JPWO2021193092A1 - - Google Patents

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Publication number
JPWO2021193092A1
JPWO2021193092A1 JP2022509905A JP2022509905A JPWO2021193092A1 JP WO2021193092 A1 JPWO2021193092 A1 JP WO2021193092A1 JP 2022509905 A JP2022509905 A JP 2022509905A JP 2022509905 A JP2022509905 A JP 2022509905A JP WO2021193092 A1 JPWO2021193092 A1 JP WO2021193092A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022509905A
Other languages
Japanese (ja)
Other versions
JPWO2021193092A5 (https=
JP7391184B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021193092A1 publication Critical patent/JPWO2021193092A1/ja
Publication of JPWO2021193092A5 publication Critical patent/JPWO2021193092A5/ja
Application granted granted Critical
Publication of JP7391184B2 publication Critical patent/JP7391184B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2022509905A 2020-03-25 2021-03-11 配線基板 Active JP7391184B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020053937 2020-03-25
JP2020053937 2020-03-25
PCT/JP2021/009763 WO2021193092A1 (ja) 2020-03-25 2021-03-11 配線基板

Publications (3)

Publication Number Publication Date
JPWO2021193092A1 true JPWO2021193092A1 (https=) 2021-09-30
JPWO2021193092A5 JPWO2021193092A5 (https=) 2022-11-15
JP7391184B2 JP7391184B2 (ja) 2023-12-04

Family

ID=77891978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022509905A Active JP7391184B2 (ja) 2020-03-25 2021-03-11 配線基板

Country Status (6)

Country Link
US (1) US12144105B2 (https=)
EP (1) EP4132231A4 (https=)
JP (1) JP7391184B2 (https=)
KR (1) KR102763739B1 (https=)
CN (1) CN115299185A (https=)
WO (1) WO2021193092A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7784351B2 (ja) * 2022-05-30 2025-12-11 京セラ株式会社 配線基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244633A (ja) * 2000-02-28 2001-09-07 Nec Corp 多層プリント配線板
JP2008218444A (ja) * 2007-02-28 2008-09-18 Sony Corp プリント配線基板
US20180212307A1 (en) * 2017-01-23 2018-07-26 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
JP2019033586A (ja) * 2017-08-08 2019-02-28 ルネサスエレクトロニクス株式会社 電子装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4700332B2 (ja) * 2003-12-05 2011-06-15 イビデン株式会社 多層プリント配線板
US20060151869A1 (en) * 2005-01-10 2006-07-13 Franz Gisin Printed circuit boards and the like with improved signal integrity for differential signal pairs
TWI443789B (zh) * 2008-07-04 2014-07-01 欣興電子股份有限公司 嵌埋有半導體晶片之電路板及其製法
JP5436963B2 (ja) * 2009-07-21 2014-03-05 新光電気工業株式会社 配線基板及び半導体装置
US9544992B2 (en) 2013-01-29 2017-01-10 Fci Americas Technology Llc PCB having offset differential signal routing
WO2016067908A1 (ja) 2014-10-29 2016-05-06 株式会社村田製作所 無線通信モジュール
US10231325B1 (en) 2016-12-20 2019-03-12 Juniper Networks, Inc. Placement of vias in printed circuit board circuits
KR101952870B1 (ko) * 2017-01-23 2019-02-28 삼성전기주식회사 안테나 통합형 rf 모듈
CN108575044B (zh) * 2017-03-13 2023-01-24 富士康(昆山)电脑接插件有限公司 印刷电路板及其组件
US10410683B2 (en) 2017-12-14 2019-09-10 Seagate Technology Llc Tightly coupled differential vias
JP7001530B2 (ja) * 2018-04-16 2022-01-19 ルネサスエレクトロニクス株式会社 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244633A (ja) * 2000-02-28 2001-09-07 Nec Corp 多層プリント配線板
JP2008218444A (ja) * 2007-02-28 2008-09-18 Sony Corp プリント配線基板
US20180212307A1 (en) * 2017-01-23 2018-07-26 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
JP2019033586A (ja) * 2017-08-08 2019-02-28 ルネサスエレクトロニクス株式会社 電子装置

Also Published As

Publication number Publication date
EP4132231A1 (en) 2023-02-08
US12144105B2 (en) 2024-11-12
KR20220143068A (ko) 2022-10-24
EP4132231A4 (en) 2024-05-01
WO2021193092A1 (ja) 2021-09-30
JP7391184B2 (ja) 2023-12-04
KR102763739B1 (ko) 2025-02-07
US20230217581A1 (en) 2023-07-06
CN115299185A (zh) 2022-11-04

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