TWI865743B - 靜電夾頭裝置、靜電夾頭裝置用套筒 - Google Patents

靜電夾頭裝置、靜電夾頭裝置用套筒 Download PDF

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Publication number
TWI865743B
TWI865743B TW110108734A TW110108734A TWI865743B TW I865743 B TWI865743 B TW I865743B TW 110108734 A TW110108734 A TW 110108734A TW 110108734 A TW110108734 A TW 110108734A TW I865743 B TWI865743 B TW I865743B
Authority
TW
Taiwan
Prior art keywords
layer
sleeve
electrostatic chuck
chuck device
laminate
Prior art date
Application number
TW110108734A
Other languages
English (en)
Chinese (zh)
Other versions
TW202145432A (zh
Inventor
山崎允義
Original Assignee
日商巴川集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商巴川集團股份有限公司 filed Critical 日商巴川集團股份有限公司
Publication of TW202145432A publication Critical patent/TW202145432A/zh
Application granted granted Critical
Publication of TWI865743B publication Critical patent/TWI865743B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gripping On Spindles (AREA)
TW110108734A 2020-03-26 2021-03-11 靜電夾頭裝置、靜電夾頭裝置用套筒 TWI865743B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020055844 2020-03-26
JP2020-055844 2020-03-26

Publications (2)

Publication Number Publication Date
TW202145432A TW202145432A (zh) 2021-12-01
TWI865743B true TWI865743B (zh) 2024-12-11

Family

ID=77891311

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110108734A TWI865743B (zh) 2020-03-26 2021-03-11 靜電夾頭裝置、靜電夾頭裝置用套筒

Country Status (6)

Country Link
US (1) US12217994B2 (https=)
JP (1) JP7465338B2 (https=)
KR (1) KR102744239B1 (https=)
CN (1) CN115244678B (https=)
TW (1) TWI865743B (https=)
WO (1) WO2021192935A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240400825A1 (en) * 2021-10-19 2024-12-05 Toray Industries, Inc. Resin composition, cured product thereof, laminate using same, electrostatic chuck, and plasma processing equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233434A (ja) * 1997-02-21 1998-09-02 Hitachi Ltd 静電吸着体と静電吸着装置
JP2004127956A (ja) * 2002-09-30 2004-04-22 Toto Ltd 静電チャック
TW200703545A (en) * 2005-05-23 2007-01-16 Tokyo Electron Ltd Electrostatic attraction electrode and treatment device
TW201921485A (zh) * 2017-08-09 2019-06-01 日商東京威力科創股份有限公司 電漿處理裝置
TW202002154A (zh) * 2018-06-15 2020-01-01 日商新光電氣工業股份有限公司 靜電夾盤及其製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060175772A1 (en) 2003-03-19 2006-08-10 Tokyo Electron Limited Substrate holding mechanism using electrostaic chuck and method of manufacturing the same
JP4557814B2 (ja) * 2005-06-09 2010-10-06 パナソニック株式会社 プラズマ処理装置
US8440049B2 (en) 2006-05-03 2013-05-14 Applied Materials, Inc. Apparatus for etching high aspect ratio features
JP5554525B2 (ja) * 2009-08-25 2014-07-23 日本特殊陶業株式会社 静電チャック
US9330953B2 (en) * 2011-03-23 2016-05-03 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
JP5717248B2 (ja) * 2011-03-30 2015-05-13 黒崎播磨株式会社 静電チャックの給電部及びその製造方法
JP5957812B2 (ja) * 2011-06-21 2016-07-27 住友大阪セメント株式会社 静電チャック装置
JP6263484B2 (ja) * 2015-01-30 2018-01-17 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP6658509B2 (ja) * 2015-02-18 2020-03-04 住友大阪セメント株式会社 静電チャック装置及び半導体製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233434A (ja) * 1997-02-21 1998-09-02 Hitachi Ltd 静電吸着体と静電吸着装置
JP2004127956A (ja) * 2002-09-30 2004-04-22 Toto Ltd 静電チャック
TW200703545A (en) * 2005-05-23 2007-01-16 Tokyo Electron Ltd Electrostatic attraction electrode and treatment device
TW201921485A (zh) * 2017-08-09 2019-06-01 日商東京威力科創股份有限公司 電漿處理裝置
TW202002154A (zh) * 2018-06-15 2020-01-01 日商新光電氣工業股份有限公司 靜電夾盤及其製造方法

Also Published As

Publication number Publication date
WO2021192935A1 (ja) 2021-09-30
JPWO2021192935A1 (https=) 2021-09-30
KR102744239B1 (ko) 2024-12-19
CN115244678A (zh) 2022-10-25
US12217994B2 (en) 2025-02-04
US20230115256A1 (en) 2023-04-13
JP7465338B2 (ja) 2024-04-10
CN115244678B (zh) 2025-11-18
TW202145432A (zh) 2021-12-01
KR20220126766A (ko) 2022-09-16

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