (en) * 2007-03-22 2013-09-17 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US8076605B2 (en) 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
JP2009122983A (ja) * 2007-11-15 2009-06-04 Sharp Corp 煙センサおよび電子機器
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US8598490B2 (en) * 2008-03-31 2013-12-03 Electro Scientific Industries, Inc. Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
DE102008021438A1 (de) * 2008-04-29 2009-12-31 Schott Ag Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle
US8448468B2 (en) * 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
US8198564B2 (en) * 2008-09-09 2012-06-12 Electro Scientific Industries, Inc. Adaptive optic beamshaping in laser processing systems
US8680430B2 (en) 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP4826861B2 (ja) * 2009-07-10 2011-11-30 三菱電機株式会社 レーザ加工方法および装置
DE102010002260A1 (de) 2010-02-23 2011-08-25 Robert Bosch GmbH, 70469 Messeinrichtung für eine Laserstrahlbearbeitungsvorrichtung
TWI430000B (zh) 2010-07-02 2014-03-11 Ind Tech Res Inst 平面顯示器之修補方法與系統
TWI497055B (zh) 2010-07-30 2015-08-21 Ｈｏｙａ股份有限公司 透過率測定裝置、光罩之透過率檢查裝置、透過率檢查方法、光罩製造方法、圖案轉印方法、光罩製品
CN110039173B (zh) * 2010-10-22 2021-03-23 伊雷克托科学工业股份有限公司 用于光束抖动和刮削的镭射加工系统和方法
US8896909B2 (en) 2010-11-04 2014-11-25 Micronic Ab Method and device scanning a two-dimensional brush through an acousto-optic deflector (AOD) having an extended field in a scanning direction
US8648277B2 (en) 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
US8546805B2 (en) * 2012-01-27 2013-10-01 Ultratech, Inc. Two-beam laser annealing with improved temperature performance
EP3054649B1 (en) 2012-02-14 2020-03-25 Intel Corporation Peer to peer networking and sharing systems and methods
US9259802B2 (en) 2012-07-26 2016-02-16 Electro Scientific Industries, Inc. Method and apparatus for collecting material produced by processing workpieces
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
DE102013201968B4 (de) 2013-02-07 2014-08-28 BLZ Bayerisches Laserzentrum Gemeinnützige Forschungsgesellschaft mbH Vorrichtung zur akustooptischen Umformung periodisch gepulster, elektromagnetischer Strahlung
JP2016516584A (ja) 2013-03-15 2016-06-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド テーパ制御のためのビーム角度とワークピース移動の連係方法
WO2014152526A1 (en) 2013-03-15 2014-09-25 Electro Scientific Industries, Inc. Laser systems and methods for aod tool settling for aod travel reduction
JP6516722B2 (ja) 2013-03-15 2019-05-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームポジショナのレーザ出射に基づく制御
TWI632013B (zh) * 2013-03-15 2018-08-11 美商伊雷克托科學工業股份有限公司 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法
JP5947740B2 (ja) * 2013-03-29 2016-07-06 トヨタ自動車株式会社 溶接部の検査装置とその検査方法
JP6300381B2 (ja) * 2013-12-03 2018-04-04 株式会社日立製作所 磁場計測装置
JP6461166B2 (ja) * 2014-01-07 2019-01-30 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 光吸収による気体センサ
JP6533644B2 (ja) 2014-05-02 2019-06-19 株式会社ブイ・テクノロジー ビーム整形マスク、レーザ加工装置及びレーザ加工方法
EP2975447B1 (en) * 2014-07-14 2019-03-20 Funai Electric Co., Ltd. Laser scanner
CN107112255B (zh) * 2014-08-29 2021-05-14 奥罗拉太阳能科技（加拿大）公司 用于测量从半导体材料反射的辐射的水平以用于测量半导体材料的掺杂物含量的系统
DE102015001421B4 (de) 2015-02-06 2016-09-15 Primes GmbH Meßtechnik für die Produktion mit Laserstrahlung Vorrichtung und Verfahren zur Strahldiagnose an Laserbearbeitungs-Optiken (PRl-2015-001)
US10374384B2 (en) * 2015-07-20 2019-08-06 Afl Telecommunications Llc Laser feedback control systems
KR20250037607A (ko) * 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
KR20160000448A (ko) 2015-09-23 2016-01-04 주식회사 코윈디에스티 회절 광학계 시스템 및 이를 이용한 레이저 가공 방법
DE102016001355B4 (de) 2016-02-08 2022-03-24 Primes GmbH Meßtechnik für die Produktion mit Laserstrahlung Verfahren und Vorrichtung zur Analyse von Laserstrahlen in Anlagen für generative Fertigung
KR20170096812A (ko) 2016-02-17 2017-08-25 주식회사 이오테크닉스 다기능 레이저 가공장치 및 이를 이용한 레이저 가공방법
DE102016208264A1 (de) * 2016-05-13 2017-11-16 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zur Überwachung, insbesondere zur Regelung, eines Schneidprozesses
CN109862991A (zh) 2016-07-28 2019-06-07 伊雷克托科学工业股份有限公司 镭射处理设备和镭射处理工件的方法
JP6823448B2 (ja) 2016-12-19 2021-02-03 花王株式会社 レーザー光照射方法、レーザー光照射装置、及びシート融着体の製造方法
CN107052596B (zh) * 2017-06-12 2019-04-30 中南大学 纯金属或合金产品微孔加工方法
US12208465B2 (en) * 2019-11-08 2025-01-28 Divergent Technologies, Inc. Optical filter having dual polarization
JP6934083B1 (ja) * 2020-04-08 2021-09-08 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000042763A (ja) 1998-07-24 2000-02-15 Komatsu Ltd レーザビームによるドットマーク形態と、そのマーキング装置及びマーキング方法
US20130330844A1 (en) 2012-06-11 2013-12-12 Ultratech, Inc. Laser annealing systems and methods with ultra-short dwell times

Also Published As

Publication number Publication date
US12011785B2 (en) 2024-06-18
CN112074370B (zh) 2023-03-14
CN116275467A (zh) 2023-06-23
TWI829703B (zh) 2024-01-21
JP2026027436A (ja) 2026-02-18
EP3774166A1 (en) 2021-02-17
KR20240050452A (ko) 2024-04-18
CN112074370A (zh) 2020-12-11
JP2024054278A (ja) 2024-04-16
WO2019236616A1 (en) 2019-12-12
TW202012088A (zh) 2020-04-01
TW202417153A (zh) 2024-05-01
KR102655354B1 (ko) 2024-04-08
JP7437323B2 (ja) 2024-02-22
KR20210005964A (ko) 2021-01-15
KR20250039487A (ko) 2025-03-20
JP7776550B2 (ja) 2025-11-26
US20240293897A1 (en) 2024-09-05
EP3774166A4 (en) 2022-01-19
US20210362277A1 (en) 2021-11-25
JP2021526973A (ja) 2021-10-11

Similar Documents

Publication Publication Date Title
KR102778985B1 (ko) 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
CN115335178B (zh) 促进激光加工工件的导引检测的激光加工设备以及其操作的方法
TWI892641B (zh) 光學系統
TWI726909B (zh) 雷射處理設備、雷射處理工件的方法及相關配置
CN113710407B (zh) 镭射加工设备、其操作方法以及使用其加工工件的方法
US11260472B2 (en) Method and system for extending optics lifetime in laser processing apparatus

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601