KR102674028B1 - 반도체 패키지 - Google Patents

반도체 패키지 Download PDF

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Publication number
KR102674028B1
KR102674028B1 KR1020180142583A KR20180142583A KR102674028B1 KR 102674028 B1 KR102674028 B1 KR 102674028B1 KR 1020180142583 A KR1020180142583 A KR 1020180142583A KR 20180142583 A KR20180142583 A KR 20180142583A KR 102674028 B1 KR102674028 B1 KR 102674028B1
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South Korea
Prior art keywords
insulating layer
wiring
layer
disposed
semiconductor package
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KR1020180142583A
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English (en)
Korean (ko)
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KR20200058055A (ko
Inventor
김준성
이두환
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삼성전자주식회사
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Priority to KR1020180142583A priority Critical patent/KR102674028B1/ko
Priority to US16/679,484 priority patent/US11158581B2/en
Priority to CN201911133387.7A priority patent/CN111199937B/zh
Publication of KR20200058055A publication Critical patent/KR20200058055A/ko
Application granted granted Critical
Publication of KR102674028B1 publication Critical patent/KR102674028B1/ko

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    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
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KR20220000273A (ko) * 2020-06-25 2022-01-03 삼성전자주식회사 반도체 패키지
US11545439B2 (en) * 2020-09-10 2023-01-03 Qualcomm Incorporated Package comprising an integrated device coupled to a substrate through a cavity
US11721603B2 (en) * 2020-10-15 2023-08-08 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated fan out method utilizing a filler-free insulating material
KR20220158123A (ko) * 2021-05-20 2022-11-30 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조방법
JP2023045675A (ja) * 2021-09-22 2023-04-03 キオクシア株式会社 半導体装置及び半導体装置の製造方法

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US8941222B2 (en) 2010-11-11 2015-01-27 Advanced Semiconductor Engineering Inc. Wafer level semiconductor package and manufacturing methods thereof
US9991190B2 (en) 2012-05-18 2018-06-05 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging with interposer frame
US9633974B2 (en) * 2015-03-04 2017-04-25 Apple Inc. System in package fan out stacking architecture and process flow
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US10026681B2 (en) * 2016-09-21 2018-07-17 Samsung Electro-Mechanics Co., Ltd. Fan-out semiconductor package
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US10867938B2 (en) * 2017-09-25 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure
KR101901714B1 (ko) * 2017-10-27 2018-09-27 삼성전기 주식회사 팬-아웃 반도체 패키지
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