KR102261213B1 - Flexible Organic Light Emitting Display Device - Google Patents

Abstract

A flexible organic light emitting display device according to an embodiment of the present invention includes a first region, a bending region extending from one side of the first region, and a second region extending from one side of the bending region and facing at least a portion of the first region A flexible substrate comprising a, an organic light emitting device and a thin film transistor on an upper surface of the first region, a lower surface of the first region, and a back plate disposed on the same surface as the lower surface of the first region among the second region, sequentially stacked on the substrate a first planarization layer and a second planarization layer, a first wire disposed on a substrate, a second wire disposed on the first planarization layer, and a third wire disposed on the same layer as the first wire; The wiring is respectively connected to the third wiring in the region adjacent to the end of the back plate among the first and second regions, and the third wiring is connected in the first region and the second region in the region adjacent to the tip of the back plate in the bending region. Each of the third wirings is connected to the second wiring to minimize defects in the flexible organic light emitting diode display.

Description

Flexible Organic Light Emitting Display Device

The present invention relates to a flexible organic light emitting display device, and more particularly, to a flexible organic light emitting display device that minimizes defects in the flexible organic light emitting display device.

As we enter the information age in earnest, the field of display devices that visually display electrical information signals is rapidly developing, and research to develop performance such as thinness, weight reduction, and low power consumption for various display devices is continuing.

Representative display devices include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), and an electro-wetting display device (Electro-Wetting). Display device (EWD) and organic light emitting display device (Organic Light Emitting Display Device; OLED), and the like.

The organic light emitting display device is a self-luminous display device, and unlike a liquid crystal display device, it does not require a separate light source, so it can be manufactured in a lightweight and thin form. In addition, the organic light emitting display device is not only advantageous in terms of power consumption due to low voltage driving, but also has excellent color realization, response speed, viewing angle, and contrast ratio (CR), and is expected to be utilized in various fields.

In the organic light emitting display device, an organic light emitting layer (EML) using an organic material is disposed between two electrodes composed of an anode and a cathode. When holes from the anode are injected into the emission layer and electrons from the cathode are injected into the emission layer, the injected electrons and holes recombine with each other to form excitons in the emission layer and emit light.

In this case, the light emitting layer contains a host material and a dopant material, so that the two materials interact. The host generates excitons from electrons and holes and serves to transfer energy to the dopant, and the dopant is a dye-based organic material added in a small amount, and serves to receive energy from the host and convert it into light.

An organic light emitting display device including a light emitting layer made of an organic material encapsulates the organic light emitting display device with glass, metal, or film, so that moisture or oxygen is transferred from the outside to the inside of the organic light emitting display device. It blocks the inflow to prevent oxidation of the light emitting layer and electrode, and protects it from mechanical or physical impact applied from the outside.

As the display device is miniaturized, efforts are being made to reduce the bezel area, which is the outer portion of the active area (A/A), in order to increase the effective display screen size in the same area of the display device.

In general, since wiring and a driving circuit for driving a screen are disposed in a bezel area corresponding to a non-active area (N/A), there is a limit to reducing the bezel area.

In a flexible organic light emitting display device that can maintain display performance even when bent by applying a flexible substrate made of a flexible material such as plastic, which has been recently developed, the bezel area is reduced while securing the area for wiring and driving circuits. In order to do this, a technology for reducing the bezel area by bending the non-display area of the flexible substrate has been developed and applied.

In this case, in the organic light emitting display device using a flexible substrate such as plastic, it is necessary to secure flexibility such as a substrate, various insulating layers disposed on the substrate, and wiring formed of a metal material.

In the case of wiring, when a substrate on which wiring is formed is bent, cracks may be generated in the wiring due to tensile force caused by bending. When a crack is generated in the wiring, normal signal transmission is not performed, so that the thin film transistor or the organic light emitting diode cannot operate normally, leading to defects in the organic light emitting diode display.

In the case of the insulating layer, since the inorganic or organic material itself constituting the insulating layer has a characteristic of brittleness, the insulating layer has considerably lower flexibility than a wiring formed of a metal. Accordingly, when the substrate on which the insulating layer is formed is bent, cracks may also occur in the insulating layer due to the tensile force caused by bending.

When cracks occur in some regions of the insulating layer, the cracks propagate to other regions of the insulating layer, and propagate to wirings in contact with the insulating layer, leading to defects in the organic light emitting diode display.

Accordingly, the inventors of the present invention have invented an organic light emitting diode display having a new structure for minimizing defects caused by cracks in wiring formed in a bent region of the organic light emitting display device.

In addition, the inventors of the present invention recognize that the space to arrange wiring is insufficient as the resolution of the organic light emitting display device increases, and provide an organic light emitting display device having a new structure in which wiring can be more freely arranged within a limited space. invented.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A flexible organic light emitting display device according to an embodiment of the present invention includes a flexible substrate including a first area, a bending area extending from one side of the first area, and a second area extending from one side of the bending area, on the upper surface of the first area. On a flexible substrate including an organic light emitting device and a thin film transistor, a lower surface of the first region, and a backplate respectively disposed on the same surface as the lower surface of the first region among the second region, the first region, the bending region and the second region a first planarization layer and a second planarization layer sequentially stacked on the , a first wire disposed on the flexible substrate, a second wire disposed on the first planarization layer, and a third wire disposed on the same layer as the first wire and a second wiring in a region adjacent to the end of the support member in the first region and in the second region, and in a region adjacent to the end of the support member in the bending region, is connected to the third wiring.

A flexible organic light emitting display device according to an embodiment of the present invention includes a flexible substrate including a display area and a non-display area surrounding the display area, an organic light emitting diode and a thin film transistor on an upper surface of the display area, and in the non-display area, the substrate is A first planarization layer and a second planarization layer sequentially stacked on the bending area to be bent, the lower surface of the display area, and the back plate on the same surface as the lower surface of the display area in a part of the bending area, and the upper surface of the non-display area including the display area and the bending area Each of the wirings on the layer, the substrate and the first planarization layer, and the region adjacent to the end of the backplate are not affected by cracks in the second planarization layer by the wirings on the substrate.

The present invention has an effect of minimizing defects caused by cracks in wiring formed in a bending region of a flexible substrate used in a flexible organic light emitting display device.

The present invention has an effect that wiring used in a flexible organic light emitting display device can be more freely arranged in a limited space.

The effect according to the present invention is not limited by the contents exemplified above, and more various effects are included in the present specification.

Since the content of the invention described in the problems to be solved above, the means for solving the problems, and the effects do not specify essential features of the claims, the scope of the claims is not limited by the matters described in the content of the invention.

1 is a block diagram of an organic light emitting diode display according to an exemplary embodiment of the present invention.
2 is a circuit diagram of a pixel included in an organic light emitting diode display according to an exemplary embodiment of the present invention.
3 is a cross-sectional view of a pixel included in an organic light emitting diode display according to an exemplary embodiment of the present invention.
4 is a plan view of an organic light emitting display device according to an exemplary embodiment of the present invention.
5 is a cross-sectional view of a bending area B/A of a flexible organic light emitting diode display according to an exemplary embodiment of the present invention.
6 is a cross-sectional view illustrating wiring of a bending area B/A of a flexible organic light emitting diode display according to an exemplary embodiment of the present invention.
7A and 7B are cross-sectional views and plan views of a portion of a bending area B/A of a flexible organic light emitting diode display according to an exemplary embodiment of the present invention.
8A, 8B, and 8C are a plan view and a cross-sectional view of a portion of a weak area W/A of a flexible organic light emitting diode display according to an embodiment of the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are exemplary, and thus the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is interpreted as including an error range even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between the two parts unless 'directly' is used.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be implemented independently of each other or may be implemented together in a related relationship. may be

1 is a block diagram of an organic light emitting display device 100 according to an embodiment of the present invention.

Referring to FIG. 1 , the organic light emitting diode display 100 includes an image processing unit 110 , a timing controller 120 , a data driver 130 , a gate driver 140 , and a display panel 150 .

The image processing unit 110 outputs a data enable signal DE along with the data signal DATA supplied from the outside. The image processing unit 110 may output one or more of a vertical synchronization signal, a horizontal synchronization signal, and a clock signal in addition to the data enable signal DE.

The timing controller 120 receives the data signal DATA from the image processing unit 110 as well as a driving signal including a data enable signal DE or a vertical synchronization signal, a horizontal synchronization signal, and a clock signal. The timing controller 120 includes a gate timing control signal GDC for controlling the operation timing of the gate driver 140 and a data timing control signal DDC for controlling the operation timing of the data driver 130 based on the driving signal. to output

The data driver 130 samples and latches the data signal DATA supplied from the timing controller 120 in response to the data timing control signal DDC supplied from the timing controller 120 , converts it into a gamma reference voltage, and outputs it. . The data driver 130 outputs the data signal DATA through the data lines DL1 to DLn.

The gate driver 140 outputs a gate signal while shifting the level of the gate voltage in response to the gate timing control signal GDC supplied from the timing controller 120 . The gate driver 140 outputs a gate signal through the gate lines GL1 to GLm.

The display panel 150 displays an image while the pixel 160 emits light in response to the data signal DATA and the gate signal supplied from the data driver 130 and the gate driver 140 . The detailed structure of the pixel 160 will be described with reference to FIGS. 2 and 3 .

2 is a circuit diagram of a pixel included in an organic light emitting diode display according to an exemplary embodiment of the present invention.

Referring to FIG. 2 , a pixel of the organic light emitting diode display 200 includes a switching transistor 240 , a driving transistor 250 , a compensation circuit 260 , and an organic light emitting device 270 .

The organic light emitting device 270 operates to emit light according to a driving current formed by the driving transistor 250 .

The switching transistor 240 performs a switching operation so that the data signal supplied through the data line 230 is stored as a data voltage in the capacitor in response to the gate signal supplied through the gate line 220 .

The driving transistor 250 operates so that a constant driving current flows between the high potential power line VDD and the low potential power line GND in response to the data voltage stored in the capacitor.

The compensation circuit 260 is a circuit for compensating the threshold voltage of the driving transistor 350 , and the compensation circuit 260 includes one or more thin film transistors and a capacitor. The configuration of the compensation circuit may vary greatly depending on the compensation method.

In addition, the pixel of the organic light emitting diode display 200 has a 2T (Transistor) 1C (Capacitor) structure including a switching transistor 240 , a driving transistor 250 , a capacitor and an organic light emitting device 270 , but a compensation circuit When 260 is added, 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, 7T2C, and the like may be variously formed.

3 is a cross-sectional view of a pixel included in an organic light emitting diode display according to an exemplary embodiment of the present invention.

The substrate 310 serves to support and protect the components of the organic light emitting diode display 300 disposed thereon. Recently, since the substrate 310 may be made of a flexible material having a flexible characteristic, the substrate 310 may be It may be a flexible substrate.

In this case, the flexible substrate may be in the form of a film including one selected from the group consisting of a polyester-based polymer, a silicone-based polymer, an acrylic polymer, a polyolefin-based polymer, and a copolymer thereof.

Specifically, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polysilane (polysilane), polysiloxane (polysiloxane), polysilazane (polysilazane), polycarbosilane (polycarbosilane), polyacrylate (polyacrylate) , polymethacrylate, polymethylacrylate, polymethylmethacrylate, polyethylacrylate, polyethylmethacrylate, cyclic olefin copolymer (COC) ), cyclic olefin polymer (COP), polyethylene (PE), polypropylene (PP), polyimide (PI), polymethylmethacrylate (PMMA), polystyrene (PS), polyacetal (POM), polyetherether Ketone (PEEK), Polyestersulfone (PES), Polytetrafluoroethylene (PTFE), Polyvinylchloride (PVC), Polycarbonate (PC), Polyvinylidenefluoride (PVDF), Perfluoroalkyl polymer (PFA) ), styrene-acrylnitrile copolymer (SAN), and a combination thereof may be composed of at least one.

A buffer layer may be further formed and disposed on the substrate 310 . The buffer layer prevents penetration of moisture or other impurities through the substrate 310 and may planarize the surface of the substrate 310 . The buffer layer is not a necessary configuration, and may not be disposed depending on the type of the substrate 310 or the type of the thin film transistor 320 disposed on the substrate.

The thin film transistor 320 disposed on the substrate 310 includes a gate electrode 322 , a source electrode 324 , a drain electrode 326 , and a semiconductor layer 328 .

The semiconductor layer 328 has better mobility than amorphous silicon or amorphous silicon, so it has low energy consumption and excellent reliability. Polycrystalline silicon that can be applied to a driving thin film transistor in a pixel ), but is not limited thereto.

Recently, oxide semiconductors have been spotlighted for their excellent mobility and uniformity. The oxide semiconductor is a quaternary metal oxide indium tin gallium zinc oxide (InSnGaZnO)-based material, a ternary metal oxide indium gallium zinc oxide (InGaZnO)-based material, indium tin zinc oxide (InSnZnO)-based material, indium aluminum zinc oxide (InAlZnO) ) based material, tin gallium zinc oxide (SnGaZnO) based material, aluminum gallium zinc oxide (AlGaZnO) based material, tin aluminum zinc oxide (SnAlZnO) based material, indium zinc oxide (InZnO) based material as binary metal oxide, tin zinc Oxide (SnZnO)-based material, aluminum zinc oxide (AlZnO)-based material, zinc magnesium oxide (ZnMgO)-based material, tin magnesium oxide (SnMgO)-based material, indium magnesium oxide (InMgO)-based material, indium gallium oxide (InGaO)-based material material, an indium oxide (InO)-based material, a tin oxide (SnO)-based material, a zinc oxide (ZnO)-based material, or the like, and the composition ratio of each element is not particularly limited.

The semiconductor layer 328 may include a source region, a drain region, and a channel between the source and drain regions including p-type or n-type impurities, and is adjacent to the channel. A lightly doped region may be included between the source region and the drain region.

The gate insulating layer 331 is an insulating film composed of a single or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), and is disposed so that current flowing through the semiconductor layer 328 does not flow to the gate electrode 322 . In this case, silicon oxide has lower ductility than metal, but has superior ductility compared to silicon nitride, and may be selectively formed as a single layer or a plurality of layers according to its characteristics.

The gate electrode 322 serves as a switch for turning on or off the thin film transistor 320 based on an electric signal transmitted from the outside through the gate line, and a conductive metal A single layer or alloy of phosphorus copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd), etc. It may be composed of multiple layers, but is not limited thereto.

The source electrode 324 and the drain electrode 326 are connected to the data line so that an electric signal transmitted from the outside is transmitted from the thin film transistor 320 to the organic light emitting diode 340 . The source electrode 324 and the drain electrode 326 are conductive metals copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and a metal material such as neodymium (Nd) or an alloy thereof may be configured as a single layer or multiple layers, but is not limited thereto.

In order to insulate the gate electrode 322, the source electrode 324, and the drain electrode 326 from each other, an interlayer insulating layer 333 composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx) is used as the gate electrode. It may be disposed between the 322 and the source electrode 324 and the drain electrode 326 .

A passivation layer 335 made of an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) is disposed on the thin film transistor 320 . The passivation layer 335 may prevent unnecessary electrical connections between components of the thin film transistor 320 and may prevent external contamination or damage. The passivation layer 335 may be omitted depending on the configuration and characteristics of the thin film transistor 320 and the organic light emitting device 340 .

The thin film transistor 320 may be classified into an inverted staggered structure and a coplanar structure according to positions of components constituting the thin film transistor 320 . In the thin film transistor of the inverted staggered structure, the gate electrode is positioned opposite the source electrode and the drain electrode with respect to the semiconductor layer. As shown in FIG. 3 , in the thin film transistor 320 having a coplanar structure, the gate electrode 322 is positioned on the same side as the source electrode 324 and the drain electrode 326 with respect to the semiconductor layer 328 .

Although the thin film transistor 320 having a coplanar structure is illustrated in FIG. 3 , the organic light emitting diode display may include a thin film transistor having an inverted staggered structure.

For convenience of description, only the driving thin film transistor is illustrated among various thin film transistors that may be included in the organic light emitting diode display, but a switching thin film transistor and a capacitor may also be included in the organic light emitting display. At this time, when a signal is applied from the gate line to the switching thin film transistor, the signal from the data line is transferred to the gate electrode of the driving thin film transistor. The driving thin film transistor transmits a current transmitted through the power wiring to the anode according to a signal received from the switching thin film transistor, and controls light emission by the current transmitted to the anode.

The thin film transistor 320 is protected and the step difference generated by the thin film transistor 320 is alleviated, and the parasitic capacitance generated between the thin film transistor 320 and the gate line and data line, and the organic light emitting device 340 ( A planarization layer 337 is disposed on the thin film transistor 320 to reduce parasitic-capacitance.

The planarization layer 337 is an acrylic resin, an epoxy resin, a phenolic resin, a polyamides resin, a polyimides resin, an unsaturated polyester resin (Unsaturated Polyesters Resin), polyphenylene-based resin (Polyphenylene Resin), polyphenylenesulfide-based resin (Polyphenylenesulfides Resin), and benzocyclobutene (Benzocyclobutene) may be formed of at least one material, but is not limited thereto.

In this case, the planarization layer 337 may be disposed as a plurality of layers, and the detailed structure will be described in detail with reference to FIG. 6 .

The organic light emitting diode 340 disposed on the planarization layer 337 includes an anode 342 , a light emitting unit 344 , and a cathode 346 .

The anode 342 may be disposed on the planarization layer 337 . In this case, the anode 342 is an electrode serving to supply holes to the light emitting part 344 , and may be electrically connected to the thin film transistor 320 through a contact hole in the planarization layer 337 .

The anode 342 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), or the like, which are transparent conductive materials, but is not limited thereto.

On the other hand, when the organic light emitting diode display 300 is a top emission that emits light to an upper portion where the cathode 346 is disposed, the emitted light is reflected from the anode 342 to more smoothly the cathode 346 . It may further include a reflective layer so that it can be emitted in the upper direction in which it is disposed. In addition, the anode 342 may have a two-layer structure in which a transparent conductive layer and a reflective layer made of a transparent conductive material are sequentially stacked, or a three-layer structure in which a transparent conductive layer, a reflective layer, and a transparent conductive layer are sequentially stacked, and the reflective layer is silver ( Ag) or an alloy containing silver.

The bank 350 disposed on the anode 342 and the planarization layer 337 may define a pixel partitioning a region that actually emits light. After photoresist is formed on the anode 342 , the bank 350 is formed by photolithography. The photoresist refers to a photosensitive resin whose solubility in a developer is changed by the action of light, and a specific pattern can be obtained by exposing and developing the photoresist. The photoresist may be classified into a positive photoresist and a negative photoresist. The positive photoresist refers to a photoresist in which the solubility of the exposed portion in the developer is increased by exposure, and when the positive photoresist is developed, a pattern in which the exposed portion is removed is obtained. In addition, the negative photoresist refers to a photoresist whose solubility in the developer of the exposed portion is greatly reduced by exposure, and when the negative photoresist is developed, a pattern in which the unexposed portion is removed is obtained.

In order to form the light emitting part 344 of the organic light emitting device 340, a deposition mask, FMM (Fine Metal Mask) may be used. At this time, in order to prevent damage that may be caused by contact with the deposition mask disposed on the bank 350 and to maintain a constant distance between the bank 350 and the deposition mask, a transparent organic material polyi is placed on the bank 350 . A spacer 352 composed of one of mid, photoacryl and benzocyclobutene (BCB) may be disposed.

A light emitting part 344 is disposed between the anode 342 and the cathode 346 . The light emitting unit 344 serves to emit light, and includes a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer, an electron transport layer (ETL), and an electron injection layer. At least one layer of an Electron Injection Layer (EIL) may be included, and some components of the light emitting unit 444 may be omitted depending on the structure or characteristics of the organic light emitting display device 300 . Here, as the light emitting layer, it is also possible to apply an organic light emitting layer and an inorganic light emitting layer.

The hole injection layer is disposed on the anode 342 to facilitate hole injection. The hole injection layer is, for example, HAT-CN (dipyrazino[2,3-f:2',3'-h]quinoxaline-2,3,6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine), and It may be formed of any one or more of N,N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine (NPD).

The hole transport layer is disposed on the hole injection layer to smoothly transfer holes to the light emitting layer. The hole transport layer is, for example, NPD (N,N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine), TPD (N,N'-bis) -(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), s-TAD(2,2',7,7'-tetrakis(N,N-dimethylamino)-9,9-spirofluorene) , and MTDATA (4,4',4"-Tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine).

The light emitting layer is disposed on the hole transport layer and includes a material capable of emitting light of a specific color to emit light of a specific color. In this case, the light emitting material may be formed using a phosphorescent material or a fluorescent material.

When the emission layer emits red light, the emission peak wavelength may be in the range of 600 nm to 650 nm, and CBP (4,4'-bis (carbazol-9-yl) biphenyl) or mCP (1,3) -bis(carbazol-9-yl)benzene) containing host material, PIQIr(acac)(bis(1-phenylisoquinoline)(acetylacetonate) iridium), PQIr(acac)(bis(1-phenylquinoline)(acetylacetonate) ) iridium), PQIr (tris(1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum). Alternatively, it may be made of a fluorescent material including PBD:Eu(DBM)3(Phen) or Perylene.

Here, the peak wavelength λmax refers to the maximum wavelength of EL (ElectroLuminescence). The wavelength at which the light emitting layers constituting the light emitting part emits their own light is called PL (PhotoLuminescence), and the light emitted by the thickness or optical characteristics of the layers constituting the light emitting layers is called the emittance. In this case, EL (ElectroLuminescence) refers to light finally emitted by the organic light emitting display device, and may be expressed as a product of PL (PhotoLuminescence) and an emittance (Emittance).

When the emission layer emits green light, the emission peak wavelength may be in the range of 520 nm to 540 nm, and includes a host material including CBP or mCP, and Ir(ppy) ₃ (tris(2-phenylpyridine)iridium ) may be made of a phosphorescent material including a dopant material such as an Ir complex containing. In addition, _{it may be made of a fluorescent material including Alq 3} (tris(8-hydroxyquinolino)aluminum).

When the emission layer emits blue light, the emission peak wavelength may be in the range of 440 nm to 480 nm, and includes a host material including CBP or mCP, and FIrPic(bis(3,5-difluoro-2) -(2-pyridyl)phenyl-(2-carboxypyridyl)iridium) may be formed of a phosphorescent material including a dopant material, and spiro-DPVBi(4,4'-Bis(2,2-diphenyl-ethen) -1-yl)biphenyl), DSA (1-4-di-[4-(N,N-di-phenyl)amino]styryl-benzene), PFO (polyfluorene)-based polymer, or PPV (polyphenylenevinylene)-based polymer It may be made of a fluorescent material including one.

The electron transport layer is disposed on the light emitting layer to facilitate the movement of electrons to the light emitting layer. The electron transport layer is, for example, Liq (8-hydroxyquinolinolato-lithium), PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole), TAZ (3- (4-biphenyl)4-phenyl-5-tert-butylphenyl-1,2,4-triazole), spiro-PBD, BCP (2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline) and BAlq (bis(2-methyl-8-quinolinolate)-4-(phenylphenolato)aluminum).

An electron injection layer may be further disposed on the electron transport layer. The electron injection layer is an organic layer that facilitates electron injection from the cathode 346 , and may be omitted depending on the structure and characteristics of the organic light emitting display device 300 . The electron injection layer is BaF2, LiF, NaCl, CsF, Li 2 O , and may be a metallic inorganic compound such as BaO, HAT-CN (dipyrazino [ 2,3-f: 2 ', 3'-h] quinoxaline-2, 3,6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine), and NPD (N,N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine) It may be any one or more organic compounds.

By further disposing an electron blocking layer or a hole blocking layer that blocks the flow of holes or electrons in a position adjacent to the light emitting layer, when electrons are injected into the light emitting layer, they move from the light emitting layer and pass through the adjacent hole transport layer or When a hole is injected into the light emitting layer, it is possible to prevent a phenomenon that the hole moves from the light emitting layer and passes to the adjacent electron transport layer, thereby improving the luminous efficiency.

The cathode 346 is disposed on the light emitting unit 344 and serves to supply electrons to the light emitting unit 344 . Since the cathode 346 must supply electrons, it may be formed of a metal material such as magnesium (Mg), silver-magnesium (Ag:Mg), which is a conductive material having a low work function, but is not limited thereto. Alternatively, when the organic light emitting diode display 300 is a top emission type, the cathode 346 may include indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), or zinc. It may be a transparent conductive oxide based on oxide (ZnO) and tin oxide (TiO).

To prevent the thin film transistor 320 and the organic light emitting diode 340, which are components of the organic light emitting diode display 300, from being oxidized or damaged due to moisture, oxygen, or impurities introduced from the outside on the organic light emitting diode 340 An encapsulation unit 360 may be disposed for the purpose, and a plurality of encapsulation layers, a foreign material compensation layer, and a plurality of barrier films may be laminated to form.

The encapsulation layer is disposed on the upper front surface of the thin film transistor 320 and the organic light emitting device 340, and may be made of one of inorganic silicon nitride (SiNx) or aluminum oxide (AlyOz), but is not limited thereto. An encapsulation layer may be further stacked on the foreign material compensation layer disposed on the encapsulation layer.

The foreign material compensation layer is disposed on the encapsulation layer, and an organic material such as silicon oxycarbon (SiOCz), acryl or epoxy resin may be used, but is not limited thereto. The foreign material compensation layer compensates for the bending and foreign material being covered by the foreign material compensation layer when a defect occurs due to cracks generated by foreign materials or particles that may be generated during the process.

By disposing a barrier film on the encapsulation layer and the foreign material compensation layer, the organic light emitting display device 300 may further delay the penetration of oxygen and moisture from the outside. The barrier film is configured in the form of a film having light-transmitting and double-sided adhesive properties, and may be composed of any one insulating material of olefin-based, acrylic-based, and silicone-based insulating materials, or COP (Copolyester). Thermoplastic Elastomer), COC (Cycoolefin Copolymer), and PC (Polycarbonate) may be further laminated with a barrier film composed of any one material, but is not limited thereto.

4 is a plan view of an organic light emitting display device according to an exemplary embodiment of the present invention.

Referring to FIG. 4 , the flexible organic light emitting display device 400 includes an active area (A/A) in which pixels actually emitting light through a thin film transistor and an organic light emitting device are disposed on a flexible substrate 410 ; and a non-active area (N/A) surrounding the edge of the display area A/A.

At this time, FIG. 4 is a plan view of a state in which the flexible substrate 410 of the flexible organic light emitting diode display 400 according to an embodiment of the present invention is not bent.

A circuit and wiring for driving the flexible organic light emitting display device 400 may be disposed in the non-display area N/A of the flexible substrate 410 . In this case, it may be disposed on the substrate 410 as a gate in panel (GIP), or may be connected to the flexible substrate 410 using a tape carrier package (TCP) or a chip on film (COF) method.

A portion of the non-display area N/A of the flexible substrate 410 may be bent in a bending direction as indicated by an arrow to form the bending area B/A. The non-display area N/A of the flexible substrate 410 is not a region where an image is displayed because wiring and a driving circuit for driving the screen are disposed, so it is not necessary to be visually recognized from the upper surface of the flexible substrate 410 . No, a portion of the non-display area N/A of the flexible substrate 410 is bent to secure an area for the wiring and the driving circuit while reducing the bezel area.

The bending region B/A of the flexible substrate 410 will be described in detail with reference to FIGS. 5 to 6 .

Various wirings are formed on the flexible substrate 410 . The wiring may be formed in the display area A/A of the substrate 410, or the circuit wiring 420 formed in the non-display area N/A may be connected to a driving circuit, a gate driver, a data driver, etc. signal can be transmitted.

The circuit wiring 420 may be formed of a conductive material, and may be formed of a conductive material having excellent ductility to minimize cracks from occurring when the flexible substrate 410 is bent. For example, it may be formed of a conductive material having excellent ductility, such as gold (Au), silver (Ag), aluminum (Al), etc., and may be formed of one of various conductive materials used in the display area A/A. , molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) and magnesium (Mg). . In this case, it may be configured as a multi-layer structure including various conductive materials, for example, it may be configured as a three-layer structure of titanium (Ti)/aluminum (Al)/titanium (Ti), but is not limited thereto.

The circuit wiring 420 formed in the bending area B/A receives a tensile force when bent. In particular, the circuit wiring 420 extending in the same direction as the bending direction on the flexible substrate 410 receives the greatest tensile force, and cracks may occur, and in severe cases, disconnection may occur. Accordingly, rather than forming the circuit wiring 420 to extend in the bending direction, at least a portion of the circuit wiring 420 disposed including the bending region B/A extends in a diagonal direction that is different from the bending direction. By forming, it is possible to minimize the occurrence of cracks by minimizing the tensile force.

The circuit wiring 420 disposed including the bending area B/A may be formed in various shapes, for example, a trapezoidal wave shape, a triangular wave shape, a sawtooth wave shape, a sinusoidal wave shape, an omega (Ω) shape, a rhombus. It may be formed in various shapes such as a shape.

The detailed structure of the circuit wiring 420 disposed including the bending region B/A of the flexible substrate 410 will be described in detail with reference to FIGS. 6 to 8C .

The gate signal and data signal described in FIG. 1 are disposed in the display area A/A from the outside through the circuit wiring 420 disposed in the non-display area N/A of the flexible organic light emitting display device 400 . It is transmitted to the pixel to emit light.

5 is a cross-sectional view of a bending area B/A of a flexible organic light emitting diode display according to an exemplary embodiment of the present invention.

Referring to FIG. 5 , a barrier film 520 is disposed on the flexible substrate 510 . The barrier film 520 is a component for protecting various components of the flexible organic light emitting display device 500 , and may be disposed to correspond to at least the display area A/A of the flexible organic light emitting display device 500 . In this case, the barrier film 520 may be made of a material having an adhesive property, and may serve to fix the polarizing plate 530 on the barrier film 520 .

A back plate 540 is disposed under the flexible substrate 510 . When the flexible substrate 510 is made of a plastic material such as polyimide, the flexible organic light emitting display device 500 manufacturing process proceeds in a situation in which a support substrate made of glass is disposed under the flexible substrate 510, and the manufacturing process is After completion, the support substrate can be released to separate.

Since components for supporting the flexible substrate 510 are required even after the supporting substrate is released, a back plate 540 for supporting the flexible substrate 510 may be disposed under the flexible substrate 510 . The back plate 540 may be disposed adjacent to the bending area B/A in another area of the flexible substrate 510 except for the bending area B/A.

Backplate 540 may be made of a thin plastic film formed of polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), other suitable polymers, combinations of these polymers, or the like.

A support member 570 is disposed between the two backplates 540 , and the support member 570 may be adhered to the backplate 540 by an adhesive layer 560 . Support member 570 may be formed of a plastic material such as polycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), other suitable polymers, combinations of these polymers, or the like. . The strength of the support member 570 formed of these plastic materials may be controlled by providing additives to increase the thickness and strength of the support member 570 . In addition, the support member 570 may be formed of glass, ceramic, metal, or other rigid materials or combinations of the aforementioned materials.

A micro coating layer 550 is disposed on the bending area B/A of the flexible substrate 510 . In this case, the micro coating layer 550 may be formed to cover one side and the barrier film 520 . The micro-coating layer 550 protects the wiring by coating the resin at the bent position with a thin thickness because a tensile force may be applied to the wiring portion disposed on the flexible substrate 510 during bending and micro-cracks may occur. plays a role

An insulating film 580 is connected to an end of the substrate 510 . Various wirings for transmitting signals to pixels disposed in the display area A/A are formed on the insulating film 580 . The insulating film 580 is formed of a material having flexibility so that it can be bent. A driving device may be mounted on the insulating film 580 , and a driving package such as a chip on film (COF) is formed together with the insulating film 650 , and formed on the insulating film 580 . It is connected to the wiring to provide a driving signal and data to the pixels disposed in the display area A/A.

The circuit board connected to the insulating film 580 may receive an image signal from the outside and apply various signals to the pixels disposed in the display area A/A, and may be a printed circuit board. .

6 is a cross-sectional view illustrating wiring of a bending area B/A of a flexible organic light emitting diode display according to an exemplary embodiment of the present invention.

FIG. 6 is an enlarged cross-section of an area in which wirings of the non-display area N/A including the bending area B/A are disposed in the flexible organic light emitting diode display 500 described with reference to FIG. 5 for convenience of explanation. It is a cross section.

Referring to FIG. 6 , the first wiring 620 and the second wiring 630 are sequentially disposed on the entire surface of the non-display area N/A including the bending area B/A of the flexible substrate 610 .

When the wiring disposed in the non-display area N/A including the bending area B/A of the flexible organic light emitting display device 600 is formed in a single-layer structure, a large amount of space is required. After depositing the conductive material, the conductive material is patterned in the shape of the wiring to be formed by a process such as etching. Since the precision of the etching process is limited, a lot of space is required due to the limitation in narrowing the gap between the wirings, Since the area of the non-display area N/A is increased, it may be difficult to implement a narrow bezel.

In addition, when a single wire is used to transmit one signal, the corresponding signal may not be transmitted when a crack occurs in the corresponding wire. In the process of bending the flexible substrate 610 , cracks may be generated in the wiring itself or cracks in other layers may be generated and the cracks may propagate to the wiring. As such, when a crack occurs in the wiring, the transmitted signal may not be transmitted.

Accordingly, the wirings disposed in the non-display area N/A including the bending area B/A of the flexible organic light emitting diode display 600 according to the embodiment of the present invention are the first wiring 620 and the second wiring. The wiring 630 is disposed in the form of a double wiring.

The first wiring 620 and the second wiring 630 may be formed of a conductive material, and may be formed of a conductive material having excellent ductility in order to reduce the occurrence of cracks when the flexible substrate 610 is bent. For example, it may be formed of a conductive material having excellent ductility, such as gold (Au), silver (Ag), aluminum (Al), etc., and may be formed of one of various conductive materials used in the display area (A/A). , molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) and magnesium (Mg). . In addition, it may be composed of a multi-layer structure including various conductive materials, for example, it may be composed of a three-layer structure of titanium (Ti)/aluminum (Al)/titanium (Ti), but is not limited thereto.

The first wiring 620 and the second wiring 630 may be surrounded by an insulating material for protecting the first wiring 620 and the second wiring 630 . For example, the first wiring 620 and the second wiring 630 may be surrounded by an inorganic layer for protecting the first wiring 620 and the second wiring 630 . For example, a buffer layer made of an inorganic material may be disposed on the lower portion, and a passivation layer made of an inorganic material may be formed to surround upper portions and sides of the first wiring 620 and the second wiring 630 . Accordingly, a phenomenon in which the first wiring 620 and the second wiring 630 react with moisture and corrode may be prevented.

A back plate 640 is disposed under the flexible substrate 610 in an area excluding the bending area B/A. Backplate 640 may be made of a thin plastic film formed of polyimide, polyethylene naphthalate, polyethylene terephthalate, other suitable polymers, combinations of these polymers, or the like.

A first planarization layer 650 is deposited and formed on the first wiring 620 to planarize the upper portion. The first planarization layer 650 is substantially the same as/similar to the planarization layer 337 described with reference to FIG. 3 . And, the first planarization layer 650 is an acrylic resin (Acrylic Resin), an epoxy resin (Epoxy Resin), a phenol resin (Phenolic Resin), a polyamide-based resin (Polyamides Resin), a polyimide-based resin (Polyimides Resin), unsaturated Polyester-based resin (Unsaturated Polyesters Resin), polyphenylene-based resin (Polyphenylene Resin), polyphenylenesulfides-based resin (Polyphenylenesulfides Resin), and benzocyclobutene (Benzocyclobutene) It may be formed of at least one material, but is not limited thereto. does not

A second wiring 630 is disposed on the first planarization layer 660 . As the second wiring 630 is disposed on the first planarization layer 660 , the number of wirings for transmitting a signal in the display area A/A may be more comfortably secured.

A second planarization layer 660 is deposited on the second wiring 630 to planarize an upper portion thereof. The second planarization layer 660 is substantially the same as/similar to the planarization layer 337 described with reference to FIG. 3 . And, the first planarization layer 650 is an acrylic resin (Acrylic Resin), an epoxy resin (Epoxy Resin), a phenol resin (Phenolic Resin), a polyamide-based resin (Polyamides Resin), a polyimide-based resin (Polyimides Resin), unsaturated Polyester-based resin (Unsaturated Polyesters Resin), polyphenylene-based resin (Polyphenylene Resin), polyphenylene sulfide-based resin (Polyphenylenesulfides Resin), and benzocyclobutene (Benzocyclobutene) may be formed of at least one material, but is not limited thereto. does not

On the second planarization layer 660 , when bending in the bending region B/A of the flexible substrate 610 , a tensile force is applied to the first wiring 620 and the second wiring 630 disposed on the flexible substrate 610 . Since micro-cracks may occur due to the action, a thin layer of resin is coated on the upper part to protect the wiring.

The organic layer such as the first planarization layer 650 and the second planarization layer 660 has a brittle property of the organic film material itself, and thus has considerably lower flexibility than a wiring formed of a metal. Accordingly, when the substrate on which the insulating layer is formed is bent, cracks may also occur in the insulating layer due to the tensile force caused by bending.

During bending, the second planarization layer 660 disposed above the first planarization layer 650 receives a greater tensile force, so cracks are often first generated in some areas, and the generated cracks are generated in other areas of the insulating layer. and propagates to the second wiring 630 in contact with the second planarization layer 660 , which may lead to defects in the flexible organic light emitting diode display 600 .

In addition, the back plate 640 disposed in an area excluding the bending area B/A under the flexible substrate 610 has high hardness to support the flexible substrate 610 , and the back plate 640 . ), a crack is generated from the top of the second planarization layer 660 in the area adjacent to the back plate 640 and propagated to the bottom while the tensile force is concentrated in the weak area (W/A) adjacent to the end of the second planarization As the crack propagates in the second wiring 630 that is in direct contact with the layer 660 , a defect may occur. The weak area W/A is set to an appropriate area according to the material, size, location, and process variation of the flexible substrate 610 and the back plate 640 .

Accordingly, the inventors of the present invention have invented an organic light emitting display device having a new structure for minimizing defects caused by cracks in wiring formed in the bending region B/A in the flexible organic light emitting display device 600 . .

A third wiring 625 disposed on the same layer as the first wiring 620 and not connected to each other is disposed in the weak area W/A adjacent to the end of the back plate 640 . In this case, a partial region or the entire region of the third interconnection 625 including both ends of the weak region W/A in the bending direction may include a second interconnection 630 disposed on the first planarization layer 650 and will overlap.

A contact hole 670 is formed in a region where the second wiring 630 and the third wiring 625 overlap at both ends of the weak region W/A in the bending direction to form the second wiring 630 and the third wiring. As the wiring 625 is connected to each other, cracks are transmitted from the top to the bottom of the second planarization layer 660 in the weak region W/A during bending, and even if a crack occurs in the second wiring 630, A signal may be bypassed and transferred to another region through the third wiring 625 .

Accordingly, even if a crack occurs in the wiring generated by bending in the flexible organic light emitting display device 600 , the flexible organic light emitting display device 600 may be normally driven without a defect.

Further, detailed structures of the bending region B/A and the weak region W/A will be described with reference to FIGS. 7A and 7B and 8A, 8B and 8C, respectively.

7A and 7B are cross-sectional views and plan views of a portion of a bending area B/A of a flexible organic light emitting diode display according to an exemplary embodiment of the present invention.

7A and 7B illustrate only a portion of the bending area B/A in the flexible organic light emitting diode display described with reference to FIGS. 1 to 6 for convenience of explanation. The main components are substantially the same as or similar to the main components described in FIGS. 1 to 6 .

7A is a plan view of a portion of the bending region B/A of the flexible organic light emitting diode display 700, and FIG. 7B is a cross-sectional view taken along line VII-VII' of FIG. 7A.

7A and 7B illustrate only a portion of the bending area B/A in the flexible organic light emitting diode display described with reference to FIGS. 1 to 6 for convenience of explanation. The main components are substantially the same as or similar to the main components described in FIGS. 1 to 6 .

7A is a plan view of a portion of the bending region B/A of the flexible organic light emitting diode display 700, and FIG. 7B is a cross-sectional view taken along line VII-VII' of FIG. 7A.

7A and 7B , the first wiring 720 is disposed on the flexible substrate 710 and the first planarization layer 750 is disposed on the first wiring 720 . A second wire 760 is disposed on the first planarization layer 750 , and a second planarization layer 760 is disposed on the second wire 760 .

The first wiring 720 and the second wiring 730 formed in the bending region B/A receive a tensile force when bent. As described in FIG. 4 , the wiring extending in the same direction as the bending direction on the flexible substrate 610 receives the greatest tensile force, and cracks may occur. If the cracks are severe, disconnection may occur. Accordingly, rather than forming the wiring to extend in the bending direction, at least a portion of the wiring disposed including the bending region B/A is formed to extend in an oblique direction that is different from the bending direction, thereby minimizing tensile force to minimize cracks. occurrence can be reduced.

The first wiring 720 and the second wiring 730 of FIG. 7A of the flexible organic light emitting diode display 700 according to the embodiment of the present invention have a Zig-Zag shape along the bending direction. The angle between the first wiring 270 and the second wiring 730 and the straight line in the bending direction is 60 degrees, and the angle between the wires at the vertex of the zigzag shape may be about 60 degrees. In addition, the angle of the zigzag wiring is set to an appropriate area according to the bending degree of the flexible substrate 710 and the material, size, position, and process of the wiring, but is not limited thereto.

The first wiring 720 and the second wiring 730 may be formed of a conductive material, and may be formed of a conductive material having excellent ductility to minimize cracks from occurring when the flexible substrate 710 is bent. For example, it may be formed of a conductive material having excellent ductility, such as gold (Au), silver (Ag), aluminum (Al), etc., and may be formed of one of various conductive materials used in the display area (A/A). , molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) and magnesium (Mg). . In this case, it may be configured as a multi-layer structure including various conductive materials, for example, it may be configured as a three-layer structure of titanium (Ti)/aluminum (Al)/titanium (Ti), but is not limited thereto.

The first wiring 720 and the second wiring 730 located on different layers may transmit different signals, and a gap between the first wiring 720 and the second wiring 730 may be maximized.

As the distance between the first wiring 720 and the second wiring 730 decreases, the possibility of interference with signals transmitted through the first wiring 720 and the second wiring 730 increases. The distance between the first wiring 720 and the second wiring 730 may be maximized within a possible range.

The first wiring 720 and the second wiring 730 do not overlap each other, and the second wiring 730 is disposed between the first wirings 720 that are adjacent to each other, for example, the first wirings 720 that are adjacent to each other. It may be disposed to correspond to the central portion between the

8A, 8B, and 8C are a plan view and a cross-sectional view of a portion of a weak area W/A of a flexible organic light emitting diode display according to an embodiment of the present invention.

8A, 8B, and 8C illustrate only a part of the weak area W/A in the flexible organic light emitting diode display described with reference to FIGS. 1 to 6 for convenience of explanation. The main components are substantially the same as or similar to the main components described in FIGS. 1 to 6 .

8A is a plan view of a part of the weak area W/A of the flexible organic light emitting diode display 800, and FIGS. 8B and 8C are cross-sectional views of VIIIa-VIIIa' and VIIIb-VIIIb' of FIG. 8A, respectively.

Referring to FIGS. 8A, 8B and 8C , a first wiring 820 and a third wiring 825 that are not connected to each other while being disposed on the same layer as the first wiring 820 are disposed on the flexible substrate 810 . and a first planarization layer 850 is disposed on the first wiring 820 and the third wiring 825 . A second wiring 860 is disposed on the first planarization layer 850 in a region overlapping with the third wiring 825 , and a second planarization layer 860 is disposed on the second wiring 860 .

6, the first wiring 820, the second wiring 830 and the third wiring ( 825) also receives a tensile force when bent in the same manner as the wiring disposed in the bending area B/A. As described in FIG. 4 , the wiring extending in the same direction as the bending direction on the flexible substrate 610 receives the greatest tensile force, and cracks may occur. If the cracks are severe, disconnection may occur. Therefore, rather than forming the wiring to extend in the bending direction, the wiring disposed including the weak region W/A is also similar to the bending region B/A, at least a portion of the wiring is in a diagonal direction different from the bending direction. By forming to extend, it is possible to reduce the occurrence of cracks by minimizing the tensile force.

The first wiring 820 and the third wiring 825 of FIG. 8A of the flexible organic light emitting diode display 800 according to the embodiment of the present invention have a Zig-Zag shape along the bending direction. In the case of the weak area W/A, since it is adjacent to the back plate area compared to the bending area B/A described with reference to FIG. 7A, the degree of bending is less, and accordingly, the first wiring 820 and the third wiring ( 825) and the straight line in the bending direction is 30 degrees, and the angle between the wires at the vertex of the zigzag shape may be around 120 degrees. In addition, the angle of the zigzag wiring is set to an appropriate area according to the bending degree of the flexible substrate 810 and the material, size, position, and process of the wiring, but is not limited thereto.

In the case of the weak area W/A, as described with reference to FIG. 6 , both the first wiring 820 and the third wiring 835 are formed on the same layer on the flexible substrate 810 . In addition, the spacing between the respective wires is affected by the angle between the wires in the zigzag shape. Accordingly, the angle between the wires in the weak area W/A may have a larger angle than the angle between the wires in the bending area B/A.

The first wiring 820 , the second wiring 830 , and the third wiring 725 are formed of a conductive material, and are made of a conductive material with excellent ductility to minimize cracks occurring during bending of the flexible substrate 810 . can be formed. For example, it may be formed of a conductive material having excellent ductility, such as gold (Au), silver (Ag), aluminum (Al), etc., and may be formed of one of various conductive materials used in the display area (A/A). , molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) and magnesium (Mg). . It may be composed of a multi-layer structure including various conductive materials, for example, it may be composed of a three-layer structure of titanium (Ti)/aluminum (Al)/titanium (Ti), but is not limited thereto.

As described with reference to FIG. 6 , the second wiring 830 and the third wiring 825 overlap each other in the region including both ends in the bending direction of the weak region W/A.

Referring to FIG. 8B , which is a cross-sectional view taken along line VIIIa-VIIIa' of FIG. 8A , the second wiring 830 and the third wiring 825 are formed through the contact hole 870 formed in the first planarization layer 850 in the overlapping region. ) are connected to each other. In addition, the process of forming the contact hole 870 and the process of connecting the second wiring 830 and the third wiring 825 to each other are a process of forming the components of the organic light emitting display device described with reference to FIG. 3 without an additional process. can proceed with

Referring to FIG. 8C , which is a cross-sectional view taken along line VIIIb-VIIIb' of FIG. 8A , the first wiring 820 and the third wiring 825 are disposed on the flexible substrate 810 . In addition, since the separation distance between the two wirings has a smaller value than the bending area B/A, the angle between the zigzag wirings of the first wiring 820 and the third wiring 825 is increased in the wiring forming process. Wiring can be formed stably.

A flexible organic light emitting display device according to an embodiment of the present invention includes a flexible substrate including a first area, a bending area extending from one side of the first area, and a second area extending from one side of the bending area, on the upper surface of the first area. On a flexible substrate including an organic light emitting device and a thin film transistor, a lower surface of the first region, and a backplate respectively disposed on the same surface as the lower surface of the first region among the second region, the first region, the bending region and the second region a first planarization layer and a second planarization layer sequentially stacked on the , a first wire disposed on the flexible substrate, a second wire disposed on the first planarization layer, and a third wire disposed on the same layer as the first wire and a second wiring in a region adjacent to the end of the support member in the first region and in the second region, and in a region adjacent to the end of the support member in the bending region, is connected to the third wiring.

The third wiring of the flexible organic light emitting diode display according to the embodiment of the present invention is disposed in a region adjacent to the end of the backplate in the first region, the bending region, and the second region.

At least a portion of the second wiring and the third wiring of the flexible organic light emitting display device according to the embodiment of the present invention overlap each other, and in the overlapping region, the second wiring and the third wiring are connected to each other through the contact hole of the first planarization layer. Connected.

The first wiring and the third wiring of the flexible organic light emitting diode display according to the embodiment of the present invention are separated from each other.

The first wiring, the second wiring, and the third wiring disposed in the bending area of the flexible organic light emitting diode display according to the embodiment of the present invention include portions formed in a zigzag shape.

The first wiring and the second wiring disposed in the bending region of the flexible organic light emitting diode display according to the embodiment of the present invention are spaced apart from each other, and the first wiring and the second wiring are sequentially alternately arranged.

It is disposed in the first region and the second region of the flexible organic light emitting diode display according to the embodiment of the present invention, and the first wiring, the second wiring, and the third wiring in the area adjacent to the end of the backplate extend in a zigzag shape.

The first wiring and the third wiring extending in a zigzag shape in the first region and the second region of the flexible organic light emitting diode display according to the exemplary embodiment are spaced apart from each other by a smaller interval than the first wiring in the bending region.

The first wiring and the third wiring extending in a zigzag shape in the first region and the second region of the flexible organic light emitting diode display according to an embodiment of the present invention are interposed between the zigzag wirings rather than the first wiring and the second wiring in the bending region. The angle has a larger value.

A driving element is disposed on the insulating film connected to the second region of the flexible organic light emitting diode display according to an embodiment of the present invention.

Each of the first wiring, the second wiring, and the third wiring of the flexible organic light emitting diode display according to an embodiment of the present invention is composed of a plurality of metal layers.

A micro-coating layer is disposed on the second planarization layer in the bending region of the flexible organic light emitting diode display according to an embodiment of the present invention.

A flexible organic light emitting display device according to an embodiment of the present invention includes a flexible substrate including a display area and a non-display area surrounding the display area, an organic light emitting diode and a thin film transistor on an upper surface of the display area, and in the non-display area, the substrate is A first planarization layer and a second planarization layer sequentially stacked on the bending area to be bent, the lower surface of the display area, and the back plate on the same surface as the lower surface of the display area in a part of the bending area, and the upper surface of the non-display area including the display area and the bending area Each of the wirings on the layer, the substrate and the first planarization layer, and the region adjacent to the end of the backplate are not affected by cracks in the second planarization layer by the wirings on the substrate.

The wiring disposed in the bending area of the flexible organic light emitting diode display according to the embodiment of the present invention extends in a zigzag shape.

It is disposed in the bending area of the flexible organic light emitting diode display according to the embodiment of the present invention, and the respective wirings on the substrate and the first planarization layer are spaced apart from each other and sequentially alternately disposed.

In the flexible organic light emitting display device according to an exemplary embodiment of the present invention, wirings disposed in an area adjacent to an end of a backplate extend in a zigzag shape.

The wirings disposed in the region adjacent to the end of the backplate of the flexible organic light emitting diode display according to the embodiment of the present invention are spaced apart from each other by a smaller distance than the wirings disposed in the bending region.

The wiring disposed in the region adjacent to the end of the backplate of the flexible organic light emitting display device according to the embodiment of the present invention is between the zigzag-shaped wirings based on the direction from the display area to the bending region rather than the wiring disposed in the bending region. The angle has a larger value.

A driving element is disposed on the insulating film connected to the non-display area of the substrate of the flexible organic light emitting diode display according to the embodiment of the present invention.

Each wiring on the substrate and the first planarization layer of the flexible organic light emitting diode display according to an embodiment of the present invention is composed of a plurality of metal layers.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100, 200, 300, 400, 500, 600, 700, 800: organic light emitting display device
110: image processing unit 120: timing controller
130: data driver 140: gate driver
150: display panel
160: pixel
220: gate line
230: data line
240: switching transistor 250: driving transistor
260: compensation circuit
270, 340: organic light emitting device
310, 410, 510, 610, 710, 810: substrate
320: thin film transistor 322: gate electrode
324: source electrode 326: drain electrode
328: semiconductor layer 331: gate insulating layer
333: interlayer insulating layer 335: passivation layer
337: planarization layer 342: anode
344: light emitting part 346: cathode
350: bank 352: spacer
360: encapsulation unit 420: circuit wiring
520: barrier film 530: polarizing plate
540, 640: back plate
550, 680: micro coating layer
560: adhesive layer 570: support member
580: circuit board
620, 720, 820: first wiring
625, 825: third wiring
630, 730, 830: second wiring
650, 750, 850: first planarization layer
660, 760, 860: second planarization layer
670, 870: contact hole
A/A: Display area N/A: Non-display area
B/A: Bending area W/A: Vulnerable area

Claims (20)

a flexible substrate including a first region, a bending region extending from one side of the first region, and a second region extending from one side of the bending region;
an organic light emitting device and a thin film transistor on an upper surface of the first region;
a back plate disposed on the same surface as the lower surface of the first area among the lower surface of the first area and the second area;
a first planarization layer and a second planarization layer sequentially stacked on the flexible substrate including the first region, the bending region, and the second region;
a first wiring disposed on the flexible substrate;
a second wiring disposed on the first planarization layer; and
and a third wiring disposed on the same layer as the first wiring,
Among the first region and the second region, the second wiring in a region adjacent to the end of the back plate and in the region adjacent to the end of the back plate in the bending region is connected to the third wiring, flexible organic light emitting display device. According to claim 1,
and the third wiring is disposed in a region adjacent to an end of the back plate in the first region, the bending region, and the second region. According to claim 1,
at least a portion of the second wiring and the third wiring overlap each other, and in the overlapping region, the second wiring and the third wiring are connected to each other through a contact hole of the first planarization layer. Device. According to claim 1,
and the first wiring and the third wiring are separated from each other. According to claim 1,
and the first wiring, the second wiring, and the third wiring disposed in the bending region include portions formed in a zigzag shape. 6. The method of claim 5,
The first wiring and the second wiring disposed in the bending region are spaced apart from each other, and the first wiring and the second wiring are sequentially alternately arranged. 6. The method of claim 5,
The flexible organic light emitting diode display is disposed in the first region and the second region, and wherein the first wiring, the second wiring, and the third wiring in an area adjacent to an end of the backplate extend in a zigzag shape. 8. The method of claim 7,
and the first and third wires extending in a zigzag shape from the first region and the second region are spaced apart from each other by a smaller interval than the first interconnection in the bending region. 9. The method of claim 8,
The first wiring and the third wiring extending in a zigzag shape in the first region and the second region have a larger angle between the zigzag wirings than the first wiring and the second wiring in the bending region. , a flexible organic light emitting display device. According to claim 1,
an insulating film connected to the second region; and
A flexible organic light emitting display device, in which a driving element is disposed on the insulating film. According to claim 1,
and each of the first wiring, the second wiring, and the third wiring includes a plurality of metal layers. According to claim 1,
A flexible organic light emitting display device, wherein a micro-coating layer is disposed on the second planarization layer in the bending region. a flexible substrate including a display area and a non-display area surrounding the display area;
an organic light emitting diode and a thin film transistor disposed on an upper surface of the display area;
a bending area in the non-display area in which the substrate is bent;
a back plate disposed on the same surface as the lower surface of the display area in the lower surface of the display area and a part of the bending area;
a first planarization layer and a second planarization layer sequentially stacked on an upper surface of the non-display area including the display area and the bending area;
respective wirings on the substrate and the first planarization layer; and
and a region adjacent to the end of the backplate is not affected by cracks in the second planarization layer by the wiring on the substrate. 14. The method of claim 13,
The wiring disposed in the bending area extends in a zigzag shape. 15. The method of claim 14,
The flexible organic light emitting display device is disposed in the bending region, and the respective wirings on the substrate and the first planarization layer are spaced apart from each other and sequentially alternately disposed. 15. The method of claim 14,
A flexible organic light emitting display device, wherein wirings disposed in an area adjacent to an end of the back plate extend in a zigzag shape. 17. The method of claim 16,
and the wirings disposed in an area adjacent to the end of the backplate are spaced apart from each other by a smaller distance than the wirings disposed in the bending area. 18. The method of claim 17,
The wiring disposed in the region adjacent to the end of the backplate has a larger angle between the zigzag-shaped wirings with respect to the direction from the display area toward the bending region than the wiring disposed in the bending region, Flexible organic light emitting display device. 14. The method of claim 13,
an insulating film connected to the non-display area of the substrate; and
A flexible organic light emitting display device, in which a driving element is disposed on the insulating film. 14. The method of claim 13,
and each wiring on the substrate and the first planarization layer includes a plurality of metal layers.

Images