KR102588338B1 - Flexible Electroluminescent Display Device - Google Patents

Abstract

A flexible electroluminescent display device includes a flexible substrate including a display area, a bending area extending from one side of the display area, and a cutting area formed by cutting one side of the bending area, a thin film transistor and a light emitting element disposed on the display area. , wiring and a flattening layer disposed on the display area and the bending area, a micro coating layer disposed on the flattening layer of the bending area, a touch screen substrate disposed on the display area, and a touch circuit board connected to the touch screen substrate, , the flexible substrate includes a cutting area formed by cutting one side of the bending area, and the touch circuit board is inserted into the cutting area and bent.

Description

Flexible Electroluminescent Display Device

This specification relates to a flexible electroluminescent display device, and more specifically, to a flexible electroluminescent display device that can minimize the bezel area of a flexible electroluminescent display device.

As we enter the information age, the field of display devices that visually display electrical information signals is developing rapidly, and research is continuing to develop performance such as thinner, lighter, and lower power consumption for various display devices.

Representative display devices include Liquid Crystal Display device (LCD), Field Emission Display device (FED), Electro-Wetting Display device (EWD), and Organic Light Emitting Display device (Organic Light Emission Display). Light Emitting Display Device (OLED), etc.

Electroluminescent displays, represented by organic light emitting displays, are self-luminous displays, and unlike liquid crystal displays, they do not require a separate light source and can be manufactured in a lightweight and thin form. In addition, electroluminescent display devices are not only advantageous in terms of power consumption due to low voltage operation, but also have excellent color reproduction, response speed, viewing angle, and contrast ratio (CR), and are expected to be utilized in various fields.

In an electroluminescent display device, an emissive layer (EML) is placed between two electrodes, an anode and a cathode. When holes from the anode are injected into the light-emitting layer and electrons from the cathode are injected into the light-emitting layer, the injected electrons and holes recombine with each other to form excitons in the light-emitting layer and emit light.

The light-emitting layer contains a host material and a dopant material, and the interaction between the two materials occurs. The host generates excitons from electrons and holes and transfers energy to the dopant. The dopant is a dye-based organic material added in small amounts. It receives energy from the host and converts it into light.

The electroluminescent display device encapsulates the electroluminescent display device with glass, metal, or film to block the inflow of moisture or oxygen from the outside into the electroluminescent display device, creating a light emitting layer or electrode. Prevents oxidation and protects from external mechanical or physical shock.

As display devices become smaller, efforts are being made to reduce the bezel area, which is the outer portion of the active area (A/A), in order to increase the effective display screen size in the same area of the display device.

Since wiring and driving circuits for driving the screen are placed in the bezel area, which is the non-active area (N/A), there was a limit to reducing the bezel area.

Regarding the recently developed flexible electroluminescent display device that can maintain display performance even when bent by applying a flexible substrate made of a soft material such as plastic, the bezel while securing area for wiring and driving circuits In order to reduce the area, technology has been developed and applied to reduce the bezel area by bending the non-display area of the flexible substrate.

In addition, electroluminescent display devices using flexible substrates such as plastic ensure flexibility of the substrate, various insulating layers placed on the substrate, and wiring formed of metal materials, and prevent cracks that may occur due to bending. It is necessary to prevent defects such as cracks.

In addition, a touch screen panel replaces the input means such as a mouse or keyboard that was previously applied as an input means for a display device and allows the user to directly input information on the screen of the display device using a finger or a pen. ) Display devices equipped with are increasingly being used in various fields.

The touch screen panel placed at the top of the display device converts the contact location directly touched by the user's hand or object into an electrical signal, and the instructions selected at the contact location are accepted as input signals and displayed on the screen through the display device. .

In addition, the touch circuit board disposed in the bezel area, which is a non-display area of the display device, has wiring and touch circuits connected to the touch screen panel to drive the touch screen panel, and an area for the wiring and touch circuits must be secured. Therefore, it was an obstacle to reducing the bezel area of the display device.

Accordingly, the inventors of the present specification have invented an electroluminescent display device with a new structure that can minimize the area of the touch circuit board of the touch screen panel disposed in the bezel area of the electroluminescent display device.

In addition, the inventors of the present specification recognized that as the resolution of electroluminescent display devices gradually increases, there is a shortage of space to place wiring, and developed an electroluminescent display device with a new structure that allows wiring to be arranged more freely within a limited space. invented.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A flexible electroluminescent display device according to an embodiment of the present specification includes a flexible substrate including a display area, a bending area extending from one side of the display area, and a cutting area formed by cutting one side of the bending area, and on the display area. Thin film transistor and light emitting device disposed, wiring and planarization layer disposed on the display area and bending area, micro coating layer disposed on the flattening layer of the bending area, touch screen substrate disposed on the display area, and connection to the touch screen substrate. The flexible substrate includes a cutting area formed by cutting one side of the bending area, and the touch circuit board is inserted into the cutting area and bent.

A flexible electroluminescent display device according to an embodiment of the present specification is a flexible display area including a display area including pixels, a non-display area including a bending area disposed outside the display area, and a cutting area formed by cutting one side of the bending area. It includes a substrate, a touch screen substrate disposed on the display area, and a touch circuit board connected to the touch screen substrate. One side of the non-display area of the flexible substrate is cut to form a cutting area, and the touch circuit board is inserted into the cutting area. It can be bent to minimize the non-display area.

A flexible electroluminescent display device according to an embodiment of the present specification is a flexible display including a display area, a bending area disposed outside the display area, a first area disposed on one side of the bending area, and a second area formed by cutting the bending area. It includes a substrate, a touch screen substrate disposed on a display area, and a touch circuit board connected to the touch screen substrate and disposed in a second area.

The electroluminescent display device according to an embodiment of the present specification has the effect of minimizing the bezel area by reducing the area of the touch circuit board included in the touch screen panel disposed on the upper part of the flexible substrate.

The flexible electroluminescent display device according to an embodiment of the present specification has the effect of allowing wiring used in the flexible electroluminescent display device to be more freely arranged within a limited space.

The effects of the flexible electroluminescent display device according to the embodiments of the present specification are not limited to the contents exemplified above, and further various effects are included in the present specification.

Since the contents of the specification described in the problem to be solved, the means to solve the problem, and the effect described above do not specify the essential features of the claim, the scope of the claim is not limited by the matters described in the content of the specification.

1 is a block diagram of an electroluminescence display device according to an embodiment of the present specification.
Figure 2 is a circuit diagram of a pixel included in an electroluminescence display device according to an embodiment of the present specification.
Figure 3 is a plan view of an electroluminescent display device according to an embodiment of the present specification.
4A and 4B are cross-sectional views of detailed structures of a display area and a bending area of an electroluminescence display device according to an embodiment of the present specification.
Figure 5 is a plan view of an electroluminescence display touch screen panel according to an embodiment of the present specification.
6A and 6B are a plan view and a perspective view of a touch screen and a flexible substrate of a flexible electroluminescent display device according to an embodiment of the present specification.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Each feature of the various embodiments of the present specification can be combined or combined with each other, partially or entirely, and various technological interconnections and operations are possible, and each embodiment may be implemented independently of each other or together in a related relationship. It may be possible.

Figure 1 is a block diagram of an electroluminescent display device 100 according to an embodiment of the present specification.

Referring to FIG. 1 , the electroluminescent display device 100 includes an image processing unit 110, a timing controller 120, a data driver 130, a gate driver 140, and a display panel 150.

The image processing unit 110 outputs a data enable signal (DE) in addition to a data signal (DATA) supplied from the outside. In addition to the data enable signal (DE), the image processing unit 110 may output one or more of a vertical synchronization signal, a horizontal synchronization signal, and a clock signal.

The timing controller 120 receives a data enable signal (DE) or a driving signal including a vertical synchronization signal, a horizontal synchronization signal, and a clock signal, as well as a data signal (DATA) from the image processing unit 110. The timing controller 120 includes a gate timing control signal (GDC) for controlling the operation timing of the gate driver 140 and a data timing control signal (DDC) for controlling the operation timing of the data driver 130 based on the driving signal. outputs.

The data driver 130 samples and latches the data signal (DATA) supplied from the timing controller 120 in response to the data timing control signal (DDC) supplied from the timing controller 120, converts it to a gamma reference voltage, and outputs it. . The data driver 130 outputs a data signal (DATA) through the data lines (DL1 to DLn).

The gate driver 140 outputs a gate signal while shifting the level of the gate voltage in response to the gate timing control signal (GDC) supplied from the timing controller 120. The gate driver 140 outputs a gate signal through the gate lines GL1 to GLm.

The display panel 150 displays an image as the pixel 160 emits light in response to the data signal (DATA) and gate signal supplied from the data driver 130 and the gate driver 140. The detailed structure of the pixel 160 is explained in detail in FIGS. 2 and 4.

Figure 2 is a circuit diagram of a pixel included in an electroluminescence display device according to an embodiment of the present specification.

Referring to FIG. 2 , the pixel of the electroluminescent display device 200 includes a switching transistor 240, a driving transistor 250, a compensation circuit 260, and a light emitting element 270.

The light emitting element 270 operates to emit light according to the driving current generated by the driving transistor 250.

The switching transistor 240 performs a switching operation so that the data signal supplied through the data line 230 is stored as a data voltage in a capacitor in response to the gate signal supplied through the gate line 220.

The driving transistor 250 operates so that a constant driving current flows between the high-potential power line (VDD) and the low-potential power line (GND) in response to the data voltage stored in the capacitor.

The compensation circuit 260 is a circuit for compensating the threshold voltage of the driving transistor 250, and the compensation circuit 260 includes one or more thin film transistors and a capacitor. The composition of the compensation circuit can vary greatly depending on the compensation method.

In addition, the pixel of the electroluminescent display device 200 is composed of a 2T (Transistor) 1C (Capacitor) structure including a switching transistor 240, a driving transistor 250, a capacitor, and a light emitting element 270, but a compensation circuit ( 260) is added, it can be formed in various ways, such as 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, 7T2C, etc.

Figure 3 is a plan view of an electroluminescence display device according to an embodiment of the present specification. In detail, the flexible substrate 310 of the flexible electroluminescent display device 300 is not bent.

Referring to FIG. 3, the flexible electroluminescent display device 300 has a display area (A/A) and a display area (A) in which pixels that actually emit light through thin film transistors and light emitting devices are arranged on the flexible substrate 310. It includes a non-display area (N/A), which is the bezel area surrounding the outer edge of /A).

The non-display area (N/A) of the flexible substrate 310 is a circuit such as a gate driver 390 for driving the flexible electroluminescent display device 300 and various signals such as a scan line (S/L). Wiring may be placed.

The circuit for driving the flexible electroluminescent display device 300 is arranged as a GIP (Gate in Panel) on the substrate 310, or is installed on the flexible substrate 310 using a TCP (Tape Carrier Package) or COF (Chip on Film) method. It may also be connected to .

A pad 395, which is a metal pattern, is disposed on one side of the substrate 310 in the non-display area (N/A) to enable bonding to an external module.

A bending area (B/A) can be formed by bending a portion of the non-display area (N/A) of the flexible substrate 310 in the bending direction as indicated by the arrow. The non-display area (N/A) of the flexible substrate 310 has wiring and driving circuits for driving the screen, and is not an area where images are displayed, so it does not need to be visible from the top of the flexible substrate 310. . Accordingly, by bending a portion of the non-display area (N/A) of the flexible substrate 310, the bezel area can be reduced while securing an area for wiring and driving circuits.

Various wiring lines are formed on the flexible substrate 310. The wiring may be formed in the display area (A/A) of the substrate 310, or the circuit wiring 370 formed in the non-display area (N/A) may connect a driving circuit, gate driver, data driver, etc. Signals can be transmitted.

The circuit wiring 370 is made of a conductive material, and may be made of a conductive material with excellent ductility to reduce the occurrence of cracks when bending the substrate 310, for example, gold (Au), silver (Ag). ), aluminum (Al), etc. may be formed of a conductive material with excellent ductility. And, it can be formed of one of various conductive materials used in the display area (A/A), such as molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), and neodymium (Nd). , copper (Cu), and an alloy of silver (Ag) and magnesium (Mg).

The circuit wiring 370 may be composed of a multi-layer structure containing various conductive materials, and may be composed of a three-layer structure of titanium (Ti)/aluminum (Al)/titanium (Ti), but is not limited thereto.

The circuit wiring 370 formed in the bending area (B/A) receives a tensile force when bent. The circuit wiring 370 extending in the same direction as the bending direction on the flexible substrate 310 is subjected to the greatest tensile force, which may cause cracks or disconnection. Therefore, rather than forming the circuit wiring 370 to extend in the bending direction, at least a portion of the circuit wiring 370 disposed including the bending area (B/A) extends in a diagonal direction that is different from the bending direction. By forming it, the tensile force can be minimized.

The circuit wiring 370 disposed including the bending area (B/A) can be formed in various shapes, such as trapezoidal wave shape, triangle wave shape, sawtooth wave shape, sinusoidal wave shape, omega (Ω) shape, diamond shape, etc. It can be.

The touch screen panel described in FIGS. 5 to 6B is disposed on the display area (A/A) of the flexible substrate 310. The touch screen panel converts the contact position directly touched by the user's hand or object into an electrical signal, and the instructions selected at the contact position are accepted as input signals and displayed on the screen through the display device.

On one side of the non-display area (N/A) of the flexible board 310, a touch circuit board on which wiring and touch circuits connected to the touch screen panel are placed is inserted to form a cutting area (C/A) that is bent. do.

The touch circuit board may include touch electrodes disposed on the touch screen panel, various wiring for transmitting signals to each other, and a touch sensing circuit for sensing touch input, and may be composed of an insulating film.

In the cutting area (C/A), an area with a width greater than the width of the touch circuit board is cut into the non-display area (N/A) of the flexible substrate 310, and a touch circuit board composed of an insulating film is inserted. This is the area that is bent. At this time, the circuit wiring 370 and pad 395 placed on the flexible substrate 310 so as not to be affected by the cutting area (C/A) are not placed in the cutting area (C/A) but are placed in the cutting area (C/A). It is placed in an area adjacent to A).

The structure of the touch screen panel disposed on the flexible substrate 310 and the detailed connection structure with the flexible substrate 310 will be described in FIGS. 5 to 6B.

4A and 4B are cross-sectional views of detailed structures of a display area and a bending area of an electroluminescence display device according to an embodiment of the present specification.

FIG. 4A is a cross-section (I-I') of the detailed structure of the display area (A/A) described in FIG. 3.

Referring to FIGS. 4A and 4B , the substrate 410 serves to support and protect the components of the electroluminescent display device 400 disposed on the top. Recently, the flexible substrate 410 can be used as a soft material with flexible characteristics such as plastic.

The flexible substrate 410 may be in the form of a film containing one of the group consisting of polyester polymer, silicon polymer, acrylic polymer, polyolefin polymer, and copolymers thereof, for example, polyethylene terephthalate (PET), Polybutylene terephthalate (PBT), polysilane, polysiloxane, polysilazane, polycarbosilane, polyacrylate, polymethacrylate, poly methyl acrylate, polymethylmethacrylate, polyethyl acrylate, polyethyl methacrylate, cyclic olefin copolymer (COC), cyclic olefin polymer (COP), Polyethylene (PE), polypropylene (PP), polyimide (PI), polymethyl methacrylate (PMMA), polystyrene (PS), polyacetal (POM), polyether ether ketone (PEEK), polyester sulfone (PES) ), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polycarbonate (PC), polyvinylidene fluoride (PVDF), perfluoroalkyl polymer (PFA), styrene acryl nitrile copolymer (SAN) ) and combinations thereof.

A buffer layer may be further disposed on the flexible substrate 410. The buffer layer prevents external moisture or other impurities from penetrating through the flexible substrate 410 and can flatten the surface of the flexible substrate 410. The buffer layer is not necessarily a necessary component, and may be removed depending on the type of thin film transistor 420 disposed on the flexible substrate 410.

The thin film transistor 420 disposed on the flexible substrate 410 includes a gate electrode 422, a source electrode 424, a drain electrode 426, and a semiconductor layer 428.

The semiconductor layer 428 is made of amorphous silicon or polycrystalline silicon, which has better mobility than amorphous silicon, has low energy consumption and excellent reliability, and can be applied to a driving thin film transistor within a pixel. ), but is not limited to this.

And, the semiconductor layer may be composed of an oxide semiconductor. Oxide semiconductors have excellent mobility and uniformity properties. Oxide semiconductors include indium tin gallium zinc oxide (InSnGaZnO)-based materials, which are quaternary metal oxides, indium gallium zinc oxide (InGaZnO)-based materials, which are ternary metal oxides, indium tin zinc oxide (InSnZnO)-based materials, and indium aluminum zinc oxide (InAlZnO). )-based materials, tin gallium zinc oxide (SnGaZnO)-based materials, aluminum gallium zinc oxide (AlGaZnO)-based materials, tin aluminum zinc oxide (SnAlZnO)-based materials, indium zinc oxide (InZnO)-based materials, which are binary metal oxides, tin-zinc Oxide (SnZnO) based material, aluminum zinc oxide (AlZnO) based material, zinc magnesium oxide (ZnMgO) based material, tin magnesium oxide (SnMgO) based material, indium magnesium oxide (InMgO) based material, indium gallium oxide (InGaO) based material The semiconductor layer 428 can be formed of indium oxide (InO)-based materials, tin oxide (SnO)-based materials, zinc oxide (ZnO)-based materials, etc., and the composition ratio of each element is not limited.

The semiconductor layer 428 may include a source region containing p-type or n-type impurities, a drain region, and a channel between the source region and the drain region. A low-concentration doping region may be further included between adjacent source and drain regions.

The source region and drain region are regions doped with impurities at a high concentration, and are regions where the source electrode 424 and drain electrode 426 of the thin film transistor 420 are connected, respectively. The impurity ion may be a p-type impurity or an n-type impurity. The p-type impurity may be one of boron (B), aluminum (Al), gallium (Ga), and indium (In), and the n-type impurity may be phosphorus ( It may be one of P), arsenic (As), antimony (Sb), etc.

The semiconductor layer 428 may be doped with an n-type impurity or a p-type impurity in the channel region depending on the thin film transistor structure of NMOS or PMOS, and the thin film transistor included in the electroluminescent display device according to the embodiment of the present specification is NMOS. Alternatively, PMOS thin film transistors are applicable.

The first insulating layer 431 is an insulating layer composed of a single layer of silicon oxide (SiOx) or silicon nitride (SiNx) or multiple layers thereof, and prevents the current flowing in the semiconductor layer 428 from flowing to the gate electrode 422. Arrange so that it does not occur. In addition, silicon oxide is less ductile than metal, but has superior ductility than silicon nitride and can be formed as a single layer or multiple layers depending on its characteristics.

The gate electrode 422 serves as a switch to turn on or off the thin film transistor 420 based on an external electrical signal transmitted through the gate line, and is made of a conductive metal. Single layer of copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd), or alloys thereof. Alternatively, it may be composed of multiple layers, but is not limited thereto.

The source electrode 424 and the drain electrode 426 are connected to the data line and allow electrical signals transmitted from the outside to be transmitted from the thin film transistor 420 to the light emitting device 440. The source electrode 424 and the drain electrode 426 are made of conductive metals such as copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), It may be composed of a single layer or multiple layers of metal materials such as neodymium (Nd) or alloys thereof, but is not limited thereto.

In order to insulate the gate electrode 422, the source electrode 424, and the drain electrode 426 from each other, a second insulating layer 433 composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx) is formed on the gate. It can be placed between the electrode 422, the source electrode 424, and the drain electrode 426.

A passivation layer made of an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) may be further disposed on the thin film transistor 420. The passivation layer can serve to prevent unnecessary electrical connections between components disposed above and below the passivation layer and prevent contamination or damage from the outside, and constitutes the thin film transistor 420 and the light emitting device 440. and may be omitted depending on the characteristics.

The thin film transistor 420 can be classified into an inverted staggered structure and a coplanar structure depending on the positions of the components constituting the thin film transistor 420. In an inverted staggered thin film transistor, the gate electrode is located on the opposite side of the source electrode and drain electrode based on the semiconductor layer. As shown in FIG. 4A, in the thin film transistor 420 having a coplanar structure, the gate electrode 422 is located on the same side as the source electrode 424 and the drain electrode 426 with respect to the semiconductor layer 428.

Although FIG. 4A shows a thin film transistor 420 having a coplanar structure, the electroluminescent display device 400 may also include a thin film transistor having an inverted staggered structure.

For convenience of explanation, only the driving thin film transistor is shown among the various thin film transistors that may be included in the electroluminescent display device 400, and switching thin film transistors, capacitors, etc. may also be included in the electroluminescent display device 400. And, when a signal is applied from the gate wire, the switching thin film transistor transfers the signal from the data wire to the gate electrode of the driving thin film transistor. The driving thin film transistor transmits the current transmitted through the power wiring by a signal received from the switching thin film transistor to the anode 442, and controls light emission by the current transmitted to the anode 442.

Protects the thin film transistor 420, alleviates the step difference caused by the thin film transistor 420, and reduces parasitic capacitance generated between the thin film transistor 420, the gate line, the data line, and the light emitting device 440. In order to reduce capacitance, planarization layers 435 and 437 are disposed on the thin film transistor 420.

The planarization layers 435 and 437 are made of acrylic resin, epoxy resin, phenolic resin, polyamides resin, polyimides resin, and unsaturated polyester. It may be formed of one or more materials among Unsaturated Polyesters Resin, Polyphenylene Resin, Polyphenylenesulfides Resin, and Benzocyclobutene, but is not limited thereto.

The electroluminescent display device 400 according to an embodiment of the present specification may include a first planarization layer 435 and a second planarization layer 437, which are a plurality of planarization layers 435 and 437 sequentially stacked. The first planarization layer 435 may be stacked and disposed on the thin film transistor 420, and the second planarization layer 437 may be sequentially stacked on the first planarization layer 435.

A buffer layer may be disposed on the first planarization layer 435. The buffer layer is disposed to protect the components disposed on the first planarization layer 435, and is a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx). It may be composed of layers, and may be omitted depending on the configuration and characteristics of the thin film transistor 420 and the light emitting device 440.

The intermediate electrode 430 is connected to the thin film transistor 420 through a contact hole formed in the first planarization layer 435. The intermediate electrode 430 is stacked to be connected to the thin film transistor 420, so that the data line can also be formed in a multi-layer structure.

The data line may be formed in a structure in which a lower layer made of the same material as the source electrode 424 and the drain electrode 426 and an upper layer made of the same material as the intermediate electrode 430 are connected, so the two layers are connected in parallel. Since the data line can be implemented, the wiring resistance of the data line can be reduced.

A passivation layer made of an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) may be further disposed on the first planarization layer 435 and the intermediate electrode 430. The passivation layer may serve to prevent unnecessary electrical connections between components and prevent contamination or damage from the outside, and may be omitted depending on the configuration and characteristics of the thin film transistor 420 and the light emitting device 440.

The light emitting device 440 disposed on the second planarization layer 437 includes an anode 442, a light emitting portion 444, and a cathode 446.

The anode 442 may be disposed on the second planarization layer 437. The anode 442 is an electrode that supplies holes to the light emitting unit 444, and is connected to the intermediate electrode 430 through a contact hole in the second planarization layer 437, and is electrically connected to the thin film transistor 420. It is connected to

The anode 442 may be made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

If the electroluminescent display device 400 is a top emission device that emits light toward the top where the cathode 446 is placed, the emitted light is reflected from the anode 442 and the cathode 446 is positioned more smoothly. It may further include a reflective layer so that it can be emitted in the upper direction.

The anode 442 may have a two-layer structure in which a transparent conductive layer made of a transparent conductive material and a reflective layer are sequentially stacked, or it may have a three-layer structure in which a transparent conductive layer, a reflective layer, and a transparent conductive layer are sequentially stacked, and the reflective layer is made of silver (Ag). Or it may be an alloy containing silver.

The bank 450 disposed on the anode 442 and the second planarization layer 437 may define a pixel by dividing an area that actually emits light. After forming photoresist on the anode 442, the bank 450 is formed by photolithography. Photoresist refers to a photosensitive resin whose solubility in a developer changes under the action of light, and a specific pattern can be obtained by exposing and developing the photoresist. Photoresist can be classified into positive photoresist and negative photoresist. Positive photoresist refers to a photoresist whose solubility in the developer of the exposed area increases with exposure. When a positive photoresist is developed, a pattern with the exposed area removed is obtained. In addition, negative photoresist refers to a photoresist whose solubility in the developer of the exposed area is greatly reduced by exposure. When the negative photoresist is developed, a pattern with the non-exposed area removed is obtained.

To form the light emitting portion 444 of the light emitting device 440, a fine metal mask (FMM), which is a deposition mask, can be used. In addition, in order to prevent damage that may occur by contact with the deposition mask disposed on the bank 450 and to maintain a constant distance between the bank 450 and the deposition mask, a transparent organic polyethylene layer is placed on the top of the bank 450. A spacer (452) composed of one of mead, photoacrylic, and benzocyclobutene (BCB) may be placed.

A light emitting unit 444 is disposed between the anode 442 and the cathode 446. The light emitting part 444 serves to emit light, and includes a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer, an electron transport layer (ETL), and an electron injection layer. (Electron Injection Layer; EIL), and some components of the light emitting unit 444 may be omitted depending on the structure or characteristics of the electroluminescence display device 400. Here, it is also possible to apply an electroluminescent layer or an inorganic light emitting layer as the light emitting layer.

The hole injection layer is disposed on the anode 442 to facilitate hole injection. The hole injection layer is HAT-CN (dipyrazino[2,3-f:2',3'-h]quinoxaline-2,3,3,6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine), and NPD (N, It may be composed of one or more of N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine).

The hole transport layer is disposed on the hole injection layer and serves to smoothly transfer holes to the light emitting layer. The hole transport layer is NPD(N,N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine), TPD(N,N'-bis-(3- methylphenyl)-N,N'-bis-(phenyl)-benzidine), s-TAD(2,2',7,7'-tetrakis(N,N-dimethylamino)-9,9-spirofluorene), and MTDATA( It may be composed of one or more of 4,4',4"-Tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine).

The light-emitting layer is disposed on the hole transport layer and can emit light of a specific color by including a material that can emit light of a specific color. Also, the light-emitting material can be formed using a phosphorescent material or a fluorescent material.

When the light-emitting layer emits red, the peak wavelength of light emission may be in the range of 600 nm to 650 nm, and CBP (4,4'-bis(carbazol-9-yl)biphenyl) or mCP (1,3 -Contains host materials including bis(carbazol-9-yl)benzene), PIQIr(acac)(bis(1-phenylisoquinoline)(acetylacetonate) iridium), PQIr(acac)(bis(1-phenylquinoline)(acetylacetonate) ) iridium), tris(1-phenylquinoline) iridium (PQIr), and octaethylporphyrin platinum (PtOEP). Alternatively, it may be made of a fluorescent material containing PBD:Eu(DBM)3(Phen) or Perylene.

Here, the peak wavelength (λmax) refers to the maximum wavelength of EL (ElectroLuminescence). The wavelength at which the light-emitting layers that make up the light-emitting part emit their own light is called PL (PhotoLuminescence), and the light that comes out under the influence of the thickness or optical characteristics of the layers that make up the light-emitting layer is called emittance. At this time, EL (ElectroLuminescence) refers to the light finally emitted by the electroluminescence display device, and can be expressed as the product of PL (PhotoLuminescence) and emittance.

When the light-emitting layer emits green, the peak wavelength of light emission may be in the range of 520nm to 540nm, and includes a host material containing CBP or mCP, and Ir(ppy)3(tris(2-phenylpyridine)iridium ) may be made of a phosphorescent material containing a dopant material such as an Ir complex containing. Additionally, it may be made of a fluorescent material containing Alq3 (tris(8-hydroxyquinolino)aluminum).

When the light emitting layer emits blue, the peak wavelength of light emission may be in the range of 440 nm to 480 nm, contains a host material containing CBP or mCP, and FIrPic (bis(3,5-difluoro-2 It may be made of a phosphorescent material containing a dopant material containing -(2-pyridyl)phenyl-(2-carboxypyridyl)iridium). In addition, spiro-DPVBi(4,4'-Bis(2,2-diphenyl-ethen) -1-yl)biphenyl), DSA (1-4-di-[4-(N,N-di-phenyl)amino]styryl-benzene), PFO (polyfluorene) polymer, and PPV (polyphenylenevinylene) polymer. It may be made of a fluorescent material containing one.

An electron transport layer is placed on the light emitting layer to facilitate the movement of electrons to the light emitting layer. The electron transport layer is Liq (8-hydroxyquinolinolato-lithium), PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole), TAZ (3-(4-biphenyl) )4-phenyl-5-tert-butylphenyl-1,2,4-triazole), spiro-PBD, BCP(2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline) and BAlq(bis(2 -methyl-8-quinolinolate)-4-(phenylphenolato)aluminum).

An electron injection layer may be further disposed on the electron transport layer. The electron injection layer is an organic layer that facilitates injection of electrons from the cathode 446, and may be omitted depending on the structure and characteristics of the electroluminescence display device 400. The electron injection layer may be a metal inorganic compound such as BaF2, LiF, NaCl, CsF, Li2O and BaO, and HAT-CN (dipyrazino[2,3-f:2',3'-h]quinoxaline-2,3, 6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine), and NPD (N,N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine) It may be one or more organic compounds.

An electron blocking layer or hole blocking layer is further placed adjacent to the light emitting layer to block the flow of holes or electrons, so that when electrons are injected into the light emitting layer, they move from the light emitting layer and pass through the adjacent hole transport layer. When holes are injected into the light-emitting layer, the luminous efficiency can be improved by preventing the hole from moving from the light-emitting layer and passing through the adjacent electron transport layer.

The cathode 446 is disposed on the light emitting unit 444 and serves to supply electrons to the light emitting unit 444. Since the cathode 446 must supply electrons, it can be made of a metal material such as magnesium (Mg) or silver-magnesium (Ag:Mg), which is a conductive material with a low work function, but is not limited thereto.

When the electroluminescent display device 400 is a top emission type, the cathode 446 is made of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide ( It may be a transparent conductive oxide of the Zinc Oxide (ZnO) and Tin Oxide (TiO) series.

A bag is placed on the light emitting device 440 to prevent the thin film transistor 420 and the light emitting device 440, which are components of the electroluminescence display device 400, from being oxidized or damaged due to moisture, oxygen, or impurities flowing in from the outside. The portion 460 can be disposed and formed by stacking a plurality of encapsulation layers, a foreign matter compensation layer, and a plurality of barrier films.

The encapsulation layer is disposed on the entire upper surface of the thin film transistor 420 and the light emitting device 440, and may be made of one of inorganic silicon nitride (SiNx) or aluminum oxide (AlyOz), but is not limited thereto. An encapsulation layer may be further disposed on the foreign matter compensation layer disposed on the encapsulation layer.

The foreign matter compensation layer is placed on the encapsulation layer, and can use organic silicon oxycarbon (SiOCz), acryl, or epoxy-based resin, but is not limited to this, and may be generated during the process. When defects occur due to cracks caused by foreign matter or particles, the bending and foreign matter can be covered by the foreign matter compensation layer to compensate.

By disposing a barrier film on the encapsulation layer and the foreign matter compensation layer, the electroluminescent display device 400 can delay the infiltration of oxygen and moisture from the outside. The barrier film is composed of a light-transmitting and double-sided adhesive film, and can be made of any one of the following insulating materials: Olefin-based, Acrylic-based, and Silicon-based, or COP (Cyclolefin). A barrier film made of any one of materials such as polymer), COC (cycloolefin copolymer), and PC (polycarbonate) can be further laminated, but is not limited thereto.

FIG. 4B is a detailed structural cross-section (II-II') of the bending area (B/A) described in FIG. 3.

Some components of FIG. 4B are substantially the same/similar to the components described in FIG. 4A and detailed description thereof will be omitted.

The gate signal and data signal described in FIGS. 1 to 3 pass from the outside through circuit wiring disposed in the non-display area (N/A) of the electroluminescent display device 400 to the pixels disposed in the display area (A/A). It is transmitted to and emits light.

When the wires disposed in the non-display area (N/A) including the bending area (B/A) of the electroluminescent display device 400 are formed in a single layer structure, a large amount of space is required to place the wires. After depositing a conductive material, the conductive material is patterned into the shape of the wire to be formed through a process such as etching. However, since the precision of the etching process is limited, a lot of space is required due to the limitation of narrowing the gap between wires. As the area of the non-display area (N/A) increases, difficulties may arise in implementing a narrow bezel.

Additionally, when one wire is used to transmit one signal, if the wire is cracked, the signal may not be transmitted. In the process of bending the substrate 410, cracks may occur in the wiring itself, or cracks may occur in other layers and the cracks may propagate to the wiring. Likewise, if a crack occurs in the wiring, the signal to be transmitted may not be transmitted.

Accordingly, the wiring disposed in the bending area (B/A) of the electroluminescent display device 400 according to the embodiment of the present specification is arranged in the form of a double wiring of the first wiring 462 and the second wiring 464. .

The first wiring 462 and the second wiring 464 are made of a conductive material and may be made of a conductive material with excellent ductility to reduce the occurrence of cracks when bending the flexible substrate 410. The first wiring 462 and the second wiring 464 may be formed of a conductive material with excellent ductility, such as gold (Au), silver (Ag), aluminum (Al), etc., and are used in the display area (A/A). It can be formed from one of a variety of conductive materials, including molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), and magnesium (Mg). ) may also be composed of an alloy, etc. In addition, the first wiring 462 and the second wiring 464 may be composed of a multi-layer structure containing various conductive materials, and are composed of a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti). It may be, but is not limited to this.

In order to protect the first wiring 462 and the second wiring 464, a buffer layer made of an inorganic insulating layer may be disposed under the first wiring 462 and the second wiring 464, and the first wiring 462 ) and a passivation layer made of an inorganic insulating layer is formed to surround the top and sides of the second wiring 464 to prevent phenomena such as corrosion of the first wiring 462 and the second wiring 464 by reacting with moisture, etc. It could be.

The first wiring 462 and the second wiring 464 formed in the bending area B/A are subjected to a tensile force when bent. As explained in FIG. 3, the wiring extending in the same direction as the bending direction on the substrate 410 receives the greatest tensile force, and cracks may occur. If the cracks are severe, wire breakage may occur. Therefore, rather than forming the wiring to extend in the bending direction, at least a portion of the wiring arranged including the bending area (B/A) is formed to extend in a diagonal direction that is different from the bending direction, thereby minimizing the tensile force and cracking. occurrence can be reduced. The shape of the wiring may be a diamond shape, a triangular wave shape, a sinusoidal shape, a trapezoid shape, etc., but is not limited thereto.

A first wiring 462 is disposed on the substrate 410 and a first planarization layer 435 is disposed on the first wiring 462. A second wiring 464 is disposed on the first planarization layer 435, and a second planarization layer 437 is disposed on the second wiring 464.

The first planarization layer 435 and the second planarization layer 437 are made of acrylic resin, epoxy resin, phenolic resin, polyamides resin, and polyimide resin. (Polyimides Resin), Unsaturated Polyesters Resin, Polyphenylene Resin, Polyphenylenesulfides Resin, and Benzocyclobutene. may, but is not limited to this.

A micro coating layer (Micro Coating Layer) 466 is disposed on the second planarization layer 437. Since the micro coating layer 466 may crack due to tensile force acting on the wiring portion disposed on the substrate 410 during bending, it protects the wiring by coating a thin layer of resin at the bending position. It plays a role.

Figure 5 is a plan view of an electroluminescence display touch screen panel according to an embodiment of the present specification.

The touch screen panel 520 is arranged so that the display area (A/A) on the flexible substrate 310 described in FIG. 3 corresponds to the touch area (T/A) where the touch electrodes 525 are disposed.

The touch electrode 525 is disposed in the touch area (T/A) of the touch screen panel 520. The touch electrode 525 may be configured so that a plurality of touch driving electrodes (Tx) and a plurality of touch sensing electrodes (Rx) intersect.

A mutual-capacitance type consisting of a touch electrode 525 configured to cross a plurality of touch driving electrodes (Tx) and a plurality of touch sensing electrodes (Rx) may be applied, but is not limited to this. , self-capacitance type may be applied. The self-capacitance method is arranged only with a plurality of touch sensing electrodes (Rx). Additionally, the touch screen panel 520 may be implemented in various ways, such as a resistive type or an electromagnetic type.

The touch pad 530 is disposed on one side of the outer portion surrounding the touch area (T/A) of the touch screen panel 520 and is correspondingly disposed on the non-display area (N/A) of the flexible substrate 520.

The touch connection wire 535 serves to electrically connect the touch electrode 525 and the touch pad 530. At this time, the touch pad 530 is placed at a position corresponding to the cutting area (C/A) of the flexible substrate 310 so that the touch circuit board 540 can be easily inserted into the cutting area (C/A) and bent.

At the end of the touch screen panel 520, a touch circuit board 540 is connected to the touch pad 530 and made of an insulating film. The touch circuit board 540 may include a touch electrode 525 disposed on the touch area (T/A), various wiring for transmitting signals to each other, and a touch sensing circuit for sensing touch input. It can be composed of a circuit board (Flexible Printed Circuit Board).

The touch circuit board 540 is inserted into the cutting area (C/A) of the flexible substrate 310 described in FIG. 3 and bent, and a non-display area is formed by bending the flexible substrate 310 in the bending area (B/A). It has a width equal to or narrower than that of (N/A).

When the touch circuit board 540 is bent on the flexible board 310, the width of the non-display area (N/A) is unnecessarily increased, making it difficult to minimize the bezel area of the flexible electroluminescent display device. Accordingly, the flexible electroluminescent display device according to the embodiment of the present specification has a non-display area (N) formed when the touch circuit board 540 is inserted into the cutting area (C/A) disposed on the flexible substrate 310 and bent. By minimizing the width of /A), there is an effect of minimizing the bezel area of the flexible electroluminescent display device. In detail, the touch circuit board 540 is inserted into the cutting area (C/A) so that the flexible board 510 including the micro coating layer in the bending area (B/A) is oriented substantially outward from the touch circuit board 540. It protrudes further, and thus, there is an effect of reducing the width of the unnecessary non-display area (N/A) generated by the touch circuit board 540.

The detailed structure of the touch screen panel 520 disposed on the flexible substrate 310 will be described in FIGS. 6A and 6B.

6A and 6B are a plan view and a perspective view of a touch screen and a flexible substrate of a flexible electroluminescent display device according to an embodiment of the present specification.

Figure 6a is a plan view of a touch screen and a flexible substrate of a flexible electroluminescent display device according to an embodiment of the present specification. Some components of FIG. 6A are substantially the same/similar to the components described in FIGS. 1 to 5 and detailed description thereof will be omitted.

Referring to FIG. 6, the flexible electroluminescent display device 600 has a display area (A/A) and a display area (A) in which pixels that actually emit light through thin film transistors and light emitting devices are arranged on the flexible substrate 610. It includes a non-display area (N/A), which is the bezel area surrounding the outer edge of /A).

A pad 695, which is a metal pattern, is disposed on one side of the substrate 610 in the non-display area (N/A) to enable bonding to an external module.

A bending area (B/A) can be formed by bending a portion of the non-display area (N/A) of the flexible substrate 610 in the bending direction shown by the arrow. The non-display area (N/A) of the flexible substrate 610 is where wiring and driving circuits for driving the screen are placed, and is not an area where images are displayed, so it does not need to be visible from the top of the flexible substrate 610. . Accordingly, by bending a portion of the non-display area (N/A) of the flexible substrate 610, the bezel area can be reduced while securing area for wiring and driving circuits.

Various wiring lines are formed on the flexible substrate 610. The wiring may be formed in the display area (A/A) of the substrate 610, or the circuit wiring 670 formed in the non-display area (N/A) may connect a driving circuit, gate driver, data driver, etc. Signals can be transmitted.

The cutting area (C/A) is made by cutting an area with a width greater than the width of the touch circuit board 640 in the non-display area (N/A) of the flexible substrate 610 to form a touch circuit board composed of an insulating film. This is an area that can be inserted and bent.

The touch screen panel 620 is arranged so that the display area (A/A) on the flexible substrate 610 and the touch area (T/A) where the touch electrodes 625 are disposed correspond to each other.

The touch electrode 625 is disposed in the touch area (T/A) of the touch screen panel 620. The touch electrode 625 may be configured so that a plurality of touch driving electrodes (Tx) and a plurality of touch sensing electrodes (Rx) intersect.

The touch pad 630 is disposed on one side of the outer portion surrounding the touch area (T/A) of the touch screen panel 620, and is correspondingly disposed on the non-display area (N/A) on the flexible substrate 620. . The touch connection wire 635 serves to electrically connect the touch electrode 625 and the touch pad 630.

At the end of the touch screen panel 620, a touch circuit board 640 is connected to the touch pad 630 and made of an insulating film. The touch circuit board 640 may include a touch electrode 625 disposed in the touch area (T/A), various wiring for transmitting signals to each other, and a touch sensing circuit for sensing touch input.

The touch circuit board 640 is inserted into the cutting area (C/A) of the flexible board 610 and bent, and the non-display area (N/A) is formed by bending the flexible board 610 in the bending area (B/A). ) When the touch circuit board 640 is bent by bending it with a width equal to or narrower than the width, the bezel area of the flexible electroluminescent display device 600 can be minimized compared to when it is bent on the flexible substrate 610. There is.

Figure 6b is a perspective view of a touch screen and a flexible substrate of a flexible electroluminescent display device according to an embodiment of the present specification.

Some components of FIG. 6B are substantially the same/similar to the components described in FIG. 6A and detailed description thereof will be omitted.

Referring to FIG. 6B, as described in FIG. 6A, the touch screen panel 620 corresponds to the display area (A/A) on the flexible substrate 610 and the touch area (T/A) where the touch electrode 625 is disposed. arranged to do so. The touch electrode 625 is disposed in the touch area (T/A) of the touch screen panel 620.

The polarizer 630 disposed on the touch screen panel 620 suppresses reflection of external light on the display area A/A. When the flexible electroluminescent display device 600 is used outside, external natural light flows in and is reflected by a reflector included in the anode of the electroluminescent device or by an electrode made of metal disposed at the bottom of the electroluminescent device. You can. The image may not be clearly visible due to the reflected lights. The polarizer 630 polarizes light introduced from the outside in a specific direction and prevents the reflected light from being emitted outside of the display device 600 again. The polarizer 630 may be disposed on the display area A/A, but is not limited thereto.

The polarizing plate 630 may be a polarizing plate composed of a polarizer and a protective film that protects it, or may be formed by coating a polarizing material for flexibility.

A cover glass (CG) that protects the exterior of the display device 600 may be placed by placing an adhesive layer on the polarizing plate 630.

A back plate 650 is disposed below the flexible substrate 610. When the flexible substrate 610 is made of a plastic material such as polyimide, the manufacturing process of the flexible electroluminescent display device 600 proceeds with a support substrate made of glass placed below the flexible substrate 610, and the manufacturing process proceeds. After completion, the support substrate can be separated and released.

Since components are needed to support the flexible substrate 610 even after the support substrate is released, a backplate 650 for supporting the flexible substrate 610 may be disposed below the flexible substrate 610. The backplate 650 may be disposed adjacent to the bending area (B/A) in other areas of the flexible substrate 610 other than the bending area (B/A).

The backplate 650 may be made of a plastic thin film formed of polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymers, or a combination of these polymers.

A support member 655 is disposed between the two back plates 650, and the support member 655 may be adhered to the back plate 650 by an adhesive layer.

The support member 655 may be formed of a plastic material such as polycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymers, or combinations of these polymers. The strength of the support member 66 formed of these plastic materials may be controlled by adding additives to increase the thickness and strength of the support member 655, such as glass, ceramic, metal or other rigid material. ) may be formed from materials or combinations of the foregoing materials.

A micro coating layer 660 is disposed on the bending area (B/A) of the flexible substrate 610. At this time, as described in FIG. 6A, the micro coating layer 660 is not disposed on the cutting area (C/A) formed by cutting one side of the flexible substrate 610.

The micro coating layer 660 serves to protect the wiring by coating it with a thin layer of resin at the bending position because tension may occur on the wiring portion disposed on the flexible substrate 610 during bending, which may cause cracks. can do. The micro coating layer 660 may be made of an acrylic material such as acrylate polymer, but is not limited thereto.

The micro coating layer 660 can adjust the neutral plane of the bending area (B/A). The neutral plane refers to a virtual surface on which no stress occurs because the compressive force and tensile force applied to the structure cancel each other out when the structure is bent. When two or more structures are stacked, a virtual neutral plane may be formed between the structures. When the entire structure is bent in one direction, the structures arranged in the bending direction with respect to the neutral plane are compressed by bending and thus receive a compressive force. On the contrary, structures placed in the direction opposite to the bending direction based on the neutral plane are stretched by bending and thus receive a tensile force. At this time, structures are generally more vulnerable when subjected to tensile force among the same compressive force and tensile force, so the probability of cracks occurring when subjected to tensile force is higher.

The flexible substrate 610 disposed below the neutral plane is compressed and thus receives a compressive force, and the wiring disposed on the upper portion may receive a tensile force, and thus cracks may occur due to the tensile force. Therefore, in order to minimize the tension on the wiring, it can be located on the neutral plane.

By placing the micro coating layer 660 on the bending area (B/A), the neutral plane can be raised upward, and the neutral plane can be formed at the same position as the wiring or located at a higher position than the neutral plane to reduce stress during bending. The occurrence of cracks can be suppressed by not being exposed to compressive force.

An insulating film 680 is connected to the end of the flexible substrate 610. Various wirings are formed on the insulating film 680 to transmit signals to pixels arranged in the display area (A/A). The insulating film 680 is made of a material that has flexibility so that it can be bent. A driving element may be mounted on the insulating film 680, and together with the insulating film 680, it forms a driving package such as a chip on film (COF), and is formed on the insulating film 680. It is connected to the wiring and provides driving signals and data to the pixels placed in the display area (A/A).

The circuit board connected to the insulating film 680 can receive image signals from the outside and apply various signals to pixels arranged in the display area (A/A), and may be a printed circuit board.

At the end of the touch screen panel 620, a touch circuit board 640 is connected to the touch pad 630 and made of an insulating film. As explained in FIG. 6A, the touch circuit board 640 is formed by inserting and bending the cutting area (C/A) of the flexible substrate 610 and bending the flexible substrate 610 in the bending area (B/A). By bending the touch circuit board 640 with a width equal to or narrower than the width of the non-display area (N/A), the size of the flexible electroluminescent display device 600 is higher than when the touch circuit board 640 is bent on the flexible board 610. This has the effect of minimizing the bezel area.

In detail, the touch circuit board 540 is inserted into the cutting area (C/A) so that the flexible board 610 including the micro coating layer 660 in the bending area (B/A) is substantially larger than the touch circuit board 640. It protrudes further in the outer direction, which has the effect of reducing the width of the unnecessary non-display area (N/A) generated by the touch circuit board 640.

A flexible electroluminescent display device according to an embodiment of the present specification includes a flexible substrate including a display area, a bending area extending from one side of the display area, and a cutting area formed by cutting one side of the bending area, and on the display area. Thin film transistor and light emitting device disposed, wiring and planarization layer disposed on the display area and bending area, micro coating layer disposed on the flattening layer of the bending area, touch screen substrate disposed on the display area, and connection to the touch screen substrate. The flexible substrate includes a cutting area formed by cutting one side of the bending area, and the touch circuit board is inserted into the cutting area and bent.

The width of the cutting area of the flexible electroluminescent display device according to the embodiment of the present specification is larger than the width of the touch circuit board.

In the flexible electroluminescent display device according to an embodiment of the present specification, the microcoating layer in the bending area protrudes more toward the outside of the flexible substrate than the touch circuit board.

The flexible electroluminescent display device according to an embodiment of the present specification further includes a buffer layer disposed on the flexible substrate.

The wiring of the flexible electroluminescent display device according to the embodiment of the present specification is composed of a plurality of metal layers.

The wiring disposed on the bending area of the flexible electroluminescent display device according to the embodiment of the present specification has one of the following shapes: a diamond shape, a triangular wave shape, a sinusoidal wave shape, and a trapezoid shape.

A flexible electroluminescent display device according to an embodiment of the present specification includes an insulating film connected to a flexible substrate, and a driving element is disposed on the insulating film.

The planarization layer of the flexible electroluminescent display device according to the embodiment of the present specification is composed of a plurality of organic material layers.

Wiring lines are disposed on the flexible substrate and the planarization layer of the flexible electroluminescent display device according to the embodiment of the present specification.

The light emitting element of the flexible electroluminescent display device according to the embodiment of the present specification includes an anode, a light emitting unit, and a cathode.

A polarizer is further disposed on the touch screen substrate of the flexible electroluminescent display device according to the embodiment of the present specification.

A backplate is disposed on the bottom of the flexible substrate of the flexible electroluminescent display device according to an embodiment of the present specification.

A flexible electroluminescent display device according to an embodiment of the present specification is a flexible display area including a display area including pixels, a non-display area including a bending area disposed outside the display area, and a cutting area formed by cutting one side of the bending area. It includes a substrate, a touch screen substrate disposed on the display area, and a touch circuit board connected to the touch screen substrate. One side of the non-display area of the flexible substrate is cut to form a cutting area, and the touch circuit board is inserted into the cutting area. It can be bent to minimize the non-display area.

The width of the cutting area of the flexible electroluminescent display device according to the embodiment of the present specification is larger than the width of the touch circuit board.

The flexible electroluminescent display device according to an embodiment of the present specification further includes a microcoating layer disposed in the bending area, and the microcoating layer protrudes further outward from the flexible substrate than the touch circuit board.

A polarizer is further disposed on the touch screen substrate of the flexible electroluminescent display device according to the embodiment of the present specification.

A flexible electroluminescent display device according to an embodiment of the present specification includes an insulating film connected to a flexible substrate, and a driving element is disposed on the insulating film.

A pixel of a flexible electroluminescent display device according to an embodiment of the present specification emits light through a thin film transistor and a light emitting element.

The light emitting element of the flexible electroluminescent display device according to the embodiment of the present specification includes an anode, a light emitting unit, and a cathode.

A backplate is disposed on the bottom of the flexible substrate of the flexible electroluminescent display device according to an embodiment of the present specification.

A flexible electroluminescent display device according to an embodiment of the present specification is a flexible display including a display area, a bending area disposed outside the display area, a first area disposed on one side of the bending area, and a second area formed by cutting the bending area. It includes a substrate, a touch screen substrate disposed on a display area, and a touch circuit board connected to the touch screen substrate and disposed in a second area.

Circuit wiring that transmits signals to the display area and a pad are disposed in the first area of the flexible electroluminescent display device according to an embodiment of the present specification.

The touch circuit board of the flexible electroluminescent display device according to the embodiment of the present specification is bent in the bending area.

It further includes a micro coating layer disposed in the first region of the flexible electroluminescent display device according to an embodiment of the present specification, and the micro coating layer protrudes more toward the outside of the flexible substrate than the touch circuit board.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

100, 200, 300, 400, 500, 600: Electroluminescent display device
110: Image processing unit
120: Timing controller
130: data driver
140: gate driver
150: display panel
160: Pixels
220: Gateline
230: data line
240: switching transistor
250: Driving transistor
260: Compensation circuit
270, 440: Light emitting device
310, 410, 610: Flexible substrate
370, 670: Circuit wiring
390, 690: Gate driving part
395, 695: pad
420: Thin film transistor
422: Gate electrode
424: Source electrode
426: Drain electrode
428: semiconductor layer
431: first insulating layer
433: second insulating layer
435: first planarization layer
437: second planarization layer
442: anode
444: light emitting unit
446: cathode
450: bank
452: spacer
460: Encapsulation part
462: first wiring
464: second wiring
466, 650: Micro coating layer
520, 620: Touch screen board
525, 625: touch electrode
530, 630: Touchpad
535, 635: Touch connection wiring
540, 640: Touch circuit board
630: Polarizer
650: backplate
655: adhesive layer
660: Support member
680: circuit board
A/A: Display area
N/A: Non-display area
B/A: Bending area
C/A: Cutting area
T/A: Touch area
S/L: scanline

Claims (24)

A flexible substrate including a display area, a bending area extending from one side of the display area, and a cutting area formed by cutting one side of the bending area;
a thin film transistor and a light emitting element disposed on the display area;
wiring and a planarization layer disposed on the display area and the bending area;
A micro coating layer disposed on the flattening layer in the bending area;
a touch screen substrate disposed on the display area; and
Includes a touch circuit board connected to the touch screen board,
The flexible substrate includes a cutting area formed by cutting one side of the bending area, and the touch circuit board is inserted into the cutting area and bent,
The cutting area extends from one side of the bending area to one end of the flexible substrate. According to claim 1,
A flexible electroluminescent display device wherein the width of the cutting area is larger than the width of the touch circuit board. According to claim 1,
A flexible electroluminescent display device, wherein the microcoating layer in the bending area protrudes more toward the outside of the flexible substrate than the touch circuit board. According to claim 1,
A flexible electroluminescent display device in which a buffer layer is further disposed on the flexible substrate. According to claim 1,
A flexible electroluminescent display device, wherein the wiring is composed of a plurality of metal layers. According to claim 1,
A flexible electroluminescent display device, wherein the wiring disposed on the bending area has one of a diamond shape, a triangular wave shape, a sinusoidal wave shape, and a trapezoid shape. According to claim 1,
an insulating film connected to the flexible substrate; and
A flexible electroluminescent display device in which a driving element is disposed on the insulating film. According to claim 1,
A flexible electroluminescent display device, wherein the planarization layer is composed of a plurality of organic material layers. According to clause 7,
A flexible electroluminescent display device, wherein the wiring is disposed on the flexible substrate and the planarization layer, respectively. According to claim 1,
A flexible electroluminescent display device, wherein the light emitting element includes an anode, a light emitting unit, and a cathode. According to claim 1,
A flexible electroluminescent display device in which a polarizer is further disposed on the touch screen substrate. According to claim 1,
A flexible electroluminescent display device in which a backplate is disposed on a lower surface of the flexible substrate. A flexible substrate including a display area including pixels, a non-display area including a bending area disposed outside the display area, and a cutting area formed by cutting one side of the bending area;
a touch screen substrate disposed on the display area; and
Includes a touch circuit board connected to the touch screen board,
One side of the non-display area of the flexible substrate is cut to form a cutting area, and the touch circuit board is inserted into the cutting area and bent to minimize the non-display area,
The cutting area extends from one side of the bending area to one end of the flexible substrate. According to claim 13,
A flexible electroluminescent display device wherein the width of the cutting area is larger than the width of the touch circuit board. According to claim 13,
A flexible electroluminescent display device further comprising a microcoating layer disposed in the bending area, wherein the microcoating layer protrudes more toward the outside of the flexible substrate than the touch circuit board. According to claim 13,
A flexible electroluminescent display device in which a polarizer is further disposed on the touch screen substrate. According to claim 13,
an insulating film connected to the flexible substrate; and
A flexible electroluminescent display device in which a driving element is disposed on the insulating film. According to claim 13,
A flexible electroluminescent display device in which the pixel emits light through a thin film transistor and a light emitting element. According to clause 18,
A flexible electroluminescent display device, wherein the light emitting element includes an anode, a light emitting unit, and a cathode. According to claim 13,
A flexible electroluminescent display device in which a backplate is disposed on a lower surface of the flexible substrate. A flexible substrate including a display area, a bending area disposed outside the display area, and a first area disposed on one side of the bending area and a second area formed by cutting the bending area;
a touch screen substrate disposed on the display area; and
It is connected to the touch screen substrate and includes a touch circuit board disposed in the second area,
The second area extends from one side of the bending area to the other end of the bending area. According to claim 21,
A flexible electroluminescent display device, wherein circuit wiring for transmitting signals to the display area and a pad are disposed in the first area. According to claim 21,
A flexible electroluminescent display device, wherein the touch circuit board is bent in the bending area. According to claim 21,
A flexible electroluminescent display device further comprising a micro coating layer disposed in the first area, wherein the micro coating layer protrudes further outward from the flexible substrate than the touch circuit board.

Images