KR102744239B1 - 정전 척 장치, 정전 척 장치용 슬리브 - Google Patents

정전 척 장치, 정전 척 장치용 슬리브 Download PDF

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Publication number
KR102744239B1
KR102744239B1 KR1020227028170A KR20227028170A KR102744239B1 KR 102744239 B1 KR102744239 B1 KR 102744239B1 KR 1020227028170 A KR1020227028170 A KR 1020227028170A KR 20227028170 A KR20227028170 A KR 20227028170A KR 102744239 B1 KR102744239 B1 KR 102744239B1
Authority
KR
South Korea
Prior art keywords
sleeve
layer
electrostatic chuck
chuck device
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227028170A
Other languages
English (en)
Korean (ko)
Other versions
KR20220126766A (ko
Inventor
노부요시 야마자키
Original Assignee
가부시키가이샤 도모에가와 코퍼레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시키가이샤 도모에가와 코퍼레이션 filed Critical 가부시키가이샤 도모에가와 코퍼레이션
Publication of KR20220126766A publication Critical patent/KR20220126766A/ko
Application granted granted Critical
Publication of KR102744239B1 publication Critical patent/KR102744239B1/ko
Active legal-status Critical Current
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Classifications

    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H01L21/68757—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gripping On Spindles (AREA)
KR1020227028170A 2020-03-26 2021-03-05 정전 척 장치, 정전 척 장치용 슬리브 Active KR102744239B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020055844 2020-03-26
JPJP-P-2020-055844 2020-03-26
PCT/JP2021/008815 WO2021192935A1 (ja) 2020-03-26 2021-03-05 静電チャック装置、静電チャック装置用スリーブ

Publications (2)

Publication Number Publication Date
KR20220126766A KR20220126766A (ko) 2022-09-16
KR102744239B1 true KR102744239B1 (ko) 2024-12-19

Family

ID=77891311

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227028170A Active KR102744239B1 (ko) 2020-03-26 2021-03-05 정전 척 장치, 정전 척 장치용 슬리브

Country Status (6)

Country Link
US (1) US12217994B2 (https=)
JP (1) JP7465338B2 (https=)
KR (1) KR102744239B1 (https=)
CN (1) CN115244678B (https=)
TW (1) TWI865743B (https=)
WO (1) WO2021192935A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240400825A1 (en) * 2021-10-19 2024-12-05 Toray Industries, Inc. Resin composition, cured product thereof, laminate using same, electrostatic chuck, and plasma processing equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344766A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2016143744A (ja) * 2015-01-30 2016-08-08 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP2019220503A (ja) * 2018-06-15 2019-12-26 新光電気工業株式会社 静電チャック及びその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233434A (ja) * 1997-02-21 1998-09-02 Hitachi Ltd 静電吸着体と静電吸着装置
JP2004127956A (ja) * 2002-09-30 2004-04-22 Toto Ltd 静電チャック
US20060175772A1 (en) 2003-03-19 2006-08-10 Tokyo Electron Limited Substrate holding mechanism using electrostaic chuck and method of manufacturing the same
JP5004436B2 (ja) 2005-05-23 2012-08-22 東京エレクトロン株式会社 静電吸着電極および処理装置
US8440049B2 (en) 2006-05-03 2013-05-14 Applied Materials, Inc. Apparatus for etching high aspect ratio features
JP5554525B2 (ja) * 2009-08-25 2014-07-23 日本特殊陶業株式会社 静電チャック
US9330953B2 (en) * 2011-03-23 2016-05-03 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
JP5717248B2 (ja) * 2011-03-30 2015-05-13 黒崎播磨株式会社 静電チャックの給電部及びその製造方法
JP5957812B2 (ja) * 2011-06-21 2016-07-27 住友大阪セメント株式会社 静電チャック装置
JP6658509B2 (ja) * 2015-02-18 2020-03-04 住友大阪セメント株式会社 静電チャック装置及び半導体製造装置
JP6866255B2 (ja) 2017-08-09 2021-04-28 東京エレクトロン株式会社 プラズマ処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344766A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2016143744A (ja) * 2015-01-30 2016-08-08 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP2019220503A (ja) * 2018-06-15 2019-12-26 新光電気工業株式会社 静電チャック及びその製造方法

Also Published As

Publication number Publication date
WO2021192935A1 (ja) 2021-09-30
JPWO2021192935A1 (https=) 2021-09-30
CN115244678A (zh) 2022-10-25
US12217994B2 (en) 2025-02-04
US20230115256A1 (en) 2023-04-13
TWI865743B (zh) 2024-12-11
JP7465338B2 (ja) 2024-04-10
CN115244678B (zh) 2025-11-18
TW202145432A (zh) 2021-12-01
KR20220126766A (ko) 2022-09-16

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