KR102576756B1 - 아릴 화합물 및 그 제조 방법 - Google Patents

아릴 화합물 및 그 제조 방법 Download PDF

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Publication number
KR102576756B1
KR102576756B1 KR1020160178131A KR20160178131A KR102576756B1 KR 102576756 B1 KR102576756 B1 KR 102576756B1 KR 1020160178131 A KR1020160178131 A KR 1020160178131A KR 20160178131 A KR20160178131 A KR 20160178131A KR 102576756 B1 KR102576756 B1 KR 102576756B1
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KR
South Korea
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group
formula
compound
represented
aryl compound
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KR1020160178131A
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English (en)
Korean (ko)
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KR20170082973A (ko
Inventor
가즈히데 야나이즈미
히데요시 야나기사와
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신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR20170082973A publication Critical patent/KR20170082973A/ko
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Publication of KR102576756B1 publication Critical patent/KR102576756B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/04—Compounds containing oxirane rings containing only hydrogen and carbon atoms in addition to the ring oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D301/00—Preparation of oxiranes
    • C07D301/27—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms
    • C07D301/28—Condensation of epihalohydrins or halohydrins with compounds containing active hydrogen atoms by reaction with hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C07D303/27—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds having all hydroxyl radicals etherified with oxirane containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
KR1020160178131A 2016-01-07 2016-12-23 아릴 화합물 및 그 제조 방법 KR102576756B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-001905 2016-01-07
JP2016001905 2016-01-07

Publications (2)

Publication Number Publication Date
KR20170082973A KR20170082973A (ko) 2017-07-17
KR102576756B1 true KR102576756B1 (ko) 2023-09-07

Family

ID=59363787

Family Applications (1)

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KR1020160178131A KR102576756B1 (ko) 2016-01-07 2016-12-23 아릴 화합물 및 그 제조 방법

Country Status (4)

Country Link
JP (1) JP6763293B2 (ja)
KR (1) KR102576756B1 (ja)
CN (1) CN106946815B (ja)
TW (1) TWI745332B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109715591A (zh) * 2016-09-13 2019-05-03 三菱瓦斯化学株式会社 化合物、树脂、组合物、以及抗蚀图案形成方法和电路图案形成方法
JP7445382B2 (ja) * 2016-09-13 2024-03-07 三菱瓦斯化学株式会社 化合物、樹脂、組成物及びパターン形成方法
JP6947132B2 (ja) * 2018-07-13 2021-10-13 信越化学工業株式会社 ウエハ加工用仮接着剤、ウエハ積層体、ウエハ積層体の製造方法、及び薄型ウエハの製造方法
JP2022178868A (ja) 2021-05-21 2022-12-02 信越化学工業株式会社 チオエポキシ基及び（メタ）アリル基含有化合物及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020192477A1 (en) 2001-02-23 2002-12-19 Tsuyoshi Honda Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
US20030078322A1 (en) 2001-09-06 2003-04-24 Tsuyoshi Honda Conductive resin compositions and electronic parts using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11130838A (ja) 1997-10-28 1999-05-18 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JP5423004B2 (ja) * 2009-01-08 2014-02-19 東レ株式会社 ネガ型感光性樹脂組成物およびそれを用いたタッチパネル用材料
JP5459196B2 (ja) * 2009-12-15 2014-04-02 信越化学工業株式会社 光硬化性ドライフィルム、その製造方法、パターン形成方法及び電気・電子部品保護用皮膜
JP5630451B2 (ja) * 2011-02-23 2014-11-26 信越化学工業株式会社 接着剤組成物及び接着性ドライフィルム
JP5942859B2 (ja) * 2012-01-27 2016-06-29 信越化学工業株式会社 シリコーン骨格含有高分子化合物、樹脂組成物、光硬化性ドライフィルム
CN103342892A (zh) * 2013-06-06 2013-10-09 西安交通大学 一种双马来酰亚胺树脂的增韧改性剂及其制备方法
JP6613901B2 (ja) * 2016-01-07 2019-12-04 信越化学工業株式会社 エポキシ変性シリコーン樹脂及びその製造方法、硬化性組成物及び電子部品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020192477A1 (en) 2001-02-23 2002-12-19 Tsuyoshi Honda Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
US20030078322A1 (en) 2001-09-06 2003-04-24 Tsuyoshi Honda Conductive resin compositions and electronic parts using the same

Also Published As

Publication number Publication date
TWI745332B (zh) 2021-11-11
JP2017125008A (ja) 2017-07-20
CN106946815B (zh) 2022-07-01
JP6763293B2 (ja) 2020-09-30
KR20170082973A (ko) 2017-07-17
CN106946815A (zh) 2017-07-14
TW201739742A (zh) 2017-11-16

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