JP2020063493A - Electroconductive material, molded article, and electronic component - Google Patents

Abstract

To provide an electroconductive material exhibiting excellent resin adhesion even in a harsh environment.SOLUTION: The present invention provides an electroconductive material in which a resin is molded on a surface thereof, or the surface of which is sealed by a resin. The surface of the electroconductive material is constituted from a metal, and satisfies conditions (1) and (2). (1) The arithmetic mean surface roughness height Sa is 0.25-0.4 μm. (2) The arithmetic mean curvature Spc of peak apexes is 30,000 to 60,000 (1/mm).SELECTED DRAWING: Figure 2

Description

  The present invention relates to a conductive material, a molded product, and an electronic component.

  In recent years, there has been an increasing demand for improvement in adhesion between metal and resin. For example, in order to protect electronic components made of metal such as lead frames and buzz bar modules from factors such as impact, temperature, and humidity, resin molding, resin sealing, or molding in which the surface of the electronic components is fixed with resin. May be molded. In such a case, it is necessary that the metal surface of the electronic component and the resin are in close contact with each other with excellent adhesion so that the resin does not peel off during use. In particular, for in-vehicle use, further improvement in adhesion is required due to the progress of computerization around the engine room in a harsh environment.

  As a publicly known technique for improving the adhesion between a metal and a resin, Patent Documents 1 to 3 disclose a plating surface of a lead frame in order to improve the adhesion between a lead frame and a molding resin in a resin-sealed semiconductor device. A roughening technique has been proposed.

  Further, as a recent publicly known technique, Patent Document 4 proposes a technique focusing on the specific surface area and the oxide film thickness of the surface layer in order to improve the adhesion between the metal and the resin.

JP-A-6-29439 JP, 10-27873, A JP, 2006-93559, A International Publication No. 2017/179447

  Conventionally, it has been required to clear, for example, JEDEC-LEVEL1 in a high temperature and high humidity test, but in recent years, due to computerization of automobiles and the like, it may have durability in a more severe environment, for example, a heat cycle test. It is required, and there are some situations in which the characteristics cannot be said to be sufficient with the conventional technology.

  The present invention has been made to solve the above problems, and provides a conductive material exhibiting excellent resin adhesion even in a harsh environment.

  As a result of diligent studies, the inventors of the present invention have formed a metal surface on which a resin is molded or sealed with a resin, and by controlling the surface in a predetermined form, a conductive material that can solve the problem is obtained. It was found that it can be obtained.

In one embodiment, the present invention completed based on the above findings is a conductive material in which a resin is molded on the surface or the surface is sealed with a resin,
The surface is made of a metal and is a conductive material satisfying the following conditions (1) and (2).
(1) Arithmetic mean surface roughness height Sa is 0.25 to 0.4 μm,
(2) The arithmetic mean song Spc of the mountain top is 30,000 to 60,000 (1 / mm).

  In still another embodiment of the conductive material of the present invention, the maximum surface roughness height Sz of the surface is 3.5 to 6.5 μm.

  In still another embodiment of the conductive material of the present invention, the conductive material includes a base material and a plating layer formed on the base material, and the surface is the plating layer.

  In still another embodiment of the conductive material of the present invention, the base material is made of any one of copper, copper alloy, aluminum, aluminum alloy, iron and iron alloy.

  In still another embodiment of the conductive material of the present invention, the plating layer is composed of one or more kinds of plating layers.

  In still another embodiment of the conductive material of the present invention, the plating layer has a first plating layer formed on the base material, and the first plating layer is copper, copper alloy, nickel and nickel alloy. It is composed of either.

  In still another embodiment of the conductive material of the present invention, the plating layer has a second plating layer formed on the first plating layer, and the second plating layer is palladium, a palladium alloy, gold and Composed of any of the gold alloys.

  In still another embodiment of the conductive material of the present invention, the total thickness of the plating layers formed of the one or more plating layers is 1 to 7 μm.

  In still another embodiment, the conductive material of the present invention partially has a surface satisfying the conditions (1) and (2).

  In still another embodiment, the present invention is a molded article comprising the conductive material of the present invention, the surface of which is molded with a resin or the surface of which is sealed with a resin.

  The present invention, in yet another embodiment, is an electronic component comprising the conductive material of the present invention.

  According to the present invention, it is possible to provide a conductive material that exhibits excellent resin adhesion even in a harsh environment.

3 is a schematic cross-sectional view showing the configuration of a conductive material according to Embodiment 1. FIG. 5 is a schematic cross-sectional view showing the configuration of a conductive material according to Embodiment 2. FIG. 7 is a schematic cross-sectional view showing the configuration of a conductive material according to Embodiment 3. FIG.

<Conductive material>
The conductive material according to the embodiment of the present invention is a conductive material in which a resin is molded on the surface or the surface is sealed with a resin, and the surface is made of metal, and the following (1) and (2) Satisfy the condition of.
(1) Arithmetic mean surface roughness height Sa is 0.25 to 0.4 μm,
(2) The arithmetic mean song Spc of the mountain top is 30,000 to 60,000 (1 / mm).

  Conventionally, regarding the adhesiveness between the metal and the resin, the line roughness (Rz, Ra) of the metal was controlled, but the parameter for controlling the adhesiveness with the resin in the electronic component used in a more severe environment. Is not enough. On the other hand, although details will be described later, in the present invention, by introducing Sa and Spc defined in International Standardization Organization ISO25178-2: 2012 as surface roughness, the adhesion to the resin is better than before. You can now control.

  Since at least the surface of the conductive material according to the exemplary embodiment of the present invention may be made of metal, details thereof will be described later, but the conductive material may be formed of one kind of metal material, and the base material and the metal layer on the surface It may be formed separately.

  The arithmetic mean surface roughness height Sa of the surface of the conductive material according to the embodiment of the present invention is controlled to 0.25 to 0.4 μm. If Sa of the surface of the conductive material is less than 0.25 μm, the anchor effect becomes insufficient due to insufficient roughening of the surface, and the adhesiveness with the resin decreases. If Sa of the surface of the conductive material is more than 0.4 μm, the tip portion of the surface of the conductive material that is roughened and easily breaks. Sa of the surface of the conductive material is preferably 0.27 to 0.38 μm, and more preferably 0.3 to 0.35 μm.

  When the metal surface of the conductive material according to the embodiment of the present invention and the resin are in close contact with each other, the resin has a larger coefficient of thermal expansion than the metal, and therefore the thermal expansion of the resin needs to be suppressed by the metal anchor. In the present invention, the arithmetic mean curve Spc at the peak of the surface of the conductive material is controlled to 30,000 to 60,000 (1 / mm) against the problem of the difference in thermal expansion coefficient from the resin. Note that Spc represents the reciprocal of the average of the principal curvatures of the peaks of the surface. That is, the sharper the summit, the larger the Spc. If the arithmetic mean curve Spc of the peaks of the surface of the conductive material is less than 30,000 (1 / mm), the anchor effect becomes insufficient, and the thermal expansion coefficient may be lost, resulting in peeling from the resin. is there. If the Spc on the surface of the conductive material is too large, the tip may be too sharp and may be easily broken, which may rather lower the adhesion strength. From such a point of view, the Spc on the surface of the conductive material is effective in combination with the above-mentioned Sa so that no particular upper limit is set, but it is preferably 60,000 (1 / mm) or less. Further, the Spc of the surface of the conductive material is preferably 340000 to 550,000 (1 / mm), more preferably 40,000 to 550,000 (1 / mm).

  The maximum surface roughness height Sz (ISO25178-2: 2012) of the surface of the conductive material according to the embodiment of the present invention is preferably 3.5 to 6.5 μm. If the Sz of the surface of the conductive material is less than 3.5 μm, the anchoring effect becomes insufficient due to insufficient roughening of the surface, and the adhesion with the resin decreases. If the Sz of the surface of the conductive material is more than 6.5 μm, the resin may not easily enter the gap between the heights of the surface of the conductive material. Sa of the surface of the conductive material is preferably 3.7 to 6.0 μm, and more preferably 4.5 to 5.0 μm.

  The conductive material according to the embodiment of the present invention is not particularly limited as long as the surface has at least a metal, and includes the following three patterns (Embodiments 1 to 3).

First embodiment relating to the configuration of the conductive material
FIG. 1 is a schematic cross-sectional view showing the configuration of a conductive material 10 according to Embodiment 1 of the present invention. The conductive material 10 is made of a metal material and has a surface 11 that satisfies the above conditions (1) and (2). An enlarged view of the portion surrounded by the dotted line frame 12 in FIG. 1 is shown in the right figure. The right diagram of FIG. 1 shows an example of the roughened surface of the conductive material 10, and the roughened surface having such a shape is not limited. According to such a configuration, since the material forming the conductive material is one kind of metal material, the manufacturing efficiency or the manufacturing cost is improved. As the metal material of the conductive material 10, for example, any of copper, copper alloy, aluminum, aluminum alloy, iron, iron alloy, nickel, nickel alloy, palladium, palladium alloy, gold and gold alloy can be used. Further, between the metal and the resin, the resin has a larger coefficient of thermal expansion. At this time, if the metal (metal material of the conductive material 10) that adheres to the resin has a high thermal conductivity, the heat trapped in the resin can be efficiently released. As a result, the thermal expansion of the resin can be suppressed. From such a viewpoint, it is preferable that the conductivity of the conductive material 10 which is proportional to the thermal conductivity of the metal material is 10% IACS or more.

  The conductive material 10 is prepared by preparing a predetermined metal material, and subjecting the surface of the metal material to etching treatment, blasting treatment, or transfer treatment with a rolling roll having an uneven surface to obtain the above (1) and (2). It is possible to form the surface 11 satisfying the condition (1). Examples of the etching treatment include commercially available etching solutions such as CZ8101 (product name) manufactured by Mec Co., Ltd., CPE900 (product name) manufactured by Mitsubishi Gas Chemical Co., Inc., and NR1870 (product name) manufactured by Mec Co., Ltd. It can be used to control the desired shape. As the etching method, various methods such as an immersion method, a spray method, and an electrolytic method can be adopted.

Embodiment 2 relating to the configuration of the conductive material
FIG. 2 is a schematic cross-sectional view showing the configuration of the conductive material 20 according to Embodiment 2 of the present invention. The conductive material 20 includes a base material 22 and a plating layer 23 formed on the base material 22, and the surface 21 that satisfies the above conditions (1) and (2) is the plating layer 23. An enlarged view of the dotted frame 24 portion of FIG. 2 is shown in the right figure. The right diagram of FIG. 2 shows an example of the roughened surface of the conductive material 20, and the roughened surface of such a shape is not limited. According to such a configuration, the surface satisfying the above conditions (1) and (2) can be controlled by the plating layer, and the thickness of the surface (surface layer, that is, plating layer) can be easily controlled. .

  The base material 22 may be made of resin, and may be made of any metal of copper, copper alloy, aluminum, aluminum alloy, iron and iron alloy. Further, the base material 22 may be made of the same kind of metal as the metal of the plating layer 23. The plating layer 23 may be made of any one of copper, copper alloy, nickel and nickel alloy. Further, if the metal (base material 22 of the conductive material 20) that indirectly adheres to the resin has a high thermal conductivity, the heat trapped in the resin can be efficiently released. As a result, the thermal expansion of the resin can be suppressed. From such a viewpoint, it is preferable that the conductivity of the conductive material 20 that is proportional to the thermal conductivity of the base material 22 is 10% IACS or more.

  As the conductive material 20, a base material 22 formed of a predetermined material is prepared, and a plating layer 23 is formed on the base material 22 under predetermined plating conditions. At this time, the surface 21 satisfying the above conditions (1) and (2) can be formed by controlling the plating conditions such as the composition of the plating bath, the plating temperature, the current density, and the plating thickness.

-Embodiment 3 relating to the configuration of the conductive material
FIG. 3 is a schematic cross-sectional view showing the configuration of the conductive material 30 according to the third embodiment of the present invention. The conductive material 30 is composed of a base material 32 and two types of plating layers (first plating layer 33, second plating layer 34). The first plating layer 33 is formed on the base material 32, the second plating layer 34 is formed on the first plating layer 33, and the surface 31 satisfying the above conditions (1) and (2) is the second plating. The layer 34. An enlarged view of the portion surrounded by the dotted line frame 35 in FIG. 3 is shown in the right figure. The right diagram of FIG. 3 shows an example of the roughened surface of the conductive material 30, and is not limited to the roughened surface having such a shape. According to such a configuration, the surface satisfying the above conditions (1) and (2) can be controlled by the plating layer, and the thickness of the surface (surface layer, that is, plating layer) can be easily controlled. . In addition, it is possible to manufacture a multi-layered plating layer with good cost and efficiency.

  The base material 32 may be made of resin, and may be made of any metal of copper, copper alloy, aluminum, aluminum alloy, iron and iron alloy. Further, the base material 32 may be made of the same kind of metal as the metal of the first plating layer 33. The first plating layer 33 may be made of any one of copper, copper alloy, nickel and nickel alloy. The second plating layer may be composed of any one of palladium, palladium alloy, gold and gold alloy. When the conductive material 30 is, for example, a lead frame, the surface of the second plating layer (the outermost surface of the conductive material 30) is plated with a noble metal in this way to improve solderability and realize low contact resistance. it can. Moreover, if the metal (base material 32 of the conductive material 30) that indirectly adheres to the resin has a high thermal conductivity, the heat trapped in the resin can be efficiently released. As a result, the thermal expansion of the resin can be suppressed. From such a viewpoint, it is preferable that the conductivity of the base material 32 of the conductive material 30 is 10% IACS or more, which is proportional to the thermal conductivity.

  As the conductive material 30, a base material 32 formed of a predetermined material is prepared, a first plating layer 33 is formed on the base material 32 under a predetermined plating condition, and then a second plating layer 34 is formed. . At this time, the surface 31 satisfying the above conditions (1) and (2) can be formed by controlling the plating conditions such as the composition of the plating bath, the plating temperature, the current density, and the plating thickness. For example, the first plating layer 33 satisfying the above conditions (1) and (2) is formed by controlling the plating conditions such as the composition of the plating bath, the plating temperature, the current density, and the plating thickness. A thin second plating layer 34 is formed on the plating layer 33. As a result, the surface profile of the second plating layer 34 becomes substantially equal to the surface profile of the first plating layer 33. In this way, the surface 31 that satisfies the above conditions (1) and (2) may be formed.

  The plating layer may be formed of one layer or two layers as in the second or third embodiment, or may be formed of three layers or four or more layers. Further, the outermost surfaces of the conductive materials 10, 20, and 30 of Embodiments 1 to 3 should be treated with a phosphoric acid ester-based treatment liquid or the like as long as the above conditions (1) and (2) are satisfied. Then, the function related to the antioxidant of plating may be added. If necessary, a sealing treatment may be applied to suppress corrosion due to pinholes in plating.

  In the conductive material according to the embodiment of the present invention, it is preferable that the total thickness of the plating layers composed of one or more plating layers is 1 to 7 μm. If the total thickness of the plating layer is less than 1 μm, a roughened surface shape cannot be sufficiently formed, and diffusion of the base material components may easily proceed. If the total thickness of the plating layer is more than 7 μm, cracks may easily occur in the plating layer of the conductive material during pressing or bending.

  The conductive material according to the embodiment of the present invention may partially have a surface that satisfies the above conditions (1) and (2). In contrast to the case where the entire surface of the conductive material satisfies the above conditions (1) and (2), the surface is partially provided, so that the resin can be easily removed from the portion where resin adhesion is unnecessary. can do. As an example, since the surface is partially provided, it is possible to easily remove the resin (burr) that has leaked from the target location. Further, a surface having a roughened shape that satisfies the above conditions (1) and (2) has a characteristic that the wire bonding property is deteriorated. Therefore, by partially providing the surface, the wire bonding property can be improved. The deterioration can be suppressed. The partially provided surface may be stripe-shaped, spot-shaped, or ring-shaped.

<Use of conductive material>
The use of the conductive material according to the embodiment of the present invention is not particularly limited, but it can be used as a material of an electronic component that requires good adhesiveness with a resin, and is particularly protected from factors such as impact, temperature, and humidity. Therefore, it can be used as a material for an electronic component that is subjected to resin molding, resin sealing of which the surface is hardened with a resin, or molding. Examples of the electronic component include metal electronic components such as lead frames and buzz bar modules. The conductive material according to the embodiment of the present invention has a very high adhesion between the surface of the conductive material and the resin, even if the surface is resin-molded, resin-sealed, or molded as such. Therefore, good durability can be expected even when used as a material for an electronic component used in a harsh environment such as a vehicle-mounted engine room, for example.

  Hereinafter, both Examples and Comparative Examples of the present invention will be shown, but these are provided for better understanding of the present invention and are not intended to limit the present invention.

<Production of conductive material>
As Examples 1 to 14, 17 to 21, Conventional Example 1, and Comparative Examples 1 and 2, surface layer plating was formed on the surface of the base material as shown in Table 1. In addition, as Examples 15 to 16 and Conventional Example 2, as shown in Table 1, base plating and surface layer plating were formed on the surface of the base material to prepare test pieces of a conductive material. The area of each base material was 50 mm × 50 mm, and the plate thickness was 0.4 mm. The types of base materials shown in Table 1 are as follows.
C11000: 99.9% Cu
C10200: 99.9% Cu
C19400: Cu-2.2% Fe-0.15% Zn-0.03% P
C70250: Cu-3% Ni-0.65% Si-0.15% Mg
A5052: Al-2.5Mg-0.4% Fe-0.25% Si-0.25% Cr-0.1% Cu-0.1% Mn-0.1% Zn
42 alloy: Fe-42% Ni

As a pretreatment condition before performing each plating, for each base material other than A5052, cathode electrolytic degreasing was performed at 5 A / dm ² for 60 seconds in an alkaline degreasing bath containing 50 g / L of sodium hydroxide, and then 10%. Acid pickling was performed for 30 seconds with a pickling solution of sulfuric acid and ammonium fluoride of 50 g / L, and each plating step was performed.

In A5052, cathodic electrolytic degreasing was carried out for 10 seconds at 5 A / dm ² in the alkaline degreasing bath described above, followed by 10 seconds of acid cleaning with a 10% sulfuric acid and 50 g / L ammonium fluoride pickling solution, and then water. In a zinc substitution bath containing 50 g / L of sodium oxide, 5 g / L of zinc oxide, 2 g / L of ferric chloride and 50 g / L of Rochelle salt, treated at a bath temperature of 25 ° C. for a treatment time of 10 seconds. Zinc substitution was carried out, and the above-mentioned acid cleaning and zinc substitution were repeated once again to shift to each plating step.

Each plating treatment was performed by electroplating by adjusting the composition of the plating bath, the temperature of the plating solution, the current density and the plating time. Table 2 shows the electroplating conditions used in Examples 1 to 5, respectively. The plating bath components were Ni metal content 130 g / L, boric acid 25 g / L, and pH 3.3. Here, the Ni metal component is composed of nickel sulfamate tetrahydrate and Ni chloride as Ni salts. More specifically, nickel sulfamate _{tetrahydrate: Ni (NH 2 SO 3)} 2 · 4H 2 O = 294g / L ( about 300g / L), 53.5g / L , nickel chloride hexahydrate in Ni content Japanese product: NiCl ₂ .6H ₂ O = about 310 g / L, and the amount of Ni is 76.5 g / L.

The surface layer platings of Examples 6 to 14 and 17 to 20, the conventional example 1 and the comparative examples 1 to 2, and the base plating and the surface layer plating of Examples 15 to 16 were used in Table 2 of the above Examples 1 to 5. It was formed by adjusting the composition of the plating bath, the temperature of the plating solution, the current density, the plating time, and the degree of stirring, based on the plating conditions. At this time, the plating conditions used in Table 2 of Examples 1 to 5 and the evaluation results described below were referred to so that Sa, Spc, and Sz of the surface of the test piece of the conductive material would have desired values. Moreover, adjustment of each plating condition was performed based on the following knowledge.
Film thickness: As the film thickness increases, the crystal grains preferentially grow in the film thickness direction (the growth speed in the film thickness direction is faster than in the horizontal direction), so Sa and Sz increase. On the other hand, with respect to Spc, the orientation becomes stronger due to the growth of crystal grains and the tip becomes sharper, and thus becomes larger.
Type of plating solution: By increasing the chlorine concentration in the plating solution, that is, the Ni chloride concentration, the crystals are easily sharpened and the surface irregularities become large and sharp, so that Sa, Sz, and Spc increase, respectively.
Plating solution temperature: If the solution temperature in the plating bath is high, crystals grow isotropically, crystal grains are likely to become large, and the tip tends to be sharp, so that Sa, Sz, and Spc increase. On the other hand, when the temperature exceeds 60 ° C., the coarsening of the crystal grains progresses, and the maximum value gradually decreases near 55 ° C.
Current density: Since the number of nucleation increases as the current density increases, it can be considered that the film thickness is thin or thick. There is a difference of about 3 μm, and if it is 3 μm or less, Sa and Sz tend to be small when the current density is high because the fine precipitation has priority, and the number of protrusions is large, but since the fine precipitation proceeds, the curvature is small. (That is, Spc increases). On the other hand, when the film thickness is thick, Sa and Sz increase due to the same factor as the above-mentioned film thickness increase, and Spc tends to increase because the orientation becomes strong due to the growth of crystal grains and the tip becomes sharp.
In Conventional Example 2, a test piece of a conductive material was prepared under the following conditions based on the example of Patent Document 3. Specifically, in the Ni plating of Conventional Example 2, 260 g / L of nickel sulfate, 50 g / L of nickel chloride, 35 g / L of boric acid, pH 4.5, bath temperature 50 ° C., current density 5 A / dm ² , It was produced under the condition that the plating time was 200 seconds.
Further, regarding the Au plating described in Examples 15 and 16 and Conventional Example 2, 20 g / L of potassium gold cyanide, 50 g / L of potassium citrate, pH 5, bath temperature of 60 ° C., and current density of 1 A / dm ² were set. The plating time is adjusted so that the film thickness becomes, and in Pd plating, 20 g / L of diamminedichloropalladium as a Pd component, 75 g / L of ammonium chloride, pH 9, bath temperature 40 ° C., current density 1.5 A / It was produced by adjusting the plating time so as to obtain a predetermined film thickness in dm ² . The plating thickness of Conventional Example 2 was 1 μm.
For confirmation of the plating thickness, a fluorescent X-ray film thickness meter (SFT9500 manufactured by Hitachi High-Tech Co., Ltd.) was used for arbitrary 5 points, and an average value at a collimator diameter of 0.2 mm and each film thickness measurement time of 30 seconds was calculated. did.

In Example 21, after performing 6 μm Ni plating under the same conditions as in Example 1, etching was performed under the following conditions until the Ni plating thickness became 5 μm.
-Etching conditions Etching solution: NR1870 manufactured by MEC, etching solution temperature: 25 ° C, etching time: 30 seconds

<Evaluation>
・ Sa, Spc, Sz on the surface
The Sa, Spc, and Sz of the surface of the test piece of the conductive material were measured with a laser microscope (VK-X150) manufactured by Keyence Corporation, with an observation magnification of 1000 times, a spot diameter φ0.8 mm, and a measurement area of 100 μm × 100 μm. The average value of five measurements (N5) was calculated and used as the values of Sa, Spc, and Sz on the surface of the test piece of the conductive material.

・ Share strength (initial)
The shear strength was measured by a pudding cup mold test using a resin-molded surface of a test piece of a conductive material as a sample. Test conditions were resin: GE-7470LA resin manufactured by Hitachi Chemical Co., Ltd., pudding cup bottom surface area: 10 mm ² , resin molding time: 120 seconds, mold cure: 175 ° C. for 8 hours, and 10 times of shear force measurement (N10). The average value of was calculated as the shear strength (initial). The shear was measured with a bond tester (Series 4000) manufactured by Daiji at a shear rate of 100 μm / sec. The evaluation criteria are as follows.
◎: 20 kg or more ○: 15 kg or more and less than 20 kg ×: less than 15 kg

・ Share strength (high temperature and high humidity test)
The shear strength was similarly measured after the sample produced as described above was allowed to stand in an environment of a temperature of 85 ° C. and a humidity of 85% for 168 hours. The evaluation criteria are as follows.
⊚: No peeling ◯: Peeling rate less than 20% ×: Peeling rate of 20% or more The peeling rate indicates the rate at which the surface of the conductive material and the resin are peeled from the image by ultrasonic flaw detection. Calculated and evaluated.

・ Share strength (heat cycle test)
Further, the sample manufactured as described above was held at 125 ° C. for 30 minutes and then held at −40 ° C. for 30 minutes, which was repeated for 500 consecutive cycles. Then, the shear strength was similarly measured. The evaluation criteria are as follows.
◎: No peeling ◯: Peeling rate less than 10% △: Peeling rate 10% or more and less than 20% ×: Peeling rate of 20% or more The peeling rate is based on an image obtained by ultrasonic flaw detection, which is the surface of the conductive material and the resin. It was evaluated by calculating whether the peeling occurred at such a ratio.
The test conditions and the evaluation results are shown in Tables 1 and 2.

In each of Examples 1 to 21, the surface of the conductive material satisfied the following conditions (1) and (2), so that the shear strength in both the initial and high temperature and high humidity tests was very good, and the heat cycle test was performed. The evaluation criteria for the shear strength of are any of Δ, ◯, and ◎, and it was found that the resin exhibits excellent resin adhesion even in a harsh environment.
(1) Arithmetic mean surface roughness height Sa is 0.25 to 0.4 μm,
(2) Arithmetic average song Spc of mountain top is 30,000 to 60,000 (1 / mm)
In each of Conventional Examples 1 and 2 and Comparative Examples 1 and 2, since the surface of the conductive material did not satisfy at least one of the above conditions (1) and (2), at least the shear strength in the heat cycle test was poor. there were.

10, 20, 30 Conductive material 11, 21, 31 Surface 12, 24, 35 Dotted frame 22, 32 Base material 23 Plating layer 33 First plating layer 34 Second plating layer

Claims (11)

A conductive material for molding resin on the surface or sealing the surface with resin,
A conductive material, the surface of which is made of metal and which satisfies the following conditions (1) and (2).
(1) Arithmetic mean surface roughness height Sa is 0.25 to 0.4 μm,
(2) The arithmetic mean song Spc of the mountain top is 30,000 to 60,000 (1 / mm).   The conductive material according to claim 1, wherein the maximum surface roughness height Sz of the surface is 3.5 to 6.5 μm. The conductive material includes a substrate and a plating layer formed on the substrate,
The conductive material according to claim 1, wherein the surface is the plating layer.   The conductive material according to claim 3, wherein the base material is made of any one of copper, copper alloy, aluminum, aluminum alloy, iron and iron alloy.   The conductive material according to claim 3, wherein the plated layer is composed of one or more kinds of plated layers.   The electroconductivity according to claim 5, wherein the plating layer has a first plating layer formed on the base material, and the first plating layer is made of any one of copper, copper alloy, nickel and nickel alloy. material.   The said plating layer has a 2nd plating layer formed on the said 1st plating layer, The said 2nd plating layer was comprised by palladium, a palladium alloy, gold, and a gold alloy. Conductive material.   The conductive material according to any one of claims 5 to 7, wherein a total thickness of the plating layers formed of the one or more plating layers is 1 to 7 µm.   The conductive material according to claim 1, which partially has a surface that satisfies the conditions (1) and (2).   A molded article provided with the conductive material according to claim 1, wherein the surface is molded with a resin or the surface is sealed with a resin.   An electronic component comprising the conductive material according to claim 1.