KR102453258B1 - 웨이퍼 모서리 결함 검사장치 및 검사방법 - Google Patents

웨이퍼 모서리 결함 검사장치 및 검사방법 Download PDF

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Publication number
KR102453258B1
KR102453258B1 KR1020200005414A KR20200005414A KR102453258B1 KR 102453258 B1 KR102453258 B1 KR 102453258B1 KR 1020200005414 A KR1020200005414 A KR 1020200005414A KR 20200005414 A KR20200005414 A KR 20200005414A KR 102453258 B1 KR102453258 B1 KR 102453258B1
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KR
South Korea
Prior art keywords
wafer
edge
defect inspection
inspection apparatus
present
Prior art date
Application number
KR1020200005414A
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English (en)
Korean (ko)
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KR20210092001A (ko
Inventor
민경훈
Original Assignee
주식회사 커미조아
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Publication date
Application filed by 주식회사 커미조아 filed Critical 주식회사 커미조아
Priority to KR1020200005414A priority Critical patent/KR102453258B1/ko
Priority to PCT/KR2020/007577 priority patent/WO2021145516A1/ko
Priority to CN202080096090.2A priority patent/CN115088060A/zh
Priority to JP2022543093A priority patent/JP7453494B2/ja
Publication of KR20210092001A publication Critical patent/KR20210092001A/ko
Application granted granted Critical
Publication of KR102453258B1 publication Critical patent/KR102453258B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020200005414A 2020-01-15 2020-01-15 웨이퍼 모서리 결함 검사장치 및 검사방법 KR102453258B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020200005414A KR102453258B1 (ko) 2020-01-15 2020-01-15 웨이퍼 모서리 결함 검사장치 및 검사방법
PCT/KR2020/007577 WO2021145516A1 (ko) 2020-01-15 2020-06-11 웨이퍼 모서리 결함 검사장치 및 검사방법
CN202080096090.2A CN115088060A (zh) 2020-01-15 2020-06-11 晶片棱角缺陷检查装置和检查方法
JP2022543093A JP7453494B2 (ja) 2020-01-15 2020-06-11 ウエハー縁欠陥検査装置及び検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200005414A KR102453258B1 (ko) 2020-01-15 2020-01-15 웨이퍼 모서리 결함 검사장치 및 검사방법

Publications (2)

Publication Number Publication Date
KR20210092001A KR20210092001A (ko) 2021-07-23
KR102453258B1 true KR102453258B1 (ko) 2022-10-11

Family

ID=76863832

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200005414A KR102453258B1 (ko) 2020-01-15 2020-01-15 웨이퍼 모서리 결함 검사장치 및 검사방법

Country Status (4)

Country Link
JP (1) JP7453494B2 (ja)
KR (1) KR102453258B1 (ja)
CN (1) CN115088060A (ja)
WO (1) WO2021145516A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113884506A (zh) * 2021-09-15 2022-01-04 杭州中欣晶圆半导体股份有限公司 一种硅片边缘及表面自动化视觉检测系统及检测方法
CN114088724B (zh) * 2021-11-20 2023-08-18 深圳市北科检测科技有限公司 一种显示屏边缘缺陷检测装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP4358889B1 (ja) 2008-06-27 2009-11-04 日本エレクトロセンサリデバイス株式会社 ウエーハ欠陥検査装置
KR101001113B1 (ko) 2008-11-12 2010-12-14 주식회사 코로 웨이퍼 결함의 검사장치 및 검사방법
FR2959864B1 (fr) * 2010-05-06 2013-01-18 Altatech Semiconductor Dispositif et procede d'inspection de plaquettes semi-conductrices en mouvement.
KR101207470B1 (ko) * 2010-11-16 2012-12-03 한미반도체 주식회사 웨이퍼 검사장치 및 이를 구비한 웨이퍼 검사 시스템
JP5769572B2 (ja) * 2011-03-30 2015-08-26 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置および基板検査方法
KR101297209B1 (ko) 2011-11-04 2013-08-16 (주)오로스 테크놀로지 반도체용 웨이퍼 결함 검사방법
US9645097B2 (en) * 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
KR20160050112A (ko) * 2014-10-28 2016-05-11 주식회사 트라이비스 라인 스캔 카메라를 이용한 솔라셀 웨이퍼 측면 검사 시스템
KR102350549B1 (ko) 2014-12-05 2022-01-14 세메스 주식회사 웨이퍼 결함 검사 장치
KR102062120B1 (ko) * 2018-02-09 2020-01-06 코리아테크노주식회사 웨이퍼 치핑 검사시스템과 웨이퍼 치핑 검사방법

Also Published As

Publication number Publication date
CN115088060A (zh) 2022-09-20
JP2023517166A (ja) 2023-04-24
JP7453494B2 (ja) 2024-03-21
WO2021145516A1 (ko) 2021-07-22
KR20210092001A (ko) 2021-07-23

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