KR102424719B1 - 마스킹된 에지를 갖는 지지 링 - Google Patents

마스킹된 에지를 갖는 지지 링 Download PDF

Info

Publication number
KR102424719B1
KR102424719B1 KR1020217022002A KR20217022002A KR102424719B1 KR 102424719 B1 KR102424719 B1 KR 102424719B1 KR 1020217022002 A KR1020217022002 A KR 1020217022002A KR 20217022002 A KR20217022002 A KR 20217022002A KR 102424719 B1 KR102424719 B1 KR 102424719B1
Authority
KR
South Korea
Prior art keywords
ring
coating
shaped body
support ring
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217022002A
Other languages
English (en)
Korean (ko)
Other versions
KR20210091360A (ko
Inventor
메흐란 베흐드자트
노르만 엘. 탐
아론 무이르 헌터
조셉 엠. 래니쉬
고지 나까니시
도시유끼 나까가와
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Priority to KR1020227025236A priority Critical patent/KR102569159B1/ko
Publication of KR20210091360A publication Critical patent/KR20210091360A/ko
Application granted granted Critical
Publication of KR102424719B1 publication Critical patent/KR102424719B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/68735—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H01L21/68721—
    • H01L21/68757—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H01L2221/683—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Drying Of Semiconductors (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
KR1020217022002A 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링 Active KR102424719B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227025236A KR102569159B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201361922451P 2013-12-31 2013-12-31
US61/922,451 2013-12-31
US14/218,597 2014-03-18
US14/218,597 US9330955B2 (en) 2013-12-31 2014-03-18 Support ring with masked edge
PCT/US2014/067367 WO2015102781A1 (en) 2013-12-31 2014-11-25 Support ring with masked edge
KR1020167020960A KR102279150B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167020960A Division KR102279150B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227025236A Division KR102569159B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링

Publications (2)

Publication Number Publication Date
KR20210091360A KR20210091360A (ko) 2021-07-21
KR102424719B1 true KR102424719B1 (ko) 2022-07-25

Family

ID=53482656

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020217022002A Active KR102424719B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링
KR1020227025236A Active KR102569159B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링
KR1020167020960A Active KR102279150B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020227025236A Active KR102569159B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링
KR1020167020960A Active KR102279150B1 (ko) 2013-12-31 2014-11-25 마스킹된 에지를 갖는 지지 링

Country Status (6)

Country Link
US (4) US9330955B2 (cg-RX-API-DMAC10.html)
JP (2) JP6408606B2 (cg-RX-API-DMAC10.html)
KR (3) KR102424719B1 (cg-RX-API-DMAC10.html)
CN (2) CN110223949B (cg-RX-API-DMAC10.html)
TW (3) TWI667735B (cg-RX-API-DMAC10.html)
WO (1) WO2015102781A1 (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX349112B (es) * 2011-05-13 2017-07-12 Dow Global Technologies Llc Formulaciones de aislamiento.
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge
WO2018187679A1 (en) 2017-04-07 2018-10-11 Applied Materials, Inc. Plasma density control on substrate edge
CN107121892B (zh) * 2017-04-26 2018-12-28 武汉华星光电技术有限公司 一种基板曝边设备
KR102723235B1 (ko) * 2018-03-13 2024-10-31 어플라이드 머티어리얼스, 인코포레이티드 플라즈마 분무 코팅을 갖는 지지 링
CN110920254B (zh) 2018-09-19 2021-03-16 精工爱普生株式会社 打印头控制电路及液体喷出装置
US12134835B2 (en) * 2021-09-01 2024-11-05 Applied Materials, Inc. Quartz susceptor for accurate non-contact temperature measurement
US20250305141A1 (en) * 2024-03-27 2025-10-02 Applied Materials, Inc. Multi-section substrate supports and related methods, process kits, and processing chambers for semiconductor manufacturing
KR102944097B1 (ko) * 2024-09-23 2026-03-27 주식회사 비아트론 웨이퍼 지지용 에지링
KR20260104246A (ko) * 2024-12-26 2026-07-06 주식회사 비아트론 웨이퍼 지지용 에지링

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047911A (ja) * 2002-07-16 2004-02-12 Dainippon Screen Mfg Co Ltd 熱処理装置

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61217561A (ja) * 1985-03-25 1986-09-27 Sumitomo Metal Ind Ltd Ｎｉ基合金の製造方法
US5690795A (en) * 1995-06-05 1997-11-25 Applied Materials, Inc. Screwless shield assembly for vacuum processing chambers
US5848889A (en) * 1996-07-24 1998-12-15 Applied Materials Inc. Semiconductor wafer support with graded thermal mass
US5884412A (en) * 1996-07-24 1999-03-23 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US6395363B1 (en) * 1996-11-05 2002-05-28 Applied Materials, Inc. Sloped substrate support
US6530994B1 (en) 1997-08-15 2003-03-11 Micro C Technologies, Inc. Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing
EP1036406B1 (en) 1997-11-03 2003-04-02 ASM America, Inc. Improved low mass wafer support system
US6200388B1 (en) * 1998-02-11 2001-03-13 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6280183B1 (en) * 1998-04-01 2001-08-28 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6048403A (en) * 1998-04-01 2000-04-11 Applied Materials, Inc. Multi-ledge substrate support for a thermal processing chamber
US6264467B1 (en) * 1999-04-14 2001-07-24 Applied Materials, Inc. Micro grooved support surface for reducing substrate wear and slip formation
US6383931B1 (en) * 2000-02-11 2002-05-07 Lam Research Corporation Convertible hot edge ring to improve low-K dielectric etch
KR20010087542A (ko) 2000-03-07 2001-09-21 윤종용 반도체 확산 공정용 석영 보트의 웨이퍼 지지장치
KR20020073814A (ko) * 2001-03-16 2002-09-28 삼성전자 주식회사 웨이퍼 열처리 장치
JP4067858B2 (ja) * 2002-04-16 2008-03-26 東京エレクトロン株式会社 Ａｌｄ成膜装置およびａｌｄ成膜方法
US7734439B2 (en) 2002-06-24 2010-06-08 Mattson Technology, Inc. System and process for calibrating pyrometers in thermal processing chambers
US7704327B2 (en) 2002-09-30 2010-04-27 Applied Materials, Inc. High temperature anneal with improved substrate support
US7241345B2 (en) * 2003-06-16 2007-07-10 Applied Materials, Inc. Cylinder for thermal processing chamber
JP4669476B2 (ja) * 2003-08-01 2011-04-13 エスゲーエル カーボン ソシエタス ヨーロピア 半導体製造時にウェハを支持するホルダ
JPWO2005017988A1 (ja) * 2003-08-15 2006-10-12 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
US6888104B1 (en) * 2004-02-05 2005-05-03 Applied Materials, Inc. Thermally matched support ring for substrate processing chamber
WO2005081283A2 (en) * 2004-02-13 2005-09-01 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
KR100733269B1 (ko) * 2005-08-18 2007-06-28 피에스케이 주식회사 반도체 식각 장비의 척 조립체
KR101122347B1 (ko) * 2006-05-31 2012-03-23 도쿄엘렉트론가부시키가이샤 절연막의 형성 방법 및 반도체 장치의 제조 방법
CN101523577A (zh) * 2006-09-29 2009-09-02 东京毅力科创株式会社 硅氧化膜的形成方法，等离子体处理装置以及存储介质
KR101207593B1 (ko) * 2007-03-28 2012-12-03 도쿄엘렉트론가부시키가이샤 Cvd 성막 장치
KR100856019B1 (ko) * 2008-02-22 2008-09-02 (주)타이닉스 플라즈마 처리장치의 기판 홀더
JP2010114190A (ja) 2008-11-05 2010-05-20 Mitsubishi Heavy Ind Ltd 光電変換装置の製造方法および光電変換装置
KR100940544B1 (ko) 2009-07-01 2010-02-10 (주)앤피에스 기판 지지 유닛
DE202010015933U1 (de) * 2009-12-01 2011-05-05 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Eine Randringanordnung für Plasmaätzkammern
US8744250B2 (en) * 2011-02-23 2014-06-03 Applied Materials, Inc. Edge ring for a thermal processing chamber
US8979087B2 (en) * 2011-07-29 2015-03-17 Applied Materials, Inc. Substrate supporting edge ring with coating for improved soak performance
EP2891174B1 (en) * 2012-08-31 2019-08-14 Semiconductor Technologies & Instruments Pte Ltd. System and method for automatically correcting for rotational misalignment of wafers on film frames
TWI675721B (zh) * 2013-07-11 2019-11-01 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
US9385004B2 (en) * 2013-08-15 2016-07-05 Applied Materials, Inc. Support cylinder for thermal processing chamber
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047911A (ja) * 2002-07-16 2004-02-12 Dainippon Screen Mfg Co Ltd 熱処理装置

Also Published As

Publication number Publication date
TW201639073A (zh) 2016-11-01
US20180315639A1 (en) 2018-11-01
JP6758353B2 (ja) 2020-09-23
JP2019036736A (ja) 2019-03-07
US10056286B2 (en) 2018-08-21
CN110223949B (zh) 2023-03-21
CN105830207A (zh) 2016-08-03
TWI578437B (zh) 2017-04-11
JP6408606B2 (ja) 2018-10-17
US9842759B2 (en) 2017-12-12
JP2017508303A (ja) 2017-03-23
TW201532183A (zh) 2015-08-16
WO2015102781A1 (en) 2015-07-09
CN110223949A (zh) 2019-09-10
KR102279150B1 (ko) 2021-07-19
KR20220107084A (ko) 2022-08-01
US20180102274A1 (en) 2018-04-12
US20150187630A1 (en) 2015-07-02
US10373859B2 (en) 2019-08-06
US9330955B2 (en) 2016-05-03
TWI667735B (zh) 2019-08-01
TW201737409A (zh) 2017-10-16
KR20160103128A (ko) 2016-08-31
KR20210091360A (ko) 2021-07-21
US20160247708A1 (en) 2016-08-25
TWI594361B (zh) 2017-08-01
KR102569159B1 (ko) 2023-08-23
CN105830207B (zh) 2019-05-31

Similar Documents

Publication Publication Date Title
KR102279150B1 (ko) 마스킹된 에지를 갖는 지지 링
TWI601233B (zh) 用於急速熱處理的最小接觸邊緣環
CN107342253B (zh) 用于热处理腔室的支撑圆柱
US9759615B2 (en) Pyrometer background elimination
CN105027270A (zh) 用于热处理腔室的高温测量过滤器
JP2004047911A (ja) 熱処理装置

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000