KR102497060B1 - Conductive materials, molded articles and electronic components - Google Patents

Abstract

A conductive material exhibiting excellent resin adhesion even under harsh environments is provided. A conductive material whose surface is molded with resin or whose surface is sealed with resin, whose surface is made of metal and which satisfies the following conditions (1) and (2). (1) The arithmetic average surface roughness height Sa was 0.25 to 0.4 µm, and (2) the arithmetic mean curve Spc of the peaks was 30,000 to 60,000 (1/mm).

Description

Conductive materials, molded articles and electronic components

The present invention relates to conductive materials, molded articles and electronic components.

In recent years, there has been an increasing demand for improvement in the adhesion between metal and resin. For example, in order to protect metal electronic parts such as lead frames and busbar modules from factors such as impact, temperature, and humidity, resin molding, resin sealing, or mold molding in which the surface of the electronic parts is hardened with resin is performed. There is work. In such a case, it is necessary that the metal surface of the electronic component and the resin adhere with excellent adhesion so that the resin does not peel off during use. In particular, for vehicle-mounted applications, further improvement in adhesion is demanded as electronicization progresses around the engine room under harsh environments.

As a known technique aimed at improving the adhesion between metal and resin, Patent Documents 1 to 3 propose a technique for roughening the plating surface of a lead frame in order to improve the adhesion between a lead frame and a mold resin in a resin-encapsulated semiconductor device. there is.

In addition, as a recent known technique, Patent Document 4 proposes a technique focusing on the specific surface area and the thickness of the oxide film of the surface layer in order to improve the adhesion between metal and resin.

Japanese Unexamined Patent Publication No. 6-29439 Japanese Unexamined Patent Publication No. 10-27873 Japanese Unexamined Patent Publication No. 2006-93559 International Publication No. 2017/179447

Conventionally, in high temperature and high humidity tests, for example, it has been required to clear JEDEC-LEVEL1, etc., but in recent years, it has been required to have durability in more severe environments, such as heat cycle tests, etc. , situations in which the characteristics are not necessarily sufficient in the prior art are found.

The present invention was made to solve the above problems, and provides a conductive material that exhibits excellent resin adhesion even under harsh environments.

As a result of intensive studies, the inventors of the present invention have found that a conductive material capable of solving the problem can be obtained by forming a resin or forming a surface to be sealed with a metal and controlling the surface to a predetermined shape.

The present invention completed on the basis of the above knowledge is, in one embodiment, a conductive material in which resin is molded on the surface or the surface is sealed with resin,

It is a conductive material in which the surface is made of metal and satisfies the following conditions (1) and (2).

(1) the arithmetic average surface roughness height Sa is 0.25 to 0.4 μm;

(2) The arithmetic mean curve Spc of the mountain peak is 30,000 to 60,000 (1/mm).

In another embodiment of the conductive material of the present invention, the maximum surface roughness height Sz of the surface is 3.5 to 6.5 μm.

In yet another embodiment of the conductive material of the present invention, the conductive material includes a substrate and a plating layer formed on the substrate, and the surface is the plating layer.

In yet another embodiment of the conductive material of the present invention, the substrate is constituted of any one of copper, copper alloy, aluminum, aluminum alloy, iron and iron alloy.

In another embodiment of the conductive material of the present invention, the plating layer is composed of one or more types of plating layers.

In another embodiment of the conductive material of the present invention, the plating layer has a first plating layer formed on the base material, and the first plating layer is composed of copper, copper alloy, nickel, or nickel alloy. there is.

In another embodiment of the conductive material of the present invention, the plating layer has a second plating layer formed on the first plating layer, and the second plating layer is made of palladium, a palladium alloy, gold, or a gold alloy. Consists of.

In another embodiment of the conductive material of the present invention, the total thickness of the plating layers composed of the one or more types of plating layers is 1 to 7 μm.

In yet another embodiment, the conductive material of the present invention partially has a surface that satisfies the above conditions (1) and (2).

In yet another embodiment, the present invention is a molded article provided with the conductive material of the present invention in which a resin is molded on the surface or the surface is sealed with a resin.

The present invention, in yet another embodiment, is an electronic component provided with the conductive material of the present invention.

ADVANTAGE OF THE INVENTION According to this invention, it is possible to provide a conductive material that exhibits excellent resin adhesion even under harsh environments.

1 is a cross-sectional schematic diagram showing the configuration of a conductive material according to Embodiment 1. FIG.
Fig. 2 is a cross-sectional schematic diagram showing the configuration of a conductive material according to Embodiment 2;
3 is a cross-sectional schematic diagram showing the configuration of a conductive material according to Embodiment 3;

<Conductive material>

The conductive material according to the embodiment of the present invention is a conductive material in which resin is molded on the surface or the surface is sealed with resin, the surface is made of metal, and the following conditions (1) and (2) are satisfied.

(1) the arithmetic average surface roughness height Sa is 0.25 to 0.4 μm;

(2) The arithmetic mean curve Spc of the mountain peak is 30,000 to 60,000 (1/mm).

Conventionally, the linear roughness (Rz, Ra) of metal has been controlled for the adhesion between metal and resin, but it is insufficient as a parameter for controlling adhesion with resin in electronic parts used under harsher environments. On the other hand, although described later in detail, in the present invention, by introducing Sa and Spc specified in International Organization for Standardization ISO25178-2: 2012 as the surface roughness, it is possible to better control the adhesion with the resin than before.

Since at least the surface of the conductive material according to the embodiment of the present invention needs to be composed of metal, as described later in detail, it may be formed of one type of metal material, or may be formed by dividing the substrate and the metal layer on the surface.

The arithmetic average surface roughness height Sa of the surface of the conductive material according to the embodiment of the present invention is controlled to 0.25 to 0.4 µm. If Sa of the surface of the conductive material is less than 0.25 μm, the anchoring effect is insufficient due to lack of roughening of the surface, and adhesion to the resin is lowered. If Sa of the surface of the conductive material is more than 0.4 µm, the roughened tip portion of the surface of the conductive material is easily broken. Sa of the surface of the conductive material is preferably 0.27 to 0.38 μm, more preferably 0.3 to 0.35 μm.

When the metal surface of the conductive material according to the embodiment of the present invention is in close contact with the resin, it is necessary to suppress the thermal expansion of the resin with a metal anchor because the resin has a higher coefficient of thermal expansion than the metal. In the present invention, the arithmetic mean curve Spc of the peaks of the surface of the conductive material is controlled to be 30,000 to 60,000 (1/mm) with respect to the problem of the thermal expansion coefficient difference with the resin concerned. Spc represents the average reciprocal of the principal curvature of the peaks of the surface. In other words, the sharper the peak, the greater the Spc. When the arithmetic mean curve Spc of the peaks of the surface of the conductive material is less than 30,000 (1/mm), the anchor effect becomes insufficient, and the thermal expansion coefficient difference is not overcome, and there is a risk of separation from the resin. In addition, when the surface Spc of the conductive material is too large, the tip becomes too sharp and becomes easy to break, and there is a possibility that the adhesion strength is lowered on the contrary. From this point of view, the surface Spc of the conductive material is preferably 60,000 (1/mm) or less, although there is no particular upper limit in order to exhibit an effect in combination with the above Sa. The surface Spc of the conductive material is preferably 34,000 to 55,000 (1/mm), more preferably 40,000 to 55,000 (1/mm).

The maximum surface roughness height Sz (ISO25178-2: 2012) of the surface of the conductive material according to the embodiment of the present invention is preferably 3.5 to 6.5 μm. If the Sz of the surface of the conductive material is less than 3.5 μm, the anchoring effect is insufficient due to lack of roughening of the surface, and adhesion to the resin is lowered. If Sz of the surface of the conductive material is more than 6.5 μm, there is a possibility that the resin may become difficult to enter the gap between the elevations of the surface of the conductive material. Sa of the surface of the conductive material is preferably 3.7 to 6.0 μm, more preferably 4.5 to 5.0 μm.

The conductive material according to the embodiment of the present invention is not particularly limited as long as the surface is at least metal, but includes the following three patterns (Embodiments 1 to 3).

・Embodiment 1 concerning configuration of conductive material

1 is a cross-sectional schematic diagram showing the configuration of a conductive material 10 according to Embodiment 1 of the present invention. The conductive material 10 has a surface 11 made of a metal material and satisfying the conditions of (1) and (2) above. An enlarged view of a portion of the dotted line border 12 of FIG. 1 is shown in the drawing on the right. 1 shows an example of a roughened surface of the conductive material 10, but is not limited to such a roughened surface. According to such a structure, since the material constituting the conductive material is one type of metal material, manufacturing efficiency or manufacturing cost is improved. As the metal material of the conductive material 10, for example, copper, copper alloys, aluminum, aluminum alloys, iron, iron alloys, nickel, nickel alloys, palladium, palladium alloys, gold and gold alloys can be configured. Moreover, as for metal and resin, the resin has a larger thermal expansion coefficient. At this time, if the thermal conductivity of the metal (metal material of the conductive material 10) in close contact with the resin is high, the heat accumulated in the resin can be efficiently released. As a result, thermal expansion of the resin can be suppressed. From this point of view, it is preferable that the conductivity proportional to the thermal conductivity of the metal material of the conductive material 10 is 10% IACS or more.

The conductive material 10 can achieve the above (1) and (2) by preparing a predetermined metal material and subjecting the surface of the metal material to etching treatment, blasting treatment, or transfer treatment using a rolling roll having a concavo-convex surface. It is possible to form a surface 11 that satisfies the condition of. As the etching treatment, for example, CZ8101 (product name) manufactured by Mech Co., Ltd., CPE900 (product name) manufactured by Mitsubishi Gas Chemical Co., Ltd., and NR1870 (product name) manufactured by Mech Co., Ltd. are commercially available from various companies. It can be controlled into a predetermined shape using an etchant having In addition, as an etching method, various methods such as an immersion method, a spray method, and an electrolytic method can be employed.

・Embodiment 2 concerning configuration of conductive material

Fig. 2 is a cross-sectional schematic diagram showing the configuration of a conductive material 20 according to Embodiment 2 of the present invention. The conductive material 20 includes a substrate 22 and a plating layer 23 formed on the substrate 22, and the surface 21 satisfying the conditions of (1) and (2) above is the plating layer 23. am. An enlarged view of a portion of the dotted line border 24 of FIG. 2 is shown in the drawing on the right. 2 shows an example of a roughened surface of the conductive material 20, but is not limited to such a roughened surface. According to this configuration, the surface satisfying the above conditions (1) and (2) can be controlled as a plating layer, and the thickness of the surface (surface layer, ie, plating layer) can be easily controlled.

The substrate 22 may be made of resin, or may be made of any metal of copper, copper alloy, aluminum, aluminum alloy, iron and iron alloy. In addition, the substrate 22 may be composed of the same type of metal as the metal of the plating layer 23 . The plating layer 23 may be comprised of any of copper, a copper alloy, nickel, and a nickel alloy. In addition, when the thermal conductivity of the metal (substrate 22 of the conductive material 20) that is indirectly in close contact with the resin is high, heat accumulated in the resin can be efficiently released. As a result, thermal expansion of the resin can be suppressed. From this point of view, it is preferable that the conductivity proportional to the thermal conductivity of the substrate 22 of the conductive material 20 is 10% IACS or more.

For the conductive material 20, a substrate 22 formed of a predetermined material is prepared, and a plating layer 23 is formed on the substrate 22 under predetermined plating conditions. At this time, by controlling the plating conditions such as the composition of the plating bath, plating temperature, current density, and plating thickness, the surface 21 satisfying the above conditions (1) and (2) can be formed.

・Embodiment 3 concerning configuration of conductive material

3 is a cross-sectional schematic diagram showing the configuration of a conductive material 30 according to Embodiment 3 of the present invention. The conductive material 30 is composed of a substrate 32 and two types of plating layers (a first plating layer 33 and a second plating layer 34). The first plating layer 33 is formed on the substrate 32, the second plating layer 34 is formed on the first plating layer 33, and the surface that satisfies the conditions of (1) and (2) above ( 31) is the second plating layer 34. An enlarged view of a portion of the dotted line border 35 of FIG. 3 is shown in the drawing on the right. 3 shows an example of a roughened surface of the conductive material 30, but is not limited to such a roughened surface. According to this configuration, the surface satisfying the above conditions (1) and (2) can be controlled as a plating layer, and the thickness of the surface (surface layer, ie, plating layer) can be easily controlled. In addition, multi-layer plating layers can be manufactured with good cost and efficiency.

The substrate 32 may be composed of resin, or may be composed of any metal of copper, copper alloy, aluminum, aluminum alloy, iron and iron alloy. In addition, the base material 32 may be comprised of the metal of the same kind as the metal of the 1st plating layer 33. The 1st plating layer 33 may be comprised with any of copper, a copper alloy, nickel, and a nickel alloy. The 2nd plating layer may be comprised with any of palladium, a palladium alloy, gold, and a gold alloy. When the conductive material 30 is, for example, a lead frame, by plating the surface of the second plating layer (the outermost surface of the conductive material 30) with noble metal in this way, solderability is improved and low contact resistance can be realized. In addition, when the thermal conductivity of the metal (substrate 32 of the conductive material 30) that is indirectly in close contact with the resin is high, heat accumulated in the resin can be efficiently released. As a result, thermal expansion of the resin can be suppressed. From this point of view, it is preferable that the conductivity proportional to the thermal conductivity of the substrate 32 of the conductive material 30 is 10% IACS or more.

For the conductive material 30, a substrate 32 made of a predetermined material is prepared, a first plating layer 33 is formed on the substrate 32 under predetermined plating conditions, and then a second plating layer 34 is formed. form At this time, by controlling the plating conditions such as the composition of the plating bath, plating temperature, current density, and plating thickness, the surface 31 satisfying the above conditions (1) and (2) can be formed. For example, by controlling the plating conditions such as the composition of the plating bath, the plating temperature, the current density, and the plating thickness, the first plating layer 33 satisfying the conditions of (1) and (2) above is formed. A thin second plating layer 34 is formed on the first plating layer 33 . As a result, the surface profile of the second plating layer 34 becomes substantially equal to that of the first plating layer 33 . In this way, you may form the surface 31 which satisfies the conditions of (1) and (2) above.

The plating layer may be formed in one or two layers as in Embodiment 2 or 3, or may be formed in three or four or more layers. Further, the outermost surfaces of the conductive materials 10, 20, and 30 of Embodiments 1 to 3 are plated by performing treatment with a phosphate ester-based treatment liquid or the like as long as the conditions (1) and (2) above are satisfied. You may impart a function related to the antioxidant of . Moreover, you may provide sealing treatment for suppressing corrosion by the pinhole of plating as needed.

In the conductive material according to the embodiment of the present invention, it is preferable that the total thickness of plating layers composed of one or more types of plating layers is 1 to 7 μm. When the total thickness of the plating layer is less than 1 µm, the roughened shape of the surface cannot be sufficiently formed, and there is a possibility that the diffusion of the components of the base material may proceed easily. If the total thickness of the plating layer is more than 7 μm, cracks may easily occur in the plating layer of the conductive material during press working or bending.

The conductive material according to the embodiment of the present invention may partially have a surface that satisfies the above conditions (1) and (2). In the case where the entire surface of the conductive material satisfies the above conditions (1) and (2), since the surface is partially provided, the resin can be easily removed from the portion where adhesion of the resin is unnecessary. As an example, since the surface is partially provided, the resin (burr) leaking from the target location can be easily removed. Moreover, since the roughened surface which satisfies the conditions of (1) and (2) above has the characteristic that wire bondability deteriorates, deterioration of wire bondability can be suppressed by providing the said surface partially. The partially provided surface may have a stripe shape, a spot shape, or a ring shape or the like.

<Use of conductive material>

Although the use of the conductive material according to the embodiment of the present invention is not particularly limited, it can be used as a material for electronic parts that require good adhesion to resin, and in particular, the surface is made of resin to protect from factors such as impact, temperature, and humidity. It can be used as a material for electronic parts subjected to hardening resin molding, resin sealing, or mold molding. As the said electronic component, metal electronic components, such as a lead frame and a bus bar module, are mentioned, for example. Since the conductive material according to the embodiment of the present invention has very good adhesion between the surface of the conductive material and the resin even if it is a molded article in which resin molding, resin sealing, or mold molding is performed on the surface, for example, for vehicle mounting Good durability can be expected even when used as a material for electronic parts used under harsh environments such as those around engine rooms.

Example

Hereinafter, Examples and Comparative Examples of the present invention are shown together, which are provided to better understand the present invention, but are not intended to limit the present invention.

<Production of conductive material>

As Examples 1 to 14 and 17 to 21, Conventional Example 1, and Comparative Examples 1 to 2, surface layer plating was formed on the surface of the substrate as shown in Table 1. Further, as Examples 15 to 16 and Conventional Example 2, base plating and surface plating were formed on the surface of the substrate as shown in Table 1 to prepare test pieces of conductive materials. The area of each substrate was 50 mm × 50 mm, and the plate thickness was 0.4 mm. In addition, the types of substrates shown in Table 1 are as follows.

C11000: 99.9% Cu

C10200: 99.9% Cu

C19400: Cu-2.2% Fe-0.15% Zn-0.03% P

C70250: Cu-3% Ni-0.65% Si-0.15% Mg

A5052: Al-2.5% Mg-0.4% Fe-0.25% Si-0.25% Cr-0.1% Cu-0.1% Mn-0.1% Zn

42 alloy: Fe-42% Ni

As pretreatment conditions before each plating, for each base material other than A5052, cathode electrolytic degreasing was performed in an alkaline degreasing bath with 50 g/L sodium hydroxide at 5 A/dm for 60 seconds, followed by 10% sulfuric acid and 50 g of ammonium fluoride. Pickling was carried out for 30 seconds with /L pickling solution, and each plating step was performed.

In addition, in A5052, after carrying out cathode electrolytic degreasing in the alkaline degreasing bath at 5 A/dm for 10 seconds, pickling with 10% sulfuric acid and 50 g/L of ammonium fluoride for 10 seconds, followed by 50 g/L of sodium hydroxide , Zinc substitution was carried out by treatment in a zinc substitution bath containing 5 g/L of zinc oxide, 2 g/L of ferric chloride, and 50 g/L of Rochelle salt at a bath temperature of 25 ° C. and a treatment time of 10 seconds, and once more the acid Washing and zinc replacement were repeated and transferred to each plating step.

Each plating treatment was performed by adjusting the composition of the plating bath, the temperature of the plating solution, the current density, and the plating time in electroplating. Table 2 shows the electroplating conditions used in Examples 1 to 5, respectively. The plating bath components were 130 g/L of Ni metal powder, 25 g/L of boric acid, and had a pH of 3.3. Here, the Ni metal powder is composed of nickel sulfamate tetrahydrate and Ni chloride as a Ni salt. More specifically, nickel sulfamate tetrahydrate: Ni(NH ₂ SO ₃ ) ₂ 4H ₂ O = 294 g/L (about 300 g/L), Ni amount 53.5 g/L, nickel chloride hexahydrate: NiCl ₂ 6H ₂ O = about 310 g/L, Ni amount is 76.5 g/L.

The surface layer plating of Examples 6 to 14 and 17 to 20, Conventional Example 1 and Comparative Examples 1 to 2, and the base plating and surface layer plating of Examples 15 to 16 were the plating conditions used in Table 2 of Examples 1 to 5. Based on the above, the composition of the plating bath, the temperature of the plating solution, the current density and plating time, and the degree of stirring were respectively adjusted. At this time, the plating conditions used in Table 2 of Examples 1 to 5 and the evaluation results described later were referred to so that Sa, Spc, and Sz on the surface of the test piece of the conductive material had desired values. In addition, adjustment of each plating condition was performed based on the following findings.

Film thickness: When the film thickness increases, since crystal grains preferentially grow in the film thickness direction (the growth rate in the film thickness direction is faster than in the horizontal direction), Sa and Sz increase. On the other hand, with regard to Spc, the orientation becomes stronger due to the growth of crystal grains, and the tip becomes sharper.

Type of plating solution: By increasing the chlorine concentration in the plating solution, that is, the concentration of Ni chloride, the crystals tend to be sharp and the irregularities on the surface greatly sharpen, so Sa, Sz, and Spc increase respectively.

Plating solution temperature: When the solution temperature of the plating bath is high, crystals grow isotropically, and crystal grains tend to become large, and the tip also tends to become sharp, so Sa, Sz, and Spc each increase. On the other hand, when the temperature exceeds 60°C, grain coarsening proceeds, and the maximum value is taken around 55°C, and eventually decreases.

Current density: Since the number of nuclei generated increases as the current density increases, it can be divided into a case where the film thickness is thin and a case where it is thick. There is a difference of about 3 μm or less, and if the current density is high, Sa and Sz tend to be smaller with priority given to fine precipitation, and the number of projections increases, but the curvature becomes small because fine precipitation proceeds ( That is, Spc tends to increase). On the other hand, when the film thickness is thick, Sa and Sz increase due to the same factor as the increase in film thickness, and Spc tends to increase in that orientation becomes stronger due to crystal grain growth and the tip becomes sharper.

In Conventional Example 2, based on the Examples of Patent Literature 3, a test piece of a conductive material was produced under the following conditions. Specifically, the Ni plating of Conventional Example 2 was carried out under conditions of 260 g/L nickel sulfate, 50 g/L nickel chloride, 35 g/L boric acid, pH 4.5, bath temperature 50°C, current density 5 A/dm 2 and plating time 200 seconds. made in.

Further, for the Au plating described in Examples 15 and 16 and Conventional Example 2, a predetermined film thickness at 20 g/L of potassium gold cyanide and 50 g/L of potassium citrate, pH 5, bath temperature of 60° C., and current density of 1 A/dm Plating time is adjusted so as to be, and in Pd plating, 20 g/L of diaminedichloropalladium as a Pd component and 75 g/L of ammonium chloride, pH 9, bath temperature of 40°C, and current density of 1.5 A/dm are applied to a predetermined film. It was produced by adjusting the plating time so as to be thick. The plating thickness of Conventional Example 2 was 1 μm.

In addition, regarding confirmation of the plating thickness, it was calculated about the average value at a collimator diameter of 0.2 mm and each film thickness measurement time of 30 seconds using a fluorescent X-ray film thickness meter (SFT9500 manufactured by Hitachi High-Tech) for five arbitrary points. .

About Example 21, after performing Ni plating of 6 micrometers under the same conditions as Example 1, it etched under the following conditions until the Ni plating thickness became 5 micrometers.

・Etching conditions

Etching solution: NR1870 manufactured by Mech Corporation, etching solution temperature: 25° C., etching time: 30 seconds

<evaluation>

·Surface Sa, Spc, Sz

Sa, Spc, and Sz of the surface of the test piece of the conductive material were measured using a laser microscope (VK-X150) manufactured by Keyence Corporation at an observation magnification of 1000 times, a spot diameter of 0.8 mm, and a measurement area of 100 μm × 100 μm. The average value of 5 measurements (N5) was calculated and used as the value of Sa, Spc, and Sz of the surface of the test piece of the conductive material.

・Shear strength (initial)

Shear strength was measured in a pudding cup mold test using a sample obtained by resin molding on the surface of a test piece of a conductive material. The test conditions were: resin: GE-7470LA resin manufactured by Hitachi Chemical Co., Ltd., area of the bottom of the pudding cup: 10 mm2, resin molding time: 120 seconds, mold cure: 175 ° C. for 8 hours, 10 shear force measurements (N10) The average value of was calculated and used as the shear strength (initial). The shear was measured at a shear rate of 100 µm/sec with a bond tester (Series 4000) manufactured by Daisy. The evaluation criteria were as follows.

◎: 20 kg or more

○: 15 kg or more and less than 20 kg

×: less than 15 kg

・Shear strength (high temperature and high humidity test)

In addition, after the sample produced as above was left to stand for 168 hours in an environment of a temperature of 85°C and a humidity of 85%, the shear strength was similarly measured. The evaluation criteria were as follows.

◎: No peeling:

○: Peeling rate less than 20%

×: Peeling rate of 20% or more

The peeling rate was evaluated by calculating what ratio the surface of the conductive material and the resin were peeling from the image obtained by ultrasonic flaw detection.

・Shear strength (heat cycle test)

In addition, the sample prepared as described above was maintained at 125 ° C. for 30 minutes and then maintained at -40 ° C. for 30 minutes as one cycle, and this was repeated for 500 cycles continuously. Then, the said shear strength was measured similarly. The evaluation criteria were as follows.

◎: No peeling:

○: Peeling rate less than 10%

△: Peeling rate of 10% or more and less than 20%

×: Peeling rate of 20% or more

The peeling rate was evaluated by calculating what ratio the surface of the conductive material and the resin were peeling from the image obtained by ultrasonic flaw detection.

The above test conditions and evaluation results are shown in Tables 1 and 2.

In all of Examples 1 to 21, since the surface of the conductive material satisfied the following conditions (1) and (2), the shear strength in any of the initial, high temperature and high humidity tests was very good, and the shear strength in the heat cycle test was very good. It was found that the evaluation criteria were any of △, ○, and ◎, and exhibited excellent resin adhesion even under harsh environments.

(1) the arithmetic average surface roughness height Sa is 0.25 to 0.4 μm;

(2) The arithmetic average curve Spc of the mountain peak is 30,000 to 60,000 (1/mm).

All of Conventional Examples 1 and 2 and Comparative Examples 1 and 2 had poor shear strength at least in the heat cycle test because the surface of the conductive material did not satisfy at least one of the conditions (1) and (2) above.

10, 20, 30: conductive material
11, 21, 31: surface
12, 24, 35: dotted border
22, 32: description
23: plating layer
33: first plating layer
34: second plating layer

Claims (11)

A conductive material in which resin is molded on the surface or the surface is sealed with resin,
The surface is composed of any one of copper, copper alloy, aluminum, aluminum alloy, iron, iron alloy, nickel, nickel alloy, palladium, palladium alloy, gold and gold alloy as a metal, and the following conditions (1) and (2) A conductive material that satisfies.
(1) the arithmetic average surface roughness height Sa is 0.25 to 0.4 μm;
(2) The arithmetic mean curve Spc of the peaks is 30,000 to 60,000 (1/mm). According to claim 1,
The conductive material, wherein the maximum surface roughness height Sz of the surface is 3.5 to 6.5 μm. According to claim 1,
The conductive material includes a substrate and a plating layer formed on the substrate,
The conductive material in which the said surface is the said plating layer. According to claim 3,
The conductive material in which the base material is composed of any one of copper, copper alloy, aluminum, aluminum alloy, iron and iron alloy. According to claim 3,
A conductive material in which the plating layer is composed of one or more types of plating layers. According to claim 5,
The conductive material, wherein the plating layer has a first plating layer formed on the substrate, and the first plating layer is composed of copper, a copper alloy, nickel, or a nickel alloy. According to claim 6,
The conductive material, wherein the plating layer has a second plating layer formed on the first plating layer, and the second plating layer is composed of palladium, a palladium alloy, gold, or a gold alloy. According to claim 5,
The conductive material, wherein the total thickness of the plating layers composed of the one or more types of plating layers is 1 to 7 μm. According to claim 1,
A conductive material partially having a surface that satisfies the conditions of (1) and (2) above. A molded article provided with the conductive material according to any one of claims 1 to 9, wherein a resin is molded on the surface or the surface is sealed with a resin. An electronic component comprising the conductive material according to any one of claims 1 to 9.

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