KR102406894B1 - 적층체의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법 - Google Patents

적층체의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법 Download PDF

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Publication number
KR102406894B1
KR102406894B1 KR1020150069614A KR20150069614A KR102406894B1 KR 102406894 B1 KR102406894 B1 KR 102406894B1 KR 1020150069614 A KR1020150069614 A KR 1020150069614A KR 20150069614 A KR20150069614 A KR 20150069614A KR 102406894 B1 KR102406894 B1 KR 102406894B1
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KR
South Korea
Prior art keywords
substrate
peeling
laminate
less
board
Prior art date
Application number
KR1020150069614A
Other languages
English (en)
Korean (ko)
Other versions
KR20150135106A (ko
Inventor
야스노리 이토
유키 다테야마
유키 호리
Original Assignee
에이지씨 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 에이지씨 가부시키가이샤 filed Critical 에이지씨 가부시키가이샤
Publication of KR20150135106A publication Critical patent/KR20150135106A/ko
Application granted granted Critical
Publication of KR102406894B1 publication Critical patent/KR102406894B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Laminated Bodies (AREA)
KR1020150069614A 2014-05-22 2015-05-19 적층체의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법 KR102406894B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014105850 2014-05-22
JPJP-P-2014-105850 2014-05-22

Publications (2)

Publication Number Publication Date
KR20150135106A KR20150135106A (ko) 2015-12-02
KR102406894B1 true KR102406894B1 (ko) 2022-06-10

Family

ID=54565557

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150069614A KR102406894B1 (ko) 2014-05-22 2015-05-19 적층체의 박리 장치 및 박리 방법, 및 전자 디바이스의 제조 방법

Country Status (4)

Country Link
JP (1) JP6459145B2 (zh)
KR (1) KR102406894B1 (zh)
CN (1) CN105084085B (zh)
TW (1) TWI659847B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105511130B (zh) * 2016-02-01 2019-09-06 京东方科技集团股份有限公司 显示基板的剥离装置及剥离方法
JP7080551B2 (ja) * 2017-12-18 2022-06-06 株式会社ディスコ 被加工物の加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003335454A (ja) 2002-05-15 2003-11-25 Sharp Corp フィルム剥離装置およびフィルム剥離方法
JP2009078902A (ja) 2007-09-26 2009-04-16 Sharp Corp 剥離装置および剥離方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4154895B2 (ja) * 2002-01-23 2008-09-24 ソニー株式会社 半導体装置の製造方法
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
KR101458901B1 (ko) * 2008-04-29 2014-11-10 삼성디스플레이 주식회사 가요성 표시 장치의 제조 방법
WO2011024689A1 (ja) 2009-08-31 2011-03-03 旭硝子株式会社 剥離装置
JP5669137B2 (ja) * 2011-03-01 2015-02-12 富士機械製造株式会社 ダイピックアップ装置
JP2013052998A (ja) * 2011-09-06 2013-03-21 Asahi Glass Co Ltd 剥離装置、及び電子デバイスの製造方法
JP2013055307A (ja) * 2011-09-06 2013-03-21 Asahi Glass Co Ltd 剥離装置、及び電子デバイスの製造方法
CN104114358B (zh) * 2012-02-17 2016-10-12 日东电工株式会社 吸附用多孔片和吸附用多孔片中使用的更换用表面层
KR101382601B1 (ko) * 2012-07-02 2014-04-17 삼성디스플레이 주식회사 유기 발광 표시 장치의 제조 장치 및 그 방법
JP5511932B2 (ja) * 2012-11-05 2014-06-04 リンテック株式会社 半導体ウエハの処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003335454A (ja) 2002-05-15 2003-11-25 Sharp Corp フィルム剥離装置およびフィルム剥離方法
JP2009078902A (ja) 2007-09-26 2009-04-16 Sharp Corp 剥離装置および剥離方法

Also Published As

Publication number Publication date
JP6459145B2 (ja) 2019-01-30
CN105084085B (zh) 2018-07-24
TW201545891A (zh) 2015-12-16
TWI659847B (zh) 2019-05-21
JP2016001733A (ja) 2016-01-07
CN105084085A (zh) 2015-11-25
KR20150135106A (ko) 2015-12-02

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