KR102693246B1 - 에지 링 마모 보상 (wear compensation) 을 위한 시스템 및 방법 - Google Patents

에지 링 마모 보상 (wear compensation) 을 위한 시스템 및 방법 Download PDF

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KR102693246B1
KR102693246B1 KR1020207019238A KR20207019238A KR102693246B1 KR 102693246 B1 KR102693246 B1 KR 102693246B1 KR 1020207019238 A KR1020207019238 A KR 1020207019238A KR 20207019238 A KR20207019238 A KR 20207019238A KR 102693246 B1 KR102693246 B1 KR 102693246B1
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edge ring
corrosion
rates
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periods
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KR20200086375A (ko
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톰 에이. 캄프
카를로스 릴-버두고
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H01L21/68721—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems
    • H01L21/02—
    • H01L21/67253—
    • H01L21/67276—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Valve-Gear Or Valve Arrangements (AREA)
KR1020207019238A 2017-12-05 2018-11-30 에지 링 마모 보상 (wear compensation) 을 위한 시스템 및 방법 Active KR102693246B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020247026254A KR102916791B1 (ko) 2017-12-05 2018-11-30 에지 링 마모 보상 (wear compensation) 을 위한 시스템 및 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762594861P 2017-12-05 2017-12-05
US62/594,861 2017-12-05
PCT/US2018/063385 WO2019112903A1 (en) 2017-12-05 2018-11-30 System and method for edge ring wear compensation

Related Child Applications (1)

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KR1020247026254A Division KR102916791B1 (ko) 2017-12-05 2018-11-30 에지 링 마모 보상 (wear compensation) 을 위한 시스템 및 방법

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KR20200086375A KR20200086375A (ko) 2020-07-16
KR102693246B1 true KR102693246B1 (ko) 2024-08-07

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KR1020247026254A Active KR102916791B1 (ko) 2017-12-05 2018-11-30 에지 링 마모 보상 (wear compensation) 을 위한 시스템 및 방법

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Country Status (6)

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US (3) US11538713B2 (https=)
JP (2) JP7323525B2 (https=)
KR (2) KR102693246B1 (https=)
CN (2) CN120221492A (https=)
TW (2) TWI810227B (https=)
WO (1) WO2019112903A1 (https=)

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CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
US12215966B2 (en) * 2019-12-06 2025-02-04 Applied Materials, Inc. Methods and systems of optical inspection of electronic device manufacturing machines
KR102822822B1 (ko) * 2020-02-25 2025-06-19 에스케이하이닉스 주식회사 에지링 모니터링 장치, 에지링 관리 시스템 및 방법
US11804368B2 (en) * 2020-03-02 2023-10-31 Tokyo Electron Limited Cleaning method and plasma processing apparatus
CN115315775A (zh) * 2020-03-23 2022-11-08 朗姆研究公司 衬底处理系统中的中环腐蚀补偿
TWI861079B (zh) * 2020-03-25 2024-11-11 美商蘭姆研究公司 基板處理系統及其方法
JP2023530125A (ja) * 2020-06-15 2023-07-13 ラム リサーチ コーポレーション Ｒｆ信号のパラメータのパルス化周波数およびデューティサイクルの制御
CN116349002A (zh) 2020-10-05 2023-06-27 朗姆研究公司 用于等离子体处理系统的可移动边缘环
KR102585286B1 (ko) * 2020-10-15 2023-10-05 세메스 주식회사 기판 처리 장치 및 소모성 부품의 마모도 측정 방법
KR102762970B1 (ko) 2020-12-23 2025-02-07 삼성전자주식회사 기판 처리 장치 모니터링 방법 및 시스템
KR20240161340A (ko) * 2023-05-04 2024-11-12 삼성전자주식회사 포커스 링 및 이를 포함하는 기판 처리 장치
TWI858758B (zh) * 2023-06-06 2024-10-11 郭光哲 微加熱及感測裝置之製造方法及其結構

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KR20240122603A (ko) 2024-08-12
TWI863390B (zh) 2024-11-21
KR20200086375A (ko) 2020-07-16
JP7672454B2 (ja) 2025-05-07
US12237203B2 (en) 2025-02-25
US20250191962A1 (en) 2025-06-12
CN120221492A (zh) 2025-06-27
CN111466019A (zh) 2020-07-28
CN111466019B (zh) 2025-03-11
US11538713B2 (en) 2022-12-27
KR102916791B1 (ko) 2026-01-22
JP7323525B2 (ja) 2023-08-08
US20200373193A1 (en) 2020-11-26
TWI810227B (zh) 2023-08-01
JP2023145608A (ja) 2023-10-11
US20230083737A1 (en) 2023-03-16
TW201935593A (zh) 2019-09-01
JP2021506117A (ja) 2021-02-18
TW202405987A (zh) 2024-02-01
WO2019112903A1 (en) 2019-06-13

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