JP7465338B2 - 静電チャック装置 - Google Patents

静電チャック装置 Download PDF

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Publication number
JP7465338B2
JP7465338B2 JP2022509496A JP2022509496A JP7465338B2 JP 7465338 B2 JP7465338 B2 JP 7465338B2 JP 2022509496 A JP2022509496 A JP 2022509496A JP 2022509496 A JP2022509496 A JP 2022509496A JP 7465338 B2 JP7465338 B2 JP 7465338B2
Authority
JP
Japan
Prior art keywords
layer
ceramic
electrostatic chuck
sleeve
chuck device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022509496A
Other languages
English (en)
Japanese (ja)
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JPWO2021192935A1 (https=
Inventor
允義 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tomoegawa Co Ltd
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of JPWO2021192935A1 publication Critical patent/JPWO2021192935A1/ja
Application granted granted Critical
Publication of JP7465338B2 publication Critical patent/JP7465338B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gripping On Spindles (AREA)
JP2022509496A 2020-03-26 2021-03-05 静電チャック装置 Active JP7465338B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020055844 2020-03-26
JP2020055844 2020-03-26
PCT/JP2021/008815 WO2021192935A1 (ja) 2020-03-26 2021-03-05 静電チャック装置、静電チャック装置用スリーブ

Publications (2)

Publication Number Publication Date
JPWO2021192935A1 JPWO2021192935A1 (https=) 2021-09-30
JP7465338B2 true JP7465338B2 (ja) 2024-04-10

Family

ID=77891311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022509496A Active JP7465338B2 (ja) 2020-03-26 2021-03-05 静電チャック装置

Country Status (6)

Country Link
US (1) US12217994B2 (https=)
JP (1) JP7465338B2 (https=)
KR (1) KR102744239B1 (https=)
CN (1) CN115244678B (https=)
TW (1) TWI865743B (https=)
WO (1) WO2021192935A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240400825A1 (en) * 2021-10-19 2024-12-05 Toray Industries, Inc. Resin composition, cured product thereof, laminate using same, electrostatic chuck, and plasma processing equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004127956A (ja) 2002-09-30 2004-04-22 Toto Ltd 静電チャック
JP2006344766A (ja) 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP3128562U (ja) 2006-05-03 2007-01-18 アプライド　マテリアルズ　インコーポレイテッド 高アスペクト比の特徴部をエッチングするのに適したインサートなしの上部チャンバーライナー
JP2016143744A (ja) 2015-01-30 2016-08-08 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP2019220503A (ja) 2018-06-15 2019-12-26 新光電気工業株式会社 静電チャック及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233434A (ja) * 1997-02-21 1998-09-02 Hitachi Ltd 静電吸着体と静電吸着装置
US20060175772A1 (en) 2003-03-19 2006-08-10 Tokyo Electron Limited Substrate holding mechanism using electrostaic chuck and method of manufacturing the same
JP5004436B2 (ja) 2005-05-23 2012-08-22 東京エレクトロン株式会社 静電吸着電極および処理装置
JP5554525B2 (ja) * 2009-08-25 2014-07-23 日本特殊陶業株式会社 静電チャック
US9330953B2 (en) * 2011-03-23 2016-05-03 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
JP5717248B2 (ja) * 2011-03-30 2015-05-13 黒崎播磨株式会社 静電チャックの給電部及びその製造方法
JP5957812B2 (ja) * 2011-06-21 2016-07-27 住友大阪セメント株式会社 静電チャック装置
JP6658509B2 (ja) * 2015-02-18 2020-03-04 住友大阪セメント株式会社 静電チャック装置及び半導体製造装置
JP6866255B2 (ja) 2017-08-09 2021-04-28 東京エレクトロン株式会社 プラズマ処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004127956A (ja) 2002-09-30 2004-04-22 Toto Ltd 静電チャック
JP2006344766A (ja) 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP3128562U (ja) 2006-05-03 2007-01-18 アプライド　マテリアルズ　インコーポレイテッド 高アスペクト比の特徴部をエッチングするのに適したインサートなしの上部チャンバーライナー
JP2016143744A (ja) 2015-01-30 2016-08-08 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP2019220503A (ja) 2018-06-15 2019-12-26 新光電気工業株式会社 静電チャック及びその製造方法

Also Published As

Publication number Publication date
WO2021192935A1 (ja) 2021-09-30
JPWO2021192935A1 (https=) 2021-09-30
KR102744239B1 (ko) 2024-12-19
CN115244678A (zh) 2022-10-25
US12217994B2 (en) 2025-02-04
US20230115256A1 (en) 2023-04-13
TWI865743B (zh) 2024-12-11
CN115244678B (zh) 2025-11-18
TW202145432A (zh) 2021-12-01
KR20220126766A (ko) 2022-09-16

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