JPWO2021192935A1 - - Google Patents
Info
- Publication number
- JPWO2021192935A1 JPWO2021192935A1 JP2022509496A JP2022509496A JPWO2021192935A1 JP WO2021192935 A1 JPWO2021192935 A1 JP WO2021192935A1 JP 2022509496 A JP2022509496 A JP 2022509496A JP 2022509496 A JP2022509496 A JP 2022509496A JP WO2021192935 A1 JPWO2021192935 A1 JP WO2021192935A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Gripping On Spindles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020055844 | 2020-03-26 | ||
| JP2020055844 | 2020-03-26 | ||
| PCT/JP2021/008815 WO2021192935A1 (ja) | 2020-03-26 | 2021-03-05 | 静電チャック装置、静電チャック装置用スリーブ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021192935A1 true JPWO2021192935A1 (https=) | 2021-09-30 |
| JP7465338B2 JP7465338B2 (ja) | 2024-04-10 |
Family
ID=77891311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022509496A Active JP7465338B2 (ja) | 2020-03-26 | 2021-03-05 | 静電チャック装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12217994B2 (https=) |
| JP (1) | JP7465338B2 (https=) |
| KR (1) | KR102744239B1 (https=) |
| CN (1) | CN115244678B (https=) |
| TW (1) | TWI865743B (https=) |
| WO (1) | WO2021192935A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240400825A1 (en) * | 2021-10-19 | 2024-12-05 | Toray Industries, Inc. | Resin composition, cured product thereof, laminate using same, electrostatic chuck, and plasma processing equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233434A (ja) * | 1997-02-21 | 1998-09-02 | Hitachi Ltd | 静電吸着体と静電吸着装置 |
| JP2004127956A (ja) * | 2002-09-30 | 2004-04-22 | Toto Ltd | 静電チャック |
| JP2006344766A (ja) * | 2005-06-09 | 2006-12-21 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
| JP3128562U (ja) * | 2006-05-03 | 2007-01-18 | アプライド マテリアルズ インコーポレイテッド | 高アスペクト比の特徴部をエッチングするのに適したインサートなしの上部チャンバーライナー |
| JP2016143744A (ja) * | 2015-01-30 | 2016-08-08 | 日本特殊陶業株式会社 | 静電チャックおよびその製造方法 |
| JP2019220503A (ja) * | 2018-06-15 | 2019-12-26 | 新光電気工業株式会社 | 静電チャック及びその製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060175772A1 (en) | 2003-03-19 | 2006-08-10 | Tokyo Electron Limited | Substrate holding mechanism using electrostaic chuck and method of manufacturing the same |
| JP5004436B2 (ja) | 2005-05-23 | 2012-08-22 | 東京エレクトロン株式会社 | 静電吸着電極および処理装置 |
| JP5554525B2 (ja) * | 2009-08-25 | 2014-07-23 | 日本特殊陶業株式会社 | 静電チャック |
| US9330953B2 (en) * | 2011-03-23 | 2016-05-03 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck device |
| JP5717248B2 (ja) * | 2011-03-30 | 2015-05-13 | 黒崎播磨株式会社 | 静電チャックの給電部及びその製造方法 |
| JP5957812B2 (ja) * | 2011-06-21 | 2016-07-27 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP6658509B2 (ja) * | 2015-02-18 | 2020-03-04 | 住友大阪セメント株式会社 | 静電チャック装置及び半導体製造装置 |
| JP6866255B2 (ja) | 2017-08-09 | 2021-04-28 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2021
- 2021-03-05 US US17/911,440 patent/US12217994B2/en active Active
- 2021-03-05 CN CN202180019517.3A patent/CN115244678B/zh active Active
- 2021-03-05 JP JP2022509496A patent/JP7465338B2/ja active Active
- 2021-03-05 WO PCT/JP2021/008815 patent/WO2021192935A1/ja not_active Ceased
- 2021-03-05 KR KR1020227028170A patent/KR102744239B1/ko active Active
- 2021-03-11 TW TW110108734A patent/TWI865743B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233434A (ja) * | 1997-02-21 | 1998-09-02 | Hitachi Ltd | 静電吸着体と静電吸着装置 |
| JP2004127956A (ja) * | 2002-09-30 | 2004-04-22 | Toto Ltd | 静電チャック |
| JP2006344766A (ja) * | 2005-06-09 | 2006-12-21 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
| JP3128562U (ja) * | 2006-05-03 | 2007-01-18 | アプライド マテリアルズ インコーポレイテッド | 高アスペクト比の特徴部をエッチングするのに適したインサートなしの上部チャンバーライナー |
| JP2016143744A (ja) * | 2015-01-30 | 2016-08-08 | 日本特殊陶業株式会社 | 静電チャックおよびその製造方法 |
| JP2019220503A (ja) * | 2018-06-15 | 2019-12-26 | 新光電気工業株式会社 | 静電チャック及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021192935A1 (ja) | 2021-09-30 |
| KR102744239B1 (ko) | 2024-12-19 |
| CN115244678A (zh) | 2022-10-25 |
| US12217994B2 (en) | 2025-02-04 |
| US20230115256A1 (en) | 2023-04-13 |
| TWI865743B (zh) | 2024-12-11 |
| JP7465338B2 (ja) | 2024-04-10 |
| CN115244678B (zh) | 2025-11-18 |
| TW202145432A (zh) | 2021-12-01 |
| KR20220126766A (ko) | 2022-09-16 |
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