KR20190064988A - Flexible Electroluminescent Display Device - Google Patents

Abstract

According to the present invention, provided is a flexible electroluminescent display device comprising: a flexible substrate including a display area, a bending area extended and bent in one side of the display area, and a cutting area formed by cutting one side of the bending area; a thin film transistor and a light emitting device disposed on the display area; wirings and planarization layers disposed on the display area and the bending area; a micro coating layer disposed on the planarization layer of the bending area; a touch screen substrate disposed on the display area; and a touch circuit board connected to the touch screen board. The flexible substrate includes the cutting area formed by cutting one side of the bending area, and the touch circuit board is inserted into the cutting area and bent.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a flexible electroluminescent display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible electroluminescence display device, and more particularly, to a flexible electroluminescence display device capable of minimizing a region of a bezel of a flexible electroluminescence display device.

As the era of information age approaches, there is a rapid development of a display device field for visually displaying electrical information signals. Researches are continuing to develop performance such as thinning, lightening, and low power consumption for various display devices.

Typical display devices include a liquid crystal display device (LCD), a field emission display device (FED), an electro-wetting display device (EWD), and an organic light- Light Emitting Display Device (OLED), and the like.

An electroluminescent display device typified by an organic light emitting display device is a self-emissive display device, and unlike a liquid crystal display device, a separate light source is not required, so that it can be manufactured in a light and thin shape. In addition, the electroluminescent display device is advantageous in terms of power consumption by low-voltage driving, and has excellent color implementation, response speed, viewing angle, and contrast ratio (CR), and is expected to be utilized in various fields.

An electroluminescent display device has an emissive layer (EML) disposed between two electrodes made of an anode and a cathode. When holes in the anode are injected into the light emitting layer and electrons in the cathode are injected into the light emitting layer, excited electrons and holes are recombined to form excitons in the light emitting layer.

A host material and a dopant material are included in the light emitting layer so that interaction between the two materials occurs. The host generates excitons from electrons and holes, transfers energy to the dopant, and the dopant is a dye organic material And receives energy from the host to convert it into light.

The electroluminescence display device encapsulates an electroluminescence display device with a glass, a metal or a film to block moisture or oxygen from entering the electroluminescence display device from the outside, And protects against external mechanical or physical impacts.

Efforts to reduce the bezel area, which is the outer portion of the active area (A / A), have been continued to increase the effective display screen size in the same area of the display device as the display device has become smaller.

In the bezel region corresponding to the non-active area (N / A), the wiring for driving the screen and the driving circuit are disposed.

With respect to a flexible electroluminescent display device capable of maintaining the display performance even when bent by applying a flexible substrate of a flexible material such as plastic, which has been recently developed, an area for a wiring and a driving circuit is secured, A technology for reducing a bezel area by bending a non-display area of a flexible substrate to reduce an area has been developed and applied.

An electroluminescent display device using a flexible substrate such as a plastic substrate has flexibility of a substrate, various insulating layers disposed on the substrate, wiring formed of a metal material, etc., and a crack It is necessary to prevent defects such as cracks.

In addition, as a means of inputting a display device, a touch screen panel (Touch Screen Panel) which can input information directly to a screen of a display device by using a finger or a pen instead of an input means such as a mouse or a keyboard, ) Is increasingly used in various fields.

A touch screen panel disposed on an upper portion of the display device converts a touch position directly touching a user's hand or an object into an electrical signal, and the instruction content selected at the touch position is received as an input signal and displayed on the screen through the display device .

The touch circuit board disposed in the bezel area, which is a non-display area of the display device, includes a wiring and a touch circuit connected to the touch screen panel for driving the touch screen panel. As a result, the bezel area of the display device has been obstructed.

Therefore, the inventors of the present invention have invented a new structure of an electroluminescent display device capable of minimizing a region of a touch circuit board of a touch screen panel disposed in a bezel region in an electroluminescent display device.

The inventors of the present invention have recognized that a space for arranging wiring is insufficient as the resolution of an electroluminescence display device increases, and realize a new structure of an electroluminescence display device capable of arranging wiring more freely in a limited space Invented.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

A flexible electroluminescent display device according to an embodiment of the present invention includes a flexible substrate including a display region, a bending region extending from one side of the display region and bent, and a cutting region formed by cutting one side of the bending region, A wiring and a planarization layer disposed on the display region and the bending region, a micro-coating layer disposed on the planarization layer of the bending region, a touch screen substrate disposed on the display region, and a touch screen substrate And the flexible substrate includes a cutting area formed by cutting one side of the bending area, and the touch circuit board is inserted into the cutting area and bent.

A flexible electroluminescent display device according to an embodiment of the present invention includes a display region including a pixel, a non-display region having a bending region disposed outside the display region, and a flexible region including a cut region formed by cutting one side of the bending region. A touch screen substrate disposed on the display area, and a touch circuit board connected to the touch screen substrate, wherein one side of the non-display area of the flexible substrate is cut to form a cut area, So that the non-display area can be minimized.

A flexible electroluminescent display device according to an embodiment of the present invention includes a flexible region including a display region, a first region disposed on one side of a bending region disposed outside the display region, and a second region formed by cutting a bending region, A touch screen substrate disposed on the display region, and a touch circuit substrate connected to the touch screen substrate and disposed in the second region.

The electroluminescent display device according to the embodiment of the present invention has an effect of minimizing a bezel area by reducing the area of a touch circuit board included in a touch screen panel disposed on an upper portion of a flexible substrate.

The flexible electroluminescent display device according to the embodiment of the present invention has an effect that the wirings used in the flexible electroluminescent display device can be arranged more freely in a limited space.

The effects of the flexible electroluminescent display device according to the embodiment of the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

The scope of the claims is not limited by the matters described in the description of the specification, as the contents of the description in the problems, the solutions to the problems, and the effects described above do not specify the essential features of the claims.

1 is a block diagram of an electroluminescent display device according to an embodiment of the present invention.
2 is a circuit diagram of a pixel included in an electroluminescent display device according to an embodiment of the present invention.
3 is a plan view of an electroluminescent display device according to an embodiment of the present invention.
4A and 4B are cross-sectional views illustrating a detailed structure of a display region and a bending region of an electroluminescent display device according to an embodiment of the present invention.
5 is a plan view of an electroluminescence display touch screen panel according to an embodiment of the present invention.
6A and 6B are a plan view and a perspective view of a touch screen and a flexible substrate of a flexible electroluminescence display device according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

It is to be understood that each of the features of the various embodiments herein may be combined or combined with each other, partially or wholly, and technically various interlocking and driving are possible, and that the embodiments may be practiced independently of each other, It is possible.

1 is a block diagram of an electroluminescent display device 100 according to an embodiment of the present invention.

Referring to FIG. 1, an EL display device 100 includes an image processing unit 110, a timing controller 120, a data driver 130, a gate driver 140, and a display panel 150.

The image processing unit 110 outputs a data enable signal DE together with a data signal DATA supplied from the outside. The image processing unit 110 may output at least one of a vertical synchronization signal, a horizontal synchronization signal, and a clock signal in addition to the data enable signal DE.

The timing controller 120 receives a data enable signal DE or a data signal DATA in addition to a drive signal including a vertical synchronization signal, a horizontal synchronization signal, and a clock signal from the image processing unit 110. The timing controller 120 generates a gate timing control signal GDC for controlling the operation timing of the gate driver 140 and a data timing control signal DDC for controlling the operation timing of the data driver 130 based on the drive signal. .

The data driver 130 samples and latches the data signal DATA supplied from the timing controller 120 in response to the data timing control signal DDC supplied from the timing controller 120 and converts the sampled data signal into a gamma reference voltage . The data driver 130 outputs the data signal DATA through the data lines DL1 to DLn.

The gate driver 140 outputs a gate signal while shifting the level of the gate voltage in response to the gate timing control signal GDC supplied from the timing controller 120. The gate driver 140 outputs the gate signal through the gate lines GL1 to GLm.

The display panel 150 displays an image while the pixel 160 emits light corresponding to the data signal DATA and the gate signal supplied from the data driver 130 and the gate driver 140. The detailed structure of the pixel 160 will be described in detail in FIG. 2 and FIG.

2 is a circuit diagram of a pixel included in an electroluminescent display device according to an embodiment of the present invention.

2, a pixel of the EL display device 200 includes a switching transistor 240, a driving transistor 250, a compensation circuit 260, and a light emitting element 270.

The light emitting element 270 operates to emit light in accordance with the driving current generated by the driving transistor 250.

The switching transistor 240 performs a switching operation so that a data signal supplied through the data line 230 corresponding to the gate signal supplied through the gate line 220 is stored in the capacitor as a data voltage.

The driving transistor 250 operates so that a constant driving current flows between the high potential power supply line VDD and the low potential power supply line GND in response to the data voltage stored in the capacitor.

The compensation circuit 260 is a circuit for compensating the threshold voltage and the like of the driving transistor 250, and the compensation circuit 260 includes at least one thin film transistor and a capacitor. The configuration of the compensation circuit may vary widely depending on the compensation method.

The pixel of the electroluminescence display device 200 is composed of a 2T (Transistor) 1C (Capacitor) structure including a switching transistor 240, a driving transistor 250, a capacitor and a light emitting element 270, 260 can be additionally formed in the present invention, it can be formed into 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, 7T2C and the like.

3 is a plan view of an electroluminescent display device according to an embodiment of the present invention. Specifically, the flexible substrate 310 of the flexible electroluminescence display device 300 is not bent.

3, the flexible electroluminescent display device 300 includes a flexible substrate 310 on which a thin film transistor and a display region A / A and a display region A / Non-display area N / A which is a bezel area surrounding the periphery of the edge of the display area / A.

A non-display area N / A of the flexible substrate 310 is connected to various circuits such as a gate driver 390 for driving the flexible electro-luminescence display device 300 and a scan line (S / L) Wiring can be arranged.

The circuit for driving the flexible electroluminescence display device 300 may be arranged in a GIP (Gate in Panel) on a substrate 310 or a flexible substrate 310 in a TCP (Tape Carrier Package) or COF (Chip on Film) Lt; / RTI >

A pad 395, which is a metal pattern, may be disposed on one side of the substrate 310 of the non-display area N / A to bond the external module.

The bending area B / A can be formed by bending a part of the non-display area N / A of the flexible substrate 310 in the bending direction as shown by the arrow. The non-display area N / A of the flexible substrate 310 is not required to be visually recognized on the upper surface of the flexible substrate 310 because the wiring and the drive circuit for driving the screen are disposed and not the area where the image is displayed . Therefore, a portion of the non-display area N / A of the flexible substrate 310 can be bent to reduce the area of the bezel while securing an area for the wiring and the driver circuit.

Various wirings are formed on the flexible substrate 310. The wiring may be formed in the display area A / A of the substrate 310 or the circuit wiring 370 formed in the non-display area N / A may be formed by connecting a driving circuit, a gate driver, a data driver, Signal.

The circuit wiring 370 is formed of a conductive material and may be formed of a conductive material having excellent ductility to reduce the occurrence of cracks when the substrate 310 is bent. For example, the circuit wiring 370 may be formed of gold (Au), silver ), Aluminum (Al), or the like. For example, one or more of Mo, Cr, Ti, Ni, and Nd may be formed as one of various conductive materials used in the display area A / , Copper (Cu), and an alloy of silver (Ag) and magnesium (Mg).

The circuit wiring 370 may be formed of a multilayer structure including various conductive materials and may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti), but the present invention is not limited thereto.

The circuit wiring 370 formed in the bending area B / A is subjected to tensile force when bent. The circuit wiring 370 extending on the flexible substrate 310 in the same direction as the bending direction is subjected to the greatest tensile force, so that cracks or disconnection may occur. Therefore, instead of forming the circuit wiring 370 so as to extend in the bending direction, at least a part of the circuit wiring 370 arranged to include the bending area B / A may be extended in a diagonal direction different from the bending direction So that the tensile force can be minimized.

The circuit wiring 370 including the bending area B / A may be formed in various shapes and may be formed in a trapezoidal shape, a triangular shape, a sawtooth shape, a sinusoidal shape, an omega shape, .

On the display area A / A of the flexible substrate 310, the touch screen panel described in FIGS. 5 to 6B is disposed. The touch screen panel converts the touch position directly touching the user's hand or object into an electrical signal, and the instruction selected at the touch position is received as an input signal and displayed on the screen through the display device.

A cut-out area (C / A) is formed at one side of the non-display area N / A of the flexible substrate 310 by inserting and bending a touch circuit board on which a wiring connected to the touch screen panel and a touch circuit is inserted do.

The touch circuit board may include a touch electrode disposed on the touch screen panel, a touch sensing circuit for sensing various wirings and touch inputs for transmitting signals to each other, and an insulating film.

The cut area C / A is formed by cutting a region having a width larger than the width of the touch circuit board in the non-display area N / A of the flexible substrate 310 and inserting a touch circuit board composed of an insulating film Bending area. At this time, the circuit wiring 370 and the pad 395 arranged on the flexible substrate 310 are not arranged in the cutting area C / A but are not arranged in the cutting area C / A so as not to be affected by the cutting area C / A).

The structure of the touch screen panel disposed on the flexible substrate 310 and the detailed connection structure with the flexible substrate 310 will be described with reference to FIGS. 5 to 6B.

4A and 4B are cross-sectional views illustrating a detailed structure of a display region and a bending region of an electroluminescent display device according to an embodiment of the present invention.

4A is a cross-sectional view (I-I ') of the detailed structure of the display area A / A described with reference to FIG.

Referring to FIGS. 4A and 4B, the substrate 410 serves to support and protect the elements of the electroluminescent display device 400 disposed thereon. In recent years, the flexible substrate 410 can be used as a flexible material having a flexible characteristic such as plastic.

The flexible substrate 410 may be in the form of a film including one of a polyester polymer, a silicone polymer, an acrylic polymer, a polyolefin polymer, and a copolymer thereof. Examples of the film include polyethylene terephthalate (PET) But are not limited to, polybutylene terephthalate (PBT), polysilane, polysiloxane, polysilazane, polycarbosilane, polyacrylate, polymethacrylate, poly (Meth) acrylate, polymethyl methacrylate, polyethylacrylate, polyethylmetacrylate, cyclic olefin copolymer (COC), cyclic olefin polymer (COP), (PE), polypropylene (PP), polyimide (PI), polymethylmethacrylate (PMMA), polystyrene (PS) (POM), polyetheretherketone (PEEK), polyester sulfone (PES), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polycarbonate (PC), polyvinylidene fluoride A perfluoroalkyl polymer (PFA), a styrene acrylonitrile polymer (SAN), and combinations thereof.

A buffer layer may be further disposed on the flexible substrate 410. The buffer layer prevents penetration of moisture or other impurities from the outside through the flexible substrate 410, and the surface of the flexible substrate 410 can be planarized. The buffer layer is not necessarily required, and may be deleted depending on the type of the thin film transistor 420 disposed on the flexible substrate 410.

The thin film transistor 420 disposed on the flexible substrate 410 includes a gate electrode 422, a source electrode 424, a drain electrode 426, and a semiconductor layer 428.

The semiconductor layer 428 has a higher mobility than amorphous silicon or amorphous silicon and thus has low energy consumption and excellent reliability and can be applied to polycrystalline silicon ), But is not limited thereto.

The semiconductor layer may be formed of an oxide semiconductor. The oxide semiconductor has characteristics of excellent mobility and uniformity. The oxide semiconductors include indium tin gallium zinc oxide (InSnGaZnO) based materials which are quaternary metal oxides, indium gallium zinc oxide (InGaZnO) based materials which are ternary metal oxides, indium tin zinc oxide (InSnZnO) based materials, indium aluminum zinc oxide ) Based material, tin-gallium zinc oxide (SnGaZnO) -based material, aluminum gallium zinc oxide (AlGaZnO) -base material, tin aluminum zinc oxide (SnAlZnO) -based material, bimetallic metal oxide indium zinc oxide (InZnO) An InGaO 3 -based material, an InGaO 3 -based material, an InGaO 3 -based material, an InGaO 3 -based material, an AlGaN-based material, an SnZnO 3 -based material, an AlZnO 3 -based material, a ZnMgO 3 -based tin magnesium oxide material, The semiconductor layer 428 can be formed of a material selected from the group consisting of indium oxide (InO), tin oxide (SnO 2), and zinc oxide (ZnO) The composition ratio is not limited.

The semiconductor layer 428 may include a source region including a p-type or an n-type impurity, a drain region, and a channel between the source region and the drain region, And may further include a lightly doped region between the adjacent source and drain regions.

The source region and the drain region are regions where the impurity is highly doped, and the source electrode 424 and the drain electrode 426 of the thin film transistor 420 are connected, respectively. The p-type impurity may be one of boron (B), aluminum (Al), gallium (Ga), and indium (In), and the n-type impurity may be phosphorus P), arsenic (As) and antimony (Sb).

The semiconductor layer 428 may be doped with an n-type impurity or a p-type impurity depending on the structure of the NMOS or PMOS thin film transistor. The thin film transistor included in the electroluminescence display according to the embodiment of the present invention may be an NMOS Or a PMOS thin film transistor is applicable.

The first insulating layer 431 is an insulating layer composed of a single layer of silicon oxide (SiOx) or silicon nitride (SiNx) or a multilayer thereof and a current flowing in the semiconductor layer 428 flows into the gate electrode 422 . The silicon oxide is less ductile than the metal, but is superior in ductility to silicon nitride and can be formed into a single layer or a plurality of layers depending on the characteristics.

The gate electrode 422 serves as a switch for turning on or turning off the thin film transistor 420 based on an electric signal transmitted from the outside through the gate line, (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd) Or multiple layers, but is not limited thereto.

The source electrode 424 and the drain electrode 426 are connected to the data line and electric signals transmitted from the outside are transmitted from the thin film transistor 420 to the light emitting element 440. The source electrode 424 and the drain electrode 426 are formed of a conductive metal such as Cu, Al, Mo, Cr, Au, Ti, Ni, And neodymium (Nd), or an alloy thereof, and may be composed of a single layer or a multilayer, but is not limited thereto.

A second insulating layer 433 composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx) is formed to cover the gate electrode 422, the source electrode 424, and the drain electrode 426, And between the electrode 422 and the source electrode 424 and the drain electrode 426.

A passivation layer composed of an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) may be further disposed on the thin film transistor 420. [ The passivation layer can prevent unnecessary electrical connection between components disposed above and below the passivation layer and prevent contamination or damage from the outside. The passivation layer can be formed by a combination of the thin film transistor 420 and the light emitting element 440 And may be omitted depending on the characteristics.

The thin film transistor 420 may be classified into an inverted staggered structure and a coplanar structure depending on the positions of the constituent elements of the thin film transistor 420. In the thin film transistor of the inverted staggered structure, the gate electrode is located on the opposite side of the source electrode and the drain electrode with respect to the semiconductor layer. 4A, the thin film transistor 420 of the coplanar structure has the gate electrode 422 located on the same side of the source electrode 424 and the drain electrode 426 as the semiconductor layer 428 as a reference.

Although the thin film transistor 420 of the coplanar structure is shown in FIG. 4A, the electroluminescent display 400 may include a thin film transistor of an inverted staggered structure.

For convenience of explanation, only the driving thin film transistor among various thin film transistors included in the electroluminescence display device 400 is shown, and a switching thin film transistor, a capacitor, and the like may be included in the electroluminescence display device 400. [ When a signal is applied from the gate wiring, the switching thin film transistor transfers a signal from the data wiring to the gate electrode of the driving thin film transistor. The driving thin film transistor transmits a current, which is transmitted through the power supply wiring, to the anode 442 by a signal received from the switching thin film transistor, and controls the light emission by the current transmitted to the anode 442.

The parasitic capacitance generated between the thin film transistor 420 and the gate line and the data line and the light emitting elements 440 is reduced by protecting the thin film transistor 420 and alleviating a step generated by the thin film transistor 420. [ The planarization layers 435 and 437 are disposed on the thin film transistor 420 in order to reduce capacitance.

The planarization layers 435 and 437 may be formed of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, But is not limited to, one or more of Unsaturated Polyesters Resin, Polyphenylene Resin, Polyphenylenesulfides Resin, and Benzocyclobutene.

The electroluminescent display 400 according to the embodiment of the present invention may include a first planarization layer 435 and a second planarization layer 437 which are a plurality of planarization layers 435 and 437 sequentially stacked. A first planarization layer 435 may be stacked on the thin film transistor 420 and a second planarization layer 437 may be sequentially stacked on the first planarization layer 435.

A buffer layer may be disposed on the first planarization layer 435. The buffer layer is disposed to protect the components disposed on the first planarization layer 435 and may be a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multiple layer of silicon nitride (SiNx) or silicon oxide Layer, and may be omitted depending on the configuration and characteristics of the thin film transistor 420 and the light emitting element 440. [

The intermediate electrode 430 is connected to the thin film transistor 420 through a contact hole formed in the first planarization layer 435. The intermediate electrode 430 may be laminated to be connected to the thin film transistor 420, and the data line may be formed in a multi-layer structure.

Since the data line can be formed by connecting the lower layer made of the same material as the source electrode 424 and the drain electrode 426 and the upper layer made of the same material as the intermediate electrode 430, The data line can be implemented, so that the wiring resistance of the data line can be reduced.

A passivation layer composed of an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) may be further disposed on the first planarizing layer 435 and the intermediate electrode 430. [ The passivation layer may prevent unnecessary electrical connection between the components and prevent contamination or damage from the outside, and may be omitted depending on the configuration and characteristics of the thin film transistor 420 and the light emitting device 440.

The light emitting element 440 disposed on the second planarization layer 437 includes an anode 442, a light emitting portion 444, and a cathode 446.

The anode 442 may be disposed on the second planarization layer 437. The anode 442 is an electrode serving to supply holes to the light emitting portion 444 and is connected to the intermediate electrode 430 through a contact hole in the second planarization layer 437. The anode 442 is electrically connected to the thin film transistor 420, Lt; / RTI >

The anode 442 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), or the like, which is a transparent conductive material, but is not limited thereto.

When the electroluminescent display device 400 is in the top emission mode in which the cathode 446 is disposed, the emitted light is reflected by the anode 442 so that the cathode 446 is arranged more smoothly So that it can be emitted in the upward direction.

The anode 442 may have a two-layer structure in which a transparent conductive layer composed of a transparent conductive material and a reflective layer are sequentially stacked or a three-layer structure in which a transparent conductive layer, a reflective layer, and a transparent conductive layer are sequentially stacked, Or an alloy including silver.

The bank 450 disposed on the anode 442 and the second planarization layer 437 can define a pixel by dividing a region that actually emits light. After the photoresist is formed on the anode 442, the bank 450 is formed by photolithography. A photoresist is a photosensitive resin whose solubility in a developer is changed by the action of light, and a specific pattern can be obtained by exposing and developing the photoresist. The photoresist can be classified into a positive photoresist and a negative photoresist. The positive type photoresist refers to a photoresist whose solubility in a developing solution of the exposed portion is increased by exposure. When the positive type photoresist is developed, a pattern in which the exposed portion is removed is obtained. The negative type photoresist is a photoresist which is greatly reduced in the solubility of the exposed portion in a developing solution upon exposure. When the negative type photoresist is developed, a pattern in which the non-exposed portion is removed is obtained.

A FMM (Fine Metal Mask) which is a deposition mask may be used to form the light emitting portion 444 of the light emitting element 440. In order to prevent damage that may occur in contact with the deposition masks disposed on the banks 450 and to maintain a certain distance between the banks 450 and the deposition masks, (Spacer) 452 made of one of a perovskite-mesoporous, a photoacid, a benzocyclobutene (BCB) may be disposed.

A light emitting portion 444 is disposed between the anode 442 and the cathode 446. The light emitting portion 444 emits light and includes a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer, an electron transport layer (ETL) And an electron injection layer (EIL), and some components of the light emitting portion 444 may be omitted depending on the structure or characteristics of the electroluminescence display device 400. Here, the electroluminescent layer and the inorganic luminescent layer can be applied to the luminescent layer.

The hole injection layer is disposed on the anode 442, and serves to smoothly inject holes. The hole-injecting layer may be formed of HAT-CN (dipyrazino [2,3-f: 2 ', 3'-h] quinoxaline-2,3,6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine) N'-bis (N'-bis (naphthalene-1-yl) -N, N'-bis (phenyl) -2,2'-dimethylbenzidine).

The hole transport layer is disposed on the hole injection layer and serves to smoothly transfer holes to the light emitting layer. The hole-transporting layer may be formed of at least one selected from the group consisting of NPD (N, N'-bis (naphthalene-1-yl) -N, N'- methylphenyl) -N, N'-bis- (phenyl) -benzidine), s-TAD (2,2 ', 7,7'-tetrakis (N, N- dimethylamino) -9,9- spirofluorene), and MTDATA 4,4 ', 4 "-Tris (N-3-methylphenyl-N-phenylamino) -triphenylamine.

The light emitting layer is disposed on the hole transporting layer and can emit light of a specific color including a substance capable of emitting light of a specific color. The light emitting material may be formed using a phosphor or a fluorescent material.

When the light emitting layer emits red light, the peak wavelength of emitted light may be in the range of 600 nm to 650 nm, and CBP (4,4'-bis (carbazol-9-yl) biphenyl) or mCP bis (1-phenylisoquinoline) acetylacetonate iridium), PQIr (acac) (bis (1-phenylquinoline) (acetylacetonate) ) iridium, PQIr (tris (1-phenylquinoline) iridium), and PtOEP (octaethylporphyrin platinum). Or a fluorescent material containing PBD: Eu (DBM) 3 (Phen) or Perylene.

Here, the peak wavelength? Max refers to the maximum wavelength of EL (Electroluminescence). The wavelength at which the light emitting layers forming the light emitting portion emit light intrinsically is referred to as PL (Photo Luminescence), and the light that is influenced by the thickness and optical characteristics of the layers constituting the light emitting layers is referred to as emittance. At this time, EL (Electroluminescence) refers to light finally emitted by the electroluminescence display device, and can be expressed by a product of PL (Photo Luminescence) and Emittance.

When the light emitting layer emits green light, the peak emission wavelength may range from 520 nm to 540 nm, including a host material including CBP or mCP, and Ir (ppy) 3 (tris (2-phenylpyridine) iridium Lt; RTI ID = 0.0 > Ir complex < / RTI > Further, it may be made of a fluorescent material containing Alq3 (tris (8-hydroxyquinolino) aluminum).

When the light emitting layer emits blue light, the peak emission wavelength may range from 440 nm to 480 nm, including a host material including CBP or mCP, and FIrPic (bis (3,5-difluoro-2 - (2-pyridyl) phenyl- (2-carboxypyridyl) iridium), and a phosphorescent material containing a dopant material such as spiro-DPVBi (4,4'-Bis -1-yl) biphenyl, DSA (1-4-di- [4- (N, N-di-phenyl) amino] styryl-benzene, PFO, polyphenylenevinylene Or a fluorescent material containing one of them.

An electron transporting layer is disposed on the light emitting layer to smooth the movement of electrons to the light emitting layer. The electron transport layer is composed of Liq (8-hydroxyquinolinolato-lithium), PBD (2- (4-biphenyl) -5- (4- tert- butylphenyl) ), 4-phenyl-5-tert-butylphenyl-1,2,4-triazole), spiro-PBD, 2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline and BAlq -methyl-8-quinolinolate) -4- (phenylphenolato) aluminum).

An electron injection layer may further be disposed on the electron transporting layer. The electron injection layer is an organic layer that facilitates the injection of electrons from the cathode 446, and may be omitted depending on the structure and characteristics of the electroluminescence display device 400. The electron injection layer may be a metallic inorganic compound such as BaF2, LiF, NaCl, CsF, Li2O and BaO, and may be a dipyrazino [2,3-f: 2 ', 3'-h] quinoxaline- 6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine), and NPD (N, N'-bis (naphthalene-1-yl) -N, N'-bis May be one or more organic compounds.

An electron blocking layer or a hole blocking layer blocking the flow of holes or electrons is disposed at a position adjacent to the light emitting layer so that when electrons are injected into the light emitting layer, they move from the light emitting layer to pass through the adjacent hole transporting layer It is possible to prevent the phenomenon that the holes migrate from the light emitting layer to the adjacent electron transporting layer when the holes are injected into the light emitting layer, thereby improving the light emitting efficiency.

The cathode 446 is disposed on the light emitting portion 444 and serves to supply electrons to the light emitting portion 444. [ The cathode 446 may be formed of a metal material such as magnesium (Mg), silver-magnesium (Ag: Mg) or the like, which is a conductive material having a low work function, and is not limited thereto.

When the electroluminescent display device 400 is a top-mounted type, the cathode 446 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO) Zinc oxide (ZnO), and tin oxide (TiO 2).

The thin film transistor 420 and the light emitting element 440 which are components of the electroluminescence display device 400 are sealed on the light emitting element 440 with a bag for preventing oxidation or damage due to moisture, A plurality of seal layers, a foreign substance compensation layer, and a plurality of barrier films may be stacked.

The sealing layer is disposed on the upper surface of the thin film transistor 420 and the light emitting device 440 and may be composed of one of silicon nitride (SiNx) or aluminum oxide (AlOz), which is an inorganic material. An encapsulation layer may be further disposed on the foreign material compensation layer disposed on the encapsulation layer.

The foreign material compensation layer is disposed on the sealing layer and may be an organic material such as silicon oxy carbon (SiOCz), acrylic or epoxy resin, but not limited thereto, When a defect occurs due to a foreign substance or a crack generated by a particle, the foreign substance compensating layer can compensate the foreign substance by covering the foreign object.

A barrier film may be disposed on the sealing layer and the foreign material compensation layer so that the electroluminescent display device 400 can delay the penetration of oxygen and moisture from the outside. The barrier film is formed of a film having a light-transmitting property and a double-sided adhesive property, and may be composed of an insulating material selected from the group consisting of an olefin series, an acrylic series, and a silicone series, or a COP A barrier film composed of a material selected from the group consisting of a polymer, a COC (Cycloolefin Copolymer), and a PC (Polycarbonate) may be further laminated, but the present invention is not limited thereto.

FIG. 4B is a cross-sectional view (II-II ') of the detailed structure of the bending region B / A described in FIG.

4B is substantially the same as or similar to the components described in FIG. 4A, and a detailed description thereof will be omitted.

The gate signal and the data signal described with reference to FIGS. 1 to 3 are connected to a pixel (not shown) disposed in the display area A / A via a circuit wiring arranged in the non-display area N / A of the electroluminescence display device 400 from the outside. So as to emit light.

When wiring arranged in the non-display area N / A including the bending area B / A of the electroluminescence display 400 is formed as a single layer structure, a lot of space is required for disposing the wiring. Since a conductive material is deposited and a conductive material is patterned by a process such as etching in the form of a wiring to be formed, since the fineness of the etching process is limited, a large space is required due to the limit for narrowing the interval between the wirings, The area of the non-display area N / A becomes large, which may cause difficulties in implementation of the narrow bezel.

In addition, when one wiring is used to transmit one signal, the corresponding signal may not be transmitted when the wiring is cracked. A crack may be generated in the wiring itself in the process of bending the substrate 410, or a crack may be generated in the other layer, and the crack may be propagated to the wiring. In this way, when a crack is generated in the wiring, the signal to be transmitted may not be transmitted.

Accordingly, the wirings disposed in the bending area B / A of the electroluminescent display device 400 according to the embodiment of the present invention are arranged in the form of a double wiring of the first wirings 462 and the second wirings 464 .

The first wiring 462 and the second wiring 464 are formed of a conductive material and may be formed of a conductive material having excellent ductility to reduce the occurrence of cracks when the flexible substrate 410 is bent. The first wiring 462 and the second wiring 464 may be formed of a conductive material having excellent ductility such as gold (Au), silver (Ag), aluminum (Al) (Ni), neodymium (Nd), copper (Cu), and silver (Ag), and magnesium (Mg), and may be formed of one of various conductive materials such as molybdenum (Mo), chromium (Cr), titanium ) Alloy or the like. The first wiring 462 and the second wiring 464 may be formed of a multilayer structure including various conductive materials and may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) But is not limited thereto.

A buffer layer made of an inorganic insulating layer may be disposed below the first wirings 462 and the second wirings 464 to protect the first wirings 462 and the second wirings 464, The first wiring 462 and the second wiring 464 are prevented from being corroded by reacting with moisture or the like by forming a passivation layer made of an inorganic insulating layer so as to surround the upper and the side of the second wiring 464 and the second wiring 464 .

The first wiring 462 and the second wiring 464 formed in the bending area B / A are subjected to a tensile force when bent. As described with reference to FIG. 3, wirings extending in the same direction as the bending direction on the substrate 410 are subjected to the greatest tensile force, cracks may occur, and breakage may occur if the cracks are severe. Therefore, instead of forming the wiring to extend in the bending direction, at least a part of the wiring disposed including the bending region B / A is formed to extend in the diagonal direction different from the bending direction, thereby minimizing the tensile force, The occurrence can be reduced. The shape of the wiring can be configured as a rhombic shape, a triangular wave shape, a sinusoidal shape, a trapezoidal shape, and the like, but is not limited thereto.

The first wiring 462 is disposed on the substrate 410 and the first planarization layer 435 is disposed on the first wiring 462. [ A second wiring 464 is disposed on the first planarization layer 435 and a second planarization layer 437 is disposed on the second wiring 464. [

The first planarizing layer 435 and the second planarizing layer 437 may be formed of a resin such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, And may be formed of one or more of polyimides resin, unsaturated polyester resin, polyphenylene resin, polyphenylenesulfide resin, and benzocyclobutene. But is not limited thereto.

A micro-coating layer 466 is disposed on the second planarization layer 437. Since the micro-coating layer 466 may be cracked due to a tensile force acting on the wiring portion disposed on the substrate 410 at the time of bending, a thin resin may be coated on the bending portion to protect the wiring. It plays a role.

5 is a plan view of an electroluminescence display touch screen panel according to an embodiment of the present invention.

The touch screen panel 520 is disposed to correspond to the display area A / A on the flexible substrate 310 described in FIG. 3 and the touch area T / A where the touch electrode 525 is disposed.

The touch electrode 525 is disposed in the touch area T / A of the touch screen panel 520. The touch electrode 525 may be configured to cross a plurality of touch driving electrodes Tx and a plurality of touch sensing electrodes Rx.

A mutual-capacitance type comprising a plurality of touch driving electrodes Tx and a touch electrode 525 configured to cross a plurality of touch sensing electrodes Rx may be applied. However, the present invention is not limited thereto, , A self-capacitance type may be applied. The self-capacitance method is disposed only on the plurality of touch sensing electrodes (Rx). In addition, the touch screen panel 520 may be implemented in various ways such as a resistive type or an electromagnetic type.

The touch pad 530 is disposed on one side of the outer frame portion covering the touch area T / A of the touch screen panel 520 and is disposed corresponding to the non-display area N / A of the flexible substrate 520.

The touch connection wiring 535 electrically connects the touch electrode 525 and the touch pad 530. At this time, the touch pad 530 is disposed at a position corresponding to the cutting area C / A so that the touch circuit board 540 can be easily inserted into the cutting area C / A of the flexible substrate 310 and bent.

At the end of the touch screen panel 520, a touch circuit board 540 formed of an insulating film is connected to the touch pad 530. The touch circuit board 540 may include a touch electrode 525 disposed on the touch area T / A and a touch sensing circuit for sensing various types of wires and touch inputs to transmit signals to each other. And a flexible printed circuit board (PCB).

The touch circuit board 540 is inserted into the cutting area C / A of the flexible substrate 310 described in FIG. 3 and bent while being bent in the bending area B / A to form the non- (N / A).

The width of the non-display area N / A is unnecessarily increased when the touch circuit board 540 is bent on the flexible substrate 310, thereby making it difficult to minimize the bezel area of the flexible electro-luminescence display device. Accordingly, the flexible electroluminescent display device according to the embodiment of the present invention includes a non-display area N formed by being bent while being inserted into a cutting area C / A in which the touch circuit board 540 is disposed on the flexible substrate 310 / A is minimized, the bezel area of the flexible electroluminescence display device can be minimized. The touch substrate 540 is inserted into the cutting area C / A so that the flexible substrate 510 including the micro coating layer in the bending area B / A is substantially out of the touch direction So that the width of the unnecessary non-display area N / A generated by the touch circuit substrate 540 can be reduced.

The detailed structure in which the touch screen panel 520 is disposed on the flexible substrate 310 will be described with reference to FIGS. 6A and 6B.

6A and 6B are a plan view and a perspective view of a touch screen and a flexible substrate of a flexible electroluminescence display device according to an embodiment of the present invention.

6A is a plan view of a touch screen and a flexible substrate of a flexible electroluminescence display device according to an embodiment of the present invention. 6A is substantially the same as or similar to the elements described in Figs. 1 to 5, and a detailed description thereof will be omitted.

6, a flexible electro-luminescence display 600 includes a flexible substrate 610, a display area A / A and a display area A on which a pixel that actually emits light is disposed through a thin film transistor and a light- / Non-display area N / A which is a bezel area surrounding the periphery of the edge of the display area / A.

A pad 695, which is a metal pattern, may be disposed on one side of the substrate 610 in the non-display area N / A to bond the external module.

The bending area B / A can be formed by bending a part of the non-display area N / A of the flexible substrate 610 in the bending direction as indicated by the arrow. The non-display area N / A of the flexible substrate 610 is not required to be visually recognized on the upper surface of the flexible substrate 610 because the wiring and the drive circuit for driving the screen are disposed and not the area where the image is displayed . Therefore, the bezel area can be reduced while bending a part of the non-display area N / A of the flexible substrate 610 to secure the area for the wiring and the driving circuit.

Various wirings are formed on the flexible substrate 610. The wiring may be formed in the display area A / A of the substrate 610 or the circuit wiring 670 formed in the non-display area N / A may be formed by connecting a driving circuit, a gate driver, Signal.

The cutting area C / A is formed by cutting a region having a width larger than the width of the touch circuit board 640 in the non-display area N / A of the flexible substrate 610, To be inserted and bent.

The touch screen panel 620 is arranged to correspond to the display area A / A on the flexible substrate 610 and the touch area T / A where the touch electrode 625 is disposed.

The touch electrode 625 is disposed in the touch area T / A of the touch screen panel 620. The touch electrode 625 may be configured to cross a plurality of touch driving electrodes Tx and a plurality of touch sensing electrodes Rx.

The touch pad 630 is disposed on one side of the outer frame portion covering the touch area T / A of the touch screen panel 620 and is disposed corresponding to the non-display area N / A on the flexible substrate 620 . The touch connection wiring 635 serves to electrically connect the touch electrode 625 and the touch pad 630.

A touch circuit board 640 is connected to the touch pad 630 at an end of the touch screen panel 620. On the touch circuit board 640, a touch electrode 625 disposed in the touch area T / A may include various wires for transmitting signals to each other and a touch sensing circuit for sensing a touch input.

The touch circuit board 640 is inserted into the cutting area C / A of the flexible substrate 610 and bent while bending the flexible substrate 610 in the bending area B / ) Width so that the bezel region of the flexible electro-luminescence display device 600 can be minimized when the touch circuit board 640 is bent on the flexible substrate 610 than when it is bent on the flexible substrate 610 .

6B is a perspective view of a touch screen and a flexible substrate of a flexible electroluminescence display device according to an embodiment of the present invention.

6B are substantially the same as or similar to those described in FIG. 6A, and a detailed description thereof will be omitted.

6A, the touch screen panel 620 corresponds to the display area A / A on the flexible substrate 610 and the touch area T / A on which the touch electrode 625 is disposed . The touch electrode 625 is disposed in the touch area T / A of the touch screen panel 620.

The polarizing plate 630 disposed on the touch screen panel 620 suppresses reflection of external light on the display area A / A. When the flexible electroluminescence display device 600 is used from the outside, the external natural light is introduced and reflected by the reflection plate included in the anode of the electroluminescent element, or reflected by the electrode composed of the metal disposed under the electroluminescent element . The reflected light may prevent the image from being visually recognized. The polarizing plate 630 polarizes the light incident from the outside in a specific direction and prevents the reflected light from being emitted to the outside of the display device 600 again. The polarizing plate 630 may be disposed on the display area A / A, but is not limited thereto.

The polarizing plate 630 may be a polarizing plate composed of a polarizer and a protective film for protecting the polarizing plate 630, or may be formed by coating a polarizing material for flexibility.

An adhesive layer may be disposed on the polarizing plate 630 and a cover glass (CG) for protecting the appearance of the display device 600 may be adhered and disposed.

A back plate 650 is disposed under the flexible substrate 610. In the case where the flexible substrate 610 is made of a plastic material such as polyimide, the manufacturing process of the flexible electroluminescence display device 600 proceeds in a situation where a supporting substrate made of glass is disposed under the flexible substrate 610, After completion, the support substrate can be released and released.

A back plate 650 for supporting the flexible substrate 610 can be disposed under the flexible substrate 610 because a component for supporting the flexible substrate 610 is required even after the supporting substrate is released. The back plate 650 may be disposed adjacent to the bending area B / A in another area of the flexible substrate 610 except for the bending area B / A.

The back plate 650 may be formed of a plastic film formed of polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymers, a combination of these polymers, and the like.

A support member 655 is disposed between the two back plates 650 and the support member 655 can be bonded to the back plate 650 by an adhesive layer.

The support member 655 may be formed of a plastic material such as polycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymers, The strength of the support member 66 formed of such plastic materials may be controlled by adding additives to increase the thickness and strength of the support member 655 and may be controlled by glass, ) Materials or combinations of the above-described materials.

A micro-coating layer 660 is disposed on the bending region B / A of the flexible substrate 610. 6A, the micro-coating layer 660 is not disposed on the cutting area C / A formed at one side of the flexible substrate 610. In this case,

Since the micro-coating layer 660 may be cracked due to a tensile force acting on the wiring portion disposed on the flexible substrate 610 at the time of bending, the micro-coating layer 660 has a role of protecting the wiring by coating the resin to a thin thickness at the bent position can do. The micro-coating layer 660 may be formed of an acrylic material such as an acrylate polymer, but is not limited thereto.

The micro-coating layer 660 can adjust the neutral plane of the bending area B / A. The neutral plane means a virtual surface that is not stressed because the compressive force and the tensile force applied to the structure are canceled each other when the structure is bent. If two or more structures are stacked, a virtual neutral plane may be formed between the structures. When the entire structure is bent in one direction, the structures arranged in the bending direction with respect to the neutral plane are compressed by the bending, so that they are subjected to the compressive force. On the contrary, the structures arranged in the direction opposite to the bending direction with respect to the neutral plane are stretched by bending, so that they are subjected to a tensile force. At this time, generally, structures are more susceptible to tensile force among the same compressive force and tensile force, so that there is a higher probability of cracking when subjected to tensile force.

Since the flexible substrate 610 disposed at the lower side with respect to the neutral plane is compressed, the wirings disposed at the upper portion receive a compressive force and can receive a tensile force, thereby causing a crack due to the tensile force. Therefore, it can be placed on the neutral plane to minimize the tensile force applied to the wiring.

By placing the microcoat layer 660 on the bending region B / A, the neutral plane can be raised in the upward direction, and the neutral plane can be formed at the same position as the wiring or at a higher position than the neutral plane, It is not received or is subjected to a compressive force, so that occurrence of cracks can be suppressed.

An insulating film 680 is connected to an end of the flexible substrate 610. On the insulating film 680, various wirings for transmitting signals to pixels arranged in the display area A / A are formed. The insulating film 680 is formed of a material having flexibility to be bent. A driving device may be mounted on the insulating film 680 and a driving package such as a chip on film (COF) may be formed together with the insulating film 680 and may be formed on the insulating film 680 And supplies driving signals and data to the pixels arranged in the display area A / A.

The circuit board connected to the insulating film 680 may apply various signals to pixels arranged in the display area A / A by receiving an image signal from the outside, and may be a printed circuit board.

A touch circuit board 640 is connected to the touch pad 630 at an end of the touch screen panel 620. 6A, the touch circuit board 640 is bent and inserted into the cutting area C / A of the flexible substrate 610, and the flexible substrate 610 is bent and formed in the bending area B / A The flexible printed circuit board 640 is bent at a width equal to or narrower than the width of the non-display area N / A so that the flexible printed circuit board 640 can be bent more flexibly than when flexed on the flexible substrate 610, The bezel area can be minimized.

The touch substrate 540 is inserted into the cutting area C / A so that the flexible substrate 610 including the micro coating layer 660 of the bending area B / A is substantially So that the width of the unnecessary non-display area N / A generated by the touch circuit board 640 can be reduced.

A flexible electroluminescent display device according to an embodiment of the present invention includes a flexible substrate including a display region, a bending region extending from one side of the display region and bent, and a cutting region formed by cutting one side of the bending region, A wiring and a planarization layer disposed on the display region and the bending region, a micro-coating layer disposed on the planarization layer of the bending region, a touch screen substrate disposed on the display region, and a touch screen substrate And the flexible substrate includes a cutting area formed by cutting one side of the bending area, and the touch circuit board is inserted into the cutting area and bent.

The width of the cut region of the flexible electro-luminescence display device according to the embodiment of the present invention is larger than the width of the touch circuit substrate.

In the flexible electroluminescent display device according to the embodiment of the present invention, the micro-coating layer in the bending area is protruded further toward the outer side of the flexible substrate than the touch circuit substrate.

A flexible electroluminescent display device according to an embodiment of the present invention further includes a buffer layer on a flexible substrate.

The wiring of the flexible electroluminescence display device according to the embodiment of the present invention is composed of a plurality of metal layers.

The wiring disposed on the bending region of the flexible electro luminescence display device according to the embodiment of the present invention has one of a rhombic shape, a triangular wave shape, a sinusoidal shape, and a trapezoidal shape.

In a flexible electroluminescent display device according to an embodiment of the present invention, a driving element is disposed on an insulating film and an insulating film connected to a flexible substrate.

The planarization layer of the flexible electroluminescence display device according to the embodiment of the present invention is composed of a plurality of organic layers.

Wirings are disposed on the flexible substrate and the planarization layer of the flexible electroluminescence display device according to the embodiment of the present invention.

A light emitting device of a flexible electroluminescence display device according to an embodiment of the present invention includes an anode, a light emitting portion, and a cathode.

The polarizing plate is further disposed on the touch screen substrate of the flexible electroluminescence display device according to the embodiment of the present invention.

A back plate is disposed on a flexible substrate of a flexible electroluminescence display device according to an embodiment of the present invention.

A flexible electroluminescent display device according to an embodiment of the present invention includes a display region including a pixel, a non-display region having a bending region disposed outside the display region, and a flexible region including a cut region formed by cutting one side of the bending region. A touch screen substrate disposed on the display area, and a touch circuit board connected to the touch screen substrate, wherein one side of the non-display area of the flexible substrate is cut to form a cut area, So that the non-display area can be minimized.

The width of the cut region of the flexible electro-luminescence display device according to the embodiment of the present invention is larger than the width of the touch circuit substrate.

The flexible electroluminescent display device according to an embodiment of the present invention further includes a micro-coating layer disposed in a bending region, and the micro-coating layer protrudes further toward the outside of the flexible substrate than the touch circuit substrate.

The polarizing plate is further disposed on the touch screen substrate of the flexible electroluminescence display device according to the embodiment of the present invention.

In a flexible electroluminescent display device according to an embodiment of the present invention, a driving element is disposed on an insulating film and an insulating film connected to a flexible substrate.

A pixel of a flexible electroluminescence display device according to an embodiment of the present invention emits light through a thin film transistor and a light emitting element.

A light emitting device of a flexible electroluminescence display device according to an embodiment of the present invention includes an anode, a light emitting portion, and a cathode.

A back plate is disposed on a flexible substrate of a flexible electroluminescence display device according to an embodiment of the present invention.

A flexible electroluminescent display device according to an embodiment of the present invention includes a flexible region including a display region, a first region disposed on one side of a bending region disposed outside the display region, and a second region formed by cutting a bending region, A touch screen substrate disposed on the display region, and a touch circuit substrate connected to the touch screen substrate and disposed in the second region.

In the first area of the flexible electro-luminescence display device according to the embodiment of the present invention, a circuit wiring and a pad for transmitting signals to the display area are disposed.

The touch circuit board of the flexible electroluminescence display device according to the embodiment of the present invention is bent in the bending region.

The flexible electro-luminescence display device further includes a micro-coating layer disposed in a first region of the flexible electro-luminescence display device according to an embodiment of the present invention, wherein the micro-coating layer protrudes further toward the outer edge of the flexible substrate than the touch circuit substrate.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of equivalents should be interpreted as being included in the scope of the present invention.

100, 200, 300, 400, 500, 600: Electroluminescent display device
110:
120: Timing controller
130: Data driver
140: gate driver
150: Display panel
160: pixel
220: gate line
230: Data line
240: switching transistor
250: driving transistor
260: Compensation circuit
270, 440: Light emitting element
310, 410, 610: flexible substrate
370, 670: circuit wiring
390, 690: Gate driver
395, 695: pad
420: thin film transistor
422: gate electrode
424: source electrode
426: drain electrode
428: Semiconductor layer
431: first insulating layer
433: second insulating layer
435: first planarization layer
437: second planarization layer
442: anode
444:
446: Cathode
450: Bank
452: Spacer
460:
462: first wiring
464: Second wiring
466, 650: Micro-coating layer
520, 620: touch screen substrate
525, 625: touch electrode
530, 630: touch pad
535, 635: Touch connection wiring
540, 640: Touch circuit board
630: polarizer
650: back plate
655: Adhesive layer
660: Support member
680: circuit board
A / A: display area
N / A: Non-display area
B / A: Bending area
C / A: Cutting area
T / A: Touch area
S / L: scan line

Claims (24)

A flexible substrate including a display area, a bending area bent from one side of the display area, and a cutting area formed by cutting one side of the bending area;
A thin film transistor and a light emitting element arranged on the display region;
A wiring and a planarization layer disposed on the display region and the bending region;
A micro-coating layer disposed on the planarization layer of the bending region;
A touch screen substrate disposed on the display area; And
And a touch circuit board connected to the touch screen substrate,
Wherein the flexible substrate includes a cutting area formed by cutting one side of the bending area, and the touch circuit board is inserted into the cutting area and bent. The method according to claim 1,
Wherein a width of the cut region is larger than a width of the touch circuit board. The method according to claim 1,
Wherein the micro-coating layer of the bending area is further projected toward the outer periphery of the flexible substrate than the touch circuit substrate. The method according to claim 1,
And a buffer layer is further disposed on the flexible substrate. The method according to claim 1,
Wherein the wiring is composed of a plurality of metal layers. The method according to claim 1,
Wherein the wiring disposed on the bending region is formed in one of a rhombic shape, a triangular wave shape, a sinusoidal shape, and a trapezoidal shape. The method according to claim 1,
An insulating film connected to the flexible substrate; And
And a driving element is disposed in the insulating film. The method according to claim 1,
Wherein the planarizing layer is composed of a plurality of organic layers. 8. The method of claim 7,
And the wiring is disposed on the flexible substrate and the planarization layer, respectively. The method according to claim 1,
Wherein the light emitting element includes an anode, a light emitting portion, and a cathode. The method according to claim 1,
And a polarizing plate is further disposed on the touch screen substrate. The method according to claim 1,
And a back plate is disposed on a bottom surface of the flexible substrate. A flexible substrate including a display area including pixels, a non-display area having a bending area disposed outside the display area, and a cutting area formed by cutting one side of the bending area;
A touch screen substrate disposed on the display area; And
And a touch circuit board connected to the touch screen substrate,
Wherein the flexible substrate is cut at one side of the non-display area to form a cut area, and the touch circuit board is inserted into the cut area and bent to minimize a non-display area. 14. The method of claim 13,
Wherein a width of the cut region is larger than a width of the touch circuit board. 14. The method of claim 13,
Further comprising a micro-coating layer disposed on the bending region, wherein the micro-coating layer is further protruded toward the outside of the flexible substrate than the touch circuit substrate. 14. The method of claim 13,
And a polarizing plate is further disposed on the touch screen substrate. 14. The method of claim 13,
An insulating film connected to the flexible substrate; And
And a driving element is disposed in the insulating film. 14. The method of claim 13,
Wherein the pixel emits light through the thin film transistor and the light emitting element. 19. The method of claim 18,
Wherein the light emitting element includes an anode, a light emitting portion, and a cathode. 14. The method of claim 13,
And a back plate is disposed on a bottom surface of the flexible substrate. A flexible substrate including a display region, a bending region disposed outside the display region, and a first region disposed on one side of the bending region and a second region formed by cutting the bending region;
A touch screen substrate disposed on the display area; And
And a touch circuit board connected to the touch screen substrate and disposed in the second area. 22. The method of claim 21,
And a circuit wiring and a pad for transmitting a signal to the display area are disposed in the first area. 22. The method of claim 21,
And the touch circuit board is bent in the bending region. 22. The method of claim 21,
Further comprising a micro-coating layer disposed in the first region, wherein the micro-coating layer is further protruded toward the outer side of the flexible substrate than the touch circuit substrate.

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