KR102763739B1 - 배선 기판 - Google Patents

배선 기판 Download PDF

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Publication number
KR102763739B1
KR102763739B1 KR1020227031731A KR20227031731A KR102763739B1 KR 102763739 B1 KR102763739 B1 KR 102763739B1 KR 1020227031731 A KR1020227031731 A KR 1020227031731A KR 20227031731 A KR20227031731 A KR 20227031731A KR 102763739 B1 KR102763739 B1 KR 102763739B1
Authority
KR
South Korea
Prior art keywords
build
layer
insulating layer
core
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227031731A
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English (en)
Korean (ko)
Other versions
KR20220143068A (ko
Inventor
토시히로 히와타시
Original Assignee
교세라 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 교세라 가부시키가이샤 filed Critical 교세라 가부시키가이샤
Publication of KR20220143068A publication Critical patent/KR20220143068A/ko
Application granted granted Critical
Publication of KR102763739B1 publication Critical patent/KR102763739B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR1020227031731A 2020-03-25 2021-03-11 배선 기판 Active KR102763739B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020053937 2020-03-25
JPJP-P-2020-053937 2020-03-25
PCT/JP2021/009763 WO2021193092A1 (ja) 2020-03-25 2021-03-11 配線基板

Publications (2)

Publication Number Publication Date
KR20220143068A KR20220143068A (ko) 2022-10-24
KR102763739B1 true KR102763739B1 (ko) 2025-02-07

Family

ID=77891978

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227031731A Active KR102763739B1 (ko) 2020-03-25 2021-03-11 배선 기판

Country Status (6)

Country Link
US (1) US12144105B2 (https=)
EP (1) EP4132231A4 (https=)
JP (1) JP7391184B2 (https=)
KR (1) KR102763739B1 (https=)
CN (1) CN115299185A (https=)
WO (1) WO2021193092A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7784351B2 (ja) * 2022-05-30 2025-12-11 京セラ株式会社 配線基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244633A (ja) 2000-02-28 2001-09-07 Nec Corp 多層プリント配線板
JP2008218444A (ja) 2007-02-28 2008-09-18 Sony Corp プリント配線基板
JP2019033586A (ja) 2017-08-08 2019-02-28 ルネサスエレクトロニクス株式会社 電子装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4700332B2 (ja) * 2003-12-05 2011-06-15 イビデン株式会社 多層プリント配線板
US20060151869A1 (en) * 2005-01-10 2006-07-13 Franz Gisin Printed circuit boards and the like with improved signal integrity for differential signal pairs
TWI443789B (zh) * 2008-07-04 2014-07-01 欣興電子股份有限公司 嵌埋有半導體晶片之電路板及其製法
JP5436963B2 (ja) * 2009-07-21 2014-03-05 新光電気工業株式会社 配線基板及び半導体装置
US9544992B2 (en) 2013-01-29 2017-01-10 Fci Americas Technology Llc PCB having offset differential signal routing
WO2016067908A1 (ja) 2014-10-29 2016-05-06 株式会社村田製作所 無線通信モジュール
US10231325B1 (en) 2016-12-20 2019-03-12 Juniper Networks, Inc. Placement of vias in printed circuit board circuits
KR101952870B1 (ko) * 2017-01-23 2019-02-28 삼성전기주식회사 안테나 통합형 rf 모듈
US10396432B2 (en) * 2017-01-23 2019-08-27 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
CN108575044B (zh) * 2017-03-13 2023-01-24 富士康(昆山)电脑接插件有限公司 印刷电路板及其组件
US10410683B2 (en) 2017-12-14 2019-09-10 Seagate Technology Llc Tightly coupled differential vias
JP7001530B2 (ja) * 2018-04-16 2022-01-19 ルネサスエレクトロニクス株式会社 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244633A (ja) 2000-02-28 2001-09-07 Nec Corp 多層プリント配線板
JP2008218444A (ja) 2007-02-28 2008-09-18 Sony Corp プリント配線基板
JP2019033586A (ja) 2017-08-08 2019-02-28 ルネサスエレクトロニクス株式会社 電子装置

Also Published As

Publication number Publication date
EP4132231A1 (en) 2023-02-08
US12144105B2 (en) 2024-11-12
KR20220143068A (ko) 2022-10-24
EP4132231A4 (en) 2024-05-01
WO2021193092A1 (ja) 2021-09-30
JP7391184B2 (ja) 2023-12-04
US20230217581A1 (en) 2023-07-06
JPWO2021193092A1 (https=) 2021-09-30
CN115299185A (zh) 2022-11-04

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