TW200844267A - Sn-plated copper alloy material for printed board terminal - Google Patents

Abstract

An Sn-plated copper alloy material comprising, by mass, 2 to 12% Zn, 0.1 to 1.0% Sn, optionally 0.005 to 0.5%, in total, at least one member selected from among Ni, Mg, Fe, P, Mn, Co, Be, Ti, Cr, Zr, Al and Ag, and the balance copper and unavoidable impurities. The Sn-plated copper alloy material has a thermal conductivity of 150 to 260 W/(m K) and a micro Vickers hardness of 120 to 215 and has its surface covered with a pure Sn phase of 0.1 to 2.0 μm average thickness. Further, there is disclosed a printed board terminal being a pin-shaped member of 0.2 to 1.0 mm in thickness (t) of its part mounted on the board and 0.9t to 2.0tmm in width (w) of its part mounted on the board obtained by press working of the above alloy material so that the base material of the copper alloy material is exposed at a press fractured surface, thereby excelling in solder mountability. Thus, there is provided an Sn-plated copper alloy material that even when plating is performed prior to press working, excellent mountability is attained, and provided a printed board terminal obtained by working of the material.

Description

200844267 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a lead-through solder that can be preferably inserted into a through hole of a printed substrate and passed through a melt-flow process. A tinned copper alloy material of the printed circuit board terminal material and a printed circuit board terminal made of the tinned copper alloy material. [Prior Art]

A printed circuit board is provided in the electronic control unit of the automobile, and a push-down terminal (hereinafter referred to as a substrate terminal) is mounted on the printed circuit board (refer to the figure. One end of the family pressing terminal is connected through a wh harness having a pressing terminal. External electronic equipment, etc. - Printed substrate terminals, inserted into the through holes of the printed circuit board, and coated, preheated, welded (stomached), cooled, and cleaned by Flux The solder is mounted on the printed circuit board. First, as the material for the substrate terminal, a tin bar of brass (C2600 j C2680) is used. That is, the width is _ _ _ ^ copper width: coffin The ore is processed in a continuous production line and divided into thinner strips. I; is punched into a pin by a joint, a male pressurization, and the pin is inserted outside the resin: h〇Using) as a connector. However, tin plating was not adhered to the press fracture surface of the substrate of the substrate produced in this step. Nisshin, you are in the field of the earth, and you have built the terminal on the substrate.

Cu; ^ First, the Sn_Pb solder is converted into a lead-free solder such as Sn-Ag system, Sn-, θ S system Sn_Bl system. In the case of the previous Sn-Pb spoilage, the gp-inserted, 疋0-hard fracture surface does not have a tinned brass end 5 200844267 : sub-, can also be successfully welded. However, since the Sn_Pb solder is benefited by the material: the material is often replaced, and the substrate is often made of yellow steel and mm is repelled to prevent the solder from adhering to the through hole. The reason is that the pressure fracture surface of the base is oxidized from the surface after the terminal is subjected to dust until the substrate is mounted on the substrate, and an oxide film rich in zn is formed on the surface of the fracture surface. In general, the resulting zn-rich oxide film is relatively stable, so that it remains after being dissolved in the flux, and the wettability of φ and the solder is poor to be repellent to the solder. Since the Sn Pb material has a eutectic composition, the melting point of 187 ° C is extremely low for the soldering temperature (about). Therefore, even if Zn-rich cerium oxide is present, if Sn-Pb solder is used, the solder is well adhered in the through hole. On the other hand, the melting point of the lead-free solder is 22 (the rc is relatively high, so it is repelled on the Zn-rich oxide film and cannot be sufficiently adhered (see Non-Patent Document 1). The countermeasure is to use a method in which the ruthenium sheet of the φ before the press processing is performed, but the step of performing the tin ore on the pin after the press processing (hereinafter, referred to as a post-plating step). After the brass wide web is divided into thin strips, it is stamped into pins by continuous pressurization, and then the step of tin plating is performed on a continuous production line. At this time, since the pressurized fracture surface is covered with mineral tin, it is possible to avoid enrichment. The Zn-containing oxide film repels the problem of the solder. However, since the thin strip is tin-plated, the plating is produced in comparison with the previous step of plating the wide web (hereinafter, referred to as the front plating step). The efficiency is extremely poor, and the manufacturing cost is extremely high. As the direction other than the above-mentioned substrate terminal, the miniaturization and high (four) configuration of the end surface area of the end of 200844 are approaching. As a result, #joules with current flow Caused by heat The increase in the temperature of the terminal is increased. As a countermeasure against temperature rise, (4) is a material that uses yellow heat, that is, a material with a high material rate. The above description is based on the printed circuit board of the electronic control unit of the automobile, but The same applies to the printed circuit board. [Non-Patent Document 1] The last time, Ichiro Ichiro: The lead-free soldering technique, the Industrial Survey (2004) pl52 ^ [Invention] The object of the present invention is to provide a structure using lead-free solder. Printed substrate terminals and their raw materials with excellent mountability. More specifically, it is possible to provide a structure of a filling knife even at a low cost in the pre-plating step, and at the same time, having good solder wettability, electrical properties, strength, and bowing workability. A tin-plated copper alloy material, and a printed circuit board terminal having a good mountability for processing the material. The inventors of the present invention have developed a good solder wettability by reducing the amount of Zn in the brass, adding a small amount of Sn, adjusting the manufacturing conditions, and performing tin plating under appropriate conditions. A material having a hermetic property, strength, and %, and a workability, which can be preferably used as a substrate terminal material. That is, the present invention provides the following copper alloy material. (1) A tin-plated copper alloy material for a printed circuit board terminal, which comprises 2 to 12% by mass of Zn and (^ to 1% by mass of Sn, and the balance being copper and unavoidable impurities, It is characterized by a thermal conductivity of 15 〇 to 26 〇 W/(m'K) and a micro v1 Cker's hardness of 12 〇 to 215, and the surface has an average thickness of (^~2) 7 200844267 The pure Sn phase of μιη is covered by (2) - 2 to 12% by mass of the copper alloy material of the tin-plated terminal for the printed circuit board, and the "mass..."; the leaf is 0.005 to 0.5 mass% iNi, Mg, Fe, p, Mn, c〇, B^^, ::, Ai, and Α§ are all of the above, while the rest are composed of copper and = impurities avoided. 'Characteristics are: Η.~26〇: · Κ) thermal conductivity ... 20 to 215 micro Vickers hardness, and the surface is covered by a pure Sn phase with an average thickness of 0.1 ~ 2.0 μηι. (1) - a printed substrate terminal, characterized by: (1) The tin-plated copper alloy strip of ~(2) is pressed and processed, and the pin-shaped structure of the copper alloy base material is exposed on the pressure fracture surface (4); The thickness (^) of the substrate assembly portion is 0.2 to the width (w) of the substrate assembly portion is 〇 (w / t = 〇 · 9 to 2.0) 〇 · (4) The printed circuit board terminal as described in the above) is exposed After 24 hours in an ambient atmosphere with a relative humidity of f85% and temperature, it was immersed in 25% of the TC-free solder for 1G seconds, at which time the area of the portion on which the solder was adhered on the pressure fracture surface was relative to The area of the portion immersed in the solder exceeds 105%. The knife can provide a low-cost printing which can be preferably inserted into the through hole of the printed substrate and passed through the flow step by the error-free solder. A tin-plated copper alloy material of a material of the second wiring board terminal, and a printed circuit board terminal excellent in the structure of the material manufactured by the material. / [Embodiment] (1) Characteristics of the alloy 8 200844267 - Copper alloy of the present invention The thermal conductivity is 150 to 260 w/(mK). If the thermal conductivity exceeds 260 W/(mK), the amount of heat dissipated by the solder through the terminals increases when the substrate is solder-mounted. The solder does not adhere enough to the through hole. On the other hand, if the thermal conductivity is less than 15〇w/(mK When the current flows on the dice, the temperature rise is large, and the connector for medium and large current cannot be used. The micro Vickers hardness (hereinafter, referred to as hardness) of the copper alloy of the present invention is φ. 〇~215. When the hardness is less than 120, the strength of the substrate terminal is insufficient, and there is a problem that the terminal is deformed when the female connector is inserted or removed. If the hardness exceeds 21 5, cracking occurs during bending. (2) Alloy component The copper alloy of the present invention has Zll and S11 as essential components and exhibits characteristics by the action of two elements. The concentration of Zri ranges from 2 to 12% by mass, and the concentration range of Sri is 〇"~1" mass 0/〇. If Zn is less than 2%, the hardness will be insufficient, and depending on the concentration of Sn, the thermal conductivity of φ will exceed 260 W/(m.K). When Zn exceeds 12%, the Zn'-rich solder is not filled in the through-holes of the oxide film, resulting in poor mountability and a thermal conductivity of less than 15 〇 W/(m.K).

Sn has the effect of promoting work hardening of the pressurization. If it is less than 0.1%, the hardness will be insufficient, and depending on the Zn concentration, the thermal conductivity will exceed 26 〇 W / (m'K). If Sn exceeds ΐ·〇%, the thermal conductivity will be less than 15〇. In the alloy of the present invention, in order to improve the strength, heat resistance, stress relaxation resistance, and the like of the alloy, Ni, Mg, Fe, P, Μ, Co, Be, Ti, Cr may be added in a total amount of 0.005 to 0.5 mass ❻/❶. One of Zr, A1 and Ag 9 200844267 and above. However, since the addition of alloying elements causes a decrease in thermal conductivity and a decrease in bending workability, it is necessary to consider this. (3) Tin plating of an alloy; the copper alloy of the present invention is tin-plated prior to press stamping. In general, the tin plating is produced according to the following steps, gp, after degreasing and pickling on the continuous mineral f-line, by the electric clock method to form = coating layer and then by electro-mine The method forms a tin-plated layer, and finally performs a process of knowing to melt the tin-plated layer. As a base plating, it is generally a Cu-based substrate::: It is sometimes used in applications where high demand is required... The bottom is applied, and Cu/Ni double can be implemented in applications where there is a higher demand for money resistance. Acoustic: Reapply: Here, the so-called Cu/Ni double-layer base mineral deposit refers to the reflowing after electron microscopy in the order of N:: bottom, Cu substrate plating, tin plating, and plating after reflow. The composition of the coating layer is a phase, a Cu-Sn phase, a Ni phase, and a base material from the surface. The details of the reflow technique are disclosed in Japanese Patent Laid-Open No. Hei-6 ==, U.S. Patent No. 3,293,187, and No. 2qq4_6_5. If the thickness of the right tin plating is too thin, the soldering of the plating part (4) will be the next: the method / is attached to the through hole. On the other hand, if the thickness of tin plating is too thick, 戸 = (4). The thickness of the appropriate tin in the present invention is an average thickness of 0.1 to 2.0 μηι. =, regardless of the type of substrate plating (including the absence of substrate (4) ... and the presence or absence of reflow treatment, as long as the average thickness of pure Sn phase 200844267 is positive 〇 1~2 · 〇μηι, can constitute the present invention, and play The shape of the terminal (4) is pressed by the tin-plated copper alloy material of the present invention, and the pin-shaped member shown in Fig. 1(a) is exemplified. The portion of the terminal for the substrate assembly (substrate structure) Thickness (mm) of the mounting part) *

It is Y·2~i.O mm. When t is less than 0·2 mm, the temperature rise of the current flowing through the terminal becomes large, and the connector for medium and large current cannot be used. Moreover, the terminals are deformed when the female connector is inserted or removed. When the temperature exceeds 2 !·〇 mm, the area of the pressure fracture surface (the copper alloy base material is exposed) becomes too large, so that the solder cannot adhere to the through hole. The width (w (mm)) of the configuration portion is set to 〇·9 t to 2 〇 t. When w is less than 〇·9 t, the surface of the tinned portion (pressurized fracture surface) is not attached, and the area of the phase 1 where the tin plating is applied (rolled surface) becomes too large, so that the solder is not wet. Attached to the through hole. When w exceeds 2.0 t, the tin-plated portion is not attached (the area of the pressurized fracture surface i is smaller than the area to which the tin-plated portion (rolled surface) is attached, so even if it is plated before brass The solder of the dressing is also adhered to the beacon hole. In this case, the constitution and effect of the present invention are not required. (5) The solder wettability of the terminal stabilizes the solder and adheres well to the through hole. The terminal subjected to aging treatment is immersed in the core of the flawless solder at a depth of 2 mm for 10 seconds. At this time, the solder wet area ratio (s) on the pressure fracture surface exceeds 105%, preferably i 1〇% or more S ( %) = (area of the part to which the solder is attached) / (area of the part which is immersed in the solder 200844267) Xi 〇〇s exceeds 100% means the solder wettability The conditions for the M y, (4) 4 positions on the solder dipping line are as follows: . Maturing: Exposure to an environment with a relative hourly humidity of 85 c 24

• Flux ULF-300R Manufactured by Tamura Manufacturing Co., Ltd. Product Name #

Mass%Ag~ 〇·5 mass°/DCii (Thousands of gold • Solder composition·· Sn~3e() is manufactured by Industrial Co., Ltd. • Solder temperature: 25 〇. (3. Solder immersion depth: • Solder immersion Time: If the characteristics of the copper alloy described above are the conditions of the present invention [Example] 2 mm 10 seconds, composition and tin plating conditions, and terminal shape satisfying ' then S will exceed 1〇5%. Use a two-frequency induction furnace at the inner diameter Dissolve 2 kg of electrical copper in a graphite crucible of 60 mm and a depth of 200 mm. After the bath surface is covered with charcoal flakes, add Zn and Sn. After adjusting the bath temperature to 1200 °C, & The main part is made into a metal mold to make each ingot with a width of 60 mm and a thickness of 30 mm. The ingot is heated at 85 Torr for 3 hours and hot rolled until the thickness reaches 8 mm. After the oxidized scale on the surface of the slab is ground by a grinder, the steps of cold rolling, recrystallization annealing, and cold rolling are sequentially performed to obtain a thickness of t (mm). During the recrystallization annealing, the material is placed in the atmosphere. Add 400 °C to 12 200844267 heat for 30 minutes. Also, in order to remove the cause The oxide film formed by annealing is first acid-washed with 10% by mass of sulfuric acid-!% by mass hydrogen peroxide solution, and then mechanically ground using #1200 grinding paper. The final cold rolling process is changed, and the calendering degree is changed (R Here, R is defined by the following formula: R (%) = (tG - t) / tGxio 〇 (t.: thickness before rolling, t: thickness after rolling) Then, various thicknesses are applied to the copper alloy material Tin plating

(1) The sample was used as a cathode in an alkaline aqueous solution and electrolytic degreasing was carried out under the following conditions. • Current density: 3 A/dm2. Degreaser: YUKEN Industrial Co., Ltd.

Display, shape, clothing, trademark r PAKUNA ” degreaser concentration: 40g / L 'temperature: scratch, time: Chuan seconds • Current density: 3 A / dm2. (2) Pickling with a 1% by mass aqueous solution of sulfuric acid

The substrate (3) was subjected to a thickness of 0.3 and a Cu/Ni double-layer substrate under the following conditions.

Ni plating of Km (Ni • bond bath composition · nickel sulfate 250 g / L,

g/L Nickel chloride 45 g/L, shed acid 30 • Plating bath temperature: 50 ° C • Current density: 5 A/dm 2 (4 ) The thickness is 以 as follows

Door* — Km Cu plating

Cu substrate and the case of Cu/沁 double-layer substrate).

• Plating bath composition · · Copper sulfate 2 〇〇 / L

δ 埽 acid 60 g / L • Forging bath temperature: 2 5 13 200844267 • Current density: 5 A / dm2 (5) Tin plating was carried out under the following conditions. Vermiculite 268 g/L, boundary

• Plating bath composition: stannous oxide 41 g / L, surfactant 5 g / L • plating bath temperature: 50. (: 琶k岔··9 A/dm2 The thickness of the tin plating is changed by the electrodeposition time.

Ο

(6) As a reflow process, the sample insertion temperature was set to * in a hot furnace for 10 seconds, and water cooling was performed. The following characteristics were evaluated for the obtained copper alloy tin bar. (a) Measurement of plating thickness The purity of the pure sn phase was measured by an electrolytic film thickness meter (electrolytic peeling method). Make the electrolyte of R-50. When electrolysis is performed by the electrolytic solution, the tin plating layer is electrolyzed. (4) When the Cu_Sn alloy layer is exposed, electrolysis is stopped, and the display value of I is set to the thickness of the pure tin plating layer. (B) Thermal conductivity The thermal conductivity was determined by a laser flash method using a thermal conductivity measuring device 851 manufactured by Jigaku Co., Ltd. The temperature is yes. . The environment is measured under vacuum conditions. (C) Micro Vickers hardness is obtained by the Akashi Seisakusho Co., Ltd. under the trade name "Micro Vickers hardness tester MVK-E type", and the Vickers hardness specified by JIS Z2244 is obtained in parallel sections with respect to the rolling direction ( HV0.5). In the case of the turtle, the pins with a width of 200844267 (mm) and a length of 30 mm were taken out from the copper alloy tin bar, and the characteristics of the following were evaluated. LD) Solder wettability 'Measurement L =... The matured sample was immersed in the non-solder, and the wetted area ratio of the solder on the cracked surface was judged to be good. J Field S exceeded 105% (E) Substrate structure The test was taken with /=r5t, 85% for 24 hours of aging, and the use of SR: clothing: Γ: 'The desktop type jet welding device made by Co., Ltd. and the error-free solder structure... The same soldering chat, substrate board; substrate material is glass epoxy * board U] _6_, copper book bottom surface (μ diameter is φ2 〇 two, Betong aperture is the width of the pin w + 〇 2 positions The inner surface of the coated auxiliary substrate is in contact with 925°. The jet of the crucible is sprayed, and the surface of the crucible is wetted and spread on the surface of the bottom surface. χ (Refer to Fig. ^). (F) Temperature rise during energization: 嶋 When the female terminal 'voltage is 12 V, 3. A DC 二 2'? When the thermocouple is soldered to the terminal and the measurement 1. When the temperature rise is less than 30 °c, it is recorded as 〇, and when it exceeds 30 〇C, it is recorded as the X-turned W-curve test. The bending radius is The optical micromirror is cracked by 400 times, and when it is not broken, it is recorded as 0. (G) The bending workability is carried out by the thickness value specified in JISH3110. For the sample after bending, the section of the curved portion is observed to be unbroken. 15 200844267 When there is a fracture, it is recorded as X. Further, cracks with a depth of more than 10 μχη are regarded as fractures. (Example 1) The alloy composition and final calendering degree are described in Table 1 for thermal conductivity, hardness, and terminal. Effect of performance: After the 0.3 μm Cu substrate plating was applied to the entire sample, 1.0 μm of tin tin was applied. The thickness of the pure Sn phase after reflowing in the sample of Table 1 was 0.6 ± 0.2 μm. It is t = 0·64 mm, w = 0.64 mm. 16 200844267 •η ·3 [1<] ―Flexibility (〇/ X) 〇〇〇〇〇〇〇〇〇〇Ο 〇〇〇〇〇〇〇温度 Temperature rises when energized (〇 / X) 〇〇〇〇〇〇〇〇〇〇 OO 〇〇〇〇〇〇〇〇 Substrate mountability (〇 / X) 〇〇〇〇0 〇〇〇〇〇O Weld welding Wetting area ratio (%) cn f ( 1 ( v 〇〇〇Ύ "< oo ! - H pH oo rH f < cn CN (N < N m 2 tn (N 1 - t 1 t VO CN T —H m (N iH m (N rH 00 CN 1—^ Hardness On mr—^ On r—^ oo mr—( 2 Ό r—< rH « r—I 00 »〇l〇m »n O VO T —H ?; S rH VO rH o VD rH Thermal conductivity (W/(m*K)) 258 210 240 230 206 ro VO Vi 212 189 CN ON fH 〇rH rH 〇\ r—1 i—H r- OO VO T—^ mv〇wn w^> l · <N 丨1 < σ\ 1—^ Final calendering degree (%) Other added elements (% by mass) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 > 1 1 1 National Ο 0.18Ni Sn (% by mass) 0.23 0.68 0.17 0.30 0.54 0.94 0.18 0.49 0.30 0.67 0.30 1 0.45 0.58 0.18 0.31 0.50 0.24 0.12 0.30 0.31 Zn (mass 0/〇) (N CN CN o G\ (N CN (ri 00 cn — ON o MD o OS o oo o OO Γ—^ oo fH Os OO Os 1L5 Ο 00 as No.. r—^ (N m inch 00 o\ o 1—( CN m 2 »n 1—4 rH OO ΟΝ 5 200844267

〇〇〇〇〇〇〇〇〇〇〇〇〇X 〇〇〇〇〇〇〇〇〇〇〇XX 〇〇X 〇〇〇〇〇〇〇〇X 〇X 〇〇〇X CN l—H (N r -H , < OO T - t P < On r 'ir - t cn (N 1 - tsr · ^ tH » 〇 o \ r - i fH (N CSJ 1 - t σ \ i - ( OO 1 - 4 r—4 (N m Ό 1 < $ i—H OO ri JQ v〇rH 00 TH ON VO r»H CJs 〇〇vH 00 ϊ—M CN os ι—Η s 1—< On 〇(N CN 1-"^ m OO g <N 00 VO s 1—< m OO (N v〇»〇<N swallowing rH ON 1—ί »n contamination 0.05Ti sog 〇O.lOFe GS ON o 0.04Zr, O.lCr 0.04Be, 0.02C〇0.08A1 1 t 1 1 1 1 1 G\ (N ONo (N o ON f—( o O <〇Os o CN 〇o cn d ο s 〇t —H (N —si—H rH mo ο 〇do OO oo wS tri r—< irv ON H OO 00 l〇r^"< cn in (N m — OO f*4 Os ο cn r—( CN CN(N m (N (N 00 CM ON CN r-< ΓΟ mm cn m £ w 200844267 Zn is 2 to 12%, Sn is 0.1 to 1·〇% by mass and the appropriate final calendering process is selected In Ν0·1~28, the thermal conductivity is in the range of 150~260 W/(mK), the hardness is in the range of 12〇~215, and the wettability of the material after processing the terminal and the substrate structure The temperature is good, the temperature rises when the power is turned on to the standard of 3 〇t or less, and there is no break during the bending process. In the case of No. 29, the Zn concentration is less than 23⁄4, so the thermal conductivity exceeds 260 W/(mK). And the solder wettability area ratio is less than 1〇5%,

This also leads to deterioration of solder build-up. Moreover, there is a possibility that the terminal is deformed when the connector is inserted or removed due to the hardness of less than 120. In the comparative example Νο·30, the Sn concentration is less than %1%, and the hardness is less than 120, which may cause the terminal to be deformed when inserted or removed from the connector. In Comparative Example No. 31, since the Zn concentration was more than 12%, the oxide film composition was tianzhu Zn, and as a result, the solder wettability area ratio was i or less, and the solder moldability was deteriorated. Moreover, the thermal conductivity is less than 15 〇 W / (m. K) ' and the temperature rises when the power is turned on exceeds the standard. In the case of No. 3 2, the concentration of sn exceeds! ·〇%, so the thermal conductivity is less than 150 W/(m'K)' and the temperature rises when the power is turned on exceeds the standard "it. It is harder than the final calendering process due to the lower rolling process." If it is less than 120, it may cause deformation of the terminal when it is plugged or unplugged. Comparative Example 〇 3 · 3 4, Tian Wu {々 salty, . Porting ~ Calendering processing is too high, resulting in hardness exceeding 215 ' and bending A fracture occurs in the middle. Comparative Example 〇 3· 3 5 〇廿 〇廿 ^ ▲ Take the steel as an example. The solder wetted area ratio is less than 80%, and the pressure fracture surface is repelled by M^t 卜 ping. The exposed part of the brass base material. The substrate cannot be assembled. The temperature rise of the i, s gentleman, and the power supply is also greatly higher than the temperature of 30 ° C. 2008. The standard is 30 ° C. (Example 2) Terminal Huai;. Humidity and influence of substrate structure. ^ The composition of the base material is Cu-8 〇./2 tests and U/〇Z" 3%Sn 4°%, thermal conductivity wheel, called hardness :; The size is t=〇·80 mm, wu〇mm. For the solder run after work, the copper alloy has a degree of calendering and the terminal

Νο·36~44 indicates that when the Cu-based mineral deposit of 0·3 μηη is applied, the thickness of the pure Sri phase after reflow is changed by changing the electrodeposited thickness of Sn. Yu Chun Sn Xiangfu!焊料 In the case of 0·1 μπιΝο·36, the solder structure deteriorates. In the pure Sn phase, 衣 37 37 37 · · · · · · · 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 良好 良好 良好 良好 良好 良好 良好 良好 良好 良好However, in pure ^ over 2.0 μπι Νο·44 Φ from phase super τ, the pure Sn phase has an unnecessary thickness 囡 economy. / _ _ Ν · · 45 45 45 45 45 45 45 45 46 每 每 每 · · 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 每 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 In the case of plating, No 4Q — — , Chuan • ~ 50 indicates that the base mineral is not applied. For this special case, the level of pure Sn phase after reflow is 0.1 μηι or more. , witnessed _ Ding Xihou, J can get good solder wettability to the structure. (Example 3) The influence of the solder shape after the terminal shape was processed on the terminal, the substrate mountability, and the temperature rise at the time of energization were described using Table 3. In the whole sample: the composition of the copper alloy base material, Cu_2 7% Zn_G16%Sn, the final calendering degree of 60%' thermal conductivity was 247 w/(m.K), and the hardness was 145. Further, after the Cu substrate plating of 〇·3 Tao was carried out, the tin of 1 〇 _ was further applied: In Table 3, the thickness of the pure Sn phase after the reflow of the sample was g.6±〇2 (four). 21 200844267 [Table 3]

In the case of setting t to 0.2~]n^~6〇·0^η, w is set to 9.9t to 2.0t, n〇.51 'gets good wetness, substrate structure The suitability is also good, and the temperature rises below the standard. Starting, ":t full 〇.2 job version 61" may lead to easy to lead up when power is on - and the creeper may be deformed when the connector is plugged in. The structure is deteriorated. w Wetting The invention is even worse, the solder is worse than the case where the solder is not full, and the solder wettability is deteriorated compared with the invention.

In the case of N 6 to 67 in which W exceeds 2_〇t, although a good 22 200844267 solder wettability and substrate mountability are obtained, the seven-inch 'but the terminal ruler + & ^ is made of brass before plating The material can also be used to improve the solder buildability of the substrate structure. u This heat must be used [Picture of the simple description] The pattern of the evaluation criteria for the evaluation of the clothing [Main component symbol description]

twenty three

Claims (1)

200844267 X. Patent application scope: 1 · A printed copper plate alloy consisting of Zn of 12% by mass of Zn and 〇.1~1 copper and unavoidable impurities, which contains 2·〇% by mass Sn, the rest is 'characterized by: and 120 to 215 micro 2·〇μπχ pure Sn phase has a thermal conductivity of 150 to 260 W / (mK) Vickers hardness, the surface has an average thickness of 〇" ~ Covered. 2. Tinned copper for printed circuit board terminals ~12 quality one as well. ·Μ•. 2% by mass and = 2 is _5~〇·5 mass% of Ni, Mg, Fe, Ρ, Mn, co, Be, Ti, Zr A1 and Ag, and the rest is copper and inevitable The impurity is composed of: 12 0~21 5 micro-μπι pure Sn phase has a thermal conductivity of 150~260 W/(mK) and Vickers hardness, and the surface has an average thickness of 〇1~2 Covered with cockroaches. ...3 A printed substrate material characterized by the fact that the copper alloy material of the tin tin of the second or the second item of the patent application is pressed and reinforced, and the joint member of the copper alloy base material on the fracture surface is added. The thickness (1) of the substrate assembly portion is W1 to 1.G _, and the width (w) of the substrate assembly portion is 0.9 t to 2.0 tmm. 4. If the printed circuit board terminal of the patent application (4) 3 is applied, the violent relative humidity is 85%, the temperature is suppressed, and the ambient atmosphere is called, and then immersed in 25 (TC lead-free solder for 1 sec. At this time, the area of the portion on which the solder is adhered on the press fracture surface is more than 105% with respect to the area of 24 200844267 impregnated in the solder. XI. Schema: 25