KR102449579B1 - 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 - Google Patents

기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 Download PDF

Info

Publication number
KR102449579B1
KR102449579B1 KR1020197005730A KR20197005730A KR102449579B1 KR 102449579 B1 KR102449579 B1 KR 102449579B1 KR 1020197005730 A KR1020197005730 A KR 1020197005730A KR 20197005730 A KR20197005730 A KR 20197005730A KR 102449579 B1 KR102449579 B1 KR 102449579B1
Authority
KR
South Korea
Prior art keywords
delete delete
base plate
array
substrate
holding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197005730A
Other languages
English (en)
Korean (ko)
Other versions
KR20190041477A (ko
Inventor
폴 이머트 셰퍼스
제리 요한네스 마르티누스 페이스터
Original Assignee
에이에스엠엘 네델란즈 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/222,705 external-priority patent/US9829804B1/en
Priority claimed from US15/222,708 external-priority patent/US20180033586A1/en
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Priority to KR1020227033553A priority Critical patent/KR102580712B1/ko
Publication of KR20190041477A publication Critical patent/KR20190041477A/ko
Application granted granted Critical
Publication of KR102449579B1 publication Critical patent/KR102449579B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H01L21/67109—
    • H01L21/68714—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020197005730A 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법 Active KR102449579B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227033553A KR102580712B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/222,705 2016-07-28
US15/222,705 US9829804B1 (en) 2016-07-28 2016-07-28 Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system
US15/222,708 US20180033586A1 (en) 2016-07-28 2016-07-28 Apparatus and method for processing or imaging a sample
US15/222,708 2016-07-28
PCT/JP2017/028156 WO2018021581A1 (en) 2016-07-28 2017-07-27 Substrate holding device, method for manufacturing such a device, and apparatus and method for processing or imaging a sample

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227033553A Division KR102580712B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20190041477A KR20190041477A (ko) 2019-04-22
KR102449579B1 true KR102449579B1 (ko) 2022-10-04

Family

ID=61016195

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020197005730A Active KR102449579B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법
KR1020227033553A Active KR102580712B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227033553A Active KR102580712B1 (ko) 2016-07-28 2017-07-27 기판 홀딩 디바이스, 기판 홀딩 디바이스의 제조 방법, 및 샘플을 프로세싱 또는 이미징하기 위한 장치 및 방법

Country Status (5)

Country Link
JP (2) JP6951415B2 (enExample)
KR (2) KR102449579B1 (enExample)
CN (1) CN109844927B (enExample)
TW (2) TWI757314B (enExample)
WO (1) WO2018021581A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI883050B (zh) * 2019-10-01 2025-05-11 荷蘭商Ａｓｍｌ荷蘭公司 用於對準及接合組件之正反兩用長型元件、用於極紫外線（ｅｕｖ）輻射源之容器、微影系統、及用於將裝置接合至容器之方法
CN114302514B (zh) * 2021-12-27 2022-09-27 哈尔滨工业大学 集成交叉式双针板热沉的电热耦合温控装置及其控温方法
CN115586710B (zh) * 2022-11-09 2025-09-02 浙江大学 基于pcm隔绝内部温度波动的温控装置和控制方法
TWI856833B (zh) * 2023-09-27 2024-09-21 大陸商鵬鼎控股（深圳）股份有限公司 感測模組及其製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050128449A1 (en) 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
US20080024743A1 (en) 2006-07-28 2008-01-31 Pieter Kruit Lithography system, method of heat dissipation and frame
US20140017613A1 (en) 2012-07-11 2014-01-16 Canon Kabushiki Kaisha Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252288A (ja) 1999-03-04 2000-09-14 Komatsu Ltd 基板保持装置
KR100351049B1 (ko) 1999-07-26 2002-09-09 삼성전자 주식회사 웨이퍼 가열 방법 및 이를 적용한 장치
US6470108B1 (en) * 2000-04-26 2002-10-22 Tini Alloy Company Optical switching device and method
JP2003224180A (ja) * 2002-01-28 2003-08-08 Kyocera Corp ウエハ支持部材
US7195693B2 (en) * 2002-06-05 2007-03-27 Advanced Thermal Sciences Lateral temperature equalizing system for large area surfaces during processing
US7156951B1 (en) * 2002-06-21 2007-01-02 Lam Research Corporation Multiple zone gas distribution apparatus for thermal control of semiconductor wafer
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7532310B2 (en) * 2004-10-22 2009-05-12 Asml Netherlands B.V. Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
JP4761948B2 (ja) 2004-12-01 2011-08-31 京セラ株式会社 炭化珪素質焼結及びそれを用いた半導体製造装置用部品
JP4462143B2 (ja) 2005-07-29 2010-05-12 住友電気工業株式会社 ウェハ保持体及びウェハ保持体を備えたウェハプローバ
US7528349B1 (en) * 2006-07-25 2009-05-05 Kla-Tencor Technologies Corporation Temperature stabilization for substrate processing
WO2008013443A2 (en) * 2006-07-28 2008-01-31 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP2008311595A (ja) * 2007-06-18 2008-12-25 Canon Inc ステージ装置、露光装置およびデバイス製造方法
JP5247175B2 (ja) 2008-02-06 2013-07-24 株式会社アルバック 真空処理装置
SG156564A1 (en) * 2008-04-09 2009-11-26 Asml Holding Nv Lithographic apparatus and device manufacturing method
EP2196857A3 (en) * 2008-12-09 2010-07-21 ASML Netherlands BV Lithographic apparatus and device manufacturing method
JP5607907B2 (ja) * 2009-09-17 2014-10-15 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置
US8529729B2 (en) * 2010-06-07 2013-09-10 Lam Research Corporation Plasma processing chamber component having adaptive thermal conductor
JP2012231046A (ja) * 2011-04-27 2012-11-22 Nikon Corp 光学装置、露光装置、及びデバイス製造方法
WO2013033315A2 (en) * 2011-09-01 2013-03-07 Veeco Instruments Inc. Wafer carrier with thermal features
WO2013049589A1 (en) * 2011-09-30 2013-04-04 Applied Materials, Inc. Electrostatic chuck with temperature control
US9514916B2 (en) * 2013-03-15 2016-12-06 Varian Semiconductor Equipment Associates, Inc. Wafer platen thermosyphon cooling system
JP6595313B2 (ja) * 2014-11-20 2019-10-23 永大産業株式会社 蓄熱壁パネル

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050128449A1 (en) 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
US20080024743A1 (en) 2006-07-28 2008-01-31 Pieter Kruit Lithography system, method of heat dissipation and frame
US20140017613A1 (en) 2012-07-11 2014-01-16 Canon Kabushiki Kaisha Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article

Also Published As

Publication number Publication date
TWI835063B (zh) 2024-03-11
CN109844927A (zh) 2019-06-04
JP6951415B2 (ja) 2021-10-20
TW201812429A (zh) 2018-04-01
KR102580712B1 (ko) 2023-09-21
TW202234574A (zh) 2022-09-01
CN109844927B (zh) 2024-01-09
KR20190041477A (ko) 2019-04-22
KR20220137160A (ko) 2022-10-11
TWI757314B (zh) 2022-03-11
JP7240463B2 (ja) 2023-03-15
WO2018021581A1 (en) 2018-02-01
JP2019523561A (ja) 2019-08-22
JP2022008512A (ja) 2022-01-13

Similar Documents

Publication Publication Date Title
JP7240463B2 (ja) 基板保持デバイス、そのようなデバイスを製造するための方法、ならびに、サンプルを処理または像形成するための装置および方法
CN111108438B (zh) 具有冷却部的空间光调制装置
JP3814598B2 (ja) 温度調整装置、露光装置及びデバイス製造方法
US6788724B2 (en) Hermetically sealed external cavity laser system and method
TW201250291A (en) Mirror array
KR101755059B1 (ko) 지지 및 위치 결정 구조체, 위치 결정을 위한 반도체 장비 시스템 및 방법
US20240105883A1 (en) Method for manufacturing a cap substrate, method for manufacturing a hermetically housed optoelectronic device, and hermetically housed optoelectronic device
US20090092168A1 (en) Laser module and optical pickup device
US9829804B1 (en) Substrate holding device, method for manufacturing such a device, and use of such a device in a lithography system
US20140017613A1 (en) Holding apparatus, processing apparatus, lithography apparatus, and method for manufacturing article
NL2019355B1 (en) Method and apparatus for exposing a sample
US20050085053A1 (en) Method of activating a getter structure
JP5305128B2 (ja) 液滴光学装置
US20140118709A1 (en) Holding apparatus, lithography apparatus, and method of manufacturing article
US20150029484A1 (en) Stage apparatus, lithography apparatus and method of manufacturing article
JP2002098909A (ja) 顕微鏡観察用温度管理器の本体部
JP2005353759A (ja) 半導体レーザ装置およびその製造方法
WO2019146027A1 (ja) 電子ビーム装置及びデバイス製造方法、並びに光電素子ユニット
GB2622217A (en) Actuator assembly
JP4558589B2 (ja) 温度制御装置、温度調節機能付き可動ステージ、及び輻射伝熱装置
JPH0547663A (ja) 分子線結晶成長装置
KR100524121B1 (ko) 레이저빔 포지션닝 장치
CN118712092A (zh) 一种静电卡盘及制作方法
JP2023044361A (ja) ステージ装置、荷電粒子線装置および真空装置
JP2006351740A (ja) 温調機能付きステージ

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

A107 Divisional application of patent
GRNT Written decision to grant
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000