KR102451856B1 - 다이싱 시트 및 반도체 칩의 제조 방법 - Google Patents
다이싱 시트 및 반도체 칩의 제조 방법 Download PDFInfo
- Publication number
- KR102451856B1 KR102451856B1 KR1020177008353A KR20177008353A KR102451856B1 KR 102451856 B1 KR102451856 B1 KR 102451856B1 KR 1020177008353 A KR1020177008353 A KR 1020177008353A KR 20177008353 A KR20177008353 A KR 20177008353A KR 102451856 B1 KR102451856 B1 KR 102451856B1
- Authority
- KR
- South Korea
- Prior art keywords
- dicing sheet
- adhesive layer
- layer
- elastic modulus
- degreec
- Prior art date
Links
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015039892 | 2015-03-02 | ||
JPJP-P-2015-039892 | 2015-03-02 | ||
PCT/JP2015/079513 WO2016139840A1 (ja) | 2015-03-02 | 2015-10-20 | ダイシングシートおよび半導体チップの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170121146A KR20170121146A (ko) | 2017-11-01 |
KR102451856B1 true KR102451856B1 (ko) | 2022-10-06 |
Family
ID=56848072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020177008353A KR102451856B1 (ko) | 2015-03-02 | 2015-10-20 | 다이싱 시트 및 반도체 칩의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6623210B2 (zh) |
KR (1) | KR102451856B1 (zh) |
CN (1) | CN107078037B (zh) |
TW (1) | TWI683881B (zh) |
WO (1) | WO2016139840A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6906402B2 (ja) * | 2017-09-07 | 2021-07-21 | 日東電工株式会社 | 半導体ウエハ保護用粘着テープ |
JP7125259B2 (ja) * | 2017-11-30 | 2022-08-24 | 日東電工株式会社 | 粘着シート |
JP6350845B1 (ja) * | 2018-01-29 | 2018-07-04 | サイデン化学株式会社 | 粘着剤組成物、粘着シート、及び粘着剤の製造方法 |
WO2019155970A1 (ja) * | 2018-02-07 | 2019-08-15 | リンテック株式会社 | 半導体加工用粘着テープ |
CN111466015B (zh) * | 2018-03-23 | 2023-08-29 | 琳得科株式会社 | 固晶膜、切割固晶片及半导体芯片的制造方法 |
JPWO2019189070A1 (ja) * | 2018-03-29 | 2021-04-01 | リンテック株式会社 | 粘着性組成物および粘着テープ |
US10464716B1 (en) * | 2018-05-22 | 2019-11-05 | The Procter & Gamble Company | Container having an adhesively attached fitment |
JP7285068B2 (ja) * | 2018-12-20 | 2023-06-01 | 三井化学東セロ株式会社 | 電子装置の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013098408A (ja) * | 2011-11-02 | 2013-05-20 | Lintec Corp | ダイシングシートおよび半導体チップの製造方法 |
JP2013199565A (ja) * | 2012-03-23 | 2013-10-03 | Lintec Corp | 電子部品加工用粘着シートおよび半導体装置の製造方法 |
JP2014072221A (ja) * | 2012-09-27 | 2014-04-21 | Furukawa Electric Co Ltd:The | 放射線硬化型ダイシング用粘着テープ |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006165004A (ja) * | 2004-12-02 | 2006-06-22 | Sumitomo Bakelite Co Ltd | 半導体ウエハ加工用粘着テープ |
JP2006202926A (ja) | 2005-01-19 | 2006-08-03 | Sekisui Chem Co Ltd | ダイシングテープ |
JP4643360B2 (ja) * | 2005-05-24 | 2011-03-02 | 株式会社イーテック | 粘着性樹脂組成物、並びに粘着シートおよびその製造方法 |
JP5379459B2 (ja) | 2008-12-03 | 2013-12-25 | 古河電気工業株式会社 | ダイシングテープ |
JP2012015340A (ja) * | 2010-06-30 | 2012-01-19 | Dainippon Printing Co Ltd | セパレータレス型ダイシングテープ |
JP5929004B2 (ja) * | 2011-03-30 | 2016-06-01 | 住友ベークライト株式会社 | 半導体加工用粘着シート |
JP2013197390A (ja) * | 2012-03-21 | 2013-09-30 | Lintec Corp | ダイシングシートおよび半導体チップの製造方法 |
TWI621682B (zh) * | 2013-03-11 | 2018-04-21 | Lintec Corp | 黏接片以及被加工的有關設備的部材之製作方法 |
-
2015
- 2015-10-20 KR KR1020177008353A patent/KR102451856B1/ko active IP Right Grant
- 2015-10-20 CN CN201580056734.4A patent/CN107078037B/zh active Active
- 2015-10-20 WO PCT/JP2015/079513 patent/WO2016139840A1/ja active Application Filing
- 2015-10-20 JP JP2017503312A patent/JP6623210B2/ja active Active
-
2016
- 2016-02-23 TW TW105105220A patent/TWI683881B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013098408A (ja) * | 2011-11-02 | 2013-05-20 | Lintec Corp | ダイシングシートおよび半導体チップの製造方法 |
JP2013199565A (ja) * | 2012-03-23 | 2013-10-03 | Lintec Corp | 電子部品加工用粘着シートおよび半導体装置の製造方法 |
JP2014072221A (ja) * | 2012-09-27 | 2014-04-21 | Furukawa Electric Co Ltd:The | 放射線硬化型ダイシング用粘着テープ |
Also Published As
Publication number | Publication date |
---|---|
JPWO2016139840A1 (ja) | 2017-12-14 |
TW201638264A (zh) | 2016-11-01 |
TWI683881B (zh) | 2020-02-01 |
JP6623210B2 (ja) | 2019-12-18 |
WO2016139840A1 (ja) | 2016-09-09 |
CN107078037A (zh) | 2017-08-18 |
KR20170121146A (ko) | 2017-11-01 |
CN107078037B (zh) | 2020-08-14 |
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