JPH02104654A - Production of surface treated steel sheet for high-effeiciency lead frame excellent in corrosion resistance, plating suitability, and solderability - Google Patents

Production of surface treated steel sheet for high-effeiciency lead frame excellent in corrosion resistance, plating suitability, and solderability

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Publication number
JPH02104654A
JPH02104654A JP25544188A JP25544188A JPH02104654A JP H02104654 A JPH02104654 A JP H02104654A JP 25544188 A JP25544188 A JP 25544188A JP 25544188 A JP25544188 A JP 25544188A JP H02104654 A JPH02104654 A JP H02104654A
Authority
JP
Japan
Prior art keywords
plating
lead frame
steel sheet
corrosion resistance
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25544188A
Other languages
Japanese (ja)
Inventor
Toshinori Katayama
片山 俊則
Yukinobu Higuchi
樋口 征順
Nobuo Tsuzuki
都築 信男
Fumio Yamamoto
山本 二三夫
Hirobumi Nakano
寛文 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP25544188A priority Critical patent/JPH02104654A/en
Publication of JPH02104654A publication Critical patent/JPH02104654A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To produce a surface treated steel sheet for high-efficiency lead frame excellent in corrosion resistance, plating suitability, and solderability by coating a Cr- containing cold rolled steel sheet having a specific composition with Ni or Co by a specific coating weight and then applying specific homogenizing treatment to the above sheet. CONSTITUTION:A Cr-containing steel sheet which has a composition consisting of, by weight, <=0.01% C, 0.005-0.10% acid-soluble Al, 3-10.5% Cr, 0.0003-0.005% B, further 0.03-0.8% of one or more elements among Ti, Nb, Zr, and V, and the balance Fe with inevitable impurities and further containing, if necessary, one or more kinds among 0.05-1% Cu, 0.05-3% Ni, and 0.05-0.5% Mo is cold-rolled. A coating layer of Ni, Co, or alloy of both in which coating weight per side is regulated to 100-3000mg/m<2> is provided to the surface of the above cold rolled steel sheet. Subsequently, the above steel sheet is subjected to homogenizing treatment at a temp. in the range between 450 deg.C and the recrystallization temp. for <=180sec in a nonoxidizing atmosphere. By this method, the surface treated steel sheet for high-efficiency lead frame excellent in various characteristics, such as stamping property and corrosion resistance, can be obtained.

Description

【発明の詳細な説明】 (a業上の利用分野) 本発明は、耐食性にすぐれるとともに、リードフレーム
製造工程における打抜き加工性(スタンピング性)に必
要な材質性能、めっき性能或いははんだ性能にすぐれた
リードフレーム用表面処理鋼板の製造法に関するもので
ある。
Detailed Description of the Invention (Field of Application in Industry A) The present invention has excellent corrosion resistance, as well as excellent material performance, plating performance, or solder performance necessary for punching workability (stamping performance) in the lead frame manufacturing process. The present invention relates to a method for manufacturing surface-treated steel sheets for lead frames.

(従来の技術) 近時、エレクトロニクス分野において、集積回路(IC
)の需要が著しく増大し、リードフレーム材料の需要も
増加し、諸性能にすぐれたリードフレーム材料の開発が
強く望まれている。
(Prior art) Recently, in the electronics field, integrated circuits (ICs)
) has increased significantly, and the demand for lead frame materials has also increased, and there is a strong desire to develop lead frame materials with excellent performance.

一般にこれらリードフレーム材は、帯材とした後、裁断
、打抜き加工を施こし、その表面にCuめっき或いはは
んだめっき(浸漬はんだ或いは電気はんだめっき)を施
こし、これにAg、Au等がめフきされ、さらにシリコ
ンチップを結合(ワイヤーボンディング)してIC素材
として使用される。
In general, these lead frame materials are made into strips, then cut and punched, and then Cu plating or solder plating (immersion solder or electric solder plating) is applied to the surface, and then Ag, Au, etc. are plated. It is then used as an IC material by bonding silicon chips (wire bonding).

従って、これらリードフレーム材料は、打抜き成形加工
性が良好である事、めっき性がすぐれている事、はんだ
性がすぐれている事が要求される。中でもリードフレー
ムの端子部がIC基盤等にはんだづけされるために、す
ぐれたはんだ性を有することが重要である。
Therefore, these lead frame materials are required to have good punching and forming processability, excellent plating properties, and excellent solderability. In particular, since the terminal portion of the lead frame is soldered to an IC board or the like, it is important to have excellent solderability.

さらには素材は、上記のようなめつき等が行なわれる以
前の貯蔵時の耐錆性、さらには処理が行なわれた後の製
品の耐錆性がすぐれている事も要求される。
Furthermore, the material is required to have excellent rust resistance during storage before being subjected to the above-mentioned plating, etc., and furthermore, the product after the treatment is required to have excellent rust resistance.

(発明が解決しようとする課題) 従来、リードフレーム材料としては、強度と熱膨張特性
からFe −42%Ni合金が主として使用されており
、またコストと導電性の利点から銅合金も使用されてい
る。しかしこの銅合金も導電性及び熱放散性の点では優
れているが、Fe −42%Ni合金に比べ強度が不足
するため、ICの自動組立工程においてアクタ−リード
を部材に差込む際折れ曲がるという不都合があった。
(Problems to be Solved by the Invention) Conventionally, Fe-42%Ni alloy has been mainly used as a lead frame material due to its strength and thermal expansion characteristics, and copper alloy has also been used due to its cost and conductivity advantages. There is. However, although this copper alloy has excellent conductivity and heat dissipation, it lacks strength compared to the Fe-42%Ni alloy, so it has been reported that actuator leads may bend when inserted into components during the automatic IC assembly process. There was an inconvenience.

さらには、最近ICの小型化の点からリードフレーム素
材も極薄化の傾向にあり、高い強度が要求されている。
Furthermore, with the recent trend toward miniaturization of ICs, lead frame materials are also becoming extremely thin, and high strength is required.

コストの点からは低炭素鋼が最も有利であるが、錆を発
生し易い問題から使用することができない。一方耐食性
及び強度に優れたステンレス鋼は、多量のCrを含有す
るためにめっき性及びはんだ性に問題がある。このよう
な問題を改善するリードフレーム用素材としては、例え
ば特開昭57−50457号、特開昭59−9149号
、特開昭60−103158号等の各公報で紹介されて
いる。これらは基本成分として4〜11%のCrを含有
し、その他にNi、 Mo、 Cu、 Ti、 Nb、
 V、 Zr等を数%以下含有せしめてリードフレーム
用素材に必要な耐錆性を向上せしめ、またステンレス鋼
の欠点とするめつき性、はんだ性を改善せしめたリード
フレーム用素材である。
Low carbon steel is the most advantageous from a cost point of view, but cannot be used due to its tendency to rust. On the other hand, stainless steel, which has excellent corrosion resistance and strength, has problems in plating and solderability because it contains a large amount of Cr. Materials for lead frames that solve these problems are introduced in, for example, Japanese Patent Laid-Open Nos. 57-50457, 59-9149, and 60-103158. These contain 4 to 11% Cr as a basic component, and also include Ni, Mo, Cu, Ti, Nb,
This is a lead frame material that contains V, Zr, etc. in a few percent or less to improve the rust resistance required for lead frame materials, and also improves the plating and solderability, which are disadvantages of stainless steel.

これら素材は、それなりの性能向上効果が得られるもの
の必ずしもリードフレーム用素材として充分な性能が得
られていない。すなわちCuめつきのめっき密着性が充
分でなく、特にワイヤーボンディング時の加熱工程にお
いて、Cuめフき層にブリスターくめつき層の部分的な
膨れ)を発生する欠点がみられた。またエレクトロニク
ス分野で多く使用されるCfL−イオンのようなハロゲ
ンイオンを含有しないノンハロゲンタイプのフラックス
を用いたはんだづけ作業において、はんだが充分に付か
ない問題があった。
Although these materials can provide a certain performance improvement effect, they do not necessarily provide sufficient performance as materials for lead frames. In other words, the plating adhesion of Cu plating was insufficient, and there was a drawback in that the Cu plating layer partially bulged in the blister plating layer, particularly in the heating process during wire bonding. Further, in soldering work using a non-halogen type flux that does not contain halogen ions, such as CfL- ions, which are often used in the electronics field, there is a problem that the solder does not adhere sufficiently.

さらにまた、上記した公知の鋼成分の鋼板に、旧或いは
Ni合金めっき、またはCu或いはCu合金のめっきを
施こしたリードフレーム用素材が特開昭61−2849
48号公報で紹介されている。該素材はFa−Cr系合
金鋼板、すなわち重量%でCr;  5.0〜10.5
%、C,0,10%以下、 Si;  2.0%以下、
Mn;2.0%以下、  Au2 、0.10%以下の
基本成分の他に必要に応じてNi、  3.0%以下、
 Cu;  2.0%以下。
Furthermore, a lead frame material obtained by applying old or Ni alloy plating, or Cu or Cu alloy plating to a steel plate having the above-mentioned known steel components is disclosed in Japanese Patent Application Laid-Open No. 61-2849.
It is introduced in Publication No. 48. The material is Fa-Cr alloy steel plate, i.e. Cr in weight%; 5.0-10.5
%, C, 0.10% or less, Si; 2.0% or less,
Mn: 2.0% or less, Au2, 0.10% or less of the basic components, and Ni, 3.0% or less, if necessary.
Cu: 2.0% or less.

Mo;  4.0%以下のうち1 fl又は2種以上、
或いはNb、 Ti、 Ta、 Zrのうち1 ffi
又は2種以上を0.6%以下添加し、残部実質的にFe
よりなる鋼板に、Ni或いはNi合金のめつき、または
Cu或いはCu合金めっきの3〜5μの被覆層を施こし
、冷間圧延した鋼板である。
Mo: 1 fl or 2 or more of 4.0% or less,
Or 1 ffi of Nb, Ti, Ta, Zr
Or, two or more types are added at 0.6% or less, and the remainder is substantially Fe.
This is a steel plate obtained by applying a coating layer of 3 to 5 microns of Ni or Ni alloy plating, or Cu or Cu alloy plating to a steel plate, and then cold rolling the steel plate.

該鋼板は、冷間圧延されたまま或いは歪み取り焼鈍をし
、リードフレーム用素材として使用されるが、Auまた
はAgのめっ包性或いははんだづけ性が、Fe−Cr系
ベース材のまま使用される場合に比してかなり改善され
る。
The steel plate is used as a lead frame material either as cold rolled or after strain relief annealing, but if the Au or Ag plating property or solderability is high, if it is used as a Fe-Cr base material. This is considerably improved compared to .

しかしながら該鋼板は、めっき後の冷間圧延時にめっき
金属が圧延ロールに付着するため、外観が平滑良好な製
品を得るのに煩雑な手入れを要するなど、製造面で問題
が多い。
However, this steel plate has many problems in terms of manufacturing, such as the fact that the plated metal adheres to the rolling roll during cold rolling after plating, requiring complicated maintenance to obtain a product with a smooth appearance.

また、性能面に対しても、次の様な問題点がある。すな
わちNi或いはNi合金めっき層を施こした素材はめっ
き性或いははんだ性が向上するものの、浸漬はんだを行
なった場合、はんだ組成中のSn金属とN」金属が拡散
反応を生じ、硬くて脆いNi−5n系合金を生成する。
Furthermore, in terms of performance, there are the following problems. In other words, materials coated with a Ni or Ni alloy plating layer have improved plating and solderability, but when immersion soldering is performed, a diffusion reaction occurs between the Sn metal and the N metal in the solder composition, and the hard and brittle Ni -5n alloy is produced.

その生成量が多くなると、はんだ層が脆くなって衝撃或
いは曲げ加工を受けた場合に破壊され易い欠点(所謂、
はんだ脆性)がある、特にこの欠点はワイヤーボンディ
ング時に加熱を受けたり、Ni或いは旧合金のめつき層
が厚くなったりした場合に発生し易い傾向にある。
When the amount of solder generated increases, the solder layer becomes brittle and easily breaks when subjected to impact or bending (so-called
(solder brittleness), and this drawback tends to occur particularly when heated during wire bonding or when the plated layer of Ni or old alloy becomes thick.

、またCu或いはCu合金が施こされた場合には、 C
u或いはCu合金は、ベースに使用されるFe−Cr系
組成の鋼板に比較して著しく責な金属或いは合金である
ために、湿潤環境或いはCJZ−イオン等の腐食因子が
存在する腐食環境において、ベースの鋼板が優先腐食さ
れ、赤錆発生成いは穿孔腐食がめつき層のピンホール部
或いは加工時の疵付き部から生じる場合がみられる。こ
の傾向は、Ni或いはNi合金のめっき層が施こされる
場合も、Fe−(:r系鋼板の鋼組成によっては同様の
原因による耐食性不良を生じる問題がある。
, and when Cu or Cu alloy is applied, C
U or Cu alloys are metals or alloys that are significantly more sensitive than the Fe-Cr based steel sheets used for the base, so they cannot be used in humid environments or in corrosive environments where corrosive factors such as CJZ-ions are present. The base steel plate is preferentially corroded, and red rust or perforation corrosion may occur from pinholes in the plating layer or from flawed areas during processing. Even when a plating layer of Ni or Ni alloy is applied, this tendency causes a problem of poor corrosion resistance due to the same cause depending on the steel composition of the Fe-(:r-based steel sheet).

本発明は、上記問題点に鑑みなされたもので、耐食性、
めっき性及びはんだ性にすぐれたリードフレーム用表面
処理鋼板の製造法を提供する。
The present invention was made in view of the above problems, and has corrosion resistance,
Provided is a method for manufacturing a surface-treated steel sheet for lead frames with excellent plating and solderability.

(課題を解決するための手段) 本発明は、重量%で、c 、 o、oi%以下、酸可溶
^x :  o、oos 〜o、to%、 CrH3〜
10.5%、B;0.0003〜0.OQ5%を含有し
、さらにTi、 Nb、 Zr。
(Means for Solving the Problems) The present invention provides acid soluble ^x: o, oos ~ o, to%, CrH3 ~ in weight%, c, o, oi% or less
10.5%, B; 0.0003-0. Contains 5% OQ and further contains Ti, Nb, and Zr.

■の1種又は2種以上を0,03〜0.8%含有し、さ
らに必要によってはCu ; 0.05〜1%、1.0
.05〜3%、 Mo ; 0.05〜0.5%の1 
fi又は2 f!!以上を含有し、残部Fe及び不可避
的不純物からなるCr含有鋼板を冷間圧延後、その表面
に片面当りの付着量が 100〜3000a+g/m”
のNl、 Co或いはNiとCoの合金の被覆層を設け
、次いで非酸化性雰囲気中の450℃〜再結晶温度の温
度範囲で180秒以下の加熱拡散処理を施こす耐食性、
めっき性及びはんだ性にすぐれた高性能リードフレーム
用表面処理鋼板の製造法である。
Contains 0.03 to 0.8% of one or more of (2), and if necessary Cu; 0.05 to 1%, 1.0
.. 05-3%, Mo; 0.05-0.5% 1
fi or 2 f! ! After cold-rolling a Cr-containing steel plate containing the above, with the remainder being Fe and unavoidable impurities, the amount of adhesion per side is 100 to 3000a+g/m"
Corrosion resistance by providing a coating layer of Nl, Co, or an alloy of Ni and Co, and then performing a heat diffusion treatment in a non-oxidizing atmosphere at a temperature range of 450 ° C. to the recrystallization temperature for 180 seconds or less,
This is a method for manufacturing surface-treated steel sheets for high-performance lead frames with excellent plating and solderability.

以上のごとく本発明は、冷間圧延後の前記組成の鋼板表
面に、適正厚さのNi、 Co或いはNi−Cu合金の
被覆層を施こし、加熱拡散処理を施こすものである。
As described above, the present invention is to apply a coating layer of Ni, Co or Ni-Cu alloy to an appropriate thickness on the surface of a cold-rolled steel sheet having the above composition, and to subject it to a heating diffusion treatment.

Crを含有する綱板は、加熱処理において、非酸化性雰
囲気を厳重に調整しても、雰囲気中に含まれる微量の酸
素によりCr2bsを含む緻密で安定した酸化膜を生成
する。この酸化膜は一般に、酸洗等の表面活性化処理に
よって均一に除去・活性化する事は困難であり、リード
フレーム製造工程のめっき性或いははんだ性を阻害する
原因となる。
Even if the non-oxidizing atmosphere is strictly controlled during heat treatment, a steel plate containing Cr forms a dense and stable oxide film containing Cr2bs due to the trace amount of oxygen contained in the atmosphere. Generally, it is difficult to uniformly remove and activate this oxide film by surface activation treatment such as pickling, and it becomes a cause of inhibiting plating or solderability in the lead frame manufacturing process.

従って、Cr含有鋼板の加熱処理において酸化膜の生成
、成長を極力抑制する事が重要である。
Therefore, it is important to suppress the formation and growth of oxide films as much as possible during heat treatment of Cr-containing steel sheets.

このため、本発明においては、Cr含有鋼板自体の酸化
膜の生成・成長速度を抑制するため鋼にBを添加し、ま
た加熱処理における加熱温度、加熱時間を夫々設定する
事によって、リードフレーム用素材に要求される特性を
満足する製造方法を開発したものである。
Therefore, in the present invention, B is added to the steel in order to suppress the formation and growth rate of the oxide film on the Cr-containing steel sheet itself, and the heating temperature and heating time in the heat treatment are set respectively. A manufacturing method has been developed that satisfies the characteristics required for the material.

鋼中へBを添加することにより、同一加熱雰囲気でCr
含有鋼板の酸化速度が抑制される。この理由を本発明者
らは次のように考えている。
By adding B to steel, Cr can be added in the same heating atmosphere.
The oxidation rate of the contained steel plate is suppressed. The present inventors believe that the reason for this is as follows.

Cr含有鋼板が酸化されて生成するCrzO5(P型(
Positive型)酸化物)には格子欠陥として金属
イオンが欠けた陽イオン空孔とその電気的中性を保つた
めの陽イオン空孔に相当する数の正孔が生成されている
CrzO5 (P type (
In the positive type oxide), cation vacancies lacking metal ions as lattice defects and holes corresponding to the number of cation vacancies for maintaining electrical neutrality are generated.

このP型酸化物の酸化速度は加熱雰囲気の酸素分圧が同
じ場合、陽イオン空孔の移動に支配される。
The oxidation rate of this P-type oxide is dominated by the movement of cation vacancies when the oxygen partial pressure of the heating atmosphere is the same.

従って、Cr含有鋼にBを添加せしめる事によって、C
r、03の格子に対して3価のCr”の代りに1価の8
0に一部を置換させると電気的中性を保つために正孔の
濃度が大きくなり、陽イオン空孔の濃度を減少すること
となり、その結果として、陽イオン空孔の移動による酸
化速度が減少せしめられる。
Therefore, by adding B to Cr-containing steel, C
r, 03 lattice, monovalent 8 instead of trivalent Cr''
When a portion is replaced with 0, the concentration of holes increases to maintain electrical neutrality, and the concentration of cation vacancies decreases, and as a result, the oxidation rate due to the movement of cation vacancies decreases. be reduced.

また、Bは本発明のように極低Ct14の場合、結晶粒
界に析出する事によって結晶粒界を強化し、ワイヤーボ
ンディング加熱時の熱影響部の結晶粒の成長、粗大化を
防止し、リードフレーム製品の強度低下を防止する。
In addition, in the case of extremely low Ct14 as in the present invention, B strengthens the grain boundaries by precipitating at the grain boundaries, and prevents the growth and coarsening of grains in the heat affected zone during wire bonding heating. Prevents strength reduction of lead frame products.

さらに、本発明に従い、適正量のTi、 Nb、 Zr
Furthermore, according to the present invention, appropriate amounts of Ti, Nb, Zr
.

■の1 fil又は2種以上を添加する事によって、次
のような効果が得られる。即ち、これらの元素はクロム
カーバイドの生成を防止して、耐錆性を向上し、またこ
れらの析出物が結晶粗大化温度を上昇して加熱温度範囲
を拡大する等の効果を奏する。
By adding one fil or two or more of (2), the following effects can be obtained. That is, these elements prevent the formation of chromium carbide and improve rust resistance, and these precipitates increase the crystal coarsening temperature to expand the heating temperature range.

このようなCr −B含有鋼板に、被覆処理後加熱処理
を行なう事によって、Nl、 Co、 Ni−Co合金
被覆層と鋼素材の相互拡散によりFeを含有するNi−
Fe、 C−Fe、或いは(Ni+ Co) −Feを
主体とする拡散層が生成される。その結果拡散被覆層は
、Ni、 Co、 Ni−Co合金の各単独被覆層より
もさらに素地鋼板との電位差が小さく近接されるため、
めっき欠陥部の素地鋼板の腐食や、赤錆発生を防止する
効果を有すると共に、Ni −Fe。
By subjecting such a Cr-B containing steel sheet to heat treatment after coating, Ni- containing Fe is formed through mutual diffusion between the Nl, Co, Ni-Co alloy coating layer and the steel material.
A diffusion layer mainly composed of Fe, C-Fe, or (Ni+Co)-Fe is generated. As a result, the diffusion coating layer has a smaller potential difference with the base steel sheet than the individual coating layers of Ni, Co, and Ni-Co alloy, so
Ni-Fe has the effect of preventing corrosion of the base steel plate in plating defects and the occurrence of red rust.

Co −Fe、  (Ni+ Co) −Fe拡散合金
層自体の耐食性もすぐれていることから、下地鋼素材を
防食し、耐錆性能を主体とした耐食性が向上する。特に
該拡散処理層は、Ni−Fe合金を被覆処理した鋼板に
比べ、耐錆性能を著しく向上させる。
Since the Co-Fe, (Ni+Co)-Fe diffusion alloy layer itself has excellent corrosion resistance, it protects the base steel material from corrosion and improves corrosion resistance mainly due to rust resistance. In particular, the diffusion treatment layer significantly improves rust resistance compared to a steel plate coated with a Ni-Fe alloy.

また拡散被覆層は、Crを含有する素地鋼板に比較して
、リードフレーム製造工程においてCuめっき等のめつ
き処理に先立って施こされる酸洗浴により容易に活性化
され、さらに拡散条件を適正に選択する事によって、め
っき密着性及び均一被覆性にすぐれためっき性能が得ら
れる。
Furthermore, compared to a base steel sheet containing Cr, the diffusion coating layer is easily activated by the pickling bath applied prior to plating treatment such as Cu plating in the lead frame manufacturing process, and furthermore, the diffusion coating layer is activated by the pickling bath applied prior to plating treatment such as Cu plating in the lead frame manufacturing process. By selecting the following, plating performance with excellent plating adhesion and uniform coverage can be obtained.

さらにこれら拡散合金被覆層は、Pb−Sn組成からな
る浸漬はんだに対して、ハロゲンイオンを含有しないフ
ラックスを使用しても、はんだ濡れ性、拡がり性がCr
含有鋼板に比較して極めてすぐれており、またFeが合
金化されているために、Ni等の単独層に比較してこれ
ら拡散被覆層とSnとの間に生成される合金層が少なく
なり、さらには長期に経時或いはワイヤーボンディング
時に加熱を受けても、その生成が抑制され、はんだ性が
向上する。
Furthermore, these diffusion alloy coating layers have solder wettability and spreadability of Cr even when a flux that does not contain halogen ions is used for immersion solder having a Pb-Sn composition.
It is extremely superior compared to steel sheets containing Sn, and since Fe is alloyed, the alloy layer formed between these diffusion coating layers and Sn is smaller compared to a single layer of Ni etc. Furthermore, even if it is heated over a long period of time or during wire bonding, its formation is suppressed and the solderability is improved.

第1図は7%Crを含有するFe−Cr系鋼板にNi系
拡散被覆層、及びNiめっき層800 mg/m’を各
々施こした場合のはんだ濡れ性と、はんだ付着後に長期
経時の密着性を対象とする加熱促進試験を行なった場合
のはんだ密着性を評価した一例を示す。
Figure 1 shows the solder wettability when a Ni-based diffusion coating layer and a Ni plating layer of 800 mg/m' are applied to a Fe-Cr steel plate containing 7% Cr, and the adhesion over a long period of time after solder adhesion. An example of evaluation of solder adhesion when an accelerated heating test was conducted is shown below.

以上の如く本発明は、Fe−Cr系合金鋼板に被覆層を
施こす事によって、リードフレーム用素材に要求される
性能特性、すなわち耐食性、めフき性及びはんだ性にす
ぐれた性能特性が得られる事によってなされたものであ
る。
As described above, the present invention provides performance characteristics required for lead frame materials, that is, excellent performance characteristics in corrosion resistance, flaking property, and solderability, by applying a coating layer to a Fe-Cr alloy steel plate. It is something that is done by being done.

転炉、電炉等の溶解炉で溶製された溶鋼を連続鋳造また
は造塊、分塊法を経てスラブとし、熱間圧延、酸洗、冷
間圧延の工程を経てC,0゜01%以下、酸可溶^i 
;  0.005〜0.10%+Cr;3〜10.5%
を含有し、さらに:Ti、 Nb、 Zr、 vノミ種
又は2 f!!!以上を0,03〜0.8%含有する鋼
板を製造する。
Molten steel melted in a melting furnace such as a converter or electric furnace is made into a slab through continuous casting, ingot making, or a blooming method, and then processed through the processes of hot rolling, pickling, and cold rolling to reduce C, 0°01% or less. , acid soluble^i
;0.005~0.10%+Cr;3~10.5%
and further contains: Ti, Nb, Zr, v flea species or 2 f! ! ! A steel plate containing 0.03 to 0.8% of the above is manufactured.

Cは強度向上元素として経済的に有利であるが、含有量
が増加しすぎるとNl、 Co、 Ni−Co合金の被
覆層のピンホール、被覆層欠陥等が増加し、また加熱拡
散処理に対しても均一拡散が損なわれ、耐食性、リード
フレーム製造工程でのめっき性、はんだ性が劣化する。
C is economically advantageous as a strength-improving element, but if its content increases too much, pinholes and defects in the coating layer of Nl, Co, and Ni-Co alloys will increase, and it will also become difficult to heat diffusion treatment. However, uniform diffusion is impaired, and corrosion resistance, plating performance in the lead frame manufacturing process, and solderability deteriorate.

すなわち、Cは他の元素と結合して鋼表面にチタンカー
バイト、ニオブカーバイト、クロムカーバイト等を析出
し、Ni。
That is, C combines with other elements to precipitate titanium carbide, niobium carbide, chromium carbide, etc. on the steel surface, and Ni.

Co等の被覆層の均一被覆性、めっき密着性等を劣化さ
せると共に、またカーバイトは加熱拡散処理において、
拡散阻害要因となって均一拡散を阻害し、均一な性能を
もつ拡散被覆層が得られない。
In addition to deteriorating the uniform coating properties and plating adhesion of coating layers such as Co, carbide also deteriorates during heat diffusion treatment.
This becomes a diffusion inhibiting factor and inhibits uniform diffusion, making it impossible to obtain a diffusion coating layer with uniform performance.

従って素地鋼板中のC含有量は、耐食性、均一拡散被覆
層の生成の観点から0.01%以下、好ましくは0.0
08%以下である。
Therefore, the C content in the base steel sheet is 0.01% or less, preferably 0.0% from the viewpoint of corrosion resistance and formation of a uniform diffusion coating layer.
0.08% or less.

AfLは、鋼中に残存する酸可溶^JZ(Son。AfL is an acid-soluble ^JZ (Son.

An)量が0.005%未満の少食有量では、酸素性ガ
スによる気泡の発生を防止する事が困難であり、鋼の表
面欠陥発生率を著しく高め、鋼素材自体の耐食性劣化、
機械的性質劣化の起点となるので、好ましいものではな
い、また、0.10%を越える過剰な酸可溶Aj2は、
へ文系酸化物を鋼表面に点在せしめて耐食性劣化の起点
となり、さらに被覆層処理に対して均一被覆性を阻害す
る要因となり好ましいものでない。従って、鋼中に含有
されるSon 、^Lは、表面処理鋼板の性能が安定し
て確保できる量として0.005〜0.10%、好まし
くは0.01〜0,08%である。
If the amount of An) is less than 0.005%, it is difficult to prevent the formation of bubbles due to oxygen gas, which will significantly increase the incidence of surface defects on the steel, resulting in deterioration of the corrosion resistance of the steel material itself.
An excess of acid-soluble Aj2 exceeding 0.10% is not preferable because it becomes a starting point for deterioration of mechanical properties.
This is not preferable because the helical oxides are scattered on the steel surface, which becomes a starting point for deterioration of corrosion resistance, and furthermore, it becomes a factor that inhibits uniform coating properties in coating layer treatment. Therefore, the amount of Son,^L contained in the steel is 0.005 to 0.10%, preferably 0.01 to 0.08%, as an amount that can stably ensure the performance of the surface-treated steel sheet.

Crは、本発明においてめっき原板の耐食性と強度を向
上する元素として添加するものである。
Cr is added in the present invention as an element that improves the corrosion resistance and strength of the plated original plate.

Cr含有鋼板は、Cr含有なし鋼板に比して、鋼板自体
の耐錆性、耐食性自体がすぐれているとともに、腐食環
境においてNi−Fe系、Co−Fe系或いは(旧+C
o) −Fe系の拡散被覆層の電位に近接化される。そ
の結果、鋼板自体の耐食性向上効果、被覆層による耐食
性向上効果及び鋼板と被覆層の複合相乗効果などからす
ぐれた耐錆性、耐食性が得られる。
Cr-containing steel sheets have superior rust resistance and corrosion resistance compared to steel sheets without Cr, and they also have superior rust and corrosion resistance in corrosive environments.
o) The potential is brought close to that of the -Fe-based diffusion coating layer. As a result, excellent rust resistance and corrosion resistance can be obtained from the corrosion resistance improvement effect of the steel plate itself, the corrosion resistance improvement effect of the coating layer, and the combined synergistic effect of the steel plate and the coating layer.

また鋼中にCrを含有することによって、機械的強度が
耐食性と共に併せ得られる。本発明においてCr含有量
が3%未満では、目的とする耐食性、強度が得られない
。′またCr含有量が10.5%を越える場合には次の
様な欠点を有する。すなわち、拡散処理に先立って施こ
されるNi被覆処理には、密着性の良好な被覆層を得る
のに活性化前処理が必要である。また拡散処理後におい
ても、素地鋼板のCr含有量が増加すると、拡散被覆層
表面にCrの拡散量が増加し、その表面がCrを含有す
るNi−Cr−Fe系、或いはCo −Cr −Fe系
等の前処理酸洗等による活性化処理が困難な被覆層が形
成され易くなる。そのために、リードフレーム製造工程
で均一被覆性にすぐれためっき層或いは密着性の良好な
めっき層が得られにくくなり、はんだ濡れ性、拡がり性
等も著しく劣化してはんだ性能を低下させる。さらには
、リードフレーム素材に要求される電気伝導性、熱伝導
性の点からも、Crの含有量が少ない方が好ましい。従
ってCr含有量の範囲は、3〜10,5%、好ましくは
5〜10%である。
Furthermore, by containing Cr in the steel, mechanical strength and corrosion resistance can be obtained. In the present invention, if the Cr content is less than 3%, the desired corrosion resistance and strength cannot be obtained. 'Furthermore, when the Cr content exceeds 10.5%, the following drawbacks occur. That is, the Ni coating treatment performed prior to the diffusion treatment requires a pre-activation treatment to obtain a coating layer with good adhesion. Even after the diffusion treatment, when the Cr content of the base steel sheet increases, the amount of Cr diffused onto the surface of the diffusion coating layer increases, and the surface becomes Cr-containing Ni-Cr-Fe or Co-Cr-Fe. Pretreatment of the system, etc. A coating layer that is difficult to activate by pickling or the like is likely to be formed. For this reason, it becomes difficult to obtain a plating layer with excellent uniform coverage or a plating layer with good adhesion in the lead frame manufacturing process, and the solder wettability, spreadability, etc. are also significantly deteriorated, leading to a decrease in solder performance. Furthermore, from the viewpoint of the electrical conductivity and thermal conductivity required for the lead frame material, it is preferable that the Cr content be small. The Cr content therefore ranges from 3 to 10.5%, preferably from 5 to 10%.

Bは鋼板の加熱時の酸化速度の減少、特にCr、03系
酸化物の生成速度の減少及び鋼板の強度とワイヤーヒー
トボンディング時の高温強度を向上するために添加され
る。これらの効果を得るためにはBの添加量は0.00
03%以上、好ましくはo、ooos%以上とする。一
方、Bは添加量が増加すると、効果が飽和するとともに
、熱間圧延時に鋼板に割れを発生する。従って、本発明
では、Bの添加量の上限はo、oos%、好ましくは0
.002%とする。
B is added to reduce the oxidation rate during heating of the steel plate, particularly to reduce the production rate of Cr and 03-based oxides, and to improve the strength of the steel plate and the high-temperature strength during wire heat bonding. In order to obtain these effects, the amount of B added is 0.00.
03% or more, preferably o,oos% or more. On the other hand, when the amount of B added increases, the effect becomes saturated and cracks occur in the steel sheet during hot rolling. Therefore, in the present invention, the upper limit of the amount of B added is o, oos%, preferably 0.
.. 002%.

Ti、 Nb、 Zr、 Vはめっき原板中に含有され
るC或いはNと結合してCrの炭化物或いは窒素物形成
を防止し、Crの耐食性効果を有効に作用せしめる成分
である。また、TIなどの炭化物或いは窒素物が結晶粒
界に微細に析出して、めっき原板の結晶粒の粗大化を防
止し、強度を確保する。特に、機成的性質を調整するた
めの加熱温度の範囲が拡大できる効果もある。
Ti, Nb, Zr, and V are components that combine with C or N contained in the plated original plate to prevent the formation of carbides or nitrogen substances of Cr, thereby effectively exerting the corrosion-resistant effect of Cr. In addition, carbides such as TI or nitrogen substances are finely precipitated at grain boundaries to prevent coarsening of the crystal grains of the plating original plate and ensure strength. In particular, it has the effect of expanding the heating temperature range for adjusting mechanical properties.

このような効果を得るためにはTi、 Nb、 Zr、
 Vの1種又は2種以上で0.03%以上含有される事
が必要であり、またその含有量が0.8%を越えると、
析出物が多くなり過ぎ素材が脆くなって、成形時に割れ
を発生し電気伝導性、熱導性も劣化する傾向にある。好
ましい範囲は0.05〜0.5%である。
In order to obtain such an effect, Ti, Nb, Zr,
It is necessary to contain 0.03% or more of one or more types of V, and if the content exceeds 0.8%,
If the amount of precipitates increases too much, the material becomes brittle, cracks occur during molding, and electrical conductivity and thermal conductivity tend to deteriorate. The preferred range is 0.05-0.5%.

また原板素材中の不可避的不純物元素については、特に
規定されるものではないが、以下述べるような含有量が
好ましい。
In addition, the unavoidable impurity elements in the original plate material are not particularly defined, but the content as described below is preferable.

Slは0.6%以下が好ましい。Stは機械的強度上昇
に有効であるが、St含有量が過剰に増加すると、Si
系酸化物が鋼表面に点在し、本発明における含有めっき
被覆処理に対して、均一被覆性を阻害するので、耐食性
の点で好ましいものでない。
Sl is preferably 0.6% or less. St is effective in increasing mechanical strength, but when the St content increases excessively, Si
The system oxides are scattered on the steel surface and inhibit the uniform coating properties of the plating treatment in the present invention, which is not preferable in terms of corrosion resistance.

従って、 0.6%以下好ましくは0.15%以下であ
る。
Therefore, it is 0.6% or less, preferably 0.15% or less.

Mnは、耐食性に悪影響を及ぼすことはないが、含有量
の増加により機械的強度が上昇し、圧延加工性を劣化す
るので、 1.5%以下がよい。
Although Mn does not adversely affect corrosion resistance, an increase in Mn content increases mechanical strength and deteriorates rolling workability, so it is preferably 1.5% or less.

その他、P、Sについては、通常の製鋼方式で含有され
る範囲で0.02%以下がよい、特に、端面等原板素材
が露出される部分の耐錆性を向上せしめるためには、S
がo、ooa%以下が好ましい。
In addition, P and S should be contained within the range of 0.02% or less in normal steelmaking methods.In particular, in order to improve the rust resistance of the parts where the original plate material is exposed such as the end face, S
is preferably o, ooa% or less.

さらに、第2の本発明においては、上記の成分で構成さ
れるめっき原板にCu、 Ni、 Moの1種又は2種
以上を含有せしめる。これら元素は、鋼板自体の耐錆性
、耐食性を向上するとともに、腐食環境においては前記
したようにCrとの複合添加によって電位が責(カソー
デイック)になり、拡散被覆層との電位差が近接化され
、Feの優先腐食による耐錆性、耐食性能の劣化が一段
と防止される。
Furthermore, in the second aspect of the present invention, the plating original plate composed of the above-mentioned components is made to contain one or more of Cu, Ni, and Mo. These elements improve the rust resistance and corrosion resistance of the steel sheet itself, and in a corrosive environment, as mentioned above, when combined with Cr, the potential becomes cathodic, and the potential difference with the diffusion coating layer is brought closer. , deterioration of rust resistance and corrosion resistance due to preferential corrosion of Fe is further prevented.

而して、これら元素の添加は、Cuが0.05〜1.0
%、Nlが0.05〜3.0%、Moが0.05〜0.
5%である。Cuの添加量が0.05%未満では、上記
の耐食性効果が得られず、また1、0%を越える場合は
原板製造時の熱延工程において赤錆脆性による割れや鋼
表面にCuが濃縮し、スケール疵を発生し易くなる。従
ってミCuは0.05〜1.0%、好ましくは0.1〜
0.5%である。
Therefore, the addition of these elements is such that Cu is 0.05 to 1.0
%, Nl is 0.05-3.0%, Mo is 0.05-0.
It is 5%. If the amount of Cu added is less than 0.05%, the above-mentioned corrosion resistance effect cannot be obtained, and if it exceeds 1.0%, Cu may cause cracking due to red rust brittleness or concentrate on the steel surface during the hot rolling process during the production of the original sheet. , scale defects are more likely to occur. Therefore, Mi-Cu is 0.05 to 1.0%, preferably 0.1 to 1.0%.
It is 0.5%.

Niは、添加量が0.05%未満では、耐食性効果が得
られず、また、3.0%を越える場合は、耐食性の向上
効果が飽和するとともに、Crとの共存効果によって被
覆層のすぐれた密着性を得るための鋼表面の前処理作業
が煩雑となる。従って、その添加量は0.05〜3.0
%、好ましくは0.1〜1.5%である。
If the amount of Ni added is less than 0.05%, no corrosion resistance effect will be obtained, and if it exceeds 3.0%, the corrosion resistance improvement effect will be saturated, and the coexistence effect with Cr will reduce the quality of the coating layer. Pretreatment of the steel surface to obtain good adhesion becomes complicated. Therefore, the amount added is 0.05 to 3.0
%, preferably 0.1 to 1.5%.

Moの添加量が0.05%未満では、耐食性向上効果が
得られず、また0、5%を越える場合はその効果が飽和
するとともに材質が硬質化し、リードフレームのような
薄手材を得るための圧延加工が困難となる。従って、そ
の添加量は0.05〜0.50%、好ましくは0.1〜
0.3%である。
If the amount of Mo added is less than 0.05%, the effect of improving corrosion resistance cannot be obtained, and if it exceeds 0.5%, the effect is saturated and the material becomes hard, making it difficult to obtain a thin material such as a lead frame. The rolling process becomes difficult. Therefore, the amount added is 0.05 to 0.50%, preferably 0.1 to 0.50%.
It is 0.3%.

さらに上記のような成分組成の鋼板(めっき原板)をそ
のまま使用したのでは、耐錆性等の耐食性、リードフレ
ーム製造工程でのCu、 Pb−5%合金等のめっき性
、或いははんだ性がリードフレーム用素材として不充分
であり、従ってNi−Fe系、Co −Fe系或いは(
Ni+ Co) −Fe系の拡散被覆層が設けられる。
Furthermore, if a steel plate (plated original plate) with the above-mentioned composition is used as is, corrosion resistance such as rust resistance, plating properties such as Cu and Pb-5% alloy in the lead frame manufacturing process, or solderability will be poor. It is insufficient as a material for frames, and therefore Ni-Fe, Co-Fe, or (
A Ni+Co)-Fe based diffusion coating layer is provided.

本発明においては冷間圧延後の上記素地鋼板に対して、
所定の厚さのNi、 Co、 Ni−Co金合金被覆さ
れる。この被覆処理に先立ち、素材表面は先ず浸漬或い
は電解等の方法による脱脂及び酸溶液を用いた活性化処
理が行なわれる。この活性化処理には、浸漬、スプレィ
等による酸洗処理或いは電解酸洗処理が行なわれるが、
Cr含有鋼板特有の表面の酸化膜の除去、還元を均一に
行なうためには、電解酸洗処理が望ましい。
In the present invention, for the base steel plate after cold rolling,
Ni, Co, and Ni-Co gold alloys are coated to a predetermined thickness. Prior to this coating treatment, the surface of the material is first degreased by a method such as immersion or electrolysis, and activated using an acid solution. This activation treatment includes pickling treatment by dipping, spraying, etc., or electrolytic pickling treatment.
In order to uniformly remove and reduce the oxide film on the surface peculiar to Cr-containing steel sheets, electrolytic pickling treatment is desirable.

すなわち、酸洗浴中での鋼素材を陰極にした陰極電解酸
洗による酸化膜の還元による活性化処理、鋼素材を陽極
にした陽極電解酸洗の酸化膜の溶解除去による活性化処
理、或いは陽極電解により酸化膜溶解除去後に更に陰極
電解によフて表面の活性化処理を組み合わせた方法等が
採用される。
That is, activation treatment by reducing the oxide film by cathodic electrolytic pickling in a pickling bath with the steel material as the cathode, activation treatment by dissolving and removing the oxide film in anodic electrolytic pickling with the steel material as the anode, or anode A method is adopted in which the oxide film is dissolved and removed by electrolysis, and then the surface is further activated by cathodic electrolysis.

これらのうち、特に陽極電解処理後にさらに陰極電解処
理を組み合わせる方法が、Cr含有鋼特有の焼鈍過程等
において形成された強固な酸化被膜を除去、還元せしめ
て、表面を活性化するのに好ましい、これらの電解酸洗
を行なう方法としては、例えばH2SO,浴、 H2S
O,浴にF−イオンを含有せしめた浴等を用い、電流密
度10〜60^/dm” 、温度が常温〜80℃、電解
時間0.5〜10秒の範囲がよい。
Among these, a method in which cathodic electrolytic treatment is further combined after anodic electrolytic treatment is particularly preferable in order to activate the surface by removing and reducing the strong oxide film formed during the annealing process peculiar to Cr-containing steel. These electrolytic pickling methods include, for example, H2SO, bath, H2S
It is preferable to use a bath containing F- ions, a current density of 10 to 60^/dm'', a temperature of room temperature to 80°C, and an electrolysis time of 0.5 to 10 seconds.

続いて行なわれるNi、 Co、 Ni−Co金合金被
覆処理方法については、例えば次のような条件での電気
めっき法によって被覆処理を行なうとよい。
The Ni, Co, and Ni--Co gold alloy coating method to be performed subsequently is preferably performed by electroplating under the following conditions, for example.

(a) Niめっき めっき浴組成の一例 硫酸ニッケル   230 g/jl!塩化ニッケル 
   40g/j2 ホウ酸       40 g/u 電流密度       7.5A/dm2めっき浴温 
     40℃ (b) Coめっき めっき浴組成の一例 硫酸コバルト    75g/fL 塩化コバルト   145g/u ホウ酸       25 g/fL 電流密度       50A/dm’めっき浴温  
    55℃ (c) Ni−Co金合金っき めっき浴組成の−例 硫酸ニッケル    45g/i 硫酸コバルト    25g/fl 塩化ニッケル   100 g/i 塩化コバルト    45g/j2 ホウ酸      30g/ft 電流密度       30A/di”めフき浴温  
    65℃ の如き条件で電気めっき法による被覆処理を行なう。
(a) Ni plating Example of plating bath composition Nickel sulfate 230 g/jl! nickel chloride
40g/j2 Boric acid 40 g/u Current density 7.5A/dm2 Plating bath temperature
40°C (b) Co plating Example of plating bath composition Cobalt sulfate 75 g/fL Cobalt chloride 145 g/f Boric acid 25 g/fL Current density 50 A/dm' Plating bath temperature
55℃ (c) Ni-Co gold alloy plating bath composition - Example Nickel sulfate 45g/i Cobalt sulfate 25g/fl Nickel chloride 100 g/i Cobalt chloride 45g/j2 Boric acid 30g/ft Current density 30A/di" Mefuki bath temperature
The coating treatment is carried out by electroplating under conditions such as 65°C.

次いで、本発明においては、リードフレーム用、素材に
要求される機械的性質を確保し、耐食性。
Next, in the present invention, the material for the lead frame has the required mechanical properties and corrosion resistance.

リードフレーム製造工程でのめっき性或いははんだ性に
すぐれた性能を有する拡散被覆層を得るための加熱拡散
処理が行なわれる。
A heating diffusion process is performed to obtain a diffusion coating layer having excellent plating or solderability in the lead frame manufacturing process.

すなわち上記成分の素地鋼板を冷間圧延後、脱脂、酸洗
等の前処理、活性化処理を施こした後、100〜300
0mg/m’の範囲の付着量(片面当り)のNi、 C
o、 Ni−Co合金の被覆処理を行ない、次いで45
0℃より高温でかつ再結晶温度より低い温度の非酸化性
雰囲気で180秒以下の加熱処理を施こす。このような
被覆層を施こす事によって、加熱時にCr含有鋼板の酸
化が防止される。その結果として、加熱雰囲気、加熱時
間等の点で加熱処理が鋼板のままに比して有利となる。
That is, after cold-rolling a base steel sheet with the above components and subjecting it to pretreatment such as degreasing and pickling, and activation treatment,
Ni, C with adhesion amount (per one side) in the range of 0 mg/m'
o, Ni-Co alloy coating treatment, then 45
Heat treatment is performed for 180 seconds or less in a non-oxidizing atmosphere at a temperature higher than 0° C. and lower than the recrystallization temperature. By applying such a coating layer, oxidation of the Cr-containing steel sheet is prevented during heating. As a result, heat treatment is more advantageous than using a steel plate as is in terms of heating atmosphere, heating time, etc.

このような処理により、高強度材質でかつ曲げ加工性に
必要な延性を有し、さらに素材鋼板と拡散被覆層との複
合効果によって、耐錆性を中心とした耐食性、めっき性
、はんだ性能の向上が可能なリードフレーム用素材を効
率よく製造する事が可能となる。
Through this treatment, the material has high strength and ductility necessary for bending workability, and the combined effect of the material steel plate and the diffusion coating layer improves corrosion resistance, mainly rust resistance, plating performance, and solder performance. It becomes possible to efficiently manufacture materials for lead frames that can be improved.

この加熱条件は、性能にすぐれた拡散被覆層を得るため
に、Ni、 Co、 Ni−Co合金の被覆層量の規制
が重要である。すなわちこれらの被覆層量が100 r
ag/m”未満の場合では、被覆層のピンホール等の被
膜欠陥が多く生成されるため、加熱拡散処理後も均一な
拡散被覆層が生成され難く、加熱処理時に欠陥部からの
素材鋼板の酸化も生じ易い。そのため素材鋼板の露出部
分の面積の増加等によって、耐食性向上効果、めつき性
或いははんだ性の向上効果が得られにくい。
Regarding this heating condition, in order to obtain a diffusion coating layer with excellent performance, it is important to control the amount of coating layer of Ni, Co, and Ni-Co alloy. That is, the amount of these coating layers is 100 r
ag/m", many coating defects such as pinholes are generated in the coating layer, making it difficult to produce a uniform diffusion coating layer even after heat diffusion treatment, and the material steel sheet is removed from the defective areas during heat treatment. Oxidation is also likely to occur.Therefore, due to an increase in the area of the exposed portion of the material steel plate, it is difficult to obtain the effect of improving corrosion resistance, plating performance, or solderability.

また、その被覆層量が3000mg/m’を越える場合
は、これらの被膜を設けた後加熱拡散処理を施こした素
材の耐食性、めっき性、はんだ性等の向上効果が飽和す
るとともに、剪断加工等の加工を受けた場合に、被膜に
クラックが生成されたり、或いは部分剥離を生じる現象
が起こる。
In addition, if the amount of the coating layer exceeds 3000 mg/m', the effects of improving corrosion resistance, plating properties, solderability, etc. of the material that has been heat-diffused after providing these coatings are saturated, and the shearing process When subjected to such processing, cracks are generated in the coating or partial peeling occurs.

さらに被膜量が上記のように多くなると、充分に拡散処
理が行なわれ難く、各々表面拡散被覆層にNi、 Co
或いはNiとCOのFeに対する含有比率の大なる、例
えば各々の濃度が90%をこえるような拡散被覆層が形
成される。その結果として被膜自体の耐食性、はんだ濡
れ性等の向上効果は得られるものの、Ni、 Co等が
多くなると電位が責な方向に穆行するため、原板素材と
の電位差が拡大し、被膜欠陥部等から原板素材の優先腐
食による赤錆発生が生じ易くなり、耐食性を劣化する傾
向になる。
Furthermore, when the amount of coating increases as described above, it is difficult to perform the diffusion treatment sufficiently, and Ni and Co are added to each surface diffusion coating layer.
Alternatively, a diffusion coating layer is formed in which the content ratio of Ni and CO to Fe is large, for example, the concentration of each exceeds 90%. As a result, the corrosion resistance and solder wettability of the coating itself can be improved, but as the amount of Ni, Co, etc. increases, the potential tends to shift in the negative direction, increasing the potential difference with the original plate material and causing defects in the coating. As a result, red rust is likely to occur due to preferential corrosion of the original plate material, and corrosion resistance tends to deteriorate.

また、Nl、 Coは安定した緻密な酸化膜を生成する
ため、これらの含有率が大なる拡散被覆層は、リードフ
レーム製造工程でのめつき(Cu或いはPb −Sn電
気はんだめっき等)に先立つ酸洗活性化処理を困難にす
る傾向があるので、均一なめつき被覆性及びめっき密着
性を得るためには好ましいものではない。
In addition, since Nl and Co form a stable and dense oxide film, a diffusion coating layer with a large content of these is required prior to plating (Cu or Pb-Sn electric solder plating, etc.) in the lead frame manufacturing process. Since it tends to make pickling activation treatment difficult, it is not preferred for obtaining uniform plating coverage and plating adhesion.

さらに最も重要な問題は、Feに対する拡散合金化元素
が高濃度の場合(例えば90%を越えた場合)には、溶
融Pb−5nはんだの濡れ性、拡がり性等の効果が飽和
するとともに、はんだ中のSn金属とこれら合金化元素
との反応或いは拡散によるNi−5n、 Co−5n合
金の生成量が多くなり、これらの硬くて脆い合金層の生
成によってはんだづけ部が衝撃或いは曲げ加工等を受け
た場合に破壊され易くなる。従って、このはんだ脆性防
止の観点から、加熱処理に先立って施こされるNi、 
Co、 NiとCoの合金の被覆層量は3000mg/
a”以下である。従って加熱拡散処理に先立つNi、 
Co或いはNfとCoの合金の被覆層量は、100〜3
000mg/a” 、好ましくは300〜2000II
Ig/m2である。
Furthermore, the most important problem is that when the concentration of diffusion alloying elements for Fe is high (for example, exceeding 90%), the wettability, spreadability, etc. effects of molten Pb-5n solder are saturated, and the solder The amount of Ni-5n and Co-5n alloys produced by reaction or diffusion between the Sn metal inside and these alloying elements increases, and the formation of these hard and brittle alloy layers may cause the soldered part to be subjected to impact or bending. easily destroyed if Therefore, from the viewpoint of preventing solder brittleness, Ni, which is applied prior to heat treatment,
The coating layer amount of Co, Ni and Co alloy is 3000mg/
a” or less. Therefore, Ni prior to heating and diffusion treatment,
The coating layer amount of Co or an alloy of Nf and Co is 100 to 3
000mg/a”, preferably 300-2000II
Ig/m2.

次いでリードフレーム用素材に要求される機械的性質及
び必要性能(耐食性、リードフレーム工程でのめっき性
、はんだ性)を得るた・めに加熱処理が施こされる。加
熱処理条件は次のような理由から規制される。すなわち
、鋼成分の素地鋼板を冷間圧延後、脱脂、酸洗の前処理
・活性化処理復旧等の被覆層を設け、加熱処理が施こさ
れる。
Next, heat treatment is performed to obtain the mechanical properties and required performance (corrosion resistance, plating properties in the lead frame process, solderability) required of the lead frame material. Heat treatment conditions are regulated for the following reasons. That is, after cold rolling a base steel sheet of steel components, a coating layer is provided for degreasing, pickling pretreatment, activation treatment recovery, etc., and then heat treatment is performed.

リードフレーム用素材に要求される機械的性質は、リー
ドフレーム形状への打抜き成形加工性を考慮した場合、
延性の少ない高強度材がすぐれており、またリードフレ
ーム製品には強度と同時に、折れ曲げ加工性が要求され
る。
The mechanical properties required for the lead frame material are as follows, considering the punching processability into the lead frame shape.
High-strength materials with low ductility are excellent, and lead frame products require both strength and bending workability.

これらの観点から種々検討した結果、強度は45〜85
 kg/mm2好ましくは55〜80 kg/mff1
2、伸びは3〜20%好ましくは5〜15%の機械的性
質のものが良好である。すなわち、強度が45 kg/
mm2未満の場合は、素材の硬度が低く、軟質のために
、打抜き成形機のポンチ或いはダイスからの加工材の抜
は性が悪く、打抜き成形速度に悪影響を及ぼす。また強
度が85 kg/mm2を越える場合は、素材の硬度が
高(なり、打抜き成形時素材に割れを発生し、成形機の
ポンチ、ダイスに損耗が生じ易くなる。従って素材の強
度は45〜85 kg/ma+”、好ましくは55〜8
0 kg/mm’である。
As a result of various studies from these points of view, the strength was 45 to 85.
kg/mm2 preferably 55-80 kg/mff1
2. Good mechanical properties are elongation of 3 to 20%, preferably 5 to 15%. That is, the strength is 45 kg/
If it is less than mm2, the hardness of the material is low and it is soft, making it difficult to remove the workpiece from the punch or die of the punching machine, which adversely affects the punching speed. Also, if the strength exceeds 85 kg/mm2, the hardness of the material will be high (the material will crack during punching and forming, and the punches and dies of the molding machine will be prone to wear and tear. Therefore, the strength of the material will be 45 to 45 kg/mm2). 85 kg/ma+”, preferably 55-8
0 kg/mm'.

またリードフレーム製品は、曲げ加工された足部分の強
度と同時に、曲げ加工時の繰り返し曲げ加工に充分たえ
ることが必要である。従って、素材の伸び率が3%未満
の場合は、折り曲げ加工によって素材の割れが発生する
。また伸び率が20%を越える場合は、曲げ加工性は良
好であるが、高強度が得られ難く、リードフレーム製品
の強度が不足するとともに、又打抜き成形性に対しても
好ましくない、従って、伸びは3%〜20%、好ましく
は5〜15%である。
In addition, the lead frame product needs to have sufficient strength in the bent leg portion and to withstand repeated bending during bending. Therefore, if the elongation rate of the material is less than 3%, the material will crack during bending. If the elongation rate exceeds 20%, bending workability is good, but it is difficult to obtain high strength, and the strength of the lead frame product is insufficient, and it is also unfavorable for punching formability. The elongation is between 3% and 20%, preferably between 5 and 15%.

而して、本発明に使用される鋼成分の素材に被覆層を設
けた素材を用いて、これらの機械的性質を確保するとと
もに、リードフレーム用素材に要求される耐食性、めっ
き性或いははんだ性の優れた性能を得る事が可能な製造
方法として加熱拡散処理を行なう。
Therefore, by using a material in which a coating layer is provided on the steel component material used in the present invention, these mechanical properties are ensured, and the corrosion resistance, plating properties, and solderability required for lead frame materials are achieved. Thermal diffusion treatment is performed as a manufacturing method that can obtain excellent performance.

リードフレーム用素材として上記の機械的性質及び各種
性能を向上せしめるためには、加熱温度450℃以上で
かつ再結晶温度より近い温度で加熱処理温度と拡散処理
を同時に、非酸化性雰囲気において、保定時間180秒
以下の加熱処理を行なう。
In order to improve the above-mentioned mechanical properties and various performances as a material for lead frames, it is necessary to simultaneously perform heat treatment and diffusion treatment at a heating temperature of 450°C or higher and closer to the recrystallization temperature in a non-oxidizing atmosphere. Heat treatment is performed for a time of 180 seconds or less.

加熱温度が450℃より低い温度でかつ保定時間180
秒以下の加熱処理では、曲げ加工に耐える機械的性質を
得るのに素地鋼板の成分が限定される問題があり、Ni
、 Co等の被覆層の拡散処理が充分に行なわれ難い問
題がある。従って前記した素材鋼成分の全組成範囲に亙
ってリードフレーム用素材として好ましい機械的性質を
得るのが困難であり、また拡散被覆層はNi、 Co等
の濃度の大なる被N層或いは表面はNi. Cojlの
まま残存するために、耐食性、或いはリードフレーム製
造工程でのめっき性、はんだ脆性等の点で本発明の目的
とする効果が得られない。
The heating temperature is lower than 450℃ and the retention time is 180℃.
Heat treatment for less than a second has the problem that the composition of the base steel sheet is limited in order to obtain mechanical properties that can withstand bending.
There is a problem in that it is difficult to sufficiently diffuse the coating layer of Co, etc. Therefore, it is difficult to obtain desirable mechanical properties as a material for a lead frame over the entire composition range of the steel material components mentioned above, and the diffusion coating layer has a high concentration of Ni, Co, etc. is Ni. Since the Cojl remains as it is, the desired effects of the present invention cannot be obtained in terms of corrosion resistance, plating properties in the lead frame manufacturing process, solder brittleness, etc.

加熱温度が再結晶温度を越える場合には、素地鋼板の強
度が軟質化して上記の目的とする機械的強度が得られに
くい。さらに加熱温度が高温になるとCrの拡散量が多
くなり、また加熱処理を非酸化性雰囲気といえども拡散
被覆層表面が高温のため酸化され、緻密で強固な酸化膜
が生成して、リードフレーム製造工程のめっき性、はん
だ性を阻害する。従ってこれらの観点から、加熱温度は
450℃より高い温度で、かつ再結晶温度より低い温度
の範囲が採用される。而して素地鋼板は、基本成分のC
r以外にTi、 Nbを含有しているので再結晶温度が
高温側に移行するため、拡散被覆層が得やすくなる。尚
再結晶温度は、鋼成分及び圧下率の程度によりて若干の
ばらつきがあり、概ね650℃程度であるが、中でも4
75〜625℃の加熱処理がよい。
When the heating temperature exceeds the recrystallization temperature, the strength of the base steel sheet becomes soft, making it difficult to obtain the desired mechanical strength. Furthermore, when the heating temperature becomes high, the amount of Cr diffused increases, and even if the heat treatment is performed in a non-oxidizing atmosphere, the surface of the diffusion coating layer is oxidized due to the high temperature, forming a dense and strong oxide film, which leads to the formation of a lead frame. Impairs plating and solderability in the manufacturing process. Therefore, from these viewpoints, the heating temperature is higher than 450° C. and lower than the recrystallization temperature. Therefore, the basic component of the base steel sheet is C.
Since it contains Ti and Nb in addition to r, the recrystallization temperature shifts to the high temperature side, making it easier to obtain a diffusion coating layer. The recrystallization temperature varies slightly depending on the steel composition and degree of rolling reduction, and is approximately 650°C, but the recrystallization temperature is approximately 650°C, but
Heat treatment at 75 to 625°C is preferable.

また加熱時間が180秒を越える場合は、上記の加熱温
度の範囲での処理によって素地鋼板からの被覆層への拡
散によるFe以外にCr等の添加元素の拡散量が多くな
り、前記した如く加熱雰囲気の調整を可成り厳格に行な
っても、拡散層表面に強固で緻密な酸化膜が生成され易
くなる。その結果として、リードフレーム製造工程での
めっき作業において、前処理・活性化処理が極めて困難
となり、均一被覆性とめつき密着性のすぐれたCuめつ
き或いは電気Pb−5nはんだめっき等を得るのが難し
くなり、また浸漬はんだに対してその濡れ性、はんだ拡
がり性を劣化する。
In addition, if the heating time exceeds 180 seconds, the amount of diffusion of additional elements such as Cr in addition to Fe due to diffusion from the base steel sheet to the coating layer increases due to treatment within the above heating temperature range, and as described above, heating Even if the atmosphere is adjusted quite strictly, a strong and dense oxide film is likely to be formed on the surface of the diffusion layer. As a result, in the plating work in the lead frame manufacturing process, pretreatment and activation treatments are extremely difficult, making it difficult to obtain Cu plating or electric Pb-5n solder plating with excellent uniform coverage and plating adhesion. It becomes difficult to solder, and also deteriorates the wettability and solder spreadability for immersion solder.

また、保定時間の下限は特に規定しないが、拡散処理を
均一に行なわしめるために10秒以上、好ましくは20
秒以上がよい、さらに、このような加熱処理の加熱雰囲
気は、非酸化性雰囲気が採用され、N2ガス、アンモニ
ア分解ガス(AXガス)、5%H2−N2系旧Xガスが
用いられる。
In addition, the lower limit of the retention time is not particularly specified, but in order to perform the diffusion treatment uniformly, it is 10 seconds or more, preferably 20 seconds or more.
A non-oxidizing atmosphere is used as the heating atmosphere for such heat treatment, and N2 gas, ammonia decomposition gas (AX gas), and 5% H2-N2-based old X gas are used.

尚加熱処理を行なった後、形状修正のための軽圧下処理
を施こしてもよく、またNi等の被覆処理を施こす過程
において、めっき浴或いは電極等から不可避的に含有さ
れる不純物、例えばS、B等が少量(約1%未満)含有
されても、本発明に支障をきたすものではない。
After the heat treatment, a light pressure treatment may be performed to modify the shape, and in the process of coating with Ni etc., impurities unavoidably contained from the plating bath or electrodes, such as Even if a small amount (less than about 1%) of S, B, etc. is contained, the present invention will not be affected.

以上の如く鋼成分に、Ni、 Co等の被覆層を設け、
前記の加熱処理方法で製造された鋼板素材は、その複合
効果によってリードフレーム用素材として、耐錆性、打
抜き成形加工性、リードフレーム製造工程でのめつき被
膜の均一処理性、密着性、はんだ性能等にすぐれた効果
を発揮する。
As described above, a coating layer of Ni, Co, etc. is provided on the steel component,
Due to its combined effects, the steel plate material manufactured by the above heat treatment method has excellent rust resistance, punching processability, uniformity of plating film in the lead frame manufacturing process, adhesion, and solderability. Demonstrates excellent effects on performance, etc.

(実施例) 第1表に示す鋼成分の素材鋼板を冷間圧延後、脱脂、酸
洗による表面活性化処理を行なってから、被覆処理及び
加熱処理を行なってリードフレーム用素材を製造した。
(Example) A raw steel plate having the steel components shown in Table 1 was cold rolled, subjected to surface activation treatment by degreasing and pickling, and then subjected to coating treatment and heat treatment to produce a lead frame material.

該評価材に対して、リードフレーム製品に要求される主
要性能について、各々以下の性能評価試験を実施して、
その性能評価を第2表に示す。
The following performance evaluation tests were conducted on the evaluation materials regarding the main performances required for lead frame products.
The performance evaluation is shown in Table 2.

尚、評価材については、熱延において各橿原さに評価材
を調整して、玲間圧下草を変化させて、厚さ0.254
mmの評価材を得た。
Regarding the evaluation material, the evaluation material was adjusted to each Kashihara during hot rolling, and the thickness of the material was changed to 0.254.
An evaluation material of mm was obtained.

この結果、本発明の製造法による鋼板は、比較材に比べ
て、リードフレーム用素材として極めてすぐれた性能を
示す。
As a result, the steel plate manufactured by the manufacturing method of the present invention exhibits extremely superior performance as a lead frame material compared to comparative materials.

〔評価試験方法〕[Evaluation test method]

■ 本発明の拡散被覆層の密着性 旧、 Co或いはNlとCOの合金の被覆層を設け、加
熱処理を行なった本評価材について、曲率半径が板厚と
同一の繰り返し曲げ加工を行ない、その後セロファンテ
ープを貼布、剥1II1./て、被覆層の剥離程度を調
査した。
■ Adhesion of the diffusion coating layer of the present invention The evaluation material, which was coated with a coating layer of Co or an alloy of Nl and CO and subjected to heat treatment, was repeatedly bent so that the radius of curvature was the same as the plate thickness, and then Apply cellophane tape and peel off 1II1. /The degree of peeling of the coating layer was investigated.

尚、評価基準は以下の方法によって行なった。The evaluation criteria were as follows.

◎・・・繰り返し回数11回以上、めっき被覆層の剥離
なし O・・・繰り返し回数8回以上〜10回でめっき被覆層
の剥離なし △・・・繰り返し回数4回以上〜7回でめっき被覆層の
剥離なし ×・・・繰り返し回数3回以下でめっき被覆層の剥、離
発生 ■ 打抜き成形加工性(スタンピング性)評価材に対し
て48ピン型のリードフレーム形状に連続スタンピング
を行ない、リードフレーム形状への打抜き成形性を以下
の評価基準で評価し、その成形加工性の評価を行なった
◎... No peeling of the plating coating layer after 11 or more repetitions O... No peeling of the plating coating layer after 8 or more to 10 repetitions △... No peeling of the plating coating after 4 or more repeats to 7 times No peeling of layer ×...Plating coating layer peels off or peels off after repeating 3 times or less ■ Stamping processability (stamping property) Evaluation material was continuously stamped into a 48-pin lead frame shape, and the lead The punching formability into a frame shape was evaluated using the following evaluation criteria, and the formability was evaluated.

O・・・打抜き端面部のかえりの発生、素材の割れ発生
等殆んどなく、打抜き成形性極めて良好 0・・・評価材の打抜き成形性は上記と同様良好である
が、若干成形機のポンチ、ダイスの連続運転による摩耗
損傷が発生 △・・・打抜き端面部にかえりが若干発生するか、或い
は成形材の装置からの抜は性が劣るため打抜き成形時に
トラブルが発生し易いX・・・打抜き成形によって割れ
が評価材に可成り発生するか、或いはポンチ、ダイス等
の摩耗が長期連続運転によって゛可成り大 ■ 耐食性能 (a)評価法A 評価材の保管貯蔵時の耐錆性能を評価するために、評価
材を所定のリードフレーム形状(48ビン型形状)に打
抜き加工後、リードフレーム製造工程での表面処理が施
こされるまでの保管時の耐錆性能の評価を以下の促進試
験法及び評価基準により、その平面部及び打抜き端面部
について評価を行なった。
0...Excellent punching formability with almost no occurrence of burrs on the punched end surface or cracking of the material 0...The punching formability of the evaluation material was as good as above, but it was slightly affected by the molding machine. Abrasion damage occurs due to continuous operation of punches and dies △... Slight burrs may occur on the punched end face, or problems may easily occur during punching and forming due to poor ability to remove the molded material from the equipment X...・Due to punching and forming, a considerable amount of cracking occurs in the evaluation material, or wear and tear on punches, dies, etc. becomes considerably large due to long-term continuous operation■ Corrosion resistance (a) Evaluation method A Rust resistance of evaluation material during storage In order to evaluate the performance, after punching the evaluation material into a predetermined lead frame shape (48 bottle shape), we evaluated the rust resistance performance during storage until surface treatment was applied in the lead frame manufacturing process. The flat part and punched end face part were evaluated using the following accelerated test method and evaluation criteria.

(60分冷凍・結露(−5℃)→120分高温湿潤(4
9℃、湿度≧98%)−24時間・室内放置(30℃)
)を1サイクルとして7サイクル評価試験を実施して、
以下の評価基準で耐錆性能を相対評価した。
(60 minutes freezing/condensation (-5℃) → 120 minutes high temperature and humidity (4
9℃, humidity ≧98%) - 24 hours, left indoors (30℃)
) was taken as one cycle, and a 7-cycle evaluation test was conducted.
Rust resistance performance was relatively evaluated using the following evaluation criteria.

平面部の耐錆性評価基準 ◎・・・赤錆発生率5%以下 O・・・  〃  5%超〜10%以下△・・・  〃
  10%超〜20%以下×・・・  〃  20%超 端面部の耐錆性評価基準 ◎・・・赤錆発生率10%以下 O・・・  〃  10%超〜20%以下Δ・・・  
〃  20%超〜40%以下×・・・  〃  40%
超 (b)評価法B リードフレーム製品の耐錆性を対象とした評価試験とし
て、リードフレーム形状(48ピンの形状)に打抜き加
工後、脱脂、浸漬酸洗を行なって、厚さ2μのCuめっ
きを施こし、塩水噴霧試験(JIS−C−5028)に
より、その耐食性を平面部及び端面部において赤錆発生
状況を観察、以下の評価基準により評価を行なった。
Rust resistance evaluation criteria for flat parts ◎... Red rust occurrence rate 5% or less O... 〃 More than 5% to 10% or less △... 〃
More than 10% to less than 20%×... 20% Rust resistance evaluation criteria for end face ◎... Red rust occurrence rate less than 10% O... More than 10% to less than 20% Δ...
〃 More than 20% ~ 40% or less ×... 〃 40%
Super (b) evaluation method B As an evaluation test for the rust resistance of lead frame products, after punching into a lead frame shape (48 pin shape), degreasing and immersion pickling were performed, and a 2μ thick Cu After plating was applied, the corrosion resistance was evaluated using a salt spray test (JIS-C-5028) by observing the occurrence of red rust on the flat surface and end surfaces, and using the following evaluation criteria.

◎・・・塩水噴霧試験24時間後の赤錆発生率1%未満 O・・・      〃     赤錆発生率1%以上
〜5%未満 Δ・・・      〃     赤錆発生率5%以上
〜10%未満 ×・・・      〃     赤錆発生率10%以
上 ■ めっき性能 リードフレーム製造工程でのめっき性能を評価するため
に、以下の方法によりCuめっき及びPb−5n合金電
気はんだめっきを行ない、そのめっき性能を評価した。
◎... Red rust occurrence rate after 24 hours of salt spray test less than 1% O... 〃 Red rust occurrence rate of 1% or more to less than 5% Δ... 〃 Red rust occurrence rate of 5% or more to less than 10% ×...・〃 Red rust occurrence rate of 10% or more ■ Plating performance In order to evaluate the plating performance in the lead frame manufacturing process, Cu plating and Pb-5n alloy electro-solder plating were performed by the following method, and the plating performance was evaluated.

(a)評価法A 評価材をリードフレーム形状に打抜き加工後、脱脂(リ
ン酸ソーダ系電解脱脂)後に、10%H2SO4浴を用
いて、30℃で5秒間の浸漬酸洗を行ない、シアンCu
メツキ浴を用いて電流密度7.5A/dm2で厚さ3μ
のめつきを施こし、Cuめっき後の外観調査及び以下の
方法による曲げ加工試験を行なってその密着性を併せ検
討した。
(a) Evaluation method A After punching the evaluation material into a lead frame shape and degreasing (soda phosphate electrolytic degreasing), immersion pickling was performed at 30°C for 5 seconds in a 10% H2SO4 bath.
Using a plating bath, the thickness is 3μ at a current density of 7.5A/dm2.
After plating, the appearance after Cu plating was inspected, and a bending test was conducted using the following method to examine the adhesion.

すなわち、曲げ加工試験は、板幅0.5mmのアクタ−
リード部について、長さ15mmに剪断後、MIL S
To 883G/2004に従い、一端を試験治具に固
定し、試料を垂直にぶら下げ、もう一端に230gのお
もりを付けて試験治具を90°に折曲げ後、もとにもど
すという工程を繰り返し実施し、Cuめっき密着性の評
価を行なった。
In other words, the bending test was performed using an actor with a plate width of 0.5 mm.
After shearing the lead part to a length of 15 mm, MIL S
In accordance with To 883G/2004, one end was fixed to the test jig, the sample was hung vertically, a 230 g weight was attached to the other end, the test jig was bent at 90°, and the process was repeated. Then, the adhesion of Cu plating was evaluated.

尚、評価は以下の評価基準で行なフた。The evaluation was conducted based on the following evaluation criteria.

◎・・・Cuめっき面は均一平滑でめフき欠陥存在せず
、繰り返し曲げ回数10回以上でCuめワき層の剥離な
し ○・・・Cuめっき面は均一平滑でめっき欠陥存在せず
、繰り返し曲げ回数6回以上でCuめっき層の剥離なし △・・・Cuめっき面に部分的に明瞭なめつぎ欠陥が若
干発生するも、繰り返し曲げ回数6回以上でCuめっき
層の剥離なし ×・・・Cuめっき面にめっき欠陥が明瞭に発生すると
ともに、繰り返し曲げ回数5回以下でCuめっき層の剥
離発生 (b)評価法B 評価法Aと同様のCuめっき後に、ワイヤーボンディン
グ時の加熱を受ける場合を想定して、400℃で5分間
の加熱処理を行なった場合のCuめフき面に発生するブ
リスター(Cuめっき層の微細な膨み)の発生状況を調
査してそのCuめっき層の密着性を評価し、以下の評価
基準でそのめっき性能の評価を行なった。
◎...The Cu plating surface is uniform and smooth, with no plating defects, and the Cu plating layer does not peel off even after repeated bending 10 times or more.○...The Cu plating surface is uniform and smooth, with no plating defects. , No peeling of the Cu plating layer after repeated bending of 6 times or more △...Although some clear plating defects occur partially on the Cu plating surface, no peeling of the Cu plating layer after repeated bending of 6 times or more ×・...Plating defects clearly occur on the Cu-plated surface, and peeling of the Cu-plating layer occurs when repeated bending is repeated 5 times or less (b) Evaluation method B After Cu plating in the same manner as evaluation method A, heating during wire bonding was performed. We investigated the occurrence of blisters (fine swells in the Cu plating layer) that occur on the Cu plating surface when heat treatment was performed at 400°C for 5 minutes, assuming that the Cu plating layer The plating performance was evaluated using the following evaluation criteria.

◎・・・ブリスターの発生なし Δ・・・ブリスターが5 X 5 cra”面積当りに
換算して5点以下発生 ×・・・ブリスターが5 x 5 cm”面積当りに換
算して6点以上発生 (c)評価法C 前記と同様の脱脂、酸洗の前処理を施こした後、アルカ
ノスルフォン酸系Pb−50%Sn電気はんだめつき浴
を用い、そのめっき性の評価を行なった。電気はんだめ
っき条件としては、めつき浴温50℃、電流密度10 
A/da’で厚さ8μのめっきを施こした。
◎... No blisters occur Δ... 5 or less blisters occur per 5 x 5 cra" area ×... 6 or more blisters occur per 5 x 5 cm" area (c) Evaluation method C After performing the same pretreatments as above, such as degreasing and pickling, the plating properties were evaluated using an alkanosulfonic acid-based Pb-50%Sn electric soldering bath. Electrical solder plating conditions include plating bath temperature of 50°C and current density of 10°C.
Plating was performed at A/da' to a thickness of 8 μm.

評価方法は、衝撃加工(評価面に直径12.5ma。The evaluation method was impact processing (the diameter of the evaluation surface was 12.5 ma).

高さljomの半球を2 m/secの速度で?#撃荷
重を加えて押し込み加工)後、テープ貼布、剥離してそ
のめっき層の密着性を評価した。
A hemisphere of height ljom at a speed of 2 m/sec? # After applying impact load and indentation), the tape was applied and peeled off to evaluate the adhesion of the plating layer.

評価基準は以下の方法により行なった。The evaluation criteria were as follows.

◎・・・めっき層の剥離なし ○・・・めっき層の剥離面積10%未満△・・・  〃
  剥離面積10%以上〜30%未満×・・・  〃 
 剥離面積30%以上■ はんだ性能 (a)評価法A 評価材のはんだ性について、リードフレーム製造工程で
打抜き加工後、Cuめつき処理の前にはんだが行なわれ
る工程を想定して、そのはんだ性について、特に打抜き
端面部のはんだ性についての評価を行なった。すなわち
、10μmX 50mmのくけい形に剪断した評価材に
ロジンアルコールフラックスを塗布して、10mmの剪
断面を下方にし、Pb−63%sb系はんだ浴に垂直に
浸漬した場合の濡れ応力と濡れ時間の測定により、その
はんだ性を以下の評価基準により評価した。
◎... No peeling of plating layer ○... Peeling area of plating layer less than 10% △... 〃
Peeling area 10% or more - less than 30%×...〃
Peeling area of 30% or more■ Soldering performance (a) Evaluation method A Regarding the solderability of the evaluation material, assume that soldering is performed after punching in the lead frame manufacturing process and before Cu plating. In particular, the solderability of the punched end face was evaluated. In other words, the wetting stress and wetting time were obtained when the evaluation material was sheared into a wedge shape of 10 μm x 50 mm, coated with rosin alcohol flux, and immersed vertically in a Pb-63%SB solder bath with the 10 mm shear plane facing downward. The solderability was evaluated using the following evaluation criteria.

尚、はんだ性の上記評価試験は、打抜き加工直後と室内
に1.5月間保管した経時後について、各々評価した。
The above evaluation test for solderability was performed immediately after punching and after being stored indoors for 1.5 months.

◎・・・濡れ応力450a+g以上でかつ濡れ時間7秒
未満で、はんだの濡れ性及び濡れ速度共極めて良好 ○・・・濡れ応力300mg以上〜450mg未満かつ
濡れ時間8秒未満で、はんだの濡れ性及び濡れ速度共可
成り良好 Δ・・・濡れ応力250mg以上〜300mg未満或い
は濡れ時間8秒以上〜10秒未満で、はんだの濡れ性或
いは濡れ速度のいずれかが若干劣る ×・・・濡れ応力250 mg未満或いは濡れ時間10
秒以上で、はんだの濡れ性或いは濡れ速度のいずれかが
極めて劣る 尚上記の濡れ応力及び濡れ時間の測定は、レスカ式のは
んだ濡れ性評価試験機を用い、フラックスを塗布した評
価材を溶融した温度350℃のはんだ洛中に一定速度(
4μm/5ec)で漫潰し、浸漬深さ4m+aで30秒
間浸漬を行ない、第2図に示すようにその際のメニスコ
グラフ測定により、濡れ応力、濡れ時間の評価を実施し
た。
◎...Wetting stress is 450a+g or more and wetting time is less than 7 seconds, and both solder wettability and wetting speed are extremely good.○...Wetting stress is 300mg or more and less than 450mg and wetting time is less than 8 seconds, and solder wettability is excellent. and wetting speed are fairly good Δ... Wetting stress is 250 mg or more and less than 300 mg or wetting time is 8 seconds or more and less than 10 seconds, and either the solder wettability or the wetting speed is slightly poor ×... Wetting stress 250 Less than mg or wet time 10
The wetting stress and wetting time described above were measured using a Resca-type solder wettability evaluation tester, and the evaluation material coated with flux was melted. Constant speed (
4 μm/5 ec) and immersed for 30 seconds at an immersion depth of 4 m+a, and as shown in FIG. 2, the wetting stress and wetting time were evaluated by meniscograph measurement.

(b)評価法B 評価材を幅30mmx長さ100mmのくけい状に剪断
後、評価材に27%ロジンアルコール・フラックスを塗
布し、はんだ組成1’b−63%Sn浴に端面部から長
さ50mm深さまで浸漬、温度360℃で10秒間浸漬
してはんだを付着せしめた。
(b) Evaluation method B After shearing the evaluation material into a wedge shape of 30 mm width x 100 mm length, 27% rosin alcohol flux was applied to the evaluation material, and a solder composition of 1'b-63% Sn bath was applied from the end face to the end surface. The solder was immersed to a depth of 50 mm for 10 seconds at a temperature of 360° C. to adhere the solder.

このあとワイヤーボンディング時の加熱処理を想定する
とともに、併せ経時に対する促進試験をも兼ねて、20
0℃で120分間の加熱処理を行なった場合のはんだの
密着性を評価した。
After this, we assumed heat treatment during wire bonding, and also served as an accelerated test for aging.
The adhesion of the solder was evaluated when heat treatment was performed at 0° C. for 120 minutes.

密着性評価法としては、曲率半径0.25mm (板厚
と同厚み)の繰り返し曲げ加工テストを行ない、はんだ
の剥離状況を調査して、そのはんだ性能を評価した。
As a method for evaluating adhesion, a repeated bending test with a radius of curvature of 0.25 mm (same thickness as the plate) was performed, and the state of solder peeling was investigated to evaluate the solder performance.

◎・・・繰り返し曲げ回数10回以上で、はんだの剥離
及びはんだ層にクラック生成なし ○・・・繰り返し曲げ回数6回以上で、はんだの剥離及
びはんだ層にクラック生成なし Δ・・・繰り返し曲げ回数3回以上で、はんだの剥離及
びはんだ層にクラック生成なし ×・・・繰り返し曲げ回数2回以下で、はんだの剥離及
びはんだ層にクラック生成 ■ リードフレーム製品の経時後の性能評価本発明の評
価材をリードフレーム形状に加工後、その表面処理工程
でCuめっき及び半田付けを行なったものについて、プ
レッシャークツカーを用いて、圧力2 kg/cm”、
温度120℃、相対湿度−85%中に、これら製品を封
入して、1000時間の経時試験を行ない、外観観察に
よりその評価を以下の評価基準で相対的に行なった。尚
、Cuめっきは3.5μ実施した。
◎...No peeling of solder or cracks in the solder layer after repeated bending 10 times or more○...No peeling of solder or cracks in the solder layer after repeated bending 6 times or moreΔ...No peeling of solder or cracks in the solder layer after repeated bending 6 times or more No peeling of solder or cracks in the solder layer after 3 or more bending times... No peeling of solder or cracks on the solder layer after 2 bending times or less ■ Performance evaluation of lead frame products over time Performance evaluation of lead frame products of the present invention After processing the evaluation material into a lead frame shape, Cu plating and soldering were performed in the surface treatment process, and a pressure of 2 kg/cm was applied using a pressure cutter.
These products were sealed in a temperature of 120 DEG C. and a relative humidity of -85% and subjected to a 1000 hour aging test, and their appearance was observed and evaluated relatively based on the following evaluation criteria. Note that Cu plating was performed to a thickness of 3.5μ.

◎・・・表面外観の変化等なく極めて良好○・・・端面
に僅少の錆発生 △・・・Cuめっき面にブリスター発生×・・・平面部
及び端面部に可成りの錆発生第1図は浸漬はんだのはん
だ性及びはんだ密着性評価結果を示すグラフであり、 (注)1は評価材のはんだ性について、10+mx50
mmのくけい形に剪断した評価材にロジンアルコールフ
ラックスを塗布して、10mmの剪断面を下方にして、
Pb−63%Sn系はんだ浴に垂直に浸漬した場合の濡
れ応力と濡れ時間の測定により、そのはんだ性を以下の
評価基準により評価した。
◎...Excellent condition with no change in surface appearance ○...Small rust on the end face △...Blisters on the Cu-plated surface ×...Significant rust on the flat surface and end face Figure 1 is a graph showing the solderability and solder adhesion evaluation results of immersion solder. (Note) 1 indicates the solderability of the evaluation material.
Apply rosin alcohol flux to the evaluation material sheared into a 10mm wedge shape, with the 10mm sheared surface facing downward.
The solderability was evaluated based on the following evaluation criteria by measuring wetting stress and wetting time when vertically immersed in a Pb-63%Sn solder bath.

尚、はんだ性の上記評価試験は、打抜き加工直後と室内
に 1.5月間保管した経時後について、各々評価した
。その評価基準は以下のとおりである。
The above evaluation test for solderability was conducted immediately after punching and after being stored indoors for 1.5 months. The evaluation criteria are as follows.

O・・・濡れ応力450+++g以上でかつ濡れ時間7
秒未満ではんだの濡れ性及び濡れ速度共極めて良好 O・・・濡れ応力300mg以上〜450mg未満でか
つ濡れ時間8秒未満ではんだの濡れ性及び濡れ速度共可
成り良好 Δ・・・濡れ応力250mg以上〜300+sg未満、
或いは濡れ時間8秒以上〜10秒未満ではんだの濡れ性
或いは濡れ速度のいずれかが若干劣る ×・・・濡れ応力250mg未満或いは濡れ時間10秒
以上で、はんだ性或いは濡れ速度のいずれかが極めて劣
る。
O...Wetting stress 450+++g or more and wetting time 7
Solder wettability and wetting speed are very good in less than seconds O... Wetting stress is 300 mg or more and less than 450 mg and wetting time is less than 8 seconds, both solder wettability and wetting speed are quite good Δ... Wetting stress is 250 mg More than 300 + sg,
Or, if the wetting time is 8 seconds or more and less than 10 seconds, either the solder wettability or the wetting speed is slightly inferior. ×...The wetting stress is less than 250 mg or the wetting time is 10 seconds or more, and either the solderability or the wetting speed is extremely poor. Inferior.

尚、前記の濡れ応力及び濡れ時間の測定は、レスカ式の
はんだ濡れ性評価試験機を用い、フラックスを塗布した
評価材を溶融した温度350℃のはんだ浴中に一定速度
(4am/5ec)で浸漬し、浸漬深さ4mmで、30
秒間浸漬を行ない、第2図に示すように、その際のメニ
スコグラフ測定により濡れ応力、濡れ時間の評価を実施
した。
The above-mentioned wetting stress and wetting time were measured using a Resca-type solder wettability evaluation tester, and the evaluation material coated with flux was melted in a solder bath at a temperature of 350°C at a constant speed (4 am/5 ec). immersed at a depth of 4 mm, 30
Dipping was carried out for seconds, and as shown in FIG. 2, wetting stress and wetting time were evaluated by meniscograph measurement at that time.

(注)2は各評価機にノンハロゲンタイプ・フラックス
(イソプロピルアルコールに13%のロジンを含有せし
めたフラックス)を塗布して、230℃のPb −63
%Snはんだ浴に漫潰し、引き上げ後エアブロ−ではん
だ付着厚さ8μ目標に施こした。該評価材を長期経時後
の密着性を想定して100℃で60分加熱処理し、衝撃
加工(評価面に直径12.5mm、高さ9Iの半球を2
 m/secの速度で衝撃荷重を加えて押し込み加工)
後、テープ貼布剥離して、その密着性を以下の評価基準
で評価する。
(Note) 2: Each evaluation machine is coated with non-halogen type flux (flux containing 13% rosin in isopropyl alcohol) and Pb-63 is heated at 230°C.
%Sn solder bath, and after pulling it up, it was applied with an air blow to a target solder adhesion thickness of 8 μm. The evaluation material was heat-treated at 100°C for 60 minutes assuming adhesion after long-term aging, and impact-treated (two hemispheres with a diameter of 12.5 mm and a height of 9I were placed on the evaluation surface).
Indentation processing by applying impact load at a speed of m/sec)
After that, the tape was peeled off and its adhesion was evaluated using the following evaluation criteria.

◎:はんだの剥離なし ○:はんだの剥離面積10%未満 △:はんだの剥離面積が10%以上30%未満X:はん
だの剥離面積が30%以上で極めて大(発明の効果) 以上説明したごとく本発明の製造法によれば、集積回路
などに使用するリードフレーム材料として、拡散被覆層
の密着性やスタンピング性とともに、耐食性、めっぎ性
、はんだ性に優れた高性能リードフレーム用表面処理鋼
板を得ることができる。
◎: No solder peeling ○: Solder peeled area is less than 10% △: Solder peeled area is 10% or more and less than 30% X: Solder peeled area is 30% or more, extremely large (effects of the invention) As explained above. According to the manufacturing method of the present invention, the surface treatment for high-performance lead frames has excellent corrosion resistance, plating properties, and solderability, as well as adhesion and stamping properties of the diffusion coating layer, which can be used as lead frame materials for integrated circuits, etc. You can get steel plates.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は浸漬はんだのはんだ性及び密着性の評価結果を
示すグラフ、第2図メニスコグラフによる濡れ応力、濡
れ時間の測定方法を説明する図面である。 代 理 人  弁理士 秋 沢 政 光他1名
FIG. 1 is a graph showing the evaluation results of solderability and adhesion of immersion solder, and FIG. 2 is a drawing explaining a method of measuring wetting stress and wetting time using a meniscograph. Agent: Patent attorney Masamitsu Akizawa and 1 other person

Claims (2)

【特許請求の範囲】[Claims] (1)重量%で、C;0.01%以下、酸可溶Al;0
.005〜0.10%、Cr;3〜10.5%、B;0
.0003〜0.005%を含有し、さらにTi、Nb
、Zr、Vの1種又は2種以上を0.03〜0.8%含
有し、残部Fe及び不可避的不純物からなるCr含有鋼
板を冷間圧延後、その表面に片面当りの付着量が100
〜300018/m^2のNi、Co或いはNiとCo
の合金の被覆層を設け、次いで非酸化性雰囲気中の45
0℃〜再結晶温度の温度範囲で180秒以下の加熱拡散
処理を施こす事を特徴とする耐食性、めっき性及びはん
だ性にすぐれた高性能リードフレーム用表面処理鋼板の
製造法。
(1) In weight%, C: 0.01% or less, acid-soluble Al: 0
.. 005-0.10%, Cr; 3-10.5%, B; 0
.. 0003 to 0.005%, and further contains Ti, Nb
After cold rolling a Cr-containing steel plate containing 0.03 to 0.8% of one or more of Zr, V, and the balance consisting of Fe and unavoidable impurities, the surface has a coating weight of 100% per side.
~300018/m^2 Ni, Co or Ni and Co
45 in a non-oxidizing atmosphere.
A method for producing a high-performance surface-treated steel sheet for lead frames with excellent corrosion resistance, plating performance, and solderability, which is characterized by performing a heat diffusion treatment for 180 seconds or less in a temperature range of 0°C to recrystallization temperature.
(2)重量%で、C;0.01%以下、酸可溶Al;0
.005〜0.10%、Cr;3〜10.5%、B:0
.0003〜0.005%を含有し、さらにTi、Nb
、Zr、Vの1種又は2種以上を0.03〜0.8%と
Cu;0.05〜1%、Ni;0.05〜3%、Mo:
0.05〜0.5%の1種又は2種以上を含有し、残部
Fe及び不可避的不純物からなるCr含有鋼板を冷間圧
延後、その表面に付着量が100〜3000mg/m^
2のNi、Co或いはNiとCoの合金の被覆層を設け
、次いで非酸化性雰囲気中の450℃〜再結晶温度の温
度範囲で180秒以下の加熱拡散処理を施こす事を特徴
とする耐食性、めっき性及びはんだ性にすぐれた高性能
リードフレーム用表面処理鋼板の製造法。
(2) In weight%, C: 0.01% or less, acid-soluble Al: 0
.. 005-0.10%, Cr; 3-10.5%, B: 0
.. 0003 to 0.005%, and further contains Ti, Nb
, Zr, V or more at 0.03-0.8%, Cu: 0.05-1%, Ni: 0.05-3%, Mo:
After cold-rolling a Cr-containing steel plate containing 0.05 to 0.5% of one or more Cr and the balance consisting of Fe and unavoidable impurities, the amount of adhesion on the surface is 100 to 3000 mg/m^
2. Corrosion resistance characterized by providing a coating layer of Ni, Co or an alloy of Ni and Co, and then subjecting it to a heat diffusion treatment in a non-oxidizing atmosphere at a temperature range of 450°C to the recrystallization temperature for 180 seconds or less. , a method for manufacturing surface-treated steel sheets for high-performance lead frames with excellent plating and solderability.
JP25544188A 1988-10-11 1988-10-11 Production of surface treated steel sheet for high-effeiciency lead frame excellent in corrosion resistance, plating suitability, and solderability Pending JPH02104654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25544188A JPH02104654A (en) 1988-10-11 1988-10-11 Production of surface treated steel sheet for high-effeiciency lead frame excellent in corrosion resistance, plating suitability, and solderability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25544188A JPH02104654A (en) 1988-10-11 1988-10-11 Production of surface treated steel sheet for high-effeiciency lead frame excellent in corrosion resistance, plating suitability, and solderability

Publications (1)

Publication Number Publication Date
JPH02104654A true JPH02104654A (en) 1990-04-17

Family

ID=17278814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25544188A Pending JPH02104654A (en) 1988-10-11 1988-10-11 Production of surface treated steel sheet for high-effeiciency lead frame excellent in corrosion resistance, plating suitability, and solderability

Country Status (1)

Country Link
JP (1) JPH02104654A (en)

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