KR102534940B1 - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
KR102534940B1
KR102534940B1 KR1020160096078A KR20160096078A KR102534940B1 KR 102534940 B1 KR102534940 B1 KR 102534940B1 KR 1020160096078 A KR1020160096078 A KR 1020160096078A KR 20160096078 A KR20160096078 A KR 20160096078A KR 102534940 B1 KR102534940 B1 KR 102534940B1
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
layer
barrier layer
present
Prior art date
Application number
KR1020160096078A
Other languages
English (en)
Korean (ko)
Other versions
KR20180013017A (ko
Inventor
박호식
이동근
최재훈
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020160096078A priority Critical patent/KR102534940B1/ko
Priority to JP2017131560A priority patent/JP7497548B2/ja
Publication of KR20180013017A publication Critical patent/KR20180013017A/ko
Priority to JP2022194059A priority patent/JP2023022267A/ja
Application granted granted Critical
Publication of KR102534940B1 publication Critical patent/KR102534940B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020160096078A 2016-07-28 2016-07-28 인쇄회로기판 KR102534940B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020160096078A KR102534940B1 (ko) 2016-07-28 2016-07-28 인쇄회로기판
JP2017131560A JP7497548B2 (ja) 2016-07-28 2017-07-04 プリント回路基板
JP2022194059A JP2023022267A (ja) 2016-07-28 2022-12-05 プリント回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160096078A KR102534940B1 (ko) 2016-07-28 2016-07-28 인쇄회로기판

Publications (2)

Publication Number Publication Date
KR20180013017A KR20180013017A (ko) 2018-02-07
KR102534940B1 true KR102534940B1 (ko) 2023-05-22

Family

ID=61076635

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160096078A KR102534940B1 (ko) 2016-07-28 2016-07-28 인쇄회로기판

Country Status (2)

Country Link
JP (1) JP2023022267A (ja)
KR (1) KR102534940B1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220098528A (ko) 2021-01-04 2022-07-12 삼성전기주식회사 인쇄회로기판

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008109140A (ja) * 2006-10-25 2008-05-08 Samsung Electro-Mechanics Co Ltd 回路基板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100990575B1 (ko) 2008-07-08 2010-10-29 삼성전기주식회사 미세 패턴을 갖는 인쇄회로기판 및 그 제조 방법
KR102281458B1 (ko) * 2014-06-23 2021-07-27 삼성전기주식회사 소자 내장형 인쇄회로기판, 반도체 패키지 및 그 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008109140A (ja) * 2006-10-25 2008-05-08 Samsung Electro-Mechanics Co Ltd 回路基板及びその製造方法

Also Published As

Publication number Publication date
JP2023022267A (ja) 2023-02-14
KR20180013017A (ko) 2018-02-07
JP2018019076A (ja) 2018-02-01

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A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant