KR102458992B1 - 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법 - Google Patents

기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법 Download PDF

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Publication number
KR102458992B1
KR102458992B1 KR1020207008395A KR20207008395A KR102458992B1 KR 102458992 B1 KR102458992 B1 KR 102458992B1 KR 1020207008395 A KR1020207008395 A KR 1020207008395A KR 20207008395 A KR20207008395 A KR 20207008395A KR 102458992 B1 KR102458992 B1 KR 102458992B1
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KR
South Korea
Prior art keywords
substrate
board
holding
hand
carrying
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KR1020207008395A
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English (en)
Korean (ko)
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KR20200040861A (ko
Inventor
야스오 아오키
Original Assignee
가부시키가이샤 니콘
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Priority to KR1020227036488A priority Critical patent/KR102614210B1/ko
Publication of KR20200040861A publication Critical patent/KR20200040861A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020207008395A 2017-09-29 2017-09-29 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법 KR102458992B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227036488A KR102614210B1 (ko) 2017-09-29 2017-09-29 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/035719 WO2019064583A1 (ja) 2017-09-29 2017-09-29 基板搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、基板搬送方法、及び露光方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227036488A Division KR102614210B1 (ko) 2017-09-29 2017-09-29 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법

Publications (2)

Publication Number Publication Date
KR20200040861A KR20200040861A (ko) 2020-04-20
KR102458992B1 true KR102458992B1 (ko) 2022-10-25

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Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020227036488A KR102614210B1 (ko) 2017-09-29 2017-09-29 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법
KR1020207008395A KR102458992B1 (ko) 2017-09-29 2017-09-29 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법
KR1020237041883A KR20230169480A (ko) 2017-09-29 2017-09-29 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020227036488A KR102614210B1 (ko) 2017-09-29 2017-09-29 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020237041883A KR20230169480A (ko) 2017-09-29 2017-09-29 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법

Country Status (5)

Country Link
JP (1) JP6813098B2 (ja)
KR (3) KR102614210B1 (ja)
CN (2) CN116520649A (ja)
TW (2) TWI693663B (ja)
WO (1) WO2019064583A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022079985A1 (ja) 2020-10-14 2022-04-21
JP2022102102A (ja) 2020-12-25 2022-07-07 株式会社日本製鋼所 リチウムイオン電池用の負極、リチウムイオン電池、リチウムイオン電池用の負極の製造方法、およびリチウムイオン電池の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010123888A (ja) 2008-11-21 2010-06-03 Nikon Corp 搬送装置、搬送方法、露光装置、及びデバイス製造方法
WO2011102410A1 (ja) 2010-02-17 2011-08-25 株式会社ニコン 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2012060134A (ja) 2010-09-13 2012-03-22 Nikon Corp 移動体装置、露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法、及び物体交換方法
JP2016053732A (ja) 2011-05-13 2016-04-14 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039999A1 (fr) * 1998-02-09 1999-08-12 Nikon Corporation Appareil de support d'une plaque de base, appareil et procede de transport de cette plaque, appareil de remplacement de cette plaque et appareil d'exposition et procede de fabrication dudit appareil
JP2006266722A (ja) * 2005-03-22 2006-10-05 Olympus Corp 基板検査システム及び基板検査方法
JP4802016B2 (ja) * 2006-03-08 2011-10-26 芝浦メカトロニクス株式会社 基板の受け渡し装置
JP2008091542A (ja) * 2006-09-29 2008-04-17 Fujifilm Corp 基板保持装置及び方法
JP2012238758A (ja) * 2011-05-12 2012-12-06 Sharp Corp 基板載置装置および基板載置方法
CN103534787B (zh) * 2011-05-13 2018-02-06 株式会社尼康 基板的更换装置
WO2013150787A1 (ja) 2012-04-04 2013-10-10 株式会社ニコン 物体搬送システム、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体保持装置、物体搬送装置、物体搬送方法、及び物体交換方法
US10752449B2 (en) * 2015-03-30 2020-08-25 Nikon Corporation Object carrier device, exposure apparatus, manufacturing method of flat-panel display, device manufacturing method, object carrying method, and exposure method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010123888A (ja) 2008-11-21 2010-06-03 Nikon Corp 搬送装置、搬送方法、露光装置、及びデバイス製造方法
WO2011102410A1 (ja) 2010-02-17 2011-08-25 株式会社ニコン 搬送装置、搬送方法、露光装置、及びデバイス製造方法
JP2012060134A (ja) 2010-09-13 2012-03-22 Nikon Corp 移動体装置、露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法、及び物体交換方法
JP2016053732A (ja) 2011-05-13 2016-04-14 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Also Published As

Publication number Publication date
TW201921572A (zh) 2019-06-01
CN111133383A (zh) 2020-05-08
WO2019064583A1 (ja) 2019-04-04
KR20220150401A (ko) 2022-11-10
KR20200040861A (ko) 2020-04-20
TWI693663B (zh) 2020-05-11
KR20230169480A (ko) 2023-12-15
TW202046435A (zh) 2020-12-16
KR102614210B1 (ko) 2023-12-14
JP6813098B2 (ja) 2021-01-13
JPWO2019064583A1 (ja) 2020-11-05
CN116520649A (zh) 2023-08-01

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