KR102604588B1 - 프리웨트 처리 방법 - Google Patents

프리웨트 처리 방법 Download PDF

Info

Publication number
KR102604588B1
KR102604588B1 KR1020227042093A KR20227042093A KR102604588B1 KR 102604588 B1 KR102604588 B1 KR 102604588B1 KR 1020227042093 A KR1020227042093 A KR 1020227042093A KR 20227042093 A KR20227042093 A KR 20227042093A KR 102604588 B1 KR102604588 B1 KR 102604588B1
Authority
KR
South Korea
Prior art keywords
prewet
substrate
module
plating
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227042093A
Other languages
English (en)
Korean (ko)
Other versions
KR20230054318A (ko
Inventor
가즈히토 즈지
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20230054318A publication Critical patent/KR20230054318A/ko
Application granted granted Critical
Publication of KR102604588B1 publication Critical patent/KR102604588B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/20—Pretreatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
KR1020227042093A 2021-10-14 2021-10-14 프리웨트 처리 방법 Active KR102604588B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/038049 WO2023062778A1 (ja) 2021-10-14 2021-10-14 プリウェット処理方法

Publications (2)

Publication Number Publication Date
KR20230054318A KR20230054318A (ko) 2023-04-24
KR102604588B1 true KR102604588B1 (ko) 2023-11-22

Family

ID=82446222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227042093A Active KR102604588B1 (ko) 2021-10-14 2021-10-14 프리웨트 처리 방법

Country Status (5)

Country Link
US (1) US12480221B2 (https=)
JP (1) JP7101925B1 (https=)
KR (1) KR102604588B1 (https=)
CN (1) CN115715337B (https=)
WO (1) WO2023062778A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4664320B2 (ja) * 2000-03-17 2011-04-06 株式会社荏原製作所 めっき方法
JP2001316869A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 電解メッキ方法
JP5232844B2 (ja) * 2003-08-21 2013-07-10 株式会社荏原製作所 めっき装置
JP4624738B2 (ja) * 2003-08-21 2011-02-02 株式会社荏原製作所 めっき装置
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
US8962085B2 (en) * 2009-06-17 2015-02-24 Novellus Systems, Inc. Wetting pretreatment for enhanced damascene metal filling
JP7067863B2 (ja) * 2016-12-28 2022-05-16 株式会社荏原製作所 基板を処理するための方法および装置
JP6857531B2 (ja) * 2017-03-31 2021-04-14 株式会社荏原製作所 めっき方法及びめっき装置
JP2019085613A (ja) * 2017-11-07 2019-06-06 株式会社荏原製作所 前処理装置、これを備えためっき装置、及び前処理方法
US20200035484A1 (en) * 2018-07-30 2020-01-30 Lam Research Corporation System and method for chemical and heated wetting of substrates prior to metal plating
JP7291030B2 (ja) * 2018-09-06 2023-06-14 株式会社荏原製作所 基板処理装置
JP2020204062A (ja) * 2019-06-14 2020-12-24 株式会社荏原製作所 めっき方法、プログラムを記憶する不揮発性の記憶媒体
CN114981486B (zh) * 2020-12-22 2023-03-24 株式会社荏原制作所 镀覆装置、预湿处理方法以及清洗处理方法

Also Published As

Publication number Publication date
US20240247393A1 (en) 2024-07-25
CN115715337B (zh) 2023-09-08
WO2023062778A1 (ja) 2023-04-20
JP7101925B1 (ja) 2022-07-15
US12480221B2 (en) 2025-11-25
JPWO2023062778A1 (https=) 2023-04-20
KR20230054318A (ko) 2023-04-24
CN115715337A (zh) 2023-02-24

Similar Documents

Publication Publication Date Title
US12251735B2 (en) Substrate cleaning device and substrate cleaning method
US20220093420A1 (en) Substrate cleaning device, substrate processing apparatus and substrate cleaning method
US20240321598A1 (en) Substrate cleaning device
CN107564837B (zh) 用于处理基板的装置和方法
KR102604588B1 (ko) 프리웨트 처리 방법
JP7805873B2 (ja) めっき装置およびめっき方法
US20220112620A1 (en) Plating method
US20230001456A1 (en) Substrate cleaning device and substrate cleaning method
JP2024013455A (ja) 基板処理装置
KR102724523B1 (ko) 기판 처리 방법 및 기판 처리 장치
JP7572593B1 (ja) めっき装置および基板処理方法
TWI800954B (zh) 預濕處理方法
US12017257B2 (en) Substrate cleaning device and substrate cleaning method
KR101330319B1 (ko) 분사유닛 및 이를 가지는 기판처리장치
JP7650411B1 (ja) 搬送装置およびめっき装置
CN116897226B (zh) 镀覆装置以及镀覆方法
JP3833883B2 (ja) 基板処理装置
US20240207900A1 (en) Substrate processing device and substrate processing method
TWI809937B (zh) 漏液判定方法及鍍覆裝置
KR20250003952A (ko) 기판 처리 장치
WO2023148869A1 (ja) めっき装置及び乾燥方法
US20230167572A1 (en) Wetting method for substrate and plating apparatus
KR101994420B1 (ko) 기판 처리 장치 및 방법
KR20240043687A (ko) 기판 처리 장치 및 기판 처리 방법
WO2023248416A1 (ja) プリウェットモジュール、およびプリウェット方法

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601