CN115244678B - 静电吸盘装置、静电吸盘装置用套筒 - Google Patents
静电吸盘装置、静电吸盘装置用套筒Info
- Publication number
- CN115244678B CN115244678B CN202180019517.3A CN202180019517A CN115244678B CN 115244678 B CN115244678 B CN 115244678B CN 202180019517 A CN202180019517 A CN 202180019517A CN 115244678 B CN115244678 B CN 115244678B
- Authority
- CN
- China
- Prior art keywords
- electrostatic chuck
- sleeve
- layer
- ceramic
- chuck device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Gripping On Spindles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020055844 | 2020-03-26 | ||
| JP2020-055844 | 2020-03-26 | ||
| PCT/JP2021/008815 WO2021192935A1 (ja) | 2020-03-26 | 2021-03-05 | 静電チャック装置、静電チャック装置用スリーブ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115244678A CN115244678A (zh) | 2022-10-25 |
| CN115244678B true CN115244678B (zh) | 2025-11-18 |
Family
ID=77891311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180019517.3A Active CN115244678B (zh) | 2020-03-26 | 2021-03-05 | 静电吸盘装置、静电吸盘装置用套筒 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12217994B2 (https=) |
| JP (1) | JP7465338B2 (https=) |
| KR (1) | KR102744239B1 (https=) |
| CN (1) | CN115244678B (https=) |
| TW (1) | TWI865743B (https=) |
| WO (1) | WO2021192935A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240400825A1 (en) * | 2021-10-19 | 2024-12-05 | Toray Industries, Inc. | Resin composition, cured product thereof, laminate using same, electrostatic chuck, and plasma processing equipment |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10233434A (ja) * | 1997-02-21 | 1998-09-02 | Hitachi Ltd | 静電吸着体と静電吸着装置 |
| JP2004127956A (ja) * | 2002-09-30 | 2004-04-22 | Toto Ltd | 静電チャック |
| US20060175772A1 (en) | 2003-03-19 | 2006-08-10 | Tokyo Electron Limited | Substrate holding mechanism using electrostaic chuck and method of manufacturing the same |
| JP5004436B2 (ja) | 2005-05-23 | 2012-08-22 | 東京エレクトロン株式会社 | 静電吸着電極および処理装置 |
| JP4557814B2 (ja) * | 2005-06-09 | 2010-10-06 | パナソニック株式会社 | プラズマ処理装置 |
| US8440049B2 (en) | 2006-05-03 | 2013-05-14 | Applied Materials, Inc. | Apparatus for etching high aspect ratio features |
| JP5554525B2 (ja) * | 2009-08-25 | 2014-07-23 | 日本特殊陶業株式会社 | 静電チャック |
| US9330953B2 (en) * | 2011-03-23 | 2016-05-03 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck device |
| JP5717248B2 (ja) * | 2011-03-30 | 2015-05-13 | 黒崎播磨株式会社 | 静電チャックの給電部及びその製造方法 |
| JP5957812B2 (ja) * | 2011-06-21 | 2016-07-27 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP6263484B2 (ja) * | 2015-01-30 | 2018-01-17 | 日本特殊陶業株式会社 | 静電チャックおよびその製造方法 |
| JP6658509B2 (ja) * | 2015-02-18 | 2020-03-04 | 住友大阪セメント株式会社 | 静電チャック装置及び半導体製造装置 |
| JP6866255B2 (ja) | 2017-08-09 | 2021-04-28 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7090481B2 (ja) * | 2018-06-15 | 2022-06-24 | 新光電気工業株式会社 | 静電チャック及びその製造方法 |
-
2021
- 2021-03-05 US US17/911,440 patent/US12217994B2/en active Active
- 2021-03-05 CN CN202180019517.3A patent/CN115244678B/zh active Active
- 2021-03-05 JP JP2022509496A patent/JP7465338B2/ja active Active
- 2021-03-05 WO PCT/JP2021/008815 patent/WO2021192935A1/ja not_active Ceased
- 2021-03-05 KR KR1020227028170A patent/KR102744239B1/ko active Active
- 2021-03-11 TW TW110108734A patent/TWI865743B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021192935A1 (ja) | 2021-09-30 |
| JPWO2021192935A1 (https=) | 2021-09-30 |
| KR102744239B1 (ko) | 2024-12-19 |
| CN115244678A (zh) | 2022-10-25 |
| US12217994B2 (en) | 2025-02-04 |
| US20230115256A1 (en) | 2023-04-13 |
| TWI865743B (zh) | 2024-12-11 |
| JP7465338B2 (ja) | 2024-04-10 |
| TW202145432A (zh) | 2021-12-01 |
| KR20220126766A (ko) | 2022-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20250069936A1 (en) | Electrostatic chuck device | |
| CN115244678B (zh) | 静电吸盘装置、静电吸盘装置用套筒 | |
| JP7402022B2 (ja) | 静電チャック装置用基台、静電チャック装置およびそれらの製造方法 | |
| JP7324677B2 (ja) | 静電チャック装置およびその製造方法 | |
| JP7335371B2 (ja) | 静電チャック装置 | |
| JP7287814B2 (ja) | 樹脂膜 | |
| JP2020178077A (ja) | 静電チャック装置およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Country or region after: Japan Address after: Tokyo, Japan Applicant after: Bachuan Group Co.,Ltd. Address before: Tokyo, Japan Applicant before: TOMOEGAWA Co.,Ltd. Country or region before: Japan |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |