CN115715337B - 预湿处理方法 - Google Patents

预湿处理方法 Download PDF

Info

Publication number
CN115715337B
CN115715337B CN202180042509.0A CN202180042509A CN115715337B CN 115715337 B CN115715337 B CN 115715337B CN 202180042509 A CN202180042509 A CN 202180042509A CN 115715337 B CN115715337 B CN 115715337B
Authority
CN
China
Prior art keywords
substrate
module
plating
nozzle head
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180042509.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN115715337A (zh
Inventor
辻一仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN115715337A publication Critical patent/CN115715337A/zh
Application granted granted Critical
Publication of CN115715337B publication Critical patent/CN115715337B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/20—Pretreatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
CN202180042509.0A 2021-10-14 2021-10-14 预湿处理方法 Active CN115715337B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/038049 WO2023062778A1 (ja) 2021-10-14 2021-10-14 プリウェット処理方法

Publications (2)

Publication Number Publication Date
CN115715337A CN115715337A (zh) 2023-02-24
CN115715337B true CN115715337B (zh) 2023-09-08

Family

ID=82446222

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180042509.0A Active CN115715337B (zh) 2021-10-14 2021-10-14 预湿处理方法

Country Status (5)

Country Link
US (1) US12480221B2 (https=)
JP (1) JP7101925B1 (https=)
KR (1) KR102604588B1 (https=)
CN (1) CN115715337B (https=)
WO (1) WO2023062778A1 (https=)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316869A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 電解メッキ方法
JP2005097732A (ja) * 2003-08-21 2005-04-14 Ebara Corp めっき装置
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
JP2007138304A (ja) * 2000-03-17 2007-06-07 Ebara Corp めっき装置及び方法
JP2011026708A (ja) * 2003-08-21 2011-02-10 Ebara Corp めっき装置
CN102804343A (zh) * 2009-06-17 2012-11-28 诺发系统有限公司 用于增强型镶嵌金属填充的润湿预处理的设备
JP2018104799A (ja) * 2016-12-28 2018-07-05 株式会社荏原製作所 基板を処理するための方法および装置
JP2019085613A (ja) * 2017-11-07 2019-06-06 株式会社荏原製作所 前処理装置、これを備えためっき装置、及び前処理方法
JP2020043333A (ja) * 2018-09-06 2020-03-19 株式会社荏原製作所 基板処理装置
JP2020204062A (ja) * 2019-06-14 2020-12-24 株式会社荏原製作所 めっき方法、プログラムを記憶する不揮発性の記憶媒体
CN112534559A (zh) * 2018-07-30 2021-03-19 朗姆研究公司 在金属镀覆前对衬底进行化学和加热润湿的系统和方法
JP6934127B1 (ja) * 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6857531B2 (ja) * 2017-03-31 2021-04-14 株式会社荏原製作所 めっき方法及びめっき装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007138304A (ja) * 2000-03-17 2007-06-07 Ebara Corp めっき装置及び方法
JP2001316869A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 電解メッキ方法
JP2005097732A (ja) * 2003-08-21 2005-04-14 Ebara Corp めっき装置
JP2011026708A (ja) * 2003-08-21 2011-02-10 Ebara Corp めっき装置
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
CN102804343A (zh) * 2009-06-17 2012-11-28 诺发系统有限公司 用于增强型镶嵌金属填充的润湿预处理的设备
JP2018104799A (ja) * 2016-12-28 2018-07-05 株式会社荏原製作所 基板を処理するための方法および装置
JP2019085613A (ja) * 2017-11-07 2019-06-06 株式会社荏原製作所 前処理装置、これを備えためっき装置、及び前処理方法
CN112534559A (zh) * 2018-07-30 2021-03-19 朗姆研究公司 在金属镀覆前对衬底进行化学和加热润湿的系统和方法
JP2020043333A (ja) * 2018-09-06 2020-03-19 株式会社荏原製作所 基板処理装置
JP2020204062A (ja) * 2019-06-14 2020-12-24 株式会社荏原製作所 めっき方法、プログラムを記憶する不揮発性の記憶媒体
JP6934127B1 (ja) * 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Also Published As

Publication number Publication date
US20240247393A1 (en) 2024-07-25
KR102604588B1 (ko) 2023-11-22
WO2023062778A1 (ja) 2023-04-20
JP7101925B1 (ja) 2022-07-15
US12480221B2 (en) 2025-11-25
JPWO2023062778A1 (https=) 2023-04-20
KR20230054318A (ko) 2023-04-24
CN115715337A (zh) 2023-02-24

Similar Documents

Publication Publication Date Title
CN1319130C (zh) 半导体基片处理装置及处理方法
TW201842236A (zh) 鍍覆方法及鍍覆裝置
CN117460866B (zh) 镀覆装置
US20240321598A1 (en) Substrate cleaning device
CN116097077A (zh) 泄漏判定方法以及镀覆装置
CN115715337B (zh) 预湿处理方法
JP2000147787A (ja) 現像方法及び現像装置
TWI894376B (zh) 鍍覆方法
JP2002075821A (ja) 現像処理装置および現像処理方法
TWI800954B (zh) 預濕處理方法
JP7572593B1 (ja) めっき装置および基板処理方法
WO2022137380A1 (ja) めっき装置、およびめっき処理方法
JP7114009B1 (ja) めっき装置、及びめっき方法
JP2002043210A (ja) 現像処理装置
US11542629B2 (en) Method of plating, apparatus for plating, and non-volatile storage medium that stores program
TW202235688A (zh) 鍍覆裝置及鍍覆方法
KR102595617B1 (ko) 도금 방법 및 도금 장치
TWI809937B (zh) 漏液判定方法及鍍覆裝置
TWI806455B (zh) 鍍覆裝置及鍍覆方法
CN116897226B (zh) 镀覆装置以及镀覆方法
US20230010624A1 (en) Substrate alignment device, substrate processing apparatus, substrate alignment method and substrate processing method
KR100614239B1 (ko) 기판 처리 방법 및 장치
JP3833883B2 (ja) 基板処理装置
JP2004162129A (ja) めっき装置及びめっき方法
TW202311570A (zh) 鍍覆方法及鍍覆裝置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant