KR102383397B1 - 반도체 소자 보호용 재료 및 반도체 장치 - Google Patents

반도체 소자 보호용 재료 및 반도체 장치 Download PDF

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Publication number
KR102383397B1
KR102383397B1 KR1020217032674A KR20217032674A KR102383397B1 KR 102383397 B1 KR102383397 B1 KR 102383397B1 KR 1020217032674 A KR1020217032674 A KR 1020217032674A KR 20217032674 A KR20217032674 A KR 20217032674A KR 102383397 B1 KR102383397 B1 KR 102383397B1
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South Korea
Prior art keywords
semiconductor element
weight
epoxy compound
element protection
bisphenol
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KR1020217032674A
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English (en)
Korean (ko)
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KR20210127793A (ko
Inventor
다까시 니시무라
히로시 마에나까
유우스께 고바야시
시게루 나까무라
다꾸지 아오야마
치즈루 김
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20210127793A publication Critical patent/KR20210127793A/ko
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Publication of KR102383397B1 publication Critical patent/KR102383397B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
KR1020217032674A 2014-07-18 2015-07-15 반도체 소자 보호용 재료 및 반도체 장치 KR102383397B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014147608 2014-07-18
JPJP-P-2014-147608 2014-07-18
KR1020177029699A KR102313846B1 (ko) 2014-07-18 2015-07-15 반도체 소자 보호용 재료 및 반도체 장치
PCT/JP2015/070248 WO2016010067A1 (ja) 2014-07-18 2015-07-15 半導体素子保護用材料及び半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020177029699A Division KR102313846B1 (ko) 2014-07-18 2015-07-15 반도체 소자 보호용 재료 및 반도체 장치

Publications (2)

Publication Number Publication Date
KR20210127793A KR20210127793A (ko) 2021-10-22
KR102383397B1 true KR102383397B1 (ko) 2022-04-08

Family

ID=55078557

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020217032674A KR102383397B1 (ko) 2014-07-18 2015-07-15 반도체 소자 보호용 재료 및 반도체 장치
KR1020177029699A KR102313846B1 (ko) 2014-07-18 2015-07-15 반도체 소자 보호용 재료 및 반도체 장치
KR1020167016198A KR101808472B1 (ko) 2014-07-18 2015-07-15 반도체 소자 보호용 재료 및 반도체 장치

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020177029699A KR102313846B1 (ko) 2014-07-18 2015-07-15 반도체 소자 보호용 재료 및 반도체 장치
KR1020167016198A KR101808472B1 (ko) 2014-07-18 2015-07-15 반도체 소자 보호용 재료 및 반도체 장치

Country Status (5)

Country Link
JP (1) JPWO2016010067A1 (zh)
KR (3) KR102383397B1 (zh)
CN (1) CN105849187A (zh)
TW (4) TWI704649B (zh)
WO (1) WO2016010067A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102460328B1 (ko) * 2015-08-17 2022-10-28 세키스이가가쿠 고교가부시키가이샤 반도체 장치 및 반도체 소자 보호용 재료
KR102611441B1 (ko) * 2017-01-03 2023-12-07 주식회사 아모센스 절연성 방열 코팅조성물 및 이를 통해 구현된 절연성 방열 물품
KR101756824B1 (ko) * 2017-01-03 2017-07-11 주식회사 아모센스 절연성 방열 코팅조성물 및 이를 통해 구현된 절연성 방열 물품
JP6678809B2 (ja) * 2017-02-24 2020-04-08 三菱電機株式会社 熱伝導性樹脂組成物、その硬化物、ならびに熱伝導性シートおよびその製造方法
WO2020158259A1 (ja) * 2019-02-01 2020-08-06 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料
WO2023140644A1 (ko) * 2022-01-20 2023-07-27 (주)에버텍엔터프라이즈 반도체 소자 봉지용 변성 에폭시 수지, 이의 제조 방법 및 이를 포함하는 낮은 휨을 나타내는 반도체 소자 봉지용 액상 수지 조성물

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012201696A (ja) 2011-03-23 2012-10-22 Panasonic Corp 電子部品用液状エポキシ樹脂組成物とそれを用いた電子装置

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JP2817474B2 (ja) 1991-09-25 1998-10-30 信越化学工業株式会社 エポキシ樹脂組成物及び硬化物
JP3821173B2 (ja) 1996-12-19 2006-09-13 信越化学工業株式会社 エポキシ樹脂組成物
JP2005200533A (ja) 2004-01-15 2005-07-28 Kyocera Chemical Corp 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP2006023295A (ja) * 2004-06-10 2006-01-26 Canon Inc 複屈折測定法及びそれを用いた複屈折測定装置
JP2006232950A (ja) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2007217469A (ja) 2006-02-14 2007-08-30 Kyocera Chemical Corp 封止用エポキシ樹脂組成物および半導体装置
US7838577B2 (en) * 2007-07-19 2010-11-23 Sekisui Chemical Co., Ltd. Adhesive for electronic component
PT2221666E (pt) * 2007-11-12 2013-10-31 Hitachi Chemical Co Ltd Composição de resina fotossensível de tipo positivo, método para a produção de um padrão de revestimento fotossensível e dispositivo semicondutor
MY152342A (en) * 2008-12-10 2014-09-15 Sumitomo Bakelite Co Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
JP5721416B2 (ja) * 2010-12-13 2015-05-20 積水化学工業株式会社 熱伝導性接着剤
JP5860151B2 (ja) * 2012-07-31 2016-02-16 旭化成イーマテリアルズ株式会社 エポキシ樹脂組成物、エポキシ樹脂、及び硬化物
JP2014040538A (ja) 2012-08-23 2014-03-06 Hitachi Chemical Co Ltd ２液タイプのエポキシ樹脂組成物

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2012201696A (ja) 2011-03-23 2012-10-22 Panasonic Corp 電子部品用液状エポキシ樹脂組成物とそれを用いた電子装置

Also Published As

Publication number Publication date
JPWO2016010067A1 (ja) 2017-04-27
TW202105621A (zh) 2021-02-01
KR20170013195A (ko) 2017-02-06
KR20210127793A (ko) 2021-10-22
TWI704649B (zh) 2020-09-11
TWI598401B (zh) 2017-09-11
CN105849187A (zh) 2016-08-10
WO2016010067A1 (ja) 2016-01-21
TW201735273A (zh) 2017-10-01
TW201921605A (zh) 2019-06-01
TWI754342B (zh) 2022-02-01
KR101808472B1 (ko) 2017-12-12
TWI653714B (zh) 2019-03-11
KR102313846B1 (ko) 2021-10-18
KR20170118261A (ko) 2017-10-24
TW201609945A (zh) 2016-03-16

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