KR102652177B1 - 기판 처리 장치 - Google Patents
기판 처리 장치 Download PDFInfo
- Publication number
- KR102652177B1 KR102652177B1 KR1020190014451A KR20190014451A KR102652177B1 KR 102652177 B1 KR102652177 B1 KR 102652177B1 KR 1020190014451 A KR1020190014451 A KR 1020190014451A KR 20190014451 A KR20190014451 A KR 20190014451A KR 102652177 B1 KR102652177 B1 KR 102652177B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- space
- transfer
- gas
- atmosphere
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 173
- 238000012545 processing Methods 0.000 title claims abstract description 167
- 238000012546 transfer Methods 0.000 claims abstract description 150
- 238000007599 discharging Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000008569 process Effects 0.000 claims abstract description 5
- 230000007723 transport mechanism Effects 0.000 claims abstract description 3
- 239000007789 gas Substances 0.000 claims description 118
- 230000032258 transport Effects 0.000 claims description 42
- 230000007246 mechanism Effects 0.000 claims description 35
- 239000001301 oxygen Substances 0.000 claims description 33
- 229910052760 oxygen Inorganic materials 0.000 claims description 33
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 32
- 238000012423 maintenance Methods 0.000 claims description 31
- 238000004891 communication Methods 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 51
- 229910001873 dinitrogen Inorganic materials 0.000 description 51
- 239000004065 semiconductor Substances 0.000 description 9
- 239000012530 fluid Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000010926 purge Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000001737 promoting effect Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018022427 | 2018-02-09 | ||
| JPJP-P-2018-022427 | 2018-02-09 | ||
| JP2018225780A JP7358044B2 (ja) | 2018-02-09 | 2018-11-30 | 基板処理装置 |
| JPJP-P-2018-225780 | 2018-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190096819A KR20190096819A (ko) | 2019-08-20 |
| KR102652177B1 true KR102652177B1 (ko) | 2024-03-27 |
Family
ID=67694446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190014451A KR102652177B1 (ko) | 2018-02-09 | 2019-02-07 | 기판 처리 장치 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7358044B2 (ja) |
| KR (1) | KR102652177B1 (ja) |
| TW (1) | TWI774921B (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7365200B2 (ja) * | 2019-11-08 | 2023-10-19 | 東京エレクトロン株式会社 | 監視システム |
| JP2021125641A (ja) * | 2020-02-07 | 2021-08-30 | 川崎重工業株式会社 | ロボット及びそれを備えた基板搬送システム |
| JP7469997B2 (ja) | 2020-09-08 | 2024-04-17 | 株式会社日立ハイテク | 半導体処理装置 |
| JP7430677B2 (ja) * | 2021-09-21 | 2024-02-13 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009194358A (ja) * | 2008-01-18 | 2009-08-27 | Seiko Epson Corp | 半導体デバイスの製造装置および製造方法 |
| WO2012133441A1 (ja) * | 2011-03-28 | 2012-10-04 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び基板処理方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3225344B2 (ja) * | 1996-01-26 | 2001-11-05 | 東京エレクトロン株式会社 | 処理装置 |
| JP2001102374A (ja) | 1999-09-28 | 2001-04-13 | Tokyo Electron Ltd | 膜形成システム |
| JP2001326162A (ja) | 2000-05-17 | 2001-11-22 | Canon Inc | 半導体製造装置および半導体デバイス製造方法 |
| JP2003100620A (ja) | 2001-09-27 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP4342147B2 (ja) | 2002-05-01 | 2009-10-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| KR100486690B1 (ko) * | 2002-11-29 | 2005-05-03 | 삼성전자주식회사 | 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법 |
| JP4798981B2 (ja) | 2004-10-28 | 2011-10-19 | 東京エレクトロン株式会社 | 基板処理装置の制御方法，基板処理装置，基板処理装置の制御を行うプログラム |
| JP5154102B2 (ja) * | 2007-03-07 | 2013-02-27 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| US8186927B2 (en) * | 2008-05-27 | 2012-05-29 | Tdk Corporation | Contained object transfer system |
| JP2014038888A (ja) | 2012-08-10 | 2014-02-27 | Hitachi High-Tech Control Systems Corp | ミニエンバイロメント装置及びその内部雰囲気置換方法 |
| JP6599599B2 (ja) | 2014-01-31 | 2019-10-30 | シンフォニアテクノロジー株式会社 | Ｅｆｅｍシステム |
| JP6189780B2 (ja) * | 2014-04-01 | 2017-08-30 | 東京エレクトロン株式会社 | 基板処理システム |
| JP6280837B2 (ja) | 2014-08-12 | 2018-02-14 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理装置の基板載置部の雰囲気制御方法 |
| WO2016117588A1 (ja) * | 2015-01-21 | 2016-07-28 | 株式会社日立国際電気 | 基板処理装置 |
| JP6392143B2 (ja) | 2015-02-24 | 2018-09-19 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および基板処理方法を実行させるプログラムが記録された記憶媒体 |
-
2018
- 2018-11-30 JP JP2018225780A patent/JP7358044B2/ja active Active
-
2019
- 2019-02-01 TW TW108104011A patent/TWI774921B/zh active
- 2019-02-07 KR KR1020190014451A patent/KR102652177B1/ko active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009194358A (ja) * | 2008-01-18 | 2009-08-27 | Seiko Epson Corp | 半導体デバイスの製造装置および製造方法 |
| WO2012133441A1 (ja) * | 2011-03-28 | 2012-10-04 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び基板処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019140379A (ja) | 2019-08-22 |
| TWI774921B (zh) | 2022-08-21 |
| JP7358044B2 (ja) | 2023-10-10 |
| TW201935563A (zh) | 2019-09-01 |
| KR20190096819A (ko) | 2019-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102652177B1 (ko) | 기판 처리 장치 | |
| JP3425592B2 (ja) | 処理装置 | |
| US11404295B2 (en) | Substrate processing apparatus | |
| KR102459133B1 (ko) | 반송실 | |
| TWI708309B (zh) | 門開閉系統及具備門開閉系統之載入埠 | |
| KR102483665B1 (ko) | 반송실과, 반송실의 케미컬 필터의 습도 관리 방법 | |
| JP2022050623A (ja) | 半導体システムにおける湿度制御 | |
| JP6599599B2 (ja) | Ｅｆｅｍシステム | |
| JP7480249B2 (ja) | 基板処理装置 | |
| KR20200006045A (ko) | 박판형상 기판 유지 핑거 및 이 핑거를 구비하는 반송 로봇 | |
| TWI787327B (zh) | 設備前端模組 | |
| US20130097802A1 (en) | Treatment Device For Transport And Storage Boxes | |
| CN110277339B (zh) | Efem以及efem的气体置换方法 | |
| KR100887320B1 (ko) | 기판처리장치 및 기판처리방법 | |
| WO2022239538A1 (ja) | 基板処理装置、半導体装置の製造方法およびプログラム | |
| KR20230123435A (ko) | 기판 처리 장치 및 기판 처리 방법 | |
| JP2969976B2 (ja) | ウエハ保管棚 | |
| JP3341978B2 (ja) | 洗浄システム | |
| JP3728201B2 (ja) | 基板処理装置 | |
| CN115881598A (zh) | 基板处理装置、半导体装置的制造方法、基板处理方法和存储介质 | |
| JPH0341471Y2 (ja) | ||
| JPH0541446A (ja) | ウエハ保管庫 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |