KR102659459B1 - 규소 함유 경화성 조성물 및 그 경화물 - Google Patents

규소 함유 경화성 조성물 및 그 경화물 Download PDF

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Publication number
KR102659459B1
KR102659459B1 KR1020187016260A KR20187016260A KR102659459B1 KR 102659459 B1 KR102659459 B1 KR 102659459B1 KR 1020187016260 A KR1020187016260 A KR 1020187016260A KR 20187016260 A KR20187016260 A KR 20187016260A KR 102659459 B1 KR102659459 B1 KR 102659459B1
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South Korea
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group
silicon
carbon atoms
general formula
represented
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KR1020187016260A
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Korean (ko)
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KR20180135863A (ko
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코이치 사이토
켄사쿠 타카다
이치로 히라츠카
후미토 카시와자키
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가부시키가이샤 아데카
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/548Silicon-containing compounds containing sulfur
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
KR1020187016260A 2016-04-22 2017-02-07 규소 함유 경화성 조성물 및 그 경화물 KR102659459B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016086594 2016-04-22
JPJP-P-2016-086594 2016-04-22
PCT/JP2017/004412 WO2017183259A1 (ja) 2016-04-22 2017-02-07 ケイ素含有硬化性組成物及びその硬化物

Publications (2)

Publication Number Publication Date
KR20180135863A KR20180135863A (ko) 2018-12-21
KR102659459B1 true KR102659459B1 (ko) 2024-04-23

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KR1020187016260A KR102659459B1 (ko) 2016-04-22 2017-02-07 규소 함유 경화성 조성물 및 그 경화물

Country Status (5)

Country Link
JP (1) JPWO2017183259A1 (zh)
KR (1) KR102659459B1 (zh)
CN (1) CN108463509B (zh)
TW (1) TWI745348B (zh)
WO (1) WO2017183259A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7391401B2 (ja) * 2019-02-22 2023-12-05 浙江三時紀新材科技有限公司 ポリシロキサン粉末フィラーの調製方法、これによって得られたポリシロキサン粉末フィラーおよびその応用

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JP2013203798A (ja) * 2012-03-27 2013-10-07 Kaneka Corp タック性を改善した熱硬化性樹脂組成物タブレット及びそれを用いた半導体のパッケージ
JP2014118464A (ja) * 2012-12-14 2014-06-30 Kaneka Corp 流動性を改善した熱硬化性樹脂組成物及びそれを用いた半導体のパッケージ
WO2014192969A1 (ja) * 2013-05-29 2014-12-04 東レ・ダウコーニング株式会社 半導体装置および半導体素子封止用硬化性シリコーン組成物

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JPH0359174A (ja) * 1989-07-21 1991-03-14 Toray Dow Corning Silicone Co Ltd 繊維構造物処理用シリコーンゴム組成物
US5645941A (en) 1992-11-19 1997-07-08 Shin-Etsu Chemical Co., Ltd. Silicone resin/silicone rubber composite material
JP3403252B2 (ja) 1994-08-31 2003-05-06 東レ・ダウコーニング・シリコーン株式会社 加熱硬化型シリコーンゴム組成物
JPH09328613A (ja) * 1996-04-10 1997-12-22 Yokohama Rubber Co Ltd:The 貯蔵安定性に優れたポリシロキサン組成物
DE19735813A1 (de) * 1997-08-18 1999-02-25 Wacker Chemie Gmbh Kompressiblen Schwefel enthaltender Siliconkautschuk
DE10065468A1 (de) * 2000-12-28 2001-11-08 Wacker Chemie Gmbh Flüssigsiliconkautschuk mit verbessertem Druckverformungsrest und erhöhter Ölbeständigkeit
JP4314454B2 (ja) 2002-09-20 2009-08-19 信越化学工業株式会社 自己接着性加熱硬化型液状シリコーンゴム組成物
JP2005068295A (ja) 2003-08-25 2005-03-17 Shin Etsu Polymer Co Ltd 熱硬化型定型シリコーン接着剤
JP5137295B2 (ja) 2005-02-24 2013-02-06 株式会社Adeka ケイ素含有硬化性組成物及びその硬化物
JP4325645B2 (ja) 2006-06-14 2009-09-02 日亜化学工業株式会社 トランスファーモールド用タブレット、その製造方法、発光装置及びその製造方法
JP2009120732A (ja) 2007-11-15 2009-06-04 Sekisui Chem Co Ltd 光半導体用樹脂組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及びそれらを用いた光半導体素子
JP5294414B2 (ja) * 2009-08-21 2013-09-18 信越化学工業株式会社 オルガノポリシルメチレン組成物及びその硬化物
KR101762348B1 (ko) * 2010-06-11 2017-07-27 가부시키가이샤 아데카 규소 함유 경화성 조성물, 그 규소 함유 경화성 조성물의 경화물 및 그 규소 함유 경화성 조성물로 형성되는 리드 프레임 기판
CN103748171B (zh) * 2011-08-10 2016-03-16 株式会社艾迪科 含硅固化性组合物及其固化物
JP2013159776A (ja) * 2012-02-09 2013-08-19 Adeka Corp ケイ素含有硬化性白色樹脂組成物及びその硬化物並びに該硬化物を用いた光半導体パッケージ及び反射材料
CN102690521B (zh) * 2012-06-19 2014-02-19 闾夏轶 一种纳米磁性硅橡胶及其制备方法和应用

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051325A (ja) * 2001-05-23 2003-02-21 Wacker Chemie Gmbh 架橋してエラストマーになる組成物の、燃料電池及び燃料電池スタック中のシール材料としての使用及びこれにより得られるシール
JP2013203798A (ja) * 2012-03-27 2013-10-07 Kaneka Corp タック性を改善した熱硬化性樹脂組成物タブレット及びそれを用いた半導体のパッケージ
JP2014118464A (ja) * 2012-12-14 2014-06-30 Kaneka Corp 流動性を改善した熱硬化性樹脂組成物及びそれを用いた半導体のパッケージ
WO2014192969A1 (ja) * 2013-05-29 2014-12-04 東レ・ダウコーニング株式会社 半導体装置および半導体素子封止用硬化性シリコーン組成物

Also Published As

Publication number Publication date
TW201807072A (zh) 2018-03-01
CN108463509B (zh) 2021-06-18
TWI745348B (zh) 2021-11-11
KR20180135863A (ko) 2018-12-21
JPWO2017183259A1 (ja) 2019-02-21
WO2017183259A1 (ja) 2017-10-26
CN108463509A (zh) 2018-08-28

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